Shrinking rugged mission subsystems
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Transcript of Shrinking rugged mission subsystems
1 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Defense Solutions Division
Shrinking Rugged Mission Subsystems
Prepared for Technology Horizons Series, June 2015
2 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Defense Solutions Division
Phil Evans
Field Applications Engineer
Curtiss-Wright - Defense Solutions Division
15 Lambourne Cres, Llanishen, Cardiff, United Kingdom CF14 5GF
T +44.2920.747.927 | M +44.7500.794.866
[email protected] | http://www.cwcdefense.com
3 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
MIL-Aero Market is Demanding Less & More
Less: (SWaP-C) • Size
• Weight
• Power
• Cost
More: • Advanced sensor / vetronics payload capabilities
• Greater processor, memory and graphics compute engines
• High-speed network connectivity and situational awareness
• Aircraft/vehicle power input compatibility/voltage protections
• Device management, diagnostics & security capabilities
• Excellent signal integrity in noisy EMI conditions
• Harsh environment survivability (wide temperatures, high shock/vibe, high altitude, humidity, dust/water ingress)
Examples: SWaP-Sensitive Platforms:
• Fixed Wing and Rotary Aircraft
• Smaller/Mid-size Unmanned Air Systems
• Tactical Ground Vehicles (including UGVs)
• Wearable / Portable Comms
4 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Curtiss-Wright Parvus Business Unit
• Parvus Business Unit, Part of Curtiss-Wright Defense Solutions Since Oct 2013
• Facility Located in Salt Lake City, Utah (USA), Since 1983
• AS9100 Rev-C Aerospace Quality Manufacturing Program
• Cisco Systems Partner: Solution Technology Integrator (STI) for Rugged Subsystems Integration
• Proven Provider of Small Form Factor (SWaP-C Optimized) Computing & Networking Subsystems for C4ISR Apps
• COTS products typically ITAR-Free (EAR export controlled)
• Application engineering services for turnkey Modified COTS (MCOTS) systems without traditional development NRE fees
• Ideal solutions for budget constrained government environment and COTS tech refresh upgrades
Key Facts
5 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Parvus Dura Systems Enable C4ISR Capabilities
Target Applications:
• Non-flight/safety-critical mission processing and network backbone tech upgrades (interfacing with vehicle / aircraft sensors, data links, radios, IP devices), typically on size, weight, power, cost (SWaP-C) constrained platforms
Parvus COTS subsystem portfolio enables Network Centric Operations:
• Every warfighter, every platform becomes network node w/interoperability (no stove pipes)
• Real-time sharing of voice, video and data for shared situational awareness
Processor
Processor
Ethernet
Switch IP
Router
Radios/
Satellite
Processor Sensors
Sensors Processor
Ethernet
Switch IP
Router
Radios/
Satellite
Parvus Subsystems for
Intra / Inter-Vehicle Networks
Sensors
Sensors
Data
Voice
Video
6 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Pedigree of Success
AH-64 Apache
Stryker
CH-53K Super Stallion
IBCS
AAV
UH-60 Blackhawk
AC-130J
PC-12
P-3-Orion
Littoral Combat Ship (LCS)
Delta / Atlas Launch Vehicle Joint Light Tactical Vehicle
MM-104 Patriot Missile
WIN-T
MRAP M-ATV
LEMV
MQ-1 Predator / MQ-9 Reaper
Sentinel Radar
JSTARS (Boeing 707-300)
C-RAM
HC-130H/J
CP-140 Aurora
Fire Scout
RQ-5 Hunter
M-8 Passenger Trains
Boeing 737
Firebird UAS
New Shepherd Husky HMDS
OH-58 Kiowa Warrior
Sampling of land, sea, air, and space platforms where Parvus products are installed:
7 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Comparison: Commonly Integrated x86 Small Form Factor (SFF) Modules
PCIe104
(90x96mm) COM-Express Compact
(95x95mm)
PCIe Mini Card
(30x51 mm) XMC
(149 x 74mm)
3U VPX
(160x 100mm)
Different Modules to Tailor Performance / SWaP-C Optimization Levels
8 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Comparison: commonly integrated small form factor (SFF) modules
PCIe104
(90 x 96 mm)
COM-Express Compact
(95 x 95 mm)
PCIe Mini
(30 x51 mm)
XMC
(149 x 74 mm) 3U VPX
(160 x 100 mm)
Continuum of rugged standards-based module building blocks to choose from
to tailor system performance / SWaP-C optimization levels
COM-Express Basic
(125 x 95 mm)
SMARC-full SoM
(82 x 80 mm)
SMARC-short SoM
(82 x 55 mm)
9 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Computing Networking
Board-Level
DuraMAR
DuraCOR® Mission Computers DuraMAR® Mobile IP Routers
DuraNET® Ethernet Switches
PC104 SBC, Power, I/O, Ethernet
Multi-Function DuraWORX® Computer + Router
DuraNET
Parvus Dura System Product Line (DuraCOR / MAR / NET / WORX)
10 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Rugged SFF Open Architecture Systems
Based on Rugged, Modular Small Form Factor (SFF) Building Blocks:
• Open Architecture: PC104, COM-Express, Mini-PCIe, mSATA, etc.
• Typically No Backplane: Lego-Like Stacking / Carrier Board Slot Architecture
• Rugged: Extended Temp Boards (-40◦ to +85◦C), Fanless, Shock/Vibe-Resistant
• Large Module Ecosystem: 100+ Suppliers of Interoperable Cards
• x86 PC Software Compatibility: Linux, Windows, etc
Low Size, Weight & Power-Cost (SWaP-C) Architectures (examples):
• Small Form Factor Modules
• PCIe104: 3.6” x 3.8” (90x96mm)
• COM-Express (95x95mm for COMe Compact)
• Mini-PCIe: (30x51mm / 30x27mm)
• mSATA (same as Mini-PCIe)
• Low Power: 2 to 50 Watts (Typical)
• Affordable: Fraction of VPX / VME Architecture
PCIe104 SBC & I/O Cards:
Stacking CPU, GPU, FPGA,
DIO, Serial, Ethernet Modules
for complex I/O requirements
COM-Express: CPU
Mezzanine Module with
Standardized Pinout
Integrates with Carrier Board
Mini-PCIe I/O Modules:
MIL-1553, ARINC429, Serial,
Ethernet, CAN, ADIO, Wireless,
Video Cards, etc.
mSATA SSDs
(87% smaller and 90% lighter
than a 2.5” solid state drive)
11 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Rugged SFF Open Architecture Systems Ruggedized Single Board Computer (SBC)
– Conformal Coating (for humidity and tin whisker mitigation)
– Underfilling of BGAs, staking of large components (for shock/vibe)
– Extended temperature components/screening (for thermal reliability)
– Minimal (or no) wiring harness/cables internally (for shock/vibe and
manufacturability (Rather, board to board interfaces or flex cabling)
Vehicle / Aircraft Power Supply
– 1500 VDC Isolated DC-DC Converter (28VDC Nominal)
– Surge/Spike Transient Protections per MIL-STD-1275D & 704F
– Built-in Power Conditioning & EMI Filtering per MIL-STD-461F
Near Cable-less Electrical Design:
PSU & Breakout boards for PCIe104 Corei7
SBC I/O and MIL-DTL-38999 Connectors
12 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Rugged Mechanical Design
Rugged Mechanicals
• IP67 Sealed (Dust/Water Proof) Enclosures
• Aerospace-Grade Aluminum-Alloy Enclosure
• Extruded / machined / sheet metal / brazed
• O-Ring gaskets for ingress protection
• Hardware torque spec’d for optimal sealing
• Rugged Connectors
• Circular MIL-DTL-38999 (or similar) Connectors
• Pre-installed spare I/O connectors/pins for add-on I/O cards
• Passive Thermal Management
• No Moving Parts / No Coldplate Required (Bolt it Down Anywhere and Go)
• Passive Thermal Management Devices (Heatpipes / Heatspreaders)
• PCB Clamshell Thermal Plates/Conduction Path to Chassis SBC Heatpipe/Spreader
SBC Heat Spreader w/
Embedded Copper Plugs
Enclosure Heatsink
Modular Chassis
13 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Rugged System Approach – Typical Qual Testing
MIL-STD-810G (Environmental) Qual-Tested (& RTCA/DO-160 for New Models) • Operating Temp.: -40ºC to +71ºC (-40ºF to +160ºF) Ambient (select models:-40ºC to +85ºC)
• Storage Temp: -40ºC to +85ºC (-40ºF to +185ºF); Newer Models: -55ºC/+85ºC
• Operating Shock: 40g, 11ms, 3 pos/neg per axis, 18 terminal peak sawtooth pulses
• Crash Safety Shock: 75g, 11ms, 2 pos/neg per axis, total 12 sawtooth
• Random Vibration: 3 Axes, 1 Hour/Axis (per Jet- Helo and Tracked Vehicle Profiles)
• Humidity: Up to 95% RH @ 40C, Non-Condensing
• Water Immersion: 1 Meter Submersion, 30 Minutes
• Dust Ingress: No Dust Ingress per Method 510.4
• Altitude: Up to 50,000ft Operational / 60,000ft Storage (for newer models)
MIL-STD-461F (EMI) Qual-Tested (& RTCA/DO-160 for New Models) • Conducted Emissions, CE102, Power Leads, 10 KHz to 10MHz, basic curve
• Conducted Susceptibility, CS101, Power Leads, 30 Hz to 150 KHz, Curve 2
• Radiated Emissions, RE102, Electric Field, 10 KHz to 18 GHz, Figure RE102-3
• Radiated Susceptibility, RS103, Electric Field, 2MHz to 18 GHz, 200V/m
Other Tests as Needed: i.e. MIL-S-901D, etc.
14 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Pre-Integrated MCOTS Systems
Pre-Integrated Subsystems
System Modularity = Many Permutations / Variants Possible
• Various CW/3rd Party I/O Module Options (PCIe104, Mini-PCIe)
• Add: MIL-STD-1553, ARINC429, Video Encoders, DIO, Ethernet, etc.
• Internal/Fixed/Removable Storage Options (Capacities/OS/Type), etc.
• Special Order: Different Connectors, Mechanical Modifications
Modified COTS (MCOTS) Variants Available Pre-Integrated by Factory
• Consult with Parvus Systems Application Engineering Team –
Minimize Customer Risk, Accelerate Schedule via Turnkey MCOTS
• Responsive & Cost-Competitive Subsystem Integration Services
• Initial Prototypes Delivered within Weeks (2-8 Typical)
• Without Traditional NRE (rather, Recurring Integration Fee)
• MCOTS Often Qualified by Similarity Analysis without NRE
• Numerous Pre-Qualified 3rd party I/O Cards
Support Mission-Specific
I/O Interfaces
(e.g. Avionics / Vehicle Databus,
GPS, Video Capture, Legacy
Radio Interfaces)
15 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Quality, Longevity, Export Control
Commercial / Dual-Use COTS Products
• ITAR-Free, EAR Export Controlled (US Commerce Dept)
Quality Manufacturing
• AS9100 Rev C Aerospace Quality Audited Production
• Preferred Supplier Status for On-Time Delivery and Quality
• Salt Lake City (USA) Manufacturing Facilities Optimized for
High Quality Typical of Military Programs; Scalable for Large Programs
• High Workmanship Standards to IPC Specifications
• Counterfeit Parts Prevention Program
• QA Inspections; 100% ATP testing; Env. Stress Screening Available
Longevity of Supply/Service
• Objective: Minimum 8 years Standard Product Lifecycle • 6 Month Customer Last Time Buy Notifications + Migration Path Planning
• Component Obsolescence Monitoring – Config. Manag. Control Option
• Multi-Year Extended Service Contracts Available
16 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
DuraCOR®: Small Form Factor Mission Computers
DuraCOR 810
DuraCOR 810-Duo
DuraCOR 820 DuraWORX 10-10 / 10-11
Roadmapped
(Core i7 Computer + Cisco Router) (Core i7 Gen 5)
Typical Features:
• Multi-core Intel x86 CPU
• PCIe bus (or legacy PCI / ISA)
• PCIe104 / Mini-PCIe I/O Slots
• Flash SSD(s)
• IP67 Aluminum Chassis
• MIL-DTL-38999 Connectors
• MIL-STD-1275/704/DO-60 Power
• Environmental / EMI Tested:
MIL-STD-810G, MIL-STD-461F / DO-160 DuraCOR 80-41
DuraCOR 80-42 DuraCOR 80-40
(Haswell,
Quad-Core)
(SandyBridge,
Dual-Core)
DuraCOR 830
17 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Selecting the Right Mission Computer...
80-41 80-40 810-Duo 810 830 820
Processor
Intel Core i7-4700EQ
(4th Gen)
Intel Core i7-2655LE
(2nd Gen) Intel Core2Duo L7400 Intel Pentium M 738 Intel Atom Z530 Intel Pentium M 738
Architecture 64-Bit, 4-Core 64-Bit, 2-Core 64-Bit, 2-Core 32-Bit, 1-Core 32-Bit, 1-Core 32-Bit, 1-Core
Size (cubic inches) 139 / 223 / 307 186 / 270 / 354 298 298 155 92
Weight (lbs) 6.0 / 7.4 / 8.8 8.5 / 9.9 / 11.3 8 7.8 4 2.9
Power Consumption < 75 W < 50 W < 40 W < 25 W < 16 W < 24 W
Power Supply 200 Watt 200 Watt 100 Watt 100 Watt 50 Watt 50 Watt
Expansion Slots
2x Mini-PCIe,
0 / 3x / 6x PCIe104 0 / 3x / 6x PCIe104 6x PCI-104 Slots 6x PC/104-Plus Slots 2x PC/104-Plus Slots -
Bus
PCI-Express
(PCIe104) PCI-Express (PCIe104) PCI (PCI-104)
PCI, ISA
(PC/104-Plus)
PCI, ISA
(PC/104-Plus)
PCI, ISA
(PC/104-Plus)
RAM 16 GB 8 GB 2 GB 1 GB 2 GB 1 GB
Storage
2x mSATA, 1x eSATA,
2x 2.5” SATA 2x 2.5” SATA
2x CF, 1x 1.8" SATA, 1x
eSATA 1x CF
1x CF +
1x SSD Internal 1x CF
USB 6x (incl. 2x USB3.0) 6x USB 2.0 6x USB 2.0 4x USB 2.0 3x USB 2.0 3x USB 2.0
Serial
2x RS232, 2x RS422,
1x RS485 2x RS232 2x RS232 2x RS232 2x RS232 2x RS232
Ethernet 2x GigE 2x GigE 1x GigE + 1x 10/100 1x 10/100 1x GigE 2x 10/100
Video 1x VGA, 2x DP++ 1x VGA, 1x HDMI 1x VGA, 1x LVDS 1x VGA 1x VGA 1x VGA
Audio Yes Yes Yes Yes Yes -
GPIO 7x 16x - - 8x 8x
MIL-STD-810G Yes Yes Yes Yes Yes Yes
MIL-STD-461F Yes Yes Yes Yes Yes Yes
MIL-STD-1275D Yes Yes Yes Yes Yes -
MIL-STD-704F Yes Yes Yes Yes Yes Yes
RTCA/DO-160 Yes Yes No No No No
DuraCOR 820
DuraCOR 830
DuraCOR 810-Duo
DuraCOR 810
DuraCOR 80-40
DuraCOR 80-41
18 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
New Product Highlight: DuraCOR 80-41
Product Parvus DuraCOR 80-41 Mission Computer
Processor Intel Core i7 (4th Gen “Haswell”), 4-core, 2.4GHz (3.4GHz w/Turbo
Boost), Intel QM87 Chipset, Intel GT2-4600 GPU
RAM 16 GB
TPM Atmel AT97SC3204 Trusted Platform Module (TPM)
Storage (Fixed) Up to 2x Internal mSATA SSD Slots (64GB-256GB Capacity)
Add-on 2.5” SATA 1 / 2-Disk SSD Segment (up to 1 TB/each)
Storage (Removable) Add-on 1 / 2-Disk 2.5” SATA SSD Segment (up to 1TB/each)
I/O Modularity
(PCIe Bus Expansion)
- Up to 2x PCIe-Mini Card I/O Slots (Internal to Base System)
with 60+ pins on DTL-38999 Connectors Reserved for I/O
- Up to 2x PCIe104 Add-on Segments (3x PC104 I/O Card Slots
Per Segment with 132-Pins each on DTL-38999 Connectors)
USB 6x Ports (2x USB 3.0, 4x USB 2.0)
Network 2x Gigabit Ethernet (GbE) Interfaces
COM 5x Serial Ports (2x RS232, 2x RS422, 1x RS485)
Video 3x Indep. Displays: 1x VGA, 2x DisplayPort++ (DP/HDMI/DVI)
Audio Stereo Audio and Microphone (Left/Right)
Discrete / GPIO 7x General-Purpose Digital I/O (3IN, 4OUT)
eSATA Supported, for Direct Attached Storage Device
Size (base system) ~135 in³ (add ~ 84 in³ per I/O expansion segment added)
Weight (base system) < 6.0 lbs (add ~ 1.5 lbs per I/O expansion segment added)
Ingress Protection Dust and Water Proof (Similar to IP67)
Power Supply 200 Watt, MIL-STD-704/1275/DO-160 Compliant (12-36VDC)
Power Consumption < 75 W
Cooling Passive, No Moving Parts, Natural Convection
Temperature -40 to +71C per MIL-STD-810G, DO-160G
Shock/Vibe 40G Shock, Jet-Helo-Tracked Vehicle Vibe per MIL-810, DO-160G
EMI/EMC CE/RE/CS/RS per MIL-STD-461 + DO-160G
Parvus® DuraCOR® 80-41 Mission Computer
• Quad-Core, 4th-Gen Intel Core i7 Modular Processor System
• 25% Size and Weight Reduction from Previous Generation
• Rugged IP67 (Dust/Waterproof) Chassis w/ Modularity (I/O & Storage)
• Base I/O: 6x USB, 2x GbE, 5x COM, 3x Video, 7x DIO, eSATA, Audio
• Application-Specific I/O Expansion via Mini-PCIe + PCIe104 I/O Cards
• 2x Mini-PCIe Module Slots in Base System
• Up to 6x PCIe104 I/O Cards (via Add-on PC104 I/O Expansion Segments)
• SATA SSDs (2x mSATA Internal Slots / Opt. 2.5” Removable SSDs)
• 28V DC MIL-STD-1275/704/DO-160 Power Supply
• MIL-STD-810G / DO-160 / MIL-STD-461F Qual Testing Pending
19 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Carriers with Mezzanine Cards Shrink Multi-core x86 Mission Computers
Hybrid Board Form Factor I/O Expansion Promotes Flexibility and Size/Weight Reduction
Couple Together Strengths of Open Standard SFF Modules to Reduce SWaP
• While Leveraging Multi-Vendor, Interoperable Module Ecosystem
DuraCOR 80-40
2nd Gen Core i7
(PCIe104-based)
DuraCOR 80-41
4th Gen Core i7
(COMe, PCIe104,
Mini-PCIe-based)
Mini PCI-E Card (30 x 51 mm or 30 x 27 mm)
mSATA SSD (30 x 51mm or 30 x 27 mm)
PCIe104 Expansion Cards (90x96 mm)
Mini PCIe I/O Module
Slots: MIL-1553, ARINC429,
Serial, Ethernet, CAN, ADIO,
Wireless, Video, etc.
mSATA SSD Slots
(87% smaller and 90% lighter
than a 2.5” solid state drive)
PCIe104 I/O Card
Expansion (GPU, FPGA,
DIO, Serial, Ethernet) for
complex I/O requirements
COM-E Module
Carrier Card
PCIe104 PCIe Mini / mSATA
COM-Express: Standardized
Pinout Enables Next Gen i7
Module to Drop Onto Carrier;
Memory on Top Gives Direct
Thermal Interface to Chassis
COMe Compact (95x95 mm)
Size and Weight Reduction:
• Fewer mechanical parts for
thermal and storage
• Fewer interconnect parts to
bring out SBC I/O signals
• Integrate Multiple Type I/O
Expansion and Storage Slots
20 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
DuraCOR 80-41: Scalable Architecture
21 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
DuraCOR 80-41: I/O & Storage Modularity
PCIe104 I/O Card Expansion
Internal I/O Expansion:
- 1 Slot Mini-PCIe (Dedicated)
- 1 Slot Mini-PCIe / mSATA (Shared)
Internal Storage:
- 1 Slot mSATA Half-Size (Dedicated)
- 1 Slot mSATA / Mini-PCIe (Shared)
Add-on: Single / Dual PCIe104 I/O Expansion Segment(s):
- 2x 66-Pin DTL-38999 Connectors for
PC104 Card I/O per Segment (Fits up to 3 Cards Each)
1-Slot 2.5” Removable SSD
2-Slot 2.5” Removable SSD
1 or 2 Disk 2.5” Fixed SSD
Modular, Interlocking Segments Scale Functionality
External SATA (eSATA) on 38999
for Direct Attached Storage Device
Add: Application-Specific I/O Modules:
- MIL-STD-1553, ARINC429, Serial, Ethernet,
Video Frame Grabber, GPS, Wi-Fi, CANbus,
DIO, USB, Analog I/O, etc.
22 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Boosting Performance with Intel “Tick-Tock” Processor Advancements
Multi-core processors from Intel reduce power consumption / watt and boost performance • 5th Gen Core i7 (Broadwell) Mission Computer – to be Announced in 2015 (DuraCOR 80-42)
• Continued Improvement in GPU/CPU MIPS per watt performance
with 14nm geometry die shrink
• Estimated 60% improvement in GPU performance
Tock 32nm (Sandy Bridge)
Tick 32nm (Westmere)
Tock 22nm (Haswell)
Tick 22nm (Ivy Bridge)
Tock 14nm (Sky Lake)
Tick 14nm (Broadwell)
DuraCOR 80-41
DuraCOR 80-42
DuraCOR 80-40
23 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Roadmap: 5th Gen Core i7 Mission Processor
DuraCOR 80-41:
• 4th Gen 22nm
CPU/GPU
• High-Speed I/O:
USB 3.0, PCIe
Gen 3 Bus,
DP++, GbE
• Flexibility: Built-in
Mini-PCIe I/O &
mSATA SSDs
DuraCOR 80-42
• Same chassis
and I/O pinout
• 5th Gen 14nm
CPU/GPU (more
perf / watt)
• 50/250ms Power
Hold-up
• N+1 Power
Redundancy
• Built-in-Test (BIT)
• More EMI Testing
Highlights:
24 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
DuraNET 10-10
Layer 2+ IOS Managed Layer 2 / 3 IOS Managed
Datacenter Class - Layer 2 / 3 IOS Managed
2x
17x
GigE
10/100
DuraNET 1268
10x GigE
Lightly Managed
10/100 5x
GigE
10/100
2x
8x / 16x / 24x
10G
GigE
3x
49x DuraNET 1059
Unmanaged
Fully Managed Layer 2+
DuraNET 20-10
20x GigE
DuraNET 30-2020 (Cisco ESS 2020-based)
DuraNET 3000 (Cisco IE-3000-based)
DuraNET 4948 (Cisco Catalyst 4948E-based)
10/100 1x
Unmanaged
10/100 5x
DuraNET® Ethernet Switch Box Product Line
20-11
8x GigE
25 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
MIL-38999
(IP67)
M12 (IP67)
DuraMAR 5915
DuraMAR 31-5915
RJ-45 (IP67)
Ethernet Switch
Router
Low SWaP-C rugged mobile IP network
router/switch subsystems for extreme tactical
vehicle / aircraft / outdoor deployments
Featuring Advanced Cisco IOS software security
and mobile networking features
Dust + waterproof, fanless, shock/vibe resistant
rugged chassis, MIL/industrial connectors,
MIL-STD power supply, MIL-STD Qual
5x 10/100
DuraMAR: Secure Mobile Router Subsystems
5x 10/100
4x 10/100
15x GbE
21x 10/100
2x GbE
4x 10/100
19x GbE
“1X” Variant “2X” Variant “3X” Variant
“0X” Variant
Router
Router
26 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Compare/Contrast DuraNET models:
10-10 1059 20-11 1268 20-10 30-2020 3000 4948
Layer 2/3 Layer 2 Layer 2
Layer 2
+ Static L3 Layer 2
Layer 2
+ Static L3
Layer 2
+ Static L3 Layer 2 / 3 Options Layer 2 + 3
Management Unmanaged Unmanaged Managed Managed Managed Managed Managed Managed
Software - -
Vitesse CE
Services
Parvus
Firmware
Vitesse CE
Services
Cisco IOS
Cisco IOS
Cisco IOS
Size (inch³) 99 110 10 152 112 126 220 / 354 / 358 1518
Weight (lbs) 3.5 1.9 0.50 5.0 4.0 5.0 6.8 / 9.9 / 10.4 23.0
10/100 5x 5x - - - 17x 8x / 16x / 24x 1x
GigE - - 8x 10x 20x 2x 2x 49x
10Gig - - - - - - - 3x
Fiber Optic - - - 2x / 4x Opt - - - 2x
Connectors M12 / RJ45 DTL-38999
Micro-mini
DTL-38999
DTL-38999 /
TFOCA II DTL-38999 DTL-38999 DTL-38999 DTL-38999
Ingress IP67 IP65 IP67 IP67 IP67 IP67 IP67 IP21
Cooling Passive Passive Passive Passive Passive Passive Passive Forced Air
VDC Input 12V / 28V 28V 12V / 28V 28V 12V / 28V 12V / 28V 28V (18-60V) 28V
Power Cons. < 8 W < 8 W < 8 W < 25 W < 20 W < 20 W < 25 W < 275 W
MIL-704 - Yes Yes Yes Yes Yes Yes Yes
MIL-1275 - - Yes Yes Yes Yes Yes -
Zeroize - - Yes Yes Yes - - -
Oper. Temp -40 to +85C -40 to +85C -40 to +85C -40 to +71C -40 to +71C -40 to +71C -40 to +71C -40 to +54C
MIL-STD-810 - Yes Yes (pend) Yes Yes Yes Yes Yes
MIL-STD-461 - - Yes (pend) Yes Yes Yes Yes Yes
DO-160 - - Yes (pend) Yes Yes Yes - -
DuraNET 30-2020
DuraNET 4948
DuraNET 10-10
DuraNET 3000
DuraNET 1059
DuraNET 1268
DuraNET 20-10 / 20-11
27 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Curtiss-Wright / Cisco Partnership
• Cisco Solution Technology Integrator (STI)
• Leverage Cisco brand preference (50-60% market share), Cisco IOS
familiarity & IT staff training for Cisco technology
Repackage Cisco Systems technology
• Harden Cisco IOS-managed Ethernet switches and routers
• Equip with rugged chassis, connectors, power supply
• Qualify to MIL-STD/DO-160 standards (environmental, EMI)
• Enable proven and familiar Cisco IOS security, mobile networking
technology to be deployed in extreme tactical apps
Commercial Version
• Tactical Communications on the
Move / Satcom
• Attack Helicopters and
Unmanned Air Systems
• Tactical Ground & Amphibious
Assault Vehicles
• Missile Defense Systems
• Littoral Combat Ships &
Unmanned Surface Vehicles
• Commercial Space Flight
Program Support
Select Models Integrate Ruggedized Cisco Technology
Ruggedized Version
28 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Scaling x86 LRU Consolidation Through Modular Chassis Design
+ +
Core i7 Computer Cisco Router DuraNET 20-10 / 30-2020 Switch DuraWORX 10-11 Multifunction LRUs
=
Consolidate Multiple Functions in One (vs Distributed)
• Scalable System Architecture – Reduce SWaP & Simplify
Systems Integration (Cabling, Power, Installation)
• DuraMAR 5915 “2X” and “3X” Series Systems Combine
Cisco Router + Ethernet Switches into one LRU
• DuraWORX Systems Combine DuraCOR Mission Processor +
DuraMAR Router + DuraNET Switch
• DuraWORX 10-11: Haswell Core i7-based
• DuraWORX 10-10: Sandy Bridge Core i7-based
Scale Standalone Line Replaceable Unit (LRU) Hardware Functions with Modular Architecture –
Reduce SWaP & Simplify Systems Integration (Cabling, Power, Installation)
29 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Design Highlights: DuraNET 20-10
Ethernet Switch
Router
DuraMAR 5915 Router Variant w/Integrated
DuraNET 20-10 Switch Option Roadmapped 2014
Side Boss Mounts (x2) Base Flange Mounts (x4)
Vertical / Horizontal Orientation
Modular Chassis: Factory Mateable with DuraCOR 80-40/41
Computer & DuraMAR 5915 Router or as
Router/Computer/Switch Combo as
“DuraWORX”
SWI-22-10
Gigabit Ethernet Switch
PWR-22-11
MIL-704/1275 Power
+
Rugged PC104 Subassemblies
Software Highlights: VITESSE Carrier Ethernet (CE) Services
Software (Same as DBH & SMS-652)
Zeroize & Built-in-Test (BIT) Support
IEEE-1588v2 Precision Timing Protocol
SNMPv3, HTTP Server, Web GUI, RS-232
Console CLI, IPv4/IPv6 Layer 3 Static IP
Routing, Port Monitoring, RMON, Syslog, 802.1X
Authentication, IGMP Snooping, Access Control
Lists (ACLs), IPv4 / IPv6 Multicast, VLAN, QoS /
CoS Traffic Prioritization, Multiple/Rapid
Spanning Tree, Link Aggregation
30 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
New Product Highlight: DuraNET 20-10 / 20-11
• Rugged Low-SWaP Gigabit Ethernet Switch Box Systems
• Ports: 8x GbE ports (20-11), 20x GbE ports (20-10)
• Size: 10 in³ (20-11), 112 in³ (20-10)
• Weight: 0.50 lb (20-11), 4.0 lbs (20-10)
• Power (max): < 8 Watts (20-11), < 25 W (20-10)
• Key Features:
• Fully managed Layer 2+ Gigabit Ethernet Switches (supports static L3 routing)
• Rugged design with full MIL-STD and DO-160 qual testing
• Operating Temp: -40 to +85C (20-11), -40 to +71C (20-10), natural convection
• Carrier Ethernet network management: SNMPv3, Web GUI, Serial CLI, IPv4/IPv6,
Port Monitoring, 802.1X authentication, Access Control Lists (ACLs), QoS/CoS Traffic Prioritization,
MSTP/RSTP, IGMP Snooping, Link Aggregation….
• IEEE-1588v2 Precision Timing Protocol
• Zeroize & Built-in-Test (BIT) Support
• Power Management Features – reduces power consumption from unused/idle ports
8x GbE
RS232 Console
Zeorize
Power Input
31 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Evolutionary Miniaturization Continues with GbE Switching
8x GbE
RS232 Console
Zeorize
Power Input
Re-use of technology optimized for
smallest/lightest physical package
SWITCH DuraNET 20-10 DuraNET 20-11
SIZE 112 in3 10 in³
WEIGHT 4.0 lbs 0.50
POWER < 25 W < 8 W
Ports 20x GbE 8x GbE
Architecture
PC104, Modular
Chassis Purpose-Built PCBA/Chassis
DTL-38999 Connectors
Micro-Miniature
DTL-38999-like Connectors
32 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Paradigm Shift in SWaP Reduction for Ethernet Switches
SWITCH SMS-684 DBH-670 DuraNET 1268 SMS-652 DuraNET 1059 DuraNET 20-10 DuraNET 20-11 DuraNET 20-12
SIZE 313 in³ 236 in³ 204 in³ 178 in³ 124 in3 112 in3 10 in³ 10 in³
WEIGHT 12 lbs 6.5 lbs 4.8 lbs 5 lbs 1.9 lbs 4.0 lbs 0.50 0.54
POWER < 60 W < 25 W < 25 W < 20 W < 8 W < 25 W < 8 W (est) < 5 W (est)
Ports 24x GbE + 4x 10G 16x GbE 10x GbE 16x GbE 5x 10/100 20x GbE 8x GbE 6x 10/100
Oper. Temp -40 / +70C -40 / +71C -40 / +71C -40 / +75C -40 / +85C -40 / +71C -40 / +85C -40 / +85C
< 10% of Size of Next Smallest CW Switch System
0
50
100
150
200
250
300
350
System Size (in Cubic Inches)
DuraNET 20-11 DuraNET 20-10
UAS Platforms Particularly
Driving Demand for Connectivity
w/ Low SWaP & Low EMI
33 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Details: Miniaturizing Low-Power Mission Computing
SOM/COM
Carrier Board + PSU
Spare Pins for Expansion I/O
PCIe-Mini
I/O Slot(s)
Shrinking the Computer: “DuraCOR Mini”
• Variants with Low-Power (a) ARM, (b) x86 Processors • Freescale i.MX6-based ARM Processor (quad-core)
• Intel Atom E8000 x86 Processor (single/dual/quad-core)
• Integrated -40/+85C Rugged SOM/COM CPU Module
• < 1.0 lb Weight, < 30 Cubic Inches Size, < 5-10 Watts Power
• I/O Expansion: Mini-PCIe I/O / mSATA SSD Module Site(s)
• Power Conditioning/EMI Filtering (MIL-STD-704 / 1275 / DO-160)
• MIL-STD-810G / MIL-STD-461F / DO-160 Qual Testing
• Rugged IP67 (Dust/Waterproof) Extended Temp Chassis
• Vetronics I/O & I/O Expansion Capabilities
• GbE, USB, CANbus, Serial, Video, Audio (I/O TBD)
• Mini-PCIe I/O Expansion Card Slot
(i.e. for MIL-STD-1553/ARINC429/etc.)
34 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Shrinking Standalone Mission Computing through Lower-Power CPUs
PRODUCT DuraCOR 80-40 DuraCOR 80-41 DuraCOR "Mini”
SIZE 186 in³ 139 in³ < 30 in³
WEIGHT 8.5 lbs 5.5 lbs < 1.0 lb
POWER
< 50 W
(x86, 64-bit, 2-core)
< 75 W
(x86, 64-bit, 4-core)
< 10 W (x86, 32-bit, 1-4-core)
< 5 W (ARM, 32-bit, 1-4-core)
25% Reduction 75% Reduction
Power-efficient multi-core ARM and x86 SystemOnChip (SoCs) CPUs are enabling
smaller form factor computers with less thermal management requirements
• Freescale i.MX6 ARM or Intel Atom
x86 Baytrail CPU (1 / 2 / 4-cores) on
System on Module (SOM)
• I/O and storage expansion via small
form factor Mini-PCIe + mSATA slots
35 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Summary
• Miniaturization of components (ICs, SOCs, connectors etc) enable new
levels of rugged system miniaturization
• Intelligent use of modular open architectures can support scalability of
I/O, various classes of processor performance, and form factor
• Multi-core low-power processors (ARM, x86) enable size/power system
reduction
• Software-based add-on functionality can combine multiple functions into
one (networking, computing)
36 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright
Q&A
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