Showcasing Photonics and Optical Technologies and Applications€¦ · Semiconductor Lasers and...

Photonics Asia 2007 • spie.org/events/pacall • TEL: +1 360 676 3290 • [email protected] 1

Call For Papers

Publish your work • Hear the latest research • Network with your peers

High Power Lasers

Semiconductor Lasers and Applications

Materials, Devices and Sensors for Sensingand Imaging

Optics in Health Care and Biomedical Optics

Solar Energy Technology and Solid StateLighting

MEMS and Nano Technologies andApplications

Optical Data Storage

Information Optics and Nonlinear Optics

Advanced Microlithography

Infrared Technologies

Electronic Imaging

Holography

Optical Design and Testing

Sponsored by:

SPIE

Chinese Optical Society (COS)

Showcasing Photonics and Optical Technologies and ApplicationsConferences · Exhibition

11–15 November 2007 · Jiuhua Grand Convention and Exhibition Center · Beijing, China

Photonics Asia 2007 • spie.org/events/pacall • TEL: +1 360 676 3290 • [email protected]

Please join us in Beijing for Photonics Asia 2007!

Photonics and optical technologies are becoming increasingly important in healthcare and medicine, environment and energy, manufacturing, information systemsand communications, display, defense and aerospace, entertainment, etc. ManyAsian countries are investing heavily in photonics technology with exciting newdiscoveries and new products. Asia photonics markets are dynamic andexpanding rapidly. For example, there are at least eight optics and photonicsvalleys in China, including the Wuhan Optics Valley, Beijing-TongzhouOptomechanical Technology Enterprise zone, Changchun Photonics Cluster,Guangdong Photonics Cluster, Shanghai Optoelectronics Base, XianOptoelectronics Campus, Zhejiang Optoelectronics Development Zone,Chongqing Photonics Campus.

Photonics Asia intends to be the must-attend event for the global photonicscommunity who need to keep up with what is happening in Asia optics andphotonics industry, especially the dynamic Chinese optics and photonicsindustry, and develop new partnerships and new markets. It will provide a uniqueforum for the reporting and review of new developments in photonics andoptoelectronics ranging from material and devices to advanced systems andapplications. Cutting-edge technologies, applications, product announcementand demonstration, market analysis and investment opportunities will bediscussed in various conference sections and products exhibition. Theconference will include a plenary session, parallel technical sessions, paneldiscussions, and product exhibition. Various exciting social programs are alsoplanned.

You are encouraged to submit your abstract and paper summary to the followingconferences and related topics. All accepted papers (oral or poster) will bepublished in SPIE Proceedings reviewed by Photonics Asia 2007 conferencechairs and program committees. SPIE proceedings are indexed in EI, INSPEC,ISI, AIAA and other leading scientific indexes.

Photonics Asia 2007General Chairs



Bingkun Zhou,COS President,Tsinghua University (China)

Brian Culshaw,2007 SPIE President,University of Strathclyde (UK)


Call For PapersCall For Papers

Photonics Asia 2007 Chairs, Committees, and Cooperating Organizations

Submit your abstract today!

spie.org/events/pacall

Sponsored by:SPIECOS—Chinese Optical Society

Supported by:China Association for Science and

Technology (CAST)National Nature Science Foundation

(NNSF)The Ministry of Science and Technology,

China

Cooperating Organizations:Japan Optical SocietyKorea Optical SocietyAustralia Optical SocietySingapore Optical SocietyBeijing Institute of TechnologyBeijing University of Posts and

TelecommunicationPeking UniversityTsinghua UniversityZhejiang UniversityChangchun University of Science and

TechnologyUniversity of Shanghai for Science and

TechnologyShanghai Jiao Tong UniversityTianjin UniversityNankai UniversityShanghai Institute of Optics and Fine

MechanicsˇCASChangchun Institute of Optics and Fine

Mechanics, CASInstitute of Semiconductor, CASInstitute of Optics and Electronics, CASShanghai Institute of Optics and Fine

Mechanics, CASChina Instrument and Control Society, CISChina Solid State Lighting Research and

Industry AllianceOptoelectronics Technology Committee,

COS

General Chairs:Brian Culshaw, 2007 SPIE President,

University of Strathclyde (UK)Bingkun Zhou, COS President, Tsinghua

University (China)

General Co-Chairs:Arthur Chiou, National Yang-Ming University

(Taiwan, China)Mitsuo Takeda, Univ. of Electro-

Communications (Japan)Chungli Bai, Chinese Academy of Sciences

(China)Seung-Han Park, Yonsei University (Korea)Zhizhan Xu, Shanghai Institute of Optics and

Fine Mechanics, CAS (China)Jianlin Cao, China Ministry of Science and

TechnologyJunhao Chu, Shanghai Institute of Technical

Physics, CAS (China)Jingming Kuang, Beijing Institute of

Technology (China)Xiaomin Ren, Beijing University of Posts and

Telecommunication (China)Dingbo Kuang, Shanghai Institute of

Technical Physics, CAS (China)Guozheng Yang, Institute of Physics, CAS

(China)

Honorary Chair:Daheng Wang, Chinese Academy of

Sciences (CAS)Guoguang Mu, Nankai University (China)

Technical Program Chair:Songlin Zhuang, Shanghai University of

Science and Technology (China)

Technical Program Co-Chairs:Xun Hou, Xian Institute of Optics and

Precision Mechanics of CAS (China)Qian Mao, Wuhan Research Institute of

Posts and Telecommunications (China)Xu Liu, Zhejiang University (China)

Local Organizing Committee Chair:Shusen Xie, Fujian Normal University (China)

Local Organizing Committee Co-Chairs:Guoqiang Ni, Beijing Institute of Technology

(China)Qihuang Gong, Peking University (China)Ying Gu, PLA General Hospital (China)Huilin Jiang, Changchun University of

Science and Technology (China)

General Secretary:Guoqiang Ni, Beijing Institute of Technology

(China)

Administrative Vice General Secretary:Boyu Ding, Beijing Institute of Technology

(China)

Vice General Secretary:Hanyi Zhang, Tsinghua University (China)Ya Cheng, Shanghai Institute of Optics and

Fine Mechanics (China)Zhongwei Fan, Academy of Opto-

electronics, CAS (China)Jianxin Chen, Fujian Normal University

(China)Lan Wu, Zhejiang University (China)Shaowen Wang, Chinese Optical SocietyYuejin Zhao, Beijing Institute of Technology

(China)Chongxiu Yu, Beijing University of Posts and

Telecommunication (China)Jun Ruan, China Solid State Lighting

Research and Industry Alliance

Local Organizing Committee:Kangnan Qi, Beijing Optical Society (China)Chunqing Gao, Beijing Institute of

Technology (China)Tiegen Liu, Tianjin University (China)Lanxing Shao, Shanghai Optical Society

(China)Zaixuan Zhang, Chinese Jiliang University

(China)Hongda Chen, Institute of Semiconductors,

CAS (China)Baosheng Liu, Beijing Optical Society

(China)Xin Wang, Hubei Optical Society (China)Lin Zhai, Chinese Optical Society (China)Zhiqiang Zhu, East China Normal University

(China)Lei Xu, Fudan University (China)Hezhou Wang, Zhongshan University (China)Zhiming Yi, Ofstar Tech (Shenzhen) Co., Ltd.

(China)


Photonics Asia 2007 Cal l for Papers

High-Power Lasers (PA101)Conference Chairs: Dianyan Fan, ShanghaiInstitute of Optics and Fine Mechanics (China);Robert F. Walter, Schafer Corp. (USA)

Program Committee: Willy L. Bohn,Deutsches Zentrum für Luft- und Raumfahrte.V. (Germany); Zhaogu Cheng, ShanghaiInstitute of Optics and Fine Mechanics (China);Tomoo Fujioka, Tokai Univ. (Japan); MaliGong, Tsinghua Univ. (China); Do-Kyeong Ko,Kwangju Institute of Science and Technology(South Korea); Ruxin Li, Shanghai Institute ofOptics and Fine Mechanics (China); Sui-Sheng Mei, North China Research Institute(China); Hansheng Peng, Laser FusionResearch Ctr./CAEP (China); Liejia Qian,Fudan Univ. (China); Fengting Sang, DalianInstitute of Chemical Physics (China); Yi Su,Institute of Applied Electronics (China);Shuangchun Wen, Hunan Univ. (China);Zuyan Xu, Institute of Physics (China);Jianquan Yao, Tianjin Univ. (China); Tai HyunYoon, Korea Research Institute of Standardsand Science (South Korea); Shouhuan Zhou,North China Research Institute of Electro-Optics (China)

Topics:

• solid state, gas, excimer, and otheradvanced lasers

• ceramic lasers• high-average-power lasers• high-power DPL• high-power chemical lasers• laser system for ICF• design and simulation for high-power lasers• high-power fiber lasers• UV lasers• applications of high-power lasers• applications of petawatt lasers• etc.

Semiconductor Lasers andApplications (PA102)Conference Chairs: Lianghui Chen, Instituteof Semiconductors, CAS (China); HiroyukiSuzuki, Nippon Telegraph and TelephoneCorp. (Japan); Paul T. Rudy, QPC Lasers, Inc.(USA)

Program Committee: Yongzhen Huang,Institute of Semiconductors, CAS (China);Takaaki Kakitsuka, NTT Photonics Labs.(Japan); Fouad Karouta, Technische Univ.Eindhoven (Netherlands); Park Liu, ShagrowTelecom Co., Ltd. (China); Yi Luo, TsinghuaUniv. (China); Guangdi Shen, Beijing Univ. ofTechnology (China); Jeffrey E. Ungar, QPCLasers, Inc.; Guoyi Zhang, Peking Univ.(China); Hongliang Zhu, Institute ofSemiconductors, CAS (China); Ninghua Zhu,Institute of Semiconductors, CAS (China)

Recent advances in semiconductor lasers areresulting in improvements in power, spatialbrightness, spectral brightness, and wavelengthreach of the devices from the UV to the Mid-IR.These advances improve performance andreduce cost in diode pumped laser systems andopen the door to enable new direct diodeapplications including materials processing,metrology, printing, display, biomedical, imaging,Raman spectroscopy, etc.

Topics:

• laser diode related materials• epitaxial technology• fabrication and packaging technologies• device physics and simulation• modeling and design• novel devices• characterization technologies for laser

diodes• high-brightness laser diodes• quantum cascade lasers• VCSEL• subsystem using laser diodes• applications of laser diodes• blue-green laser technology• etc.

Lasers in Material Processing andManufacturing (PA103)Conference Chairs: Shusen Deng, ChinaDaheng Corp. (China); Akira Matsunawa,Osaka Univ. (Japan); Xiao Zhu, HuazhongUniv. of Science and Technology (China)

Program Committee: Keming Du, EdgeWaveGmbH (Germany); Yijian Jiang, Beijing Univ.of Technology (China); Yan Li, Peking Univ.(China); Yongfeng Lu, Univ. of Nebraska/Lincoln (USA); Günther Weinmann,Consultant (Germany); Minlin Zhong,Tsinghua Univ. (China)

Topics (suggested):

• laser-induced removal of materials: ablation,desorption, trimming, surface cleaning, etc.

• laser-induced deposition of materials: laser-assisted CVD, laser spread, surfacepyrolysis, laser deposition, etc.

• laser surface modifications: texturing,patterning, hardening, doping, alloying,resistivity changes, welding, cutting,marking, drilling, etc.

• industrial systems: beam delivery systems,laser systems prototyping, engraving,micromachining, processing systems, etc.

• laser inspection and metrology: inspectionand testing systems, processing monitoring,interferometry, sensing, thermometry, etc.


Call For Papers

Optics in Health Care andBiomedical Optics (PA104)Conference Chairs: Xingde Li, Univ. ofWashington (USA); Qingming Luo, HuazhongUniv. of Science and Technology (China);Ying Gu, General Hospital of PLA (China)

Program Committee: Jing Bai, Tsinghua Univ.(China); Britton Chance, Univ. of Pennsylvania(USA); Wei R. Chen, Univ. of CentralOklahoma; Zhongping Chen, Univ. ofCalifornia/Irvine (USA); Jing Cheng, TsinghuaUniv. (China); Zhihua Ding, Zhejiang Univ.(China); James G. Fujimoto, MassachusettsInstitute of Technology (USA); Min Gu,Swinburne Univ. of Technology (Australia);Masamitsu Haruna, Osaka Univ. (Japan); Ho-Pui Ho, The Chinese Univ. of Hong Kong(Hong Kong, China); Fu-Jen Kao, NationalSun Yat-Sen Univ. (Taiwan, China); Beop-MinKim, Yonsei Univ. (South Korea); Jun-Heng Li,Chinese PLA General Hospital (China); HongLiu, Univ. of Oklahoma (USA); Hui Ma,Tsinghua Univ. (China); Shuming Nie, GeorgiaInstitute of Technology (USA); VasilisNtziachristos, Massachusetts GeneralHospital (USA); Yuwen Qin, National NaturalScience Foundation of China (China); JiananY. Qu, Hong Kong Univ. of Science andTechnology (Hong Kong, China); MamoruTamura, Hokkaido Univ. (Japan); Bruce J.Tromberg, Beckman Laser Institute andMedical Clinic (USA); Valery V. Tuchin,Saratov State Univ. (Russia); Guiying Wang,Shanghai Institute of Optics and FineMechanics (China); Kemin Wang, HunanNormal Univ. (China); Lihong V. Wang,Washington Univ. in St. Louis (USA); XunbinWei, Fudan Univ. (China); Shusen Xie, FujianNormal Univ. (China); Da Xing, South ChinaNormal Univ. (China); Songlin Xu, ShanghaiSecond Medical Univ. (China); Chih-ChungYang, National Taiwan Univ. (Taiwan, China);Arjun G. Yodh, Univ. of Pennsylvania (USA);Gilwon Yoon, Seoul National Univ. ofTechnology (South Korea); Shaoqun Zeng,Huazhong Univ. of Science and Technology(China); Jing Zhu, Ren Ji Hospital (China)

Biophotonic technologies are experiencing rapidadvance and have shown tremendous potentialfor diagnosis of diseases, guiding surgicalinterventions, and monitoring therapeutic effects.Optical methods are generally noninvasive andsensitive to unique tissue contrast (absorption,scattering, birefringence, fluorescence, andnonlinear signal generation etc) thatcomplements other biomedical diagnostictechnologies. Optically based instruments/devices can be extremely compact and costeffective, suitable for home, clinic and globalhealth care. The field of biophotonics is highlymultidisciplinary and has been attracting moreand more researchers from physics, chemistry,electrical engineering, biomedical engineering,computer science, nanotechnology, and manyother disciplines. The past few years have alsowitnessed the integration of biophotonics withother technologies, such as optics-acoustics,optics-molecular and nano techniques, optics

and MRI, and optics and positron emissiontomography (PET). Clinical applications ofemerging biophotonics technologies span manyareas including ophthalmology, dermatology,cardiology, gastroenterology, dentistry, urology,and neurology etc. The objective of thisconference is to provide a technical forum forengineers, scientists, clinicians, and health careindustry and government agencies to report,share and learn the latest fundamental,translational and clinical research anddevelopments in the field of biomedical optics,and promote cross-disciplinary, institutional, andinternational collaborations. The topics of thisconference are broad and will cover (but notlimited to) the following:

Topics:

Light-tissue interaction• photo therapy (Photo dynamic therapy, low-

level red light therapy, photo-thermaltherapy etc)

• optical spectroscopy (absorption, elasticscattering, angular-resolved scattering,enhanced backscattering, fluorescence etc)

• bio-optical imaging theory and technology(Diffuse photon, OCT, multiphotonfluorescence, SHG tissue imaging, speckleimaging etc)

• emerging hybrid biomedical imagingtechnologies (photo-acoustic imaging,CARS, optical-MRI, optical PET etc)

• nanomedicine (quantum dots, contrastagents, molecular imaging, nanoparticlebased biosensors, target delivery etc)

• novel imaging devices (optically basedendoscopes, implantable devices, point ofcare devices etc)

• biomedical and clinical applications (opticaldiagnosis, optically guided intervention,optical monitoring of therapy andregenerative medicine, optically basedgenomics, proteomics and physiomics etc).

Quantum Optics and Applications inComputing and Communications(PA105)Conference Chairs: Guangcan Guo, Univ. ofScience and Technology of China (China);Song-hao Liu, South China Normal Univ.(China); Osamu Hirota, Tamagawa Univ.(Japan)

Program Committee: Hoi Fung Chau, TheUniv. of Hong Kong (Hong Kong, China);Luming Duan, Univ. of Michigan (USA);Byoung S. Ham, Inha Univ. (South Korea);Shiqun Li, Tsinghua Univ. (China); JianweiPan, Univ. of Science and Technology ofChina (China); Kunchi Peng, Shanxi Univ.(China); Ling-An Wu, Institute of Physics(China); Andrew C. Yao, Tsinghua Univ.(China); Ming-Sheng Zhan, Wuhan Institute ofPhysics and Mathematics (China); WeipingZhang, East China Normal Univ. (China)

Topics:

• quantum cryptography• entanglement photon resource• long-distance quantum network• quantum computation based on quantum

optics• quantum information• quantum measurement• quantum communication.

Submit your abstract today!spie.org/events/pacall

Critical Dates

Abstract Due Date:15 June 2007

Manuscript Due Date:15 October 2007PLEASE NOTE: Submissions imply theintent of at least one author to register,attend the symposium, present the paperas scheduled, whether it is an oral or posterpresentation, and submit a full manuscript.

Papers from post-meeting Proceedingsof SPIE are published in the SPIE DigitalLibrary beginning at 2 to 4 weeks after themeeting. Print volumes are published andshipped beginning at 6 weeks after themeeting, and symposium CD-ROMs areavailable to ship beginning at 8 weeks afterthe meeting. Manuscripts are dueapproximately 4 weeks before the meeting.



LED Materials and Devices (PA106)Conference Chairs: Chuangtian Chen, BeijingCtr. for Crystal Research and Development(China); Jian Wang, South China Univ. ofTechnology (China); Changhee Lee, SeoulNational Univ. of Technology (South Korea)

Program Committee: Yanbing Hou, BeijingJiaotong Univ. (China); Yuguang Ma, Jilin Univ.(China); Yong Qiu, Tsinghua Univ. (China);Franky So, Univ. of Florida (USA); Ching W.Tang, Univ. of Rochester (USA); Hezhou Wang,Zhongshan Univ. (China); Gang Yu, CBrite, Inc.(USA)

In the field of light-emitting diodes (LEDs),including inorganic LEDs and organic LEDs(OLEDs), technical progress in the materials andthe devices has been breathtaking during the lastfew decades. State of the art inorganic LEDs aresmall, bright, reliable, rugged, and power efficient.The internal quantum efficiency defined by theefficiency of converting electricity to light has beenimproved steadily, and nowadays is made closeto 100% by materials advancements, noveldevice structures, and process improvements.The application of inorganic LEDs in solid statelighting has gained remarkable momentum in thepast few years. From traffic lights to displaybacklights, from outdoor billboards to indoorsignage, inorganic LEDs have become ubiquitousin our lives.

Since the discovery of OLEDs, including smallmolecule OLEDs (SmOLEDs) and polymer light-emitting diodes (PLEDs), it only took a little bit over10 years—research and developments for OLEDstechnology to evolve from attractive to practical forflat panel display applications. In contrast, it tookapproximately 30 years for liquid crystal cells to becommercialized for active matrix LCD products. Byoffering lightweight, thin panel thickness, wide-viewangle, high-self-electroluminescent efficiencies, andless power consumption, OLEDs display technologyis the only serious current challenge to the LCD_sdominance in small and medium-sized displays. Asthe focus of OLEDs displays is shifted from passive-matrix to active-matrix, AMOLED displays areexpected to enjoy the fastest growth this year. Thesuccess story of OLEDs has just begun.

To provide an opportunity for the researchersall over the world seeking to keep abreast of thelatest developments and share their researchand business with each other, on behalf of theOrganizing Committee, we would have the honorto invite you to attend this session dedicated toLED materials and devices. The topics of thissession are broad and will cover (but are notlimited to) the following:• organic light emitting diode technology and

applications• polymer light emitting diode technology and

applications• FPD materials and components• emissive display devices• liquid-crystal displays and systems• laser and luminescent materials• nonlinear optical materials• new materials for displays• materials and devices• display applications.

Advanced Materials and Devices forSensing and Imaging (PA107)Conference Chairs: Anbo Wang, VirginiaPolytechnic Institute and State Univ. (USA);Yimo Zhang, Tianjin Univ. (China); YukihiroIshii, Tokyo Univ. of Science (Japan)

Program Committee: Jun Chen, TokyoPolytechnic Univ. (Japan); Xiangang Luo,Institute of Optics and Electronics (China);Kazuhiko Oka, Hokkaido Univ. (Japan); RibunOnodera, Univ. of Industrial Technology(Japan); Yukitoshi Otani, Tokyo Univ. ofAgriculture and Technology (Japan); Gang-Ding Peng, Univ. of New South Wales(Australia); Yun-Jiang Rao, Univ. of ElectronicScience and Technology of China (China);Tsutomu Shimura, The Univ. of Tokyo (Japan);Hong-Bo Sun, Jilin Univ. (Japan); MitsuoTakeda, The Univ. of Electro-Communications(Japan); Yaolin Wang, Shanghai Institute ofMetallurgy (China); Hai Xiao, Univ. of Missouri/Rolla (USA); Miao Yu, Univ. of Maryland/College Park (USA)

Today the development of advanced sensing andimaging heavily depends on advances in keymaterials and devices for better sensitivity,responsivity, functionality, and environmentalcapability. The objective of this conference is toprovide a forum for photonic scientists,engineers and industrial experts to present anddiscuss the current state and the cutting-edgeinnovation in the field of materials and devicesfor photonic sensing and imaging. Papers aresolicited on, but not limited to, the followingtopics:• materials and devices for optical metrology• optical and laser interferometry• wavelength-scanning interferometry• micro- and nanosensor technologies• CCD technologies and applications• CMOS arrays and applications• two-photon absorption and applications• advanced materials for sensing• biologic sensor chip• devices for optical sensing• sensor system on chip• optical fiber sensors• infrared detectors• ultraviolet (UV) photodetectors and solar-

blind UV detectors• temperature detector• numeral pickup devices• measurement of sensing devices• sensing devices for wireless sensing network• human factors.

Advanced Sensor Systems andApplications (PA108)Conference Chairs: Yun-Jiang Rao, Univ. ofElectronic Science and Technology of China(China); Yanbiao Liao, Tsinghua Univ. (China);Gang-Ding Peng, Univ. of New South Wales(Australia)

Program Committee: Xiaoyi Bao, Univ. ofOttawa (Canada); Ian M. Bassett, The Univ. ofSydney (Australia); Weimin Chen, ChongqingUniv. (China); Kin Seng Chiang, City Univ. ofHong Kong (Hong Kong, China); Kenneith T.V. Grattan, The City Univ. (United Kingdom);David A. Jackson, Univ. of Kent (UnitedKingdom); Wei Jin, The Hong KongPolytechnic Univ. (Hong Kong, China);Byoungho Lee, Seoul National Univ. ofTechnology (South Korea); Tongyu Liu,Intelligent Sensor Systems Ltd. (UnitedKingdom); Jinping Ou, Harbin Institute ofTechnology (China); David D. Sampson, TheUniv. of Western Australia (Australia); PingShum, Nanyang Technological Univ.(Singapore); Okihiro Sugihara, Tohoku Univ.(Japan); Hwa-Yaw Tam, The Hong KongPolytechnic Univ. (Hong Kong, China); K.Thyagarajan, Indian Institute of TechnologyDelhi (India); David J. Webb, Aston Univ.(United Kingdom); Reinhardt Willsch, Institutfür Physikalische Hochtechnologie e.V.(Germany); Shizhuo S. Yin, The PennsylvaniaState Univ. (USA); Libo Yuan, HarbinEngineering Univ. (China); Lin Zhang, AstonUniv. (United Kingdom)

The areas of photonic sensors and theirapplications have expanded rapidly in recentyears. Photonic sensors, especially fiber opticsensors, are widely used for measurement ofvarious physical and chemical parameters inmany fields. Recent developments in fibergratings, microstructured optical fibers, speciallydoped optical fibers, and low-cost planarwaveguide devices, etc., provide great potentialand solutions for a variety of sensing applicationsthat conventional sensors can not handle. Thistopical conference will provide an internationalforum for the most recent and interestingtechnical issues concerning photonic sensors andtheir applications, including novel sensor devices,advanced sensing methods and systems,innovative sensor integration and multiplexingtechniques, and new applications and field tests.There will be a number of invited talks presentedby pioneers and leading scientists in the field ofphotonic sensors. Specific topics of interest are(but not limited to):• physical and mechanical sensors• chemical, environmental and biomedical

sensors• sensors for electrical or magnetic field

measurement• multiplexing and integration of sensors• interferometric and polarimetric sensors• microstructured optical fiber sensors• optical planar waveguide-based sensors• passive and active components for

photonic sensing• distributed and quasi-distributed sensing• new sensor applications and field tests.


Call For Papers

Nanophotonics, Nanostructures,and Nanometrology (PA109)Conference Chairs: Xin Zhu, Peking Univ.(China); Stephen Y. Chou, Princeton Univ.(USA); Yasuhiko Arakawa, The Univ. of Tokyo(Japan)

Program Committee: Yong Chen, Ecolenormale supérieure (France); Bert Hecht,Univ. Basel (Switzerland); Lin Huang, VeecoMetrology Group (USA); Seongsin M. Kim,Stanford Univ. (USA); Olivier J. F. Martin,École Polytechnique Fédérale de Lausanne(Switzerland); Motoichi Ohtsu, The Univ. ofTokyo (Japan); Seung-Han Park, Yonsei Univ.(South Korea); Din-Ping Tsai, National TaiwanUniv. (Taiwan, China); Jia Wang, TsinghuaUniv. (China); Daozhong Zhang, Institute ofPhysics (China)

Topics

• theory and physics of near-field optics amdnanophotonics

• scanning near-field optical microscopy• application of near-field optics in life

sciences• application of near-field optics in

semiconductors• spectroscopy of nanostructures• field distribution in the optical near-field• temporal behavior in the optical near-field• optical interactions in nanometer scale• quantum dots• surface plasma• near-field spectroscopy of nanostructures• single molecule detection• nanophotonic devices• near-field optical memory• quantum dots and photonic crystals• etc.

Holography and Diffractive Optics(PA110)Conference Chairs: Yunlong Sheng, Univ.Laval (Canada); Dahsiung Hsu, Beijing Univ.of Posts and Telecommunications (China);Chongxiu Yu, Beijing Univ. of Posts andTelecommunications (China)

Program Committee: Jenq-Yang Chang,National Central Univ. (Taiwan, China); JiabiChen, Univ. of Shanghai for Science andTechnology (China); Linsen Chen, SuzhouUniv. (China); Chunlei Du, Institute of Opticsand Electronics (China); Min Gu, SwinburneUniv. of Technology (Australia); Anzhi He,Nanjing Univ. of Science & Technology (China);Hoang Yan Lin, National Taiwan Univ. (Taiwan,China); Dahe Liu, Beijing Normal Univ. (China);Hai Ming, Univ. of Science and Technology ofChina (China); Toyohiko Yatagai, Univ. ofTsukuba (Japan); Xiaocong Yuan, NanyangTechnological Univ. (Singapore); ChangheZhou, Shanghai Institute of Optics and FineMechanics (China)

Topics

• diffractive optical elements• holographic optical elements• document and product anti-counterfeiting;• subwavelength optics• plasmonics optics• photonics crystals• volume holograms, optical memory, and

storage• digital holography• 3D holographic microscopy• digital holographic interferometry• 3D imaging and display;• photonics materials• wavefront engineering• computational opto-electronic imaging• spatial light modulators• optical micromanipulation, optical tweezers• applications to optical signal processing

and communication.


Critical Dates





Electronic Imaging and MultimediaTechnology (PA111)Conference Chairs: Liwei Zhou, BeijingInstitute of Technology (China); Chung-ShengLi, IBM Corp. (USA); Minerva M. Yeung, IntelCorp. (USA)

Program Committee: Oscar C. L. Au, HongKong Univ. of Science and Technology (HongKong, China); Edward Y. Chang, Google(China); Pao-Chi Chang, National CentralUniv. (Taiwan, China); Shih-Fu Chang,Columbia Univ. (USA); Yuan-Chi Chang, IBMThomas J. Watson Research Ctr. (USA);Liang-Gee Chen, National Taiwan Univ.(Taiwan, China); Ming-Syan Chen, NationalTaiwan Univ. (Taiwan, China); Tsuhan Chen,Carnegie Mellon Univ. (USA); Tihao Chiang,National Chiao Tung Univ. (Taiwan, China);Tzi-cker Chiueh, Stony Brook Univ. (USA);Julia Chung, National Cheng Kung Univ.(Taiwan, China); Yeong-Ho Ha, KyungpookNational Univ. (South Korea); Xun Hou, Xi’anInstitute of Optics and Precision Mechanics(China); Hui-I Hsiao, IBM China ResearchLab. (China); Chiou-Ting Hsu, National TsingHua Univ. (Taiwan, China); Thomas S. Huang,Univ. of Illinois at Urbana-Champaign (USA);Sun-Yuan Kung, Princeton Univ. (USA); C.-C.J. Kuo, Univ. of Southern California (USA);Wanjiun Liao, National Taiwan Univ. (Taiwan,China); Ching-Yung Lin, IBM Thomas J.Watson Research Ctr. (USA); Wei-Ying Ma,Microsoft Research Asia (China); BangaloreS. Manjunath, Univ. of California/SantaBarbara (USA); Sanjit K. Mitra, Univ. ofCalifornia/Santa Barbara (USA); Jun Ohya,Waseda Univ. (Japan); Ming Ouhyoung,National Taiwan Univ. (Taiwan, China);Timothy Shih, Tamkang Univ. (Taiwan, China);Ming-Ting Sun, Univ. of Washington (USA);Chua-Chin Wang, National Taiwan Univ.(Taiwan, China); Yao Wang, Polytechnic Univ.(USA); Yuan-Fang Wang, Univ. of California/Santa Barbara (USA);Ja-Ling Wu, National Taiwan Univ. (Taiwan,China); Min Wu, Univ. of Maryland/CollegePark (USA); Aidong Zhang, Univ. at Buffalo(USA); Dazun Zhao, Beijing Institute ofTechnology (China)

Recent advances in computing andcommunications have made digital imagery aswell as other modalities such as audio, video,and other sensory data become prevalent. It hasled to the creation of large scale databases ofmultimedia or multi-modal data in general. Suchdatabases and data require effective methodsand paradigms to browse, share, and searchfor audio-visual content. They are finding readyapplications in a wide range of fields such asadvertising and marketing, education andtraining, entertainment, medicine, surveillance,wearable computing, biometrics, and remotesensing. Because of the very nature ofmultimedia data, new and innovative methodsare called for in modeling, processing,organizing, and indexing of this data for efficientmanagement, access and delivery of thecontent. The aim of this conference is to bring

together the researchers who are developingsuch methods, and the users, who are definingthe needs for such methods. We are solicitingpapers in all relevant areas including thefollowing:• medical imaging (including ultrasound,

X-ray, CT, MRI, PET, etc.)• wavelet and multispectral image/video

processing• image/video restoration, reconstruction,

and enhancement• color image/video processing,

representation, and transformations• analysis, processing, segmentation, and

motion estimation for image and video• content-based retrieval for multimedia

databases• biometric and multi-biometric (including

fingerprint, face recognition, etc.)• digital surveillance• wireless multimedia• system and applications for image and

video processing• virtual reality and 3D imaging• signal processing for multi-modal media

integration• multimedia security, content protection and

forensics• multimedia human-machine interface and

interaction• image and video compression/coding• multimedia and social networks.

Optical Design and Testing (PA112)Conference Chairs: Yongtian Wang, BeijingInstitute of Technology (China); KimioTatsuno, Hitachi, Ltd. (Japan); Jannick P.Rolland, College of Optics & Photonics/Univ.of Central Florida (USA); Theo T. Tschudi,Technische Univ. Darmstadt (Germany)

Program Committee: Genrui Cao, BeijingInstitute of Technology (China); Lei Chen,Nanjing Univ. of Science & Technology (China);Toshihide Dohi, OptiWorks, Inc. (Japan); YvesGilliand, Consultant (Switzerland); Hong Hua,College of Optical Sciences/The Univ. ofArizona (USA); Seung-Woo Kim, KoreaAdvanced Institute of Science and Technology(South Korea); Jong-Ung Lee, Cheongju Univ.(South Korea); Tiegen Liu, Tianjin Univ.(China); Juan L. Rayces, J.L. RaycesConsulting, Inc. (USA); Masato Shibuya,Tokyo Polytechnic Univ. (Japan); Rung-YwanTsai, Industrial Technology Research Institute(Taiwan, China); Prudence M. J. H. Wormell,Imperial College London (United Kingdom);Lijiang Zeng, Tsinghua Univ. (China); WeiqianZhao, Beijing Institute of Technology (China)

Topics

• aspheric fabrication and metrology• development in local and global

optimization methods• diffractive optics• display systems• education in optics• freeform optics• interferometry• medical optics and bio-optics• novel lens designs• optical instrument design• spaceborne optics• surface profilometry• testing and alignment of optical surfaces

and elements• UV optics• zoom optics and multi-configuration optics• micro-optics.



Advances in Optical Data StorageTechnology (PA113)Conference Chairs: Guofan Jin, TsinghuaUniv. (China); Kees A. Schouhamer Immink,Turing Machines, Inc. (Netherlands); KeijiShono, Fujitsu Labs. Ltd. (Japan)

Program Committee: Dianyong Chen, PhilipsResearch East Asia (China); Tow ChongChong, National Univ. of Singapore(Singapore); Fuxi Gan, Shanghai Institute ofOptics and Fine Mechanics (China);Qingsheng He, Tsinghua Univ. (China); Ken-ichi Itoh, Fujitsu Labs. Ltd. (Japan); TakeshiMatsui, Ricoh Co., Ltd. (Japan); Takeo Ohta,Ovonic Phase Change Institute (Japan);Yoshihiro Okino, Kansai Univ. (Japan);Longfa Pan, Tsinghua Univ. (China); No-Cheol Park, Yonsei Univ. (South Korea); AilunRong, Beihang Univ. (China); H. Sadik, Call &Recall Inc.; Luping Shi, National Univ. ofSingapore (Singapore); Han-Ping D. Shieh,National Chiao Tung Univ. (Taiwan, China);Shiquan Tao, Beijing Univ. of Technology(China); Motoyasu Terao, Hitachi, Ltd.(Japan); Din-Ping Tsai, National Taiwan Univ.(Taiwan, China); Kiichi Ueyanagi, Fuji XeroxCo., Ltd. (Japan); Paul Weijenbergh,Consultant (Netherlands)

Topics

• optical multidimension and multilevelstorage

• super-high-density optical storage• new optical storage materials and

components• high data rate transfer and processing in

optical storage• high-density optical disk replication

technology• TB optical storage system integration• optical disks standard and testing

technology.

Infrared Technologies andApplications (PA114)Conference Chairs: Yi Cai, Kunming Instituteof Physics (China); Haimei Gong, ShanghaiInstitute of Technical Physics (China); Jean-Pierre Chatard, ULIS (France)

Program Committee: Yuping Cui, TianjinJinhang Institute (China); Ernest Grimberg,Opgal Optronic Industries Ltd. (Israel);Jianzhong Han, North China ResearchInstitute of Electro-Optics (China); Weiqi Jin,Beijing Institute of Technology (China);Yongzhi Liu, Univ. of Electronic Science andTechnology of China (China); Piotr Pregowski,Pregowski Infrared Services (Poland); FiodorF. Sizov, V. Lashkariov Institute ofSemiconductor Physics (Ukraine); JianyuWang, Shanghai Institute of Technical Physics(China); Hui Huang, Kunming Institute ofPhysics (China)

Topics

• infrared materials• infrared detectors and focal plane array• coolers for IR systems• uncooled infrared imaging devices and

systems• infrared spaceborne remote sensing• superspectral airborne remote sensing• signal processing• infrared image processing• testing and calibration• applications.

Call For Papers


Critical Dates





Information Optics and PhotonicsTechnologies (PA116)Conference Chairs: Guoguang Mu, NankaiUniv. (China); Feijun Song, China DahengGroup, Inc. (China); Francis T. S. Yu, ThePennsylvania State Univ. (USA); SugandaJutamulia, Univ. of Northern California (USA)

Program Committee: Ken Y. Hsu, NationalChiao Tung Univ. (Taiwan, China); KazuyoshiItoh, Osaka Univ. (Japan); Soo-Gil Kim,Hoseo Univ. (South Korea); Byoungho Lee,Seoul National Univ. of Technology (SouthKorea); Sar Sardy, Univ. of Indonesia(Indonesia); Kehar Singh, Indian Institute ofTechnology Delhi (India); Yunan Sun, BeijingInstitute of Technology (China); Shiquan Tao,Beijing Univ. of Technology (China); JunUozumi, Hokkai-Gakuen Univ. (Japan);Joewono Widjaja, Suranaree Univ. ofTechnology (Thailand); Jinghui Xie, BeijingInstitute of Technology (China); Pochi Yeh,Univ. of California/Santa Barbara (USA);Shizhuo S. Yin, The Pennsylvania State Univ.(USA)

Topics

• pattern recognition with optics• nonlinear pattern recognition• hybrid neural networks• optical computing and switching• holographic and optical memory• wavelets in optical information processing• fractional Fourier transform• composite filter synthesis• iterative procedures in electro-optical

information processing• optoelectronic hybrid system for three

dimensional object recognition• algorithms and systems for optical

information processing• applications of photorefractive devices• applications of laser diodes and microlasers• applications of other novel devices• photonic devices for information technology• Bragg gratings and fiber sensors• advance in optical data storage technology,

optical storage materials and components.

Optoelectronic Devices andIntegration (PA117)Conference Chairs: Xuping Zhang, NanjingUniv. (China); Hai Ming, Univ. of Science andTechnology of China (China); Maggie Y. Chen,Omega Optics, Inc. (USA)

Program Committee: Xiaoyi Bao, Univ. ofOttawa (Canada); Kin Seng Chiang, City Univ.of Hong Kong (Hong Kong, China); Mee-KoyChin, Nanyang Technological Univ.(Singapore); Xuejun Lu, Univ. ofMassachusetts/Lowell (USA); Gang-DingPeng, Univ. of New South Wales (Australia);Ping Shum, Nanyang Technological Univ.(Singapore); Hwa-Yaw Tam, The Hong KongPolytechnic Univ. (Hong Kong, China); SuningTang, Crystal Research, Inc. (USA); Joel M.Therrien, Univ. of Massachusetts/Lowell(USA)

Optoelectronic devices are being used in a widearray of applications in telecommunications, solarcells, scientific instrumentation, data storage,automotive, and military applications. Photonicdesign and simulation methods are a prerequisitefor a fundamental understanding of advancedphotonic structures as well as for thedevelopment of new photonic devices andapplications. Research on new materials,processes and design are giving rise tooptoelectronic devices with higher efficiencies,denser integration, and better reliabilities. Withthe new breakthroughs in organic photonicdevices, vertical-cavity surface-emitting lasers,semiconductor photodetectors and optoelec-tronic integrated circuits, new package designsand reliability methodologies must be developedas these devices increase in functionality andintegration.

This conference is intended to provide a forumfor the interchange of ideas on optoelectronicdevice at different levels, including design,simulation, fabrication, integration, andapplications. The topics of this conference willcover, but not limited to, the following topics:• physics and simulation of optoelectronic

devices• devices for photonic applications• fiber and guided-wave lasers and amplifiers• organic photonic materials and devices• terahertz and gigahertz electronics and

photonics• synthesis and photonics of nanoscale materials• emerging optoelectronic applications• vertical-cavity surface-emitting lasers• polarization maintained/scrambled laser• semiconductor photodetectors• reliability of optical fiber components,

devices, systems, and networks• micro-optics and photonic interconnects• multifunctional components, and arrayed

devices• optoelectronic hybrid and monolithic

integration• integrated optics and photonic integrated

circuits• photonics packaging and integration• surface plasmon nanolithography,

plasmonic waveguide and devices.


MEMS/MOEMS Technologies andApplications (PA115)Conference Chairs: Jung-Chih Chiao, TheUniv. of Texas at Arlington (USA); ZhaoyingZhou, Tsinghua Univ. (China); Xuyuan Chen,Vestfold Univ. (Norway) and Xiamen Univ.(China); Xinxin Li, Shanghai Institute ofMicrosystem and Information Technology(China)

Program Committee: Said F. Al-Sarawi, TheUniv. of Adelaide (Australia); Linan An, Univ. ofCentral Florida (USA); Quanfang Chen, Univ. ofCentral Florida (USA); Mu Chiao, The Univ. ofBritish Columbia (Canada); Haiqing T. Gong,Nanyang Technological Univ. (Singapore);Kazuhiro Hane, Tohoku Univ. (Japan); Nils D.Hoivik, IBM Thomas J. Watson Research Ctr.(USA); Ciprian I. Iliescu, Institute ofBioengineering and Nanotechnology(Singapore); Henrik Jakobsen, Vestfold Univ.College (Norway); Youngwoo Kwon, SeoulNational Univ. of Technology (South Korea);Mary J. Li, NASA Goddard Space Flight Ctr.(USA); Lih-Yuan Lin, Univ. of Washington(USA); Yu-Chen Lin, SpringSoft Inc. (Taiwan,China); Ai Qun Liu, Nanyang TechnologicalUniv. (Singapore); Xiaowei Liu, Harbin Instituteof Technology (China); Zhichun Ma, MichiganAerospace Corp. (USA); Daoheng Sun, XiamenUniv. (China); William C. Tang, Consultant;Tza-Huei Wang, Johns Hopkins Univ. (USA);Xiaohao Wang, Tsinghua Univ. (China); YuelinWang, Shanghai Institute of Microsystem andInformation Technology (China); Da-Jeng Yao,National Tsing Hua Univ. (Taiwan, China); T. C.Yih, The Univ. of Texas at San Antonio (USA);Yanhang Zhang, Boston Univ.

Microelectromechanical systems (MEMS) andmicrooptoelectromechanical systems (MOEMS)have made great advances in many applications.This conference covers a wide scope of MEMSresearch including materials, design, fabrication,processes, packaging, manufacturing, integration,control, application, and system issues. Theapplications also extend to microelectronics,nanotechnology, biology, medicine, radio-frequencyelectronics, sensing, and photonics. Theconference will bring together academic andindustrial researchers to discuss the present stateof MEMS and MOEMS, and identify emergent andfuture trends. The specific topics include:• optical MEMS and applications• bioMEMS and applications• RF MEMS and applications• micromechanics• MEMS in aerospace, manufacturing industry,

medicine, sensors, telecom, and automobiles• MEMS design, methodologies, control,

modeling, analysis, and characterization• MEMS fabrication, packaging, reliability and

manufacturing• microelectronics, microoptics and MEMS

integration• materials, hybrid integration, monolithic

integration, multilayer platforms andmultiscale systems

• nanoscale system, nanomachining,nanophotonics in MEMS, and NEMS

• sensors and actuators.


Advanced MicrolithographyTechnology (PA118)Conference Chairs: Chris A. Mack,Lithoguru.com (USA); Jinfeng Kang, PekingUniv. (China); Jun-en Yao, Beijing Institute ofAeronautics and Astronautics (China)

Program Committee: Alek C. Chen, ASMLTaiwan Ltd. (Taiwan, China); Kohji Hashimoto,Toshiba Corp. (Japan); Yanqui Li, Institute ofElectrical Engineering (China); Chin-HsiangLin, Taiwan Semiconductor ManufacturingCo., Ltd. (Taiwan, China); Ming Liu, Institute ofMicroelectronics (China); Christopher J.Progler, Photronics, Inc. (USA); ChienmingWang, Semiconductor ManufacturingInternational Corp. (China)

Topics

Leading-edge optical lithographytechnology• immersion lithography• 193-nm and 248-nm manufacturing

technologies• hyper-NA and polarization• lithography simulation.

Lithographing resolution enhancementtechnologies• off-axis illumination (OAI)• optical proximity effect correction (OPC)• phase-shift mask (PSM)• double patterning• design for manufacturability.

Metrology and process control inlithography• advanced process control• CD and overlay metrology• metrology for OPC• line-edge roughness measurement.

Photoresists and process technology• materials for immersion lithography• photoresist trimming, advanced processing• new photoresist materials• antireflection coatings

New-generation lithography technologies• 157-nm optical lithography• 13-nm EUV lithography• electron beams lithography• x-ray lithography• nano-imprint lithography.

Nonlinear Optics and Applications(PA119)Conference Chairs: Yiping Cui, SoutheastUniv. (China); Qihuang Gong, Peking Univ.(China); Yuen-Ron Shen, Univ. of California/Berkeley (USA)

Program Committee: Francois Kajzar, Univ.d’Angers (France); Ursula Keller, ETH Zürich(Switzerland); Dai-sik Kim, Seoul NationalUniv. of Technology (South Korea); TakayoshiKobayashi, The Univ. of Tokyo (Japan); Song-hao Liu, South China Normal Univ. (China);Jingjun Xu, Nankai Univ. (China); ToyohikoYatagai, Univ. of Tsukuba (Japan); Pochi Yeh,Univ. of California/Santa Barbara (USA); VictorZadkov, M.V. Lomonosov Moscow State Univ.(Russia); Jiasen Zhang, Peking Univ. (China)

Nonlinear Optics is the study of effects andphenomena related to the interaction of coherentlight with matter. During the past decades manynonlinear optical phenomena were discoveredone after the other. Nonlinear optics has played,and will continue to play, an important role inthe progresses of physics, chemistry, surfacescience, materials, biology, and other areas.Meanwhile new nonlinear optical materials anddevices also developed very rapidly. Nonlinearoptics technologies provide people with meansof light controlled by light in spatial domain, timedomain and frequency domain, and are thuswidely used in information technology and manyother application fields. This conference willprovide an international forum for the mostrecent and advanced issues concerningnonlinear optical phenomena and applications.There will be a number of invited talks presentedby pioneers and expert scientists in the fields ofNonlinear Optics. The conference will mainlyfocus on (but not limited to) the following andrelated topics:• high-intensity and relativistic nonlinear

optics• novel nonlinear materials and structures• nonlinear optics in waveguides• quantum and atomic optics• quantum interference phenomena and

multiphoton processes• optical orientation, polarization, and

nonlinear spectroscopy• optical coherent transient phenomena• nonlinear frequency generation and

conversion• optical data storage and associative

memories• phase-controlled nonlinear optical

processes• photorefractive effects, phase conjugation• ultrafast nonlinear optics and applications.

Terahertz Photonics (PA120)Conference Chairs: Chunlin Zhang, CapitalNormal Univ. (China); Xi-Cheng Zhang,Rensselaer Polytechnic Institute (USA)

Program Committee: Haewook Han, PohangUniv. of Science and Technology (SouthKorea); Kazuhiko Hirakawa, Univ. of Tokyo(Japan); Chi H. Lee, Univ. of Maryland/CollegePark (USA); Ci-Ling Pen, National Chiao TungUniv. (Taiwan, China); Masahiko Tani, OsakaUniv. (Japan); Chao Zhang, Univ. ofWollongong (Australia); Yan Zhang, CapitalNormal Univ. (China)

Topics

• THz generation and detection• THz photonic devices• interaction of THz radiation with matters• THz spectroscopy and imaging• THz wave for biomedical application• nondestructive sensing and imaging• THz wave for communication.

Call For Papers


Critical Dates





Solar Energy Technology andApplication (PA121)Conference Chairs: Yuwen Zhao, Beijing SolarEnergy Research Institute (China); NuofuChen, Institute of Semiconductors (China);Vladimir M. Andreev, A.F. Ioffe Physico-Technical Institute (Russia); Jai Singh, CharlesDarwin Univ. (Germany)

Program Committee: Guanghua Chen, BeijingUniv. of Technology (China); Richard Corkish,Univ. of New South Wales (Australia);Rongqiang Cui, Shanghai Jiao Tong Univ.(China); Songyuan Dai, Hefei Univ. ofTechnology (China); Lianghuan Feng, SichuanUniv. (China); Junfeng Li, Consultant (China);Jiang-Tsair Lin, Industrial TechnologyResearch Institute (Taiwan, China); ZumingLiu, Consultant (China); Hui Shen, Sun Yat-Sen Univ. (China); Qi Wang, NationalRenewable Energy Lab. (USA); ShaozhenXiong, Nankai Univ. (China); Honghua Xu,Institute of Electrical Engineering, CAS (China);Deren Yang, Zhejiang Univ. (China); MeifangZhu, Graduate School of the ChineseAcademy of Sciences (China)

Topics

• photovoltaic technology and applications• photothermic technology and applications.

Solid State Lighting (PA122)Conference Chairs: Jinmin Li, Institute ofSemiconductors, CAS (China); Ling Wu, ChinaSSL Research and Industry Alliance (China);Yubo Fan, Xiamen Hualian (China);Yonghang Zhang, Arizona State Univ. (USA);Mike Coltrin, National Ctr. for SSL, SandiaNational Labs. (USA)

Program Committee: Fengyi Jiang, NanchangUniv. (China); Kei M. Lau, Hong Kong Univ. ofScience and Technology (Hong Kong, China);B. J. Lee, Epistar Corp. (USA); TsunemasaTaguchi, Yamaguchi Univ. (Japan); GuohongWang, Institute of Semiconductors, CASs(China); Xiaoliang Wang, Institute ofSemiconductors (China); Enboa Wu, HongKong Applied Science and TechnologyResearch Institute Co. Ltd. (Hong Kong,China); Fuhua Yang, Institute ofSemiconductors (China); Young-Moon Yu,Korea Photonics Technology Institute (SouthKorea); Yiping Zeng, Institute ofSemiconductors (China); Guoyi Zhang, PekingUniv. (China); Yong-Hang Zhang, ArizonaState Univ. (USA)

Topics

• physical mechanisms in LEDs materials• ultraviolet LED• high-power, high-efficiency, long-life white

LEDs• novel substrates for epitaxy• application of photonic crystal materials and

nanostructures in LEDs• physics, simulation and management of

photon within the LEDs chip• light-matter interactions, optical coupling

and modeling• color mixing and other novel methods to

generate white LEDs• packaging and testing• secondary optics for SSL.



Critical Dates





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Broad spectrum of informationAccess over 230,000 editor-reviewed papers thatcover the expanding field of optical science andengineering—the foremost enabling technology for the21st Century.

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General Informat ion

Conference LocationPhotonics Asia 2007 will be located at theJiuhua Grand Convention and Exhibition Centerin Beijing. Information about the venue can befound at http://www.jiuhua.com.cn/.

Official LanguageThe official language of the conferencepresentations is English. The short courses willbe conducted in Chinese.

Abstract SubmissionAbstracts must be submitted through SPIE Web(see page 15 for submission information).Submission of an abstract implies the intent ofat least one author to register, attend thesymposium, present the paper (either orally orin poster format), and submit a full-lengthmanuscript for publication in the conferenceproceedings.

Conference ProceedingsManuscripts will be reviewed by the technicalsubcommittee co-chairs and selected experts.Conference proceedings will be published inEnglish and available after the symposium. SPIEProceedings are indexed in INSPEC, EiCompendex, Physics Abstracts, ChemicalAbstracts, International Aerospace Abstracts,Index to Scientific and Technical Proceedings,and NASA Astrophysical Data System.

Advance Technical ProgramAvailable Fall 2007The comprehensive Advance Technical Programfor this symposium will list conferences, papertitles, and authors in order of presentation; anoutline of all planned special events; and hoteland registration information. All those whosubmit an abstract will receive a copy.

RegistrationRegistration will be available in the AdvanceTechnical Program. All authors (including invitedor solicited speakers), program committeemembers, and session chairs are responsible forregistering and paying the reduced author/session chair/program committee registrationfee. Current SPIE members receive a furtherdiscount on the registration fee.

Plenary SessionPhotonics Asia 2007 will open with an excitingplenary session featuring presentations by someof the world’s most prominent business leaders,top executives, scientists, and engineers on thecutting-edge of photonics technologies.

Excursions and ToursBeijing is a wonderful city to visit with places ofhistorical and cultural interest including theForbidden City, Tiananmen Square, the Templeof Heaven, the Summer Palace, and just 40 milesaway the Great Wall of China.

Letters of Invitation for VisaProcessForeign citizens can obtain a China visa fromChinese embassies, consulates, visa offices, andthe consular department of the office of ChineseForeign Ministry. For further information, pleaseconsult the nearest China visa authorities in yourcountry. The Embassy of People’s Repulic ofChina in the United States of America hasinformation at:

www.china-embassy.org/eng/hzqz/zgqz/default.htm

Clearance InformationIf government and/or company clearance isrequired to present and publish your presenta-tion, start the process now to ensure that youreceive clearance if your paper is accepted.


Submission of Abstracts

Abstract Due Date: 15 June 2007

Manuscripts Due Date: 15 October 2007

11–15 November 2007Jiuhua Grand Convention and Exhibition Center · Beijing, China

Showcasing Photonics and OpticalTechnologies and Applications

Attend the ConferencePresent a paper and participate in the conference

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1. By submitting an abstract, I agree to the following conditions:• An author or coauthor (including keynote, invited, and solicited

speakers) will register at the reduced author registration rate, attend themeeting, and make the presentation as scheduled. (Current SPIEMembers receive an additional discount on the registration fee.)

• Authors and coauthors attending the meeting will obtain funding fortheir registration fees, travel, and accommodations, independent ofSPIE, through their sponsoring organizations before submittingabstracts.

• All clearances, including government and company clearance, havebeen obtained to present and publish. If you are a DoD contractor,allow at least 60 days for clearance.

• SPIE is authorized to circulate your abstract to conference committeemembers for review and selection purposes.

• Accepted abstracts may be published in printed and web programspromoting the conference. Please submit only 250-word abstracts thatare suitable for publication.

• A full-length manuscript (8-12 pages) for any accepted oral or posterpresentation will be submitted for publication in the SPIE Digital Libraryand conference Proceedings.

2. Prepare to submit:• Have all contact information (full names, affiliations, addresses, phone

numbers, and emails) for your coauthors ready.• Only original material should be submitted.• Abstracts should contain enough detail to clearly convey the approach

and the results of the research.• Commercial papers, papers with no new research/development

content, and papers where supporting data or a technical descriptioncannot be given for proprietary reasons will not be accepted forpresentation in this conference.

3. Submit your abstract using the

“submit an abstract” link at:

http://spie.org/events/pa

You will be prompted to sign in to the MySPIE system. If you have a MySPIEaccount, sign in using your username and password. First-time users ofMySPIE can create a new account by clicking on the create new accountlink.

Review, Notification, Program Placement• To ensure a high-quality conference, all abstracts and Proceedings

manuscripts will be reviewed by the Conference Chair/Editor fortechnical merit and suitability of content. Conference Chair/Editors mayrequire manuscript revision before approving publication, and reservethe right to reject for presentation or publication any paper that doesnot meet content or presentation expectations. SPIE’s decision onwhether to accept a presentation or publish a manuscript is final.

• Applicants will be notified of abstract acceptance and sent manuscriptinstructions by e-mail no later than 6 August 2007.

• Final placement in an oral or poster session is subject to the Chairs’discretion. Instructions for oral and poster presentations will be sent toyou by e-mail.

Proceedings of SPIE and SPIE Digital Library• Full-manuscripts will be Chair/Editor-reviewed and published in the

Proceedings of SPIE and in SPIE Digital Library.• Manuscript instructions will be e-mailed to the contact author and are

also available from the “Author Info” link on the conference website.• Authors must be authorized to transfer copyright of the manuscript to

SPIE, or provide a suitable publication license.• Only papers presented at the conference and received according to

publication guidelines and timelines will be published in the conferenceProceedings and SPIE Digital Library.

• Published papers are indexed in leading scientific databasesincluding INSPEC, Ei Compendex, Chemical Abstracts, InternationalAerospace Abstracts, ISI Index to Scientific and Technical Proceed-ings and NASA Astrophysical Data System, and are searchable in theSPIE Digital Library. Full manuscripts are available to SPIE DigitalLibrary subscribers.

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