SEP/2011

SHIELD CAN CLIP ENGINEERING GUIDE

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Shield Can Clip (PTC Series)

［ Major Application ］

- CELLULAR PHONE - PMP - WIBRO USB DONGLE - GPS MODULE - NAVIGATION - HSUPA / HSDPA module - MP4 - PON - HIPASS - UMPC

［ Key Features ］

Efficient use of the PCB space To increase productivity by mounting the Clip automatically Reduction in the term and the expense for the development by removing the frame Cost reduction Efficient purchase by standardization Easy repairs

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Product Overview

Part Name Size

H x W x L

Packing (Reel)

Shield can Thickness

Plating Mat’l Customer

PTC0703B 1.28 x 0.8 x

6.5 10,000 0.15~0.20 Sn SUS

SAMSUNG MOBILE,SAMSUNG COMPUTER, LG MOBILE,KTFT,PANTECH,KYOCERA

PTC0703C 1.28 x 0.8 x

6.5 10,000 0.3 Sn SUS SAMSUNG MOBILE,LG MOBILE

PTC0704 1.28 x 1.1 x

6.5 10,000 0.15~0.20 Sn SUS

SAMSUNG MOBILE,SAMSUNG TV, SAMSUNG LCD,LG DISPLAY

PTC0704A 1.28 x 1.1 x

6.5 10,000 0.3 Sn SUS SAMSUNG MOBILE,SAMSUNG NETWORK

PTC0801 1.28 x 1.1 x

3.9 10,000 0.2~0.3 Sn SUS SAMSUNG MOBILE

PTC0703D 1.15 x 0.8 x

6.5 10,000 0.15~0.2 Sn SUS

SAMSUNG MOBILE,SAMSUNG COMPUTER, LG MOBILE,PANTECH,SKT,FOXCONN

PTC0703E 1.15 x 0.8 x

6.5 10,000 0.3 Sn SUS SAMSUNG MOBILE

PTC0901 1.20 x 1.1 x

6.5 10,000 0.4 Sn SUS SAMSUNG MOBILE

PTC0706 (EMBOSS)

1.28 x 1.0 x 6.5

10,000 0.15~0.2 Sn SUS SAMSUNG NETWORK,ZTE

PTC3121N 0.8 x 0.8 x

4.4 10,000 0.2 Sn SUS

SAMSUNG MOBILE,QUALCOMM LG ELECTRONICS

PTC1121N 0.8 x 0.8 x

4.4 10,000 0.15 Sn SUS

SAMSUNG MOBILE LG ELECTRONICS,PANTECH

Embossing Clip is an advanced type of Clip that is designed to strengthen the retention force by adding Embossing on the joint part.

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Application example

HOLE

Shield Can Clip

Embossing Clip

Embossing

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Appilcation note

Big size shield can which cover whole PCB had better separate to 2 piece of shield can.

The minimum gap size between clip and clip is 0.3mm.

The clip pad keeps 0.5mm distance from PCB edge.

Clip should be separated from Magnetic strip components as far as possible.

When the gap size between shield Can and plastic cover is less than 0.2mm, it is perfect for drop test.

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Underfill

When you artwork clip at near memory chip

1) in case of sealing with “resin”, keep 0.4mm distance from IC

2) in case of no sealing, 0.15~0.2mm distance from IC is enough

* Sealing with Resin,

they call “ underfill” for protecting memory on drop test

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Clip placement

Case 1) when designing PCB with 4 pcs of clip

Do not place the clip at the center position.

Because it is not perfect for drop test and

inserting shield can by manual.

Recommended placement)

It is good for assembly and drop test

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Clip placement

Case 2) artwork with 6 pcs of clip

Case 3) artwork with 10pcs of clip especially in RF part

More clip is better for EMI shielding

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Clip application note

Case 4) With screw

When designing PCB with big shield can, you can use clip and

screw at the same time

Screw hole

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Application example for base band

As you can see, you can use the PCB space efficiently in base band part.

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Clip placement guide considering noise emmission

Clip should be placed within 20mm distance not to affect the wireless sensitivity

Without SHIELD CAN

SMT SHIELD CAN

CLIP

GSM850 110dBuV 93dBuV 90dBuV

PCS 105dBuV 80dBuV 82dBuV

• according to the evaluation result, both have same shield effectiveness.

- If shield can side length is less than 20mm, then clip should be placed at center. - When you consider assembly, clip should be placed within 5mm distance from corner. - Clip should be placed at shortest distance from hot spot.

Part Name Size

H x W x L A B

A’ (space size)

B’ (space size)

PTC0703 Series 1.28 x 0.8 x 6.5 0.25mm 6.5mm 0.3mm 7mm

PTC0704 Series 1.28 x 1.1 x 6.5 0.25mm 6.5mm 0.3mm 7mm

PTC0801 1.28 x 1.1 x 3.9 0.25mm 3.9mm 0.3mm 4.3mm

PTC3121,1121N PTC1001,1002

0.8 x 0.8 x 4.4 0.15mm 4.4mm 0.20mm 4.8mm

PTC0706 1.28 x 1.0 x 6.5 0.15mm 6.5mm 0.20mm 7mm

PTC2030 0.6 x 0.6 x 6.5 0.1mm 6.5mm 0.15mm 7mm

0.3mm

0.2mm

7mm

4.8mm

A’ A’

B’

B’

B

B

A

A

Remain space size of each clip

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Part Name

Height from

ground

PCB Lay Out

Solder Mask Lay Out(%)

Part Name

Height from

ground

PCB Lay Out

Solder Mask Lay Out(%)

PTC 0703 Series

0.25 PTC0706 0.15

PTC 0704 Series

0.25

PTC3121NPTC1121N

PTC1001PTC1002

0.15

PTC 0801

0.25 PTC2030 0.1

Soldering Recommend(Mask 0.1T)

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Appendix

Item Spec Method Result

Peeling strength

(Lateral force) - More than 3 kgf

- Max : 5.2 kgf - Min : 4.2 kgf - AVG : 4.6 kgf

Flexural Strength

(Twist test)

- Do not drop out

(twist 1mm) Good

Insertion/

Retention force

- Insertion force : less than 1,000g - retention force : more than 60g

- measure the force after 10 cycles(inserting and pulling out) ( Can Thickness : 0.2T )

-Insertion force : 420 g -retention force : 118 g

Contact

resistance - 100 mΩ Max - After inserting shield Can

- Max : 34 mΩ - Min : 26 mΩ - AVG : 30 mΩ

PCB

Push

GageClip