Shanghai Feb 20111 Shanghai Microsemi Semiconductor Co., Ltd.
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Transcript of Shanghai Feb 20111 Shanghai Microsemi Semiconductor Co., Ltd.
Shanghai
Feb 2011 1
Shanghai Microsemi
Semiconductor Co., Ltd.
Shanghai
Feb 2011 2
Company Profile
• Located at Xin Zhuang, Shanghai, China
• Established in September 1995
• 100% owned by Microsemi Corp in Dec 2007
• 4” Wafer Fab with monthly output 60K pcs, 80% utilization rate
Shanghai
Feb 2011 3
Products Portfolio• GPP Chips• Finished Goods
Shanghai
Feb 2011 4
Finish Goods
Diode
GPP Diode
ModulesBridges
3-Phase Rectifier Bridges
High VoltageStack Diode
Single-PhaseRectifier Bridges
Diode Modules
Rectifier+SCR Modules
3-Phase Rectifier Modules
FRED Modules
SCR Modules
Products Tree
Shanghai
Feb 2011 5
Microsemi Shanghai ’s
Technology Advantages
Shanghai
Feb 2011 6
Passivation techniquesPassivation techniquesStar Die Construction
Process Diffused wafer (Open Junction)
Diffused wafer
+ Silicone rubber
protection
Grooves etching
+ Glass layer on etched grooves
Grooves etching
+ SIPOS
+ Glass layer on etched grooves
Quality rating
Low end
Low quality
Low end
Low quality
Medium quality Better than medium quality
P+ N
N+
P+ N
+
P+ N N+
P+N
N+N
N+ P+
Shanghai
Feb 2011 7
Microsemi’s Microsemi’s 5-Star5-Star Passivation Passivation
P+ N
N+
Silicon nitride layer
= Silicon Nitride & Glass passivation = Silicon Nitride & Glass passivation Microsemi uses the process for all hi-rel discrete devicesMicrosemi uses the process for all hi-rel discrete devices
Process : Grooves etching + Silicon Nitride + glass layer on Process : Grooves etching + Silicon Nitride + glass layer on etched grooves etched grooves
Quality rating: Highest quality process Quality rating: Highest quality process
Shanghai
Feb 2011 8
Advantages of SMSC’s GPP chips• Technology coming from Microsemi
Corp’s Hi-Rel processing
• Unique multilayer passivation ensure excellent high temperature characteristics and passing 200C HTRB test
• Die size from 0.050” Sq to 0.672” Hex
LPCVD : Low Pressure Chemical Vapor Deposition
High purity evaporated metal ensure a strong metallurgical bond and provides extremely low contact resistance
P+ Layer
N+ Layer
LPCVD growth layers plus glass passivation
Shanghai
Feb 2011 9
GPP Chips -- SMSC’s New developed Passivated Double Isolation Chips
Double Isolation Technology
Advantages:
Shanghai
Feb 2011 10
FG’s Release to Market (RTM) Procedures
Die qualification
1. Visual examination
2. Electrical inspection
3. HTRB
SMSC SMSC/Sub-con SMSC
Die receiving inspection
1. Visual / Electrical inspection
2. Assembly
Finished Goods (FG)
1. Visual/Electrical
2. Stamping
3. Reliability tests
REPEATEDABILITY TRIALS
FG inspection
1. Visual / Electrical inspection
2. Reliability tests (next slide)
RTM
Shanghai
Feb 2011 11
Reliability Tests Plan
Test Description PurposeDevice Under
Test
1High Temperature reverse
Voltage Burn-inDetermine the effect of bias and temp on the
device over an extended period of timeDie & F.G.
2 AutoclaveDetermine the effect of temp, humidity & pressure
on the device over time, unbiasedF.G.
3High temperature storage
test
To accelerate failure mechanisms which are thermally activated through the application of
extreme temp, unbisedF.G.
4 Temperature CyclingDetermine the effect of temp on Material Thermal
MismatchF.G.
5 Intermittent Operating Life
To evaluate the bulk stability of the die and to generate defects resulting from manufacturing aberrations that are manifested as time and
stress-dependent failures
F.G.
6 Reverse Energy test Application test for high voltage diodeHigh voltage
diode
7 Welder test Application test for UFT modules UFT Modules
Shanghai
Feb 2011 12
Reliability TestsTest Description Test Conditions
High Temperature Storage Life(HTSL)
Ta = 150 , T=48H,℃No bias
Temperature Cycling Test(TCT)
HOT Ta=Tvjm T= 30mins, COLD Ta=Tvjl T= 30mins, TRANSFERRING ≤
10secs, Cycles=10
Pressure Cooker Test (PCT)—(Plastic package)
15P.S.I @ 121 , T=48H℃
High Temperature Reverse Bias(HTRB)
Tj=150 , VBR=80%VRRM, T=96H℃
Intermittent Operating Life(OP-Life)
Ton = Toff = 5minutes, or Ton =From Tj= 25+/-5 to Tj =150+0/-10 , ℃ ℃
Toff= From Tj= 150+0/-10 to Tj =25+/-5 ℃ ℃
Shanghai
Feb 2011 13
Single Phase Bridge Rectifiers Specs:
Io = 0.5~50A STD VRRM =200 ~ 1000V
Typical Applications: GBJ 、 IH 、 KBJ Series:
Induction Heater/Home Appliance/Switching Power/Industrial Power Controller
GBU 、 GBL 、 KBP Series: PC Power/LCD-TV/Industrial Power Controller
GBPC & GBPC-W Series: Welder/Air-condition/Communication Power Supply/Industrial Power Controller
Shanghai
Feb 2011 14
High Voltage Stack Diodes • Plastic case UL flammability recognition 94V-0
• Replacement of Philips parts (e.g. BYX134GPL)
• Using SMSC’s unique passivated GPP chips
• High voltage up to 6KV GPP chips
• High maximum operating temperature
• Application: Ignition systems; High voltage coils;
X-ray system; Microwave system, etc.
Business Partners: Federal Mogul Delphi Eldor
TYPE
MAIN ELECTRICAL PARAMETERSPKG
DIMMVRRM / kV IF ( AV ) / mA IFSM/A VF/ V
BYX134P 4 10 30 5.00 DO-15
MSHV40P 4 10 30 5.00 DO-41
Shanghai
Feb 2011 15
FRED ModulesUltra Fast Recovery Epitaxial Diodes
•Common cathode configuration •Epoxy Potting body •Low Leakage Current •Low Forward Voltages •150 Operating Junction Temperature ℃•RoHS Compliance
CODE VRRM VF I F Trr
UFT20040CT 400V 1.1 V 100A 75ns
UFT20060CT 600V 1.2 V 100A 75ns
Shanghai
Feb 2011 16
3-Phase Bridge Rectifiers MT Series
35 to 50 Ampere Current Rating
800V to 1800V Reverse Voltage Rating
Direct Replacement to IXYS & IR parts
Typical Applications:
UPS, Industrial Power Controller,
Input rectifiers for PWM inverter,
Battery DC power supplies
High-frequency Switching Power Supply
Shanghai
Feb 2011 17
3-Phase Bridge Rectifiers
Type Frame Remark
MT3516A
Framework: Aluminium Copper Clad Laminate
The lower Case-temperature, the higher efficient, the better reliability, and the longer lifetime
MT3516Framework: Aluminium based Case
NEW
Shanghai
Feb 2011 18
3-Phase Bridge Rectifiers
Brand Type Rthj-c( /W)℃
MSC MT3516A 1# 0.73
MSC MT3516A 2# 0.70
(A) Vxx36-16 1# 1.76
(A) Vxx36-16 2# 2.04
(B) 36Mx160 1# 2.70
Shanghai
Feb 2011 19
Assembly Technology -- “Vacuum + H2” Multi-Gas Brazing Technology
-- Brazing with DBC for excellent thermal distribution
-- Ultrasonic scanning to ensure reliable brazing quality
-- High insulation voltage ≥ 3000V
-- Vacuum Welding Technology -- Voidage: <2.5%
-- X-ray Whole Body Scanned
Power Diode Modules NEW
Quality Assurance SMSC’s New developed
Passivated Double Isolation
Chips Inside
100% HTRB Test for Each
Lot
Double Moat Structure
DGP Chip
DGP design would improve the reliability and performance
Shanghai
Feb 2011 20
Power Diode Modules Diode-Diode Modules
CODE CIRCUIT VRRM IF PKG
MSKD
800V-1800V
36A-120A D1
165A-200A D2
MSAD
250A-300A D3
350A-400A D4
MSCD
500A-600A D5
800A D6
Shanghai
Feb 2011 21
Power Diode Modules Rectifier Modules
CODE CIRCUIT VRRM ID PKG
MSD 800V-1800V
30A-50A M1
52A-75A M2
100A-200A M3
Shanghai
Nov 2010 22
Power Diode Modules
Applications
-- DC Power Equipment
-- Inverter
-- Battery Charger
-- DC Motor Power Supply
-- Welding Machine
-- PWM Converter Rectifier
Shanghai
Feb 2011 23
New product Promotion
Applications -- Input rectification
-- Output rectifies which are available in indentical package outlines
-- Industrial Level
60EPS Series •High Reliability & High current capacity•Low Leakage Current•Low Forward Voltage•150 Operating Junction Temperature℃•ROHS Compliance•Replacement of IR Parts•The official approval document of 60EPS by APC of Schneider Denmark.
TYPE
MAIN ELECTRICAL PARAMETERSPKG
DIMMVRRM / V IF ( AV ) / A IFSM/A VRSM/ V
60EPS12 1200 60 1100 1300TO-247AC
60EPS16 1600 60 1600 1700
Shanghai
Feb 2011 24
New product Promotion ——3-phase Rectifier Modules
MSDM Series• Glass passivated chip• High Reliability• Superior thermal conductivity• Blocking voltage:800 to 1800 V• Heat transfer through aluminum
oxide DBC ceramic isolated metal
baseplate
Application --Three phase rectifiers for power supplies
--Rectifiers for DC motor field supplies
--Battery charger rectifiers
--Input rectifiers for variable frequency drives
Thin modules(17mm high)
M2-1M3-1
CODE IF CASE
MSDM 50~100A
M2-1
150~200A M3-1
Shanghai
Feb 2011 25
New product Promotion ——Diode Modules
MSCD-B/MSAD-B/MSKD-B Series• Blocking voltage:800 to 1800V
• Heat transfer through aluminum
oxide DBC ceramic isolated metal
baseplate
• Glass passivated chip
Application• Non-controllable rectifiers for
AC/AC converters
• Line rectifiers for transistorized
AC motor controllers
• Field supply for DC motors
D2-1
MSKD-B3 12
MSAD-B3 12
MSCD-B3 12
D1-1
Circuit CODE IFCAS
E
MSCD-BMSKD-BMSAD-B
36A-120A D1-1
165A-240A D2-1
Shanghai
Feb 2011 26
New product Promotion ——Thyristor Modules
MSTC/MSFC Series• Isolation voltage 3000V• High surge capability• Glass passivated chips• International standard package • Simple Mounting• Heat transfer through aluminum oxide DCB
ceramic isolated metal baseplate
Application• Power Converters• Lighting Control• DC Motor Control and Drives • Heat and temperature control
MSTC1 32
4
7
5
6
Circuit
T1/F1
T2/F2
MSFC1 32
45
Shanghai
Feb 2011 27
New product Promotion ——3 phase Rectifiers+SCR Modules
MSDT Series• Three Phase Diode and a
Thyristor• Isolation voltage 3000V• High surge capability• Glass passivated chips• Simple Mounting• Isolated Module Package
Application• Inverter for AC or DC motor control• Current stablilzed power supply• Switching power supply
1 2
5 4 3
0
67
Circuit
M4 M5
CODE Case
MSDT75 M4
MSDT100 M4
MSDT150 M5
MSDT200 M5
Shanghai
Feb 2011 28
Power ModulesCross Reference Guide (partial) :
* For Reference Only
Microsemi Semikron IXYS
MSD75-16 SKD82/16 VUO82-16N07
MSD100-16 SKD110/16 VUO110-16N07
MSD160-16 SKD160/16 VUO160-16N07
MSD200-16 SKD210/16 VUO190-16N07
MSDM150-16 / VUO162-16N07
MSDM200-16 / VUO192-16N07
MSCD100-16 SKKD100/16 MDD95-16N1B
MSCD165-16 SKKD162/16 MDD172-16N1B
MSCD250-16 SKKD260/16 MDD220-16N1B
MSCD400-16 SKKD380/16 MDD312-16N1B
MSTC25-16 SKKT27/16 MCC26
MSTC60-16 SKKT57/16 MCC56
MSTC110-16 SKKT106/16 MCC95
MSTC160-16 SKKT162/16 MCC161
MSFC25-16 SKKH27/16 MCD26
MSFC60-16 SKKH57/16 MCD56
MSFC110-16 SKKH106/16 MCD95
MSFC160-16 SKKH162/16 MCD161
3-phanse modules
Diode modules
Thyristor/Diode modules
Thyristor/Thyristormodules
Shanghai
Feb 2011 29
Power Modules Cross Reference Guide (partial) :
* For Reference Only
Microsemi SanRex
MSDT75-16 DFA75BA160
MSDT100-16 DFA100BA160
MSDT150-16 DFA150AA160
MSDT200-16 DFA200AA160
MSDM50-16 DF50AA160
MSDM75-16 DF75AA160
MSDM100-16 DF100AA160
MSCD60B-16 DD60KB160
MSCD100B-16 DD100KB160
MSCD165B-16 DD160KB160
MSCD240B-16 DD240KB160
Three Phase Diode + aThyristor
3-phanse modules
Diode modules
Shanghai
Feb 2011 30
Major Customers
Shanghai
Feb 2011 31
Quality System
• ISO
9001:2008
• ISO 14001:2004
Shanghai
Feb 2011 32
Quality System
• RoHS Compliance
• REACH
Compliance
• UL Approved
Shanghai
Feb 2011 33
Thank YouShanghai Microsemi Semiconductor Co., Ltd.
203 Shen Nan Road, Shanghai, 201108, PRC
Website: http://www.smsemi.com
Email: [email protected]
Sales : 0086 - 21 - 6489 - 6650