SFH 2201 - Farnell element14 · 300 mV 350 mV Short-circuit current E v = 1000 lx; Std. Light A I...
Transcript of SFH 2201 - Farnell element14 · 300 mV 350 mV Short-circuit current E v = 1000 lx; Std. Light A I...
SFH 2201
1 Version 1.1 | 2018-07-23
Produktdatenblatt | Version 1.1 www.osram-os.com
SFH 2201
TOPLED® Silicon PIN Photodiode with Enhanced Blue Sensi-tivity
Applications — Electronic Equipment — Industrial Automation (Machine Controls, Light
Barriers, Vision Controls)
Features: — Package: clear silicone
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— Suitable for reflow soldering — small package (WxDxH): 4 mm x 5.1 mm x 0.85mm — Solder control structure
Ordering Information
Type Photocurrent Photocurrent Ordering Codetyp.
Ev = 1000 lx; white LED; VR = 5 V Ev = 1000 lx; white LED; VR = 5 VIP IP
SFH 2201 ≥ 10 µA 13 µA Q65112A3981
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Maximum RatingsTA = 25 °C
Parameter Symbol Values
Operating Temperature Top min. max.
-40 °C 85 °C
Storage temperature Tstg min. max.
-40 °C 85 °C
Reverse voltage VR max. 16 V
Total power dissipation Ptot max. 150 mW
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
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CharacteristicsTA = 25 °C
Parameter Symbol Values
Spectral sensitivity VR = 5 V; Std. Light A, T = 2856 K
S typ. 76 nA/lx
Wavelength of max sensitivity λS max typ. 950 nm
Spectral range of sensitivity λ10% typ. 300 ... 1100 nm
Radiant sensitive area A typ. 8.12 mm²
Dimensions of active chip area L x W typ. 2.85 x 2.85 mm x mm
Half angle φ typ. 60 °
Dark current VR = 10 V
IR typ. max.
1 nA 25 nA
Spectral sensitivity of the chip λ = 400 nm
Sλ typ. 0.2 A / W
Spectral sensitivity of the chip λ = 550 nm
Sλ typ. 0.45 A / W
Open-circuit voltage Ev = 1000 lx; Std. Light A
VO min. typ.
300 mV 350 mV
Short-circuit current Ev = 1000 lx; Std. Light A
ISC typ. 76 µA
Rise time VR = 5 V; RL = 50 Ω; λ = 850 nm; IP = 800 µA
tr typ. 0.04 µs
Fall time VR = 5 V; RL = 50 Ω; λ = 850 nm; IP = 800 µA
tf typ. 0.04 µs
Forward voltage IF = 100 mA; E = 0
VF typ. 1.2 V
Capacitance VR = 0 V; f = 1 MHz; E = 0
C0 typ. 65 pF
Temperature coefficient of voltage TCV typ. -2.6 mV / K
Thermal resistance junction ambient real RthJA max. 280 K / W
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400 600 800 1000λ [ ]
20
40
60
80
100[ ]
Relative Spectral Sensitivity 1), 2) Srel = f (λ)
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
1000
0
0
Directional Characteristics 1), 2) Srel = f (φ)
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0 2 4 6 8 10 12 14 16[ ]
600
800
1000
1200
[ ]
Dark Current 1), 2)
IR = f (VR) ; E = 0
10-6 10-5 10-4 10-3 0.01 0.1 1 10[ ]
10
20
30
40
50
60
70[ ]
Capacitance 1), 2)
C = f (VR); f = 1 MHz; E = 0;
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Dimensional Drawing 3)
Approximate Weight: 46.0 mg
Package marking: Cathode
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Handling Indication: The package is casted with silicone. Mechanical stress at the silicone surface of the unit should be avoid-ed. Pickup the device at the plastic frame.
Recommended Solder Pad 3)
Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
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Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping 3)
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Tape and Reel 4)
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU
180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1500
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Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 3)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
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Transportation Packing and Materials 3)
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or e
quivale
nt pro
cessing (p
eak package
2. Afte
r th
is b
ag is o
pened,
devices th
at will
be s
ubjecte
d to in
frare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body te
mp.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD-0
33 for bake p
rocedure
.
Floor
time s
ee belo
w
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Floor
time
1 Y
ear
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICONDUCTO
RS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
Dimensions of transportation box in mmWidth Length Height
195 ± 5 mm 195 ± 5 mm 30 ± 5 mm
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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
For further application related informations please visit www.osram-os.com/appnotes
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Disclaimer
DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.
Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the OSRAM OS Webside.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
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Glossary1) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2) Testing temperature: TA = 25°C3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.4) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.