MO

DE

L :

LN

500/LN

510S

ER

VIC

E M

AN

UA

L

MARCH, 2007

PORTABLE NAVIGATIONSERVICE MANUAL

MODEL : LN500/LN510

http://biz.lgservice.com

INFORMATION

If you have other questions about the Navigation Device, please contact your supplier orTechnical Support:

- 1-1 -

[CONTENTS]❍ SECTION 1. GENERAL• SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

• SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

• ACCESSORIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

• NAME OF EACH PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

• SUPPORT-HOTLINE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

• SOFTWARE UPGRADE METHOD (OS IMAGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

❍ SECTION 2. ELECTRICAL SECTION• BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

• VOLTAGE SHEET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-6

• SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-7

• PRINTED CIRCUIT DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

❍ SECTION 3. EXPLODED VIEWS• CABINET & MAIN FRAME SECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

❍ SECTION 4. REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

- 1-2 -

❏ SAFETY PRECAUTIONSElectrostatically Sensitive Devices (ESD)Some semiconductor (solid state) devices can be damaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integratedcircuits and some field-effect transistors and semiconductor chip components. The following techniques shouldbe used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain offany electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device, which should be removed for potential shock reasonsprior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" cangenerate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESDdevices.

6. Do not remove a replacement ESD device from its protective package until immediately before you areready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together byconductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch theprotective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALLOTHER SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-erate static electricity sufficient to damage an ESD device).

CAUTION. GRAPHIC SYMBOLS

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE,IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED“DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE ARISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERTTHE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION INSERVICE LITERATURE.

SECTION 1. GENERAL

- 1-3 -

❏ SPECIFICATIONSITEM SPECIFICATION REMARK

OS Win CE 5.0

CPU Centrality Atlas-II ARM9

276 Mhz

MEMORY LN500B : 256 MB Built-in Memory

LN500/505 : 512 MB Built-in Memory

LN510 : 1 GB External SD Card

LN515 : 2 GB External SD Card

DISPLAY 3.5 inch TFT LCD LG Philps LCD

Resolution 320 X 240

Backlight LED type

Touch Screen Analog resisitive type

AUDIO Mono, Internal Speaker Typical 1.0W (1EA)

GPS SiRF star III,

Internal Antenna

NAVI Full Map Voice Guidance

MAP Navtaq

POWER DC 5.0 +/- 0.2V Vehicle PowerCigar-jack Input (12V)

TEMPERATURE Operating : -10~60 °C

Storing : -30~80 °C

Built-in BATTERY 3.7 V (Li-Ion) Typical 3-hours

operation

INTERFACE Mini-USB Port USB 1.1

External GPS Jack (Optional)

Multimedia Electronic Picture Frame BMP, JPG, GIFFiles Compatible

- 1-4 -

❏ ACCESSORIES

Main Set

SD MemoryCard

(Optional)

Suction-Mount Cradle

USBCable

Cigar Light Adapter

Carring Case

ACAdapter

GPS aerial(Optional)

InstallationCD

Quick StartGuide

Contents may be changed without notices.

SD memory card (Optional)The supplied SD Memory Card space may be insufficient after upgrade. In this case, another SD Memory Cardthat has bigger space has to be purchased..

826

829 835

801

828 836830

825 827

- 1-5 -

❏ NAME OF EACH PART

• Front panel

SRC

VOL

2

3

4

1

RESET5

1. LCD2. SRC (Source) button

Move to the main menu screen or theprevious screen.Power sleeEntering power sleep mode.On : Press and hold.Off : Press and hold again.

3. Volume UpIncreases the volume level.

4. Volume DownDecrease the volume level.

5. RESET holeIf the unit fails to operate properly, press thereset button using a ball point pen or a similartool.

To activate the menu function through the LCD screen, touch the LCD screen with afinger.

- 1-6 -

• Rear / Side panel

2

3

6

7

4

5

1

1. External GPS Antenna Slot

2. SpeakerGets a voice guidance service.

3. Docking connector

4. USB port

5. Memory Card SlotInsert a SD Memory Card.

6. Power Hold On / Off buttonOn : Push button up.Off : Push button down.

7. Power supply connectorTiffical DC 5V

Deleting or altering the map data in the built-in memory or the SD memory card ran-domly, may cause problems in the navigation function.

- 1-7 -

❏ SUPPORT-HOTLINE

LG Subsidiary Country Service Number

LG Electronics ESPANA S.A. SPAIN 902 500 234

LG Electronics U.K. Ltd U.K. / IRELAND 0870 873 5454

LG Electronics France FRANCE 0825-826-8220825-825-592

LG Electronics Deutschland GmbH GERMANY 01805 4737 84

LG Electronics Italia S.p.A ITALY 39 199600099

LG Electronics Hellas S.A GREECE +30-210-4800-564/8801 11 200 900

LG Electronics Benelux B.V BELGIUMLUXEMBOURGNetherlands

070-233-55732-70-233-5570900-543-5454

LG ELECTRONICS MAGYAR KFT HUNGARYBulgaria

36-06-40-545454+359-070-1-5454

LG Electronics Polska Sp. z.o.o POLAND 801 54 54 54

LG Electronics Portugal, S,A PORTUGAL 808-78-5454

LG Electronics Nordic AB SWEDENDENMARKFINLANDNORWAY

0771 41 43798088 57580800 116 587800 18 740

Austria AUSTRIA 420 810 555 810

RUMANIA RUMANIA 40 31 228 3542

CZECH REPUBLIC CZECHSLOVAKIA

420 810 555 810421 850 111 154

LG Electonics Australia AUSTRALIA 1 800 643 156

If you have other questions about the Navigation Device, please contact yoursupplier or Technical Support:

www.lge.com/support/software.jspFor questions on products please visit our

site or contact the Support Team.

Monday-Fridays : 09 : 00 am - 6 : 00 pm

- 1-8 -

1. Execute Atlas Mgr 5.0

2. Press and hold the VOL- button, push up the slide switch and press OPEN button, then INPUT window isactivated. Keep pressing VOL- button until INPUT window is activated.

3. Input 1 on INPUT window and then press ENTER on keyboard.• EBOOT is displayed on screen.

4. The log is created on USB Terminal and enter your selection is displayed, input u.Then press Update NK Image icon and file selection windows is displayed, select chain.lst file from OSIMAGE file.

5. Os image is downloaded, then disconnect USB cable after product is turned on.

The ways software upgrade for LAN-B360 two, OS IMAGE and MAP DATA.MAP is executed by DESTINATOR CONSOLE. (Refer to USER_GUIDE)

❏ SOFTWARE UPGRADE METHOD (OS IMAGE)

- 2-1 -

SECTION 2. ELECTRICAL SECTION❏ BLOCK DIAGRAM

• SYSTEM BLOCK DIAGRAM

Atl

as-I

I(C

entr

alit

y So

C)

(Arm

9@27

6MH

z)

SD I

/F

USB

1.1

GP

SR

F &

BB

JTA

G

Key

I/F

CO

DE

C(W

M97

12)

Syst

emM

emor

y

NA

ND

Fla

sh

MIC

OM

TF

T L

CD

3.5í

í

UA

RT

For

Deb

ug

PW

R C

TR

L

SD_D

AT

<3:0

>,SD

_CL

KSD

_CM

D, S

D_C

D

USB

_DM

, USB

_DP

USB

_ID

, USB

_VB

US

X_G

PS_

TX

X_G

PS_

RX

NT

RST

, TD

I, T

DO

TM

S, T

CK

, SR

ST

SRC

, VO

L +

/-

X_T

XD

1(D

A_D

AT

A)

X_R

XD

1(A

D_D

AT

A)

X_T

FS1

, X_S

CL

K1

AD

D

: X_M

A<1

2:0>

D

AT

A :

X_M

D<3

1:0>

/CS,

CL

K, C

KE

, /W

E,

/CA

S, /R

AS

PW

R K

ey C

TR

LSl

eep/

Wak

eup

CT

RL

Cha

rgin

g C

TR

L

RG

B (

6:6:

6), V

DD

, VC

C,

LE

D P

WR

, TO

UC

H X

/Y

X_T

X0

X_R

X0

VD

DP

DN

, VD

DP

RE

VP

LA

, VP

HA

, I/O

Tou

ch I

/F

Aud

ioA

MP

AD

<0:7

>, C

LE

, AL

EW

E, R

E, R

Y_B

Y

Don

ít u

se A

STR

ON

sock

et

- 2-2 -

AT

LA

S-II

Pow

er

Pow

er

Sour

ceSw

itch

Bat

tery

LD

O1.

2

LT

3407

-2D

ual D

C/D

C(8

00m

A/8

00m

A)

VSS

TL

(1.

8V, 1

50m

A)

Fol

low

SD

RA

M V

olta

ge

USB

_VD

DA

(3.

3V, 1

0mA

)

XV

DD

IO (

3.3V

, 75m

A)

IOV

CC

(3.

3V, 5

0mA

)

USB

_VD

DL

( (1

.3V

, ?)

VD

DP

DN

(1.

3V, 3

00m

A)

VD

D_P

RE

(1.

3V, 5

0mA

)

VP

LD

(1.

2V, 3

mA

)

VP

LA

(1.

2V, 1

mA

)

Loa

d S/

W

SDR

AM

(1.

8V, 1

70m

A)

*N

ote

2

NA

ND

Fla

sh (

3,3V

, 60m

A)

*N

ote

3

SD C

ard

(3,3

V, 7

0mA

) *

Not

e 1

GPS

(3,

3V, 9

0mA

)

LC

D (

3,3V

/5V

, 25m

A)

*N

ote

4

MIC

OM

(3,

3V, 2

0mA

)

Aud

io A

MP.

, 5V

/ 20

0mA

(T

ypic

al 1

W),

14

0mA

max

VP

HA

(3.3

V 2

mA

)

GP

S ba

ckup

(3,

3V,1

mA

)

Typ

ical

10u

A @

1.5V

Sing

le D

C/D

C(6

00m

A)

LD

O 3

.3

Boo

st, M

AX

1790

Boo

st, M

AX

1554

B

ack

Lig

ht (

400m

W, 5

V /

80m

A ñ

6 L

ED

s)

Cha

rger

(400

mA

)

DC

Inp

ut

(Max

5.5

V)

LD

O 3

.3

ON

/OF

F

Loa

d S/

W

AA

T3

22

1IJ

S (

EN

)

ISL

62

73

AT

T3

21

6 (

EN

)

AA

T3

68

6

Loa

d S/

W

Slid

ing

Swit

ch

CO

DE

C (

3,3

V, 3

0mA

)L

DO

3.3

SD_O

N

VC

C33

_1 O

N(b

y m

icom

)

PA

_ON

GP

S_O

N

LC

D50

ON

X_P

WR

_EN

VC

C13

ON

VC

C18

ON

(by

mic

om)

PU

LL

UP

LE

D(3

.3V

, 80m

A),

Deb

ug (

3.3V

, 100

mA

)-SM

C/S

eria

l

BL

_ON

CO

DE

C_O

N

AA

T3

22

1IJ

S (

EN

)

LD

O 5

V, A

ME

8804

adj

LD

O 3

.3

LC

D33

ON

• POWER BLOCK DIAGRAM

- 2-3 -

• SW BLOCK DIAGRAM

LAN-B360 Hardware Platform

OAL

DEVICE DRIVERS

Kernel

GWES File

System

Device

Manager Networking and

Communication System

Programming Interface (Win32,COM,MFC,ATL)

Communication Interface (Winsock,RAS,TAPI)

DT Navigation

OAL : OEM Adaptation LayerGWES : Graphics, Windowing and

Event SubsystemCOM : Component Object Model MFC : Microsoft Foundation ClassATL : Active Template LibraryRAS : Remote Access SeverTAPI : Telephony Application Program Interface

DT PhotoViewer

DT Source Menu

DT SetupVolumeControl

- 2-4 -

• CPU CONNECTION DIAGRAM

AT

LA

S-I

I (R

EV

.D)

276

MH

z

SD

RA

M6

4Mb

yte

IC3

00

,IC3

00

1K

4S5

61

63

3F-7

5

NA

ND

Fla

sh3

2Mb

yte

IC4

01

K9F

56

08U

0M

SD

car

d c

on

nC

N4

00

54-

21

08-

9-R

Fro

nt

bu

tto

nF

ron

t L

ED

SW

80

1, 8

02,

80

3

Au

dio

Co

dec

IC6

01

WM

971

2

Au

dio

Po

wer

Am

pIC

70

1N

JM20

70

GP

SS

irfII

I m

od

ule

CN

20

0

U-p

roce

ssor

IC9

02

PIC

16F

72

US

B I

/FJK

700

De

bu

gg

er s

eria

lC

N7

01

LCD

(3.

5î)

+ T

OU

CH

CN

50

1

TC

ON

IC5

00

HS

35

31

63

Gam

ma

IC5

01

AD

85

11

JTA

GC

N8

03

- 2-5 -

• GPS BLOCK DIAGRAM

VC

C

RF

Sw

itch

SA

W

Filt

er

25X

25P

atch

Ant

LNA

RF IC

Bas

eban

dIC

SiR

F II

IFla

sh

Rec

harg

eabl

e B

atte

ryLD

O

TX

Dat

a

RX

Dat

a

- 2-6 -

❏ VOLTAGE SHEET

• MAIN PCB

1. TEST VOLTAGE : DC 10.5~16V2. CHECK METHOD : VR MIN(10.5V)/MAX(16V)

PART NAME SPEC 10.5V 16V

C518 10uF/50V 18.81 18.82

C519 10uF/16V 3.31 3.31

C616 10uF/16V 5.35 5.36

C627 22uF/16V 5.06 5

C639 10uF/16V 3.35 3.35

C633 10uF/16V 5.03 5.01

C642 10uF/16V 5.03 5

C904 47uF/10V 5.17 5.17

C909 22uF/6.3V 5.16 5.17

C902 10uF/10V 5.4 5.41

C905 47uF/10V 4.18 4.18

C1004 10uF/16V 4.72 4.7

C1000 10uF/16V 1.81 1.8

C1011 10uF/16V 1.34 1.35

C1019 10uF/16V 3.27 3.28

C1008 10uF/16V 1.19 1.19

C1020 10uF/17V 3.23 3.23

C1024 10uF/18V 3.31 3.31

C1018 10uF/19V 3.31 3.31

C1009 22uF/6.3V 1.34 1.33

• GPS

1. TEST VOLTAGE : DC 10.5~16V2. CHECK METHOD : VR MIN(10.5V)/MAX(16V)

PART NAME SPEC 10.5V 16V

C121 10uF/16V 3.29 3.3

C128 10uF/16V 1.18 1.18

2-7 2-8

❏ SCHEMATIC DIAGRAMS

• CPU I/O SCHEMATIC DIAGRAM

2-9 2-10

• CPU POWER & CONFIGURATION SCHEMATIC DIAGRAM

2-11 2-12

• SDRAM SCHEMATIC DIAGRAM

2-13 2-14

• NAND FLASH & SD CARD SCHEMATIC DIAGRAM

2-15 2-16

• GPS SCHEMATIC DIAGRAM

2-17 2-18

• LCD POWER & CONNECTOR SCHEMATIC DIAGRAM

2-19 2-20

• CODEC & AMP SCHEMATIC DIAGRAM

2-21 2-22

• CONNECTOR SCHEMATIC DIAGRAM

2-23 2-24

• MICOM, KEY & LED SCHEMATIC DIAGRAM

2-25 2-26

• POWER RAIL SCHEMATIC DIAGRAM

2-27 2-28

• POWER SCHEMATIC DIAGRAM

2-29 2-30

❏ PRINTED CIRCUIT DIAGRAMS

• MAIN P.C BOARD DIAGRAM (TOP SIDE)

2-31 2-32

• MAIN P.C BOARD DIAGRAM (BOTTOM SIDE)

2-33 2-34

• GPS P.C BOARD DIAGRAM (TOP SIDE)

• GPS P.C BOARD DIAGRAM (BOTTOM SIDE)

3-23-1

250

255

A46

A49

270

281

450

450

283

280

282

A40

A41

251

260

CABLE1

SECTION 3. EXPLODED VIEW

❏ CABINET & MAIN FRAME SECTION

NOTE) Refer to SECTION 4 REPLACEMENTPARTS LIST in order to look for thepart number of each part.