Service Manual Kx Tgd210ag1

7/25/2019 Service Manual Kx Tgd210ag1

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Panasonic System Networks Co., Ltd. 2014

Unauthorized copying and distribution is a violation

of law.

ORDER NO. KM41410868CE

Telephone EquipmentModel No. KX-TGD210AG1

KX-TGD212AG1

KX-TGDA20AG1Digital Cordless PhoneB: Black Version

(for Argentina)

(Handset)

KX-TGDA20 KX-TGD210

(Base Unit)

Caller ID Compatible

(Charger Unit)

Model No Base Unit Handset Charger Unit

KX-TGD210 1 (TGD210) 1 (TGDA20)

KX-TGD212 1 (TGD210) 2 (TGDA20) 1

KX-TGDA20 1 (TGDA20) 1

Configuration for each model


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2

KX-TGD210AG1/KX-TGD212AG1/KX-TGDA20AG1

WARNING

This service information is designed for experienced repair technicians only and is not designed for use by the generalpublic. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attemptingto service a product. Products powered by electricity should be serviced or repaired only by experienced professionaltechnicians. Any attempt to service or repair the product or products dealt with in this service information by anyoneelse could result in serious injury or death.

IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked byin the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential thatthese critical parts should be replaced with manufacturers specified parts to prevent shock, fire or other hazards.Do not modify the original design without permission of manufacturer.

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.When this mark does appear, please read and follow the special instructions described in this manual on the

use of PbF and how it might be permissible to use Pb solder during service and repair work.

LWhen you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.

LThe illustrations in this Service Manual may vary slightly from the actual product.


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TABLE OF CONTENTSPAGE PAGE

1 Safety Precautions -----------------------------------------------4

1.1. For Service Technicians --------------------------------- 4

2 Warning-------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4

2.2. About Lead Free Solder (PbF: Pb free)-------------- 4

2.2.1. Suggested PbF Solder ------------------------------ 52.3. Discarding of P. C. Board-------------------------------- 5

3 Specifications ----------------------------------------------------- 6

4 Technical Descriptions -----------------------------------------7

4.1. US-DECT Description ------------------------------------ 7

4.1.1. TDD Frame Format ---------------------------------- 7

4.1.2. TDMA system------------------------------------------ 7

4.1.3. Signal Flowchart in the Radio Parts-------------- 8

4.2. Block Diagram (Base Unit_Main)---------------------- 9

4.3. Block Diagram (Base Unit_RF Part)-----------------10

4.4. Circuit Operation (Base Unit) --------------------------11

4.4.1. BBIC (Base Band IC: IC501) ---------------------11

4.4.2. EEPROM (IC611)------------------------------------11

4.4.3. Power Supply Circuit/Reset Circuit--------------12

4.4.4. Telephone Line Interface---------------------------14

4.4.5. Parallel Connection Detect Circuit/Auto

Disconnect Circuit -----------------------------------15

4.4.6. Calling Line Identification (Caller ID)/Call

Waiting Caller ID -------------------------------------16

4.5. Block Diagram (Handset)-------------------------------18

4.6. Circuit Operation (Handset)----------------------------19

4.6.1. Outline --------------------------------------------------19

4.6.2. Power Supply Circuit/Reset Circuit--------------19

4.6.3. Charge Circuit ----------------------------------------19

4.6.4. Battery Low/Power Down Detector--------------19

4.6.5. Speakerphone----------------------------------------194.7. Signal Route -----------------------------------------------20

5 Location of Controls and Components ------------------22

6 Installation Instructions ---------------------------------------22

7 Operating Instructions-----------------------------------------22

8 Test Mode ----------------------------------------------------------23

8.1. Engineering Mode----------------------------------------23

8.1.1. Base Unit ----------------------------------------------23

8.1.2. Handset ------------------------------------------------25

9 Service Mode -----------------------------------------------------27

9.1. How to Clear User Setting (Handset Only)---------27

10 Troubleshooting Guide ----------------------------------------28

10.1. Troubleshooting Flowchart -----------------------------2810.1.1. Check Power------------------------------------------29

10.1.2. Check Record ----------------------------------------30

10.1.3. Check Playback -------------------------------------31

10.1.4. Check Battery Charge------------------------------31

10.1.5. Check Link---------------------------------------------32

10.1.6. Check the RF part -----------------------------------34

10.1.7. Registering a Handset to the Base Unit--------38

10.1.8. Deregistering a Handset ---------------------------38

10.1.9. Check Handset Transmission --------------------39

10.1.10. Check Handset Reception-------------------------39

10.1.11. Check Caller ID --------------------------------------39

11 Disassembly and Assembly Instructions ---------------40

11.1. Disassembly Instructions -------------------------------40

11.1.1. Base Unit ----------------------------------------------40

11.1.2. Handset ------------------------------------------------41

11.1.3. Charger Unit ------------------------------------------ 42

11.2. How to Replace the Handset LCD------------------- 43

12 Measurements and Adjustments --------------------------44

12.1. Equipment Required ------------------------------------ 44

12.2. The Setting Method of JIG----------------------------- 44

12.2.1. Connections (Base Unit) -------------------------- 4412.2.2. Connections (Handset) ---------------------------- 45

12.2.3. How to install Batch file into P.C. ---------------- 46

12.2.4. Commands-------------------------------------------- 46

12.3. Adjustment Standard (Base Unit) -------------------- 47

12.3.1. Bottom View ------------------------------------------ 47

12.4. Adjustment Standard (Handset)---------------------- 48

12.4.1. Component View ------------------------------------ 48

12.5. Things to Do after Replacing IC or X'tal------------ 49

12.5.1. How to download the data ------------------------ 49

12.6. Frequency Table------------------------------------------ 51

13 Miscellaneous----------------------------------------------------52

13.1. How to Replace the Flat Package IC --------------- 52

13.1.1. Preparation--------------------------------------------52

13.1.2. How to Remove the IC-----------------------------52

13.1.3. How to Install the IC --------------------------------53

13.1.4. How to Remove a Solder Bridge ---------------- 53

13.2. Terminal Guide of the ICs, Transistors and

Diodes ------------------------------------------------------54

13.2.1. Base Unit ---------------------------------------------- 54

13.2.2. Handset------------------------------------------------ 54

14 Schematic Diagram --------------------------------------------55

14.1. For Schematic Diagram --------------------------------55

14.1.1. Base Unit (Base Unit (Main))--------------------- 55

14.1.2. Handset (Handset (Main)) ------------------------ 55

14.2. Base Unit (Main) ----------------------------------------- 5614.2.1. KX-TGD210------------------------------------------- 56

14.3. Handset (Main) ------------------------------------------- 58

15 Printed Circuit Board ------------------------------------------61

15.1. Base Unit (Main) ----------------------------------------- 61

15.1.1. Component View ------------------------------------ 61

15.1.2. Bottom View ------------------------------------------ 62

15.2. Handset-----------------------------------------------------63

15.2.1. Component View ------------------------------------ 63

15.2.2. Bottom View ------------------------------------------ 64

16 Exploded View and Replacement Parts List ----------- 65

16.1. Cabinet and Electrical Parts (Base Unit)----------- 65

16.1.1. KX-TGD210------------------------------------------- 6516.2. Cabinet and Electrical Parts (Handset)------------- 66

16.3. Cabinet and Electrical Parts (Charger Unit) ------- 67

16.4. Accessories and Packing Materials ----------------- 68

16.4.1. KX-TGD210AG1------------------------------------- 68

16.4.2. KX-TGD212AG1------------------------------------- 69

16.5. Replacement Parts List---------------------------------70

16.5.1. Base Unit ---------------------------------------------- 70

16.5.2. Handset------------------------------------------------ 71

16.5.3. Charger Unit ------------------------------------------ 72

16.5.4. Accessories and Packing Materials ------------ 72

16.5.5. Screws -------------------------------------------------72

16.5.6. Fixtures and Tools----------------------------------- 72


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1 Safety Precautions

1.1. For Service Technicians Repair service shall be provided in accordance with repair technology information such as service manual so as to

prevent fires, injury or electric shock, which can be caused by improper repair work .

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

2 Warning

2.1. Battery Caution1. Danger of explosion if battery is incorrectly replaced.2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufactures Instructions.

2.2. About Lead Free Solder (PbF: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that

contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder.

Caution PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 F 20 F (370 C 10 C).

Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).

When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

ComponentComponentpin

Solder

Remove all of theexcess solder

(Slice View)

p


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2.2.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the

manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P. C. BoardWhen discarding P. C. Board, delete all personal information such as telephone directory and caller l ist or scrap P. C. Board.

0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g


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3 Specificat ions

Note for Service: Operation range:Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.

Analog telephoneconnection: Telephone Line

Power source

Receiving Method

Oscillation Method

Detecting Method

Tolerance of OSC Frequency

Modulation Method

ID CodeRinger Equivalence No. (REN)

Dialing Mode

Redial

Speed Dialer

Power Consumption

Operating Conditions

Dimensions (W x D x H)

Mass (Weight)

AC Adaptor

(PNLV226AG0Z, 220240 V AC,

50/60 Hz)

Super Heterodyne

PLL synthesizer

Quadrature Discriminator

13.824 MHz 100 Hz

Frequency Modulation

40 bit0.1B

Standby: Approx. 0.6 W (*1)

Maximum: Approx. 3.2 W (*1)

0 C - 40 C (32 F 104 F)

20 % 80 % relative air humidity

(dry)

Approx. 143 mm x 103mm x 48mm(*1)

Approx. 143 mm x 103mm x 48mm(*2)

Approx. 140 g (*1)

Approx. 170 g (*2)

Rechargeable Ni-MH battery

AAA (R03) size (1.2 V 400 mAh)

Super Heterodyne

PLL synthesizer

Quadrature Discriminator

10.368 MHz 100 Hz

Frequency Modulation

40 bit

Tone (DTMF)/Pulse

Up to 48 digits

Up to 32 digits (Phonebook)

6 days at Standby,

10 hours at Talk

0 C - 40 C (32 F 104 F)


(dry)

Approx. 48mm x 30 mm x 168mm

Approx. 130 g

Base Unit Handset Charger

AC Adaptor

(PNLV233AGAZ, 220240 V AC,

50/60 Hz)

Standby: Approx. 0.1 W,

Maximum: Approx. 1.8 W

0 C - 40 C (32 F 104 F)


(dry)

Approx. 72 mm x 72 mm x 45

mm

Approx. 100 g

Duplex procedure:

TDMA (Time Division Multiple Access)

Channel spacing:

1,728 kHz

Bit rate:

1,152 kbit/s

Modulation:

GFSK (Gaussian Frequency Shift Keying)

RF transmission power:

115 mW (max.)

Voice coding:ADPCM 32 kbit/s

N

N

N

N

N

N

N Standard:DECT 6.0 (Digital Enhanced Cordless

Telecommunications 6.0)N Number of channels:60 Duplex Channels

N Frequency range:1.91 GHz to 1.93 GHz


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4 Technical Descriptions

4.1. US-DECT DescriptionThe frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same

frequency. Refer to Frequency Table(P.51).

4.1.1. TDD Frame Format

4.1.2. TDMA systemThis system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy

bearer use.

In 1 slot 417 s, the 10 ms of voice data is transmitted. 2 - Handsets Link

Traffic BearerA link is established between base unit and handset.

The state where duplex communication is performed.

Handset doesn't make up duplex in no free RF channels because of interference. (*1)

Dummy BearerBase unit sends Dummy-data to the all stand-by state handsets.

Handsets receive that data for synchronization and monitoring request from the base unit.

Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)

Note:(*1) It is a feature under FCC 15 regulation and for interference avoidance.

In the case of checking RF parts, it is better in least interference condition.

417 s (available) 417 s (blind)

5 ms 5 ms

Up Link ( Handset ->Base Unit ) Down Link ( Base Unit ->Handset )

DATA rate : 1.152 Mbps

RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6

RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6

TX RX

RXTX

Traffic Bearer Dummy bearer

Base unit

Handset 1

(Stand by)

Handset 2

(Link)

Handset 3(Link)


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4.1.3. Signal Flowchart in the Radio PartsReception

A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.

Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.

As for a handset RF, RF signal is received in one antenna.

BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".

BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.

TransmissionA voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.

Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.

As for a base unit RF, RF signal is received in two antennas.

BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal

from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".

BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.


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4.2. Block Diagram (Base Unit_Main)

KX-TGD210/212BLOCKDIAGRAM(BaseUnit_Main)

OperationalP.C.Board

D101

CHARGE_

CONTACT

+ -

SP

X501

13.824MHz

A

NT1

TELJACK

L1T

L1R

DCP

DCM

DCJACK

RLY

SIDETONE

CIRCUIT

Q161

Q141

BELL

DETECT

HOO

K

BEL

L

Q111

LI

N

LOU

T

RF_

PART

HSMIP

HSMI

N

IC501

BBIC

INUSE

DETECT2

INUSE

DETECT1

RECEIVE

AMP

DCIN

1

DCIN

2

IC302

VCCP

A

VBAT_

AP

U

VBA

T

VCC_F

E

VCC_IF

VCC_

VCO

3.0V

DOUBOU

T

SCL,SDA

WP

VDD

ANS_LED

IC601

FLASH

MEMORY

IC611

EEPROM

MEMORY

KEYS

R151,R152

R131,R133

Q171

VBAT

DL,CS

MSG_LED

KEY13

KEYC,D,E

SPOUTNSPOUTP

3.0V

REGULATOR

CLK,DO

STM/CKM

R371

R372

VCCA

VCC

RXp

RXn

TXp

TXn

RESET

RSTN


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4.3. Block Diagram (Base Unit_RF Part)

KX-TGD210/212 BLOCK DIAGRAM (Base Unit_RF Part)

RXp

RXn

ANT1

TXp

TXn


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4.4. Circuit Operation (Base Unit)General Description:

(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech

compression, record and playback, and memory management required in a digital telephone answering machine.

The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions

as follows.

4.4.1. BBIC (Base Band IC: IC501) Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.

An error correction algorithm is used to enable playback of these messages from the Flash Memory.

DTMF Generator

When the DTMF data from the handset is received, the DTMF signal is output.

Synthesized Voice (Pre-recorded message)

The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

Caller ID demodulation

The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.

Digital Switching

The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the

Telephone line, etc. They are determined by the signal path route operation of voice signal.

Block Interface Circuit

RF part, LED, Key scan, Speaker, Telephone line.

4.4.2. EEPROM (IC611)Following information data is stored.

Settings

ex: message numbers, ID code, Flash Time, Tone/Pulse

RF part

ADPCM

Analog

Front

End

&

Multi-

plexer

TELLine

Interface

Digital

SpeechProcessor

Caller ID

Modem

Digital TAM System

Host CPU

BBIC (IC501)

TDD & TDMAwith FHSS

Processor ADPCM

EEPROM IC611

*1


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4.4.3. Power Supply Circuit/Reset CircuitThe power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is

insulated from VBAT by Doubler of BBIC.

Circuit Operation:

5.5V

VBAT

RSTN(Reset)

pin 54

VBATpin 10

pin 57

pin 9

pin 15IC501IC302 IC601

BBIC

DOUBLER OUTFor peripherals

VDDC (1.2V)

AC Adaptor 3.0VREGULATOR

FLASH

IC611

EEPROM

+3.0V

STM/CKM

ReceiveAmp.

RF Part

ANS LEDMSG LED

Startmonitor(IC501 57pin)

VDDC (1.2 V)

VBAT

Reset (RSTN)(IC501_54 pin)

BBIC chip initialize

(CKM/STM)


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4.4.3.1. Charge CircuitThe voltage from the AC adaptor is supplied to the charge circuits.

D361

R372

R371

F301 DCP

+5.5V

CHARGE-

CHARGE+

(

)

DCMD362

C351


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4.4.4. Telephone Line InterfaceTelephone Line Interface Circuit:

Function Bell signal detection

ON/OFF hook and pulse dial circuit

Side tone circuit

Bell signal detection and OFF HOOK circuit:In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)

and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:T R111C111Q111BBIC pin 5 [BELL]

When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through

the circuit). Following signal flow is the DC current flow.

T D101 Q141 Q161 R163 D101 P101 R

ON HOOK Circuit:Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-

hook condition.

Pulse Dial Circuit:Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.

Side Tone Circui t:Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is

canceled by the canceller circuit of BBIC.

C120

1000p

R131

10M

L1RR133

330k

VDDC

C111

0.0

47u

R141

100k

C142

K0.0

1u

C124

NC

L1T

C132

K0.0

1u

+3.0V

R112

100k

R113

10k

C186

10p

R142

2.7

k

C123

NC

R145

2.2

k

R111

100k

C113

K0.6

8u

R121 390k

R122 390k

C112

0.0

47u

Q142B

C

E

*SA101

300V

SA103

NC

2

1

Q111

D113

A

K

D133

A

K

D153

NC

A

K

R164

2.7k

R161

100k

C168

NC

R151

100k

C152

0.0

1u

R177

1k

Q171

Q161B

C

EC161

10u

R165

27k

+3

.0V

C164

NC

RA151

1k

1 2

34

C181

NC

C184

1u

C16 3 NC

D101

1

4 3

2

C101 680p

C102 680p

C 1 21 6 8 0p

C 1 22 6 8 0p

R163

39

R152

130k

R176

1k

R175

3.9

k

R172 680kC176

1u

R114

47k

1

2

*D142

25V

C17 3

0.1 u

C167

1000p

C171

0.0

22u

C175

560p

C178

0.0

33u

R160

820

R171

220

R168

4.7

k

*R115

NC

*C115NC

*P101

*Q141

*D143

NC

*SA102

NC

*R162

47k

Hookook

BELLLL

Pin 5 of IC501

Pin 6 of IC501

Pin18ofIC5

01

Pin17ofIC5

01

Pin16ofIC501

Pin25of

IC501

Pin24of

IC501

Pin 28 of IC501


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4.4.5. Parallel Connection Detect Circuit/Auto Disconnect CircuitFunction:

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a

circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone

connected in parallel is on hook or off hook by detecting changes in the T/R voltage.

Circuit Operation:Parallel connection detection when on hook:

When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is

0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by

detecting the voltage changes.

If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after

detecting parallel connection is off hook.

Q141

Q161

R141

R142

RA151

R131

R133

Q142R151

R145

C132

Pin 17 of IC501DCIN1

Pin 18 of IC501DCIN2

HOOKPin 6 of IC501

C101

D101

C102SA101

P101

TEL JACK

3

4

2

1R163

L1T

L1R

R152C152

RA151


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4.4.6. Calling Line Identification (Caller ID)/Call Waiting Caller IDFunction:

Caller ID

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company

to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been

entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the

first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK

(Frequency Shift Keying) * format. Data "1"is a 1200 Hz sine wave, and data "0"is a 2200 Hz sine wave. There are two types of

the message format which can be received: i.e. the single message format and plural message format. The plural messageformat allows to transmit the name and data code information in addition to the time and telephone number data.

*: Also the telephone exchange service provides other formats.

1st Ring

2 sec Silent interval 4 sec2nd Ring

2 sec

0.5 s 575 ms min 0.5 s

DATA

0.1 Vrms

STD Ring / 20 Hz

Tip-Ring

DATA inA

B DATA out

1200 Hz

=DATA "1"

1 bit=833 s

2200 Hz

=DATA "0 "

70 Vrms

month day hour minute number

201348700035161504

Single message format

Plural message format

1st Ring

2 sec

718ms2nd Ring0.5 s

DATA

month day hour minute number

20134870003516 16

DATA CODE NAME

201 JohnS

mith 04


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Call Waiting Caller IDCalling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,

to receive information about a calling party on a waited call. The transmission of the calling information takes place almost

immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new

call.

Function:The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and

MARK data pass the following route.

Telephone Line P101 C121, C122 R121, R122 IC501 (25, 24).

If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the

information for the second and subsequent callers is not displayed on the portable handset display.

C121R121

C122

P101

L1TL1R

SA101R122C120

25

24

BBICIC501"FSK"data

TelephoneLine


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4.5. Block Diagram (Handset)

QSP

I

FLAS

HMEMORY

IC4

SPEAKER

RECEIVER

MIC

CHARGE

CIRCUIT

Q2,Q3,Q4,

Q

2

Q

3

Q

4

Q9,R8

Q

9

R

CHARG

E

CONTACTSC

HARGE(+)

CHARGE

_CTRL

CHARG

E_

DET

EEPROM

SCL

SDA

BATTER

Y

TERMIN

AL

R45

VBAT

BATT-

1.8

V

Q11

.8V

LCD

CD

RESET

CSB

SDA

SCL

CPU

Analog

Front

End

D/A

A/D

35

37

21

22

17

18

34

33

66

67

32 2

473

63

64

76

ADPCM

Codec

Filter

DSP

Speec

h

Deco

ding

Speec

h

Enco

ding

BMC

Burs

t

Deco

ding

ANT1

Burs

t

Enco

ding

RFPLL

MOD/DEMOD

1 2 87

86

RXn

A

NT1

RXp

TXp

TXn

7 8

XTAL

X1 1

0.3

68

MHz

BATTERY

46

ONSWITCH

KEYPAD

ROWS

COLUMNS

57,

58,

59,

60

11,

12,

13,

14,

55

47,

48,

51,

53QSPI-IO0-3

44

45

Charge

Pump

CP3V

CP4V

BBIC

IC1

IC7

65

KEYLED

61

LDO

_CTRL

CP3.0

V

CP3V

QSPI

Con

trol

52QSPI-SCK

49QSPI-CS

KX-TGDA20BLOCKDIAGRAM(Handset)

LCD-BACKLIGHT

77

Reset

Reset

Pin71


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4.6. Circuit Operation (Handset)

4.6.1. OutlineHandset consists of the following ICs as shown in Block Diagram (Handset)(P.18).

DECT BBIC (Base Band IC): IC1

- All data signals (forming/analyzing ACK or CMD signal)

- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)

- PLL Oscillator

- Detector- Compress/Expander

- Reception

- Integrated 1.9 GHz PA for DECT

QSPI FLASH MEMORY: IC4

- Main Program D/L Area

EEPROM: IC3

- Temporary operating parameters (for RF, etc.)

4.6.2. Power Supply Circuit/Reset CircuitCircuit Operation:

When power on the Handset, the voltage is as follows;

BATTERY(2.2 V ~ 2.6 V: BATT+) F1 Q1 (1.8 V), IC1-44pin (3.0V)

The Reset signal generates IC1 (71 pin) and 1.8 V.

4.6.3. Charge Circu itCircuit Operation:

When charging the handset on the Base Unit, the charge current is as follows;

DC+(5.5 V) R371 R372 D362 CHARGE+(Base) CHARGE+(Handset) Q3 F1 BATTERY+...

Battery...

BATTERY- R45 GND CHARGE-(Handset)CHARGE-(Base)GND DC-(GND)

In this way, the BBIC on Handset detects the fact that the battery is charged.

The charge current is controlled by switching Q9 of Handset.Refer to Fig.101 in Power Supply Circuit/Reset Circuit(P.12).

4.6.4. Battery Low/Power Down DetectorCircuit Operation:

Battery Low and Power Down are detected by BBIC which check the voltage from battery.

The detected voltage is as follows;

Battery Low

Battery voltage: V(Batt) 2.25 V 50 mV

The BBIC detects this level and " " starts flashing.

Power Down

Battery voltage: V(Batt) 2.0 V 50 mV

The BBIC detects this level and power down.

4.6.5. Speakerphone

The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

1.8 V

Reset

(IC1_71pin)

Battery +

Q2

R8


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4.7. Signal Route

Note:

: inside of Handset

---ANT. - - IC501(46/47 - 28) - C184 - Q161 - Q141

- D101 - P101 - T/R(TEL LINE)

T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177 - C173 - Q171 - C178

- IC501(16 - 44/45) - - ANT. ---

---ANT. - - IC501(46/47 - 28) - C184 - Q161 - Q141

- D101 - P101 -T/R(TEL LINE)

T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 -R178

- IC501(16-44/45) - - ANT. ---

---ANT. - - IC501(46/47- 73/74) - IC601

IC601 - IC501(73/74 - 28) - C184 - Q161 - Q141 - D101 - P101

- T/R(TEL LINE)

T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 - R178

- IC501(16 - 73/74) - IC601

IC601 - IC501(73/74 - 29/31) - SPEAKER

IC501(28) - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)

T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)

T/R(TEL LINE) - P101 - R111/R112 - C111/C112 - Q111 - IC501(5)

HANDSET TX

HANDSET RX

HANDSET

SP-Phone TX

HANDSET

SP-Phone RX

SIGNAL ROUTE IN ROUTE OUT

GREETINGRECORDING

GREETING PLAYTO TEL LINE

ICM RECORDING

ICM PLAY TOSPEAKER

DTMF SIGNALTO TEL LINE

CALLER ID

BELL DETECTION

MIC (+) - C13- IC1 (17) IC1(86)

MIC () - C11 - IC1 (18) IC1(87)

C859 - ANT to BASE

from BASE UNIT ANT 1 IC1 (1)IC1 (2)

IC1 (21) - RECEIVER (+)

IC1 (22) - RECEIVER ()

MIC (+) - C13- IC1 (17) IC1(86)

MIC () - C11 - IC1 (18) IC1(87)

C859 - ANT to BASE

from BASE UNIT ANT IC1 (1) IC1 (35) - SP () IC1 (2) IC1 (37) - SP (+)

MIC (+) - C13- IC1 (17) IC1(86)

MIC () - C11 - IC1 (18) IC1(87)

C859 - ANT to BASE


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RF part signal route

SIGNAL ROUTE IN ROUTE OUT

HANDSET RF

[ TX_ROUTE ]

HANDSET RF

[ RX_ROUTE ]

BASE UNIT RF

[ TX_ROUTE ]

BASE UNIT RF

[ RX_ROUTE ]

IC1(86/87) - C859 - ANT

ANT - IC(1/2)

IC501(44/45) - C819 - C872 - ANT

ANT - C872 - C895 - IC501(46/47)

Note:

: inside of Handset


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5 Location of Controls and ComponentsRefer to the Operating Instructions.

Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation InstructionsRefer to the Operating Instructions.


7 Operating InstructionsRefer to the Operating Instructions.



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8 Test Mode

8.1. Engineer ing Mode

8.1.1. Base Unit

Important:

Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

Dial keypad

9). Press (off) to return to standby mode.

After that, turn the base unit power off and then power on.

1). Press MENU{ }.

2). Select "Initial Setup" using or

then press {OK} .

H/S key operation

{ } {V}

4). Enter "7", "2", "6", "2", "7", "6", "6", "4".

Note:7262 7664 = PANA SONI

(see letters printed on dial keys)

6). Enter " ", " ", " ", " " (Address). (*1)

7). Enter " ", " " (New Data). (*1)

5). Select "Write EEP" using or

then press or {>}.

{ } {V}

3). Select "Line Setup" using or

then press {OK}or {>}.

{^} {V}

_ _ _ _ _ _

H/S LCD

Set Addr.:

Default Data

Set Addr.:

C OK

New Data

Set Addr.:

C OK8). Press , a long confirmation beep

will be heard.

{OK}

OK

Service Mode

Read EEP

Write EEP{OK}Get S/W Ver.

{TALK:Talk }{ }

{OFF }

{FLASH}

{CALL WAIT} (Call wait)

Soft keys

? (Volume) key/(Phonebook)/

CID (Caller ID) key/

REDIAL (Redial) key/

Navigator key/(Off)


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Frequently Used Items (Base Unit)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

(*2)

Items Address Default Data New Data Remarks

C-ID (FSK) sensitivity 06 DE/06 DD 00/28 00/1C

(3 dB up)

00/14

(6 dB up)

When hex changes from 00/28 to 00/1C or

00/14, gain increases by 3 dB or 6 dB.

C-ID (DTMF) sensitivity 06 F8/06F7 00/01 0B/4C

(3 dB up)

0F/F6

(6 dB up)

When hex changes from 00/01 to 0B/4C or

0F/F6, gain increases by 3 dB or 6 dB.

Frequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to

confirm the contents. Careless rewriting may

cause serious damage to the computer system.ID 00 02 ~ 00 06 Given value - -

Bell length 03 D4 3C (6 sec) (*3) 1E (3 sec) 14 (2 sec) This is time until bell stops ringing.

(Unit: 100 msec)

Desired Number (hex) Input Keys Desired Number (hex) Input Keys

0 0 A [R] + 0

1 1 B [R] + 1

. . C [R] + 2

. . D [R] + 3

. . E [R] + 49 9 F [R] + 5

Bell length 3C (hex) = 60 (dec) 60 100 msec = 6000 msec (6 sec)


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8.1.2. Handset

Important:

Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

Dial keypad

8). Press (off) to return to standby mode.

After that, turn the base unit power off and then power on.

1). Press MENU{ }.

2). Select "Initial Setup" using or

then press {OK} .

H/S key operation

{ } {V}

3). Enter "7", "2", "6", "2", "7", "6", "6", "4".

Note:7262 7664 = PANA SONI

(see letters printed on dial keys)

5). Enter " ", " ", " ", " " (Address). (*1)

6). Enter " ", " " (New Data). (*1)

4). Select "Write EEP" using or

then press or {>}.{ } {V}

_ _ _ _ _ _

H/S LCD

Set Addr.:

Default Data

Set Addr.:

C OK

New Data

Set Addr.:

C OK7). Press , a long confirmation beep

will be heard.

{OK}

OK

Service Mode

Read EEP

Write EEP{OK}Get S/W Ver.

{TALK:Talk}{ }

{OFF }

{FLASH}

{CALL WAIT} (Call wait)

Soft keys

?(Volume) key/

(Phonebook)/

CID (Caller ID) key/

REDIAL (Redial) key/

Navigator key/(Off)


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Frequently Used Items (Handset)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the

handset.

Items Address Default Data New Data Possible Adjusted

Value MAX (hex)

Possible Adjusted

Value MIN (hex)

Remarks

Battery Low 00 09 70 - - -

(*2)Frequency 00 07 / 00 08 70/02 - - -

ID 00 02 ~ 00 06 Given value - - -

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys

0 0 A [Flash] + 0

1 1 B [Flash] + 1

. . C [Flash] + 2

. . D [Flash] + 3

. . E [Flash] + 4

9 9 F [Flash] + 5


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9 Service Mode

9.1. How to Clear User Setting (Handset Only)Handset

Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.

(The contents of user setting are reset to factory default)

*Usage time is not cleared.

2 5 8 0


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10 Troubleshooting Guide

10.1. Troubleshooting Flowchart

Cross Reference:Check Power(P.29)

Check Playback(P.31)

Check Record(P.30)

Check Battery Charge(P.31)

Check Link(P.32)

Check the RF part(P.34)

Check Handset Transmission(P.39)

Check Handset Reception(P.39)

Check Caller ID(P.39)

Power ON Base Unit

OK

FLOW CHART

Check Power

OK

Playback Pre-Message Check Playback

Record

OK

Check Record

Range Check the RF part

Handset Voice Transmission Check Handset Transmission

Handset Voice ReceptionOK

OK

OK

Check Handset Reception

Caller ID Reception Check Caller IDCaller ID Error

No voice

No voice

No charge

Not playback

Not record

Not working

NG

No link

OK

Link

Battery Charge

OK

Check Battery Charge

Check Link


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10.1.1. Check Power

10.1.1.1. Base Unit

Cross Reference:Power Supply Circuit/Reset Circuit(P.12)

Note:BBIC is IC501.

(*1) Refer to Specifications (P.6) for part number and

supply voltage of AC adaptor.

(*2) Refer to Base Unit (Main)(P.61).

10.1.1.2. Handset

Cross Reference:

Power Supply Circuit/Reset Circuit(P.12)

Isthe AC Adaptor inserted into AC outlet? (*1)

Isoutput voltage of AC adaptor 5.5 V?

YES

Check AC Adaptor.

Check VDDC (1.2 V): Test Point [VDDC]

OK

Check Power Supply Circuit.

NO

NO

NO

NO

RSTN: Reset = "High"?

YES

Check Reset Circuit.

Check Xtal CLK = 13.824 MHz?

YES

Check X501.

Check BBIC.

Check Power Supply Circuit/Reset Circuit .

Check BBIC (IC1).

Check F1 is not open.

Check X1.

Is the voltage of BATT+ 2.3 V more?

Check the battery and around BATT+ and

BATT- are not shorted.

Is the battery inserted BATT+ and BATT-?

Does BBIC (IC1: 7) oscillate at 10.368 MHz?

YES

YES

YES

YES

NO

NO

YES

Is the voltage of +1.8V about 1.8 V?

Is the voltage of CP3V about 3.0 V?

Check BBIC (IC1).

YES

Is the voltage of CP4V about 4.0V ?(When LED is On)

YES

NO

NO

NO


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10.1.2. Check Record

10.1.2.1. Base UnitA) Not record Incoming Message

Cross Reference:Signal Route(P.20)

Telephone Line Interface(P.14)

Parallel Connection Detect Circuit/Auto Disconnect

Circuit(P.15)

Note:Flash Memory is IC601.

BBIC is IC501.

Check Bell signal.

OK

Check Telephone Line Interface

[Bell].

Does the unit catch line?YES

Check Telephone Line Interface[OFF HOOK].

Check Line In: Pin 16 of BBIC. Check ICM Recording in Signal Route.NO

OK

Check Auto Disconnect Circuit.

OK

Check Parallel Connection Detection

Circuit.

OK

Check BBIC and Flash Memory.

NO

NO


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10.1.3. Check Playback

10.1.3.1. Base Unit


Note:Flash Memory is IC601.

BBIC is IC1.

(*1) Refer to Base Unit (Main)(P.61).

10.1.4. Check Battery Charge

10.1.4.1. Base Unit

Cross Reference:

Charge Circuit(P.13)

10.1.4.2. Handset

Cross Reference:Check Power(P.29)


10.1.4.3. Charger Unit

Cross Reference:


Check VDDC (1.2 V): Test Point [VDDC]

OK

Check Power Supply Circuit.

Check output of BBIC (Pin 29, 31).

OK

Check BBIC and Flash Memory.

Check Speaker and its surroundings.

NO

NO

Check Charge Circuitof Base Unit.

Check Handset.

Plug in the AC Power source.

Charge Handset on Base Unit.

Is the voltage of two charge contacts about

3 V or more?OK

NO

Check Charge Contacts at

Base Unit from mechanical point of view.

YES

Is BBIC (IC1: 34) high at charge state? Check Charge Circuit.

CheckPower of Handset.Is Check Power OK?

NO

NO

YES

Check Charge Circuitof Charger Unit.

Check Handset.

Plug in the AC Power source.

Charge Handset on Charger Unit.

Is the voltage of two charge contacts about

3 V or more?OK

NO

Check Charge Contacts at Charger Unit

from mechanical point of view.

YES


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10.1.5. Check Link

10.1.5.1. Base Unit



Note:*1 How to adjust +3.0V:

Execute the command "VDA"

Refer to Things to Do after Replacing IC or X'tal(P.49) for Base Unit.

*2 How to adjust the frequency of X501:

To see the frequency, execute the command SFR, then check the TP_CKM (IC501-57pin).

To adjust frequency, send command SFR until the frequency counter becomes13.824 MHZ55HZ.

Check around Power Supply Circuit.

Adjust +3.0V voltage to 3.0 V.

Does Base Unit make link with normal working

Handset?

Check around X501 and RF module and adjust

clock frequency.

NO

NO

NO

NO

YES

YES

Is the voltage of VBAT about 3.0 V?

Check the RF part

Does the RF clock (CLK) oscillate at 13.824 MHz inBase Unit Test Mode?

YES

Is the voltage of VDDC about 1.2 V?

Is the voltage of +3.0V about 3.0 V?

YES

YESBase Unit is OK. Check Handset.

NO

OK

*1

*2


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10.1.5.2. Handset



Note:(*1) Refer to Troubleshooting by Handset(P.31)

To see the frequency, execute the command SFR, then check the TP_CKM (IC1-55pin).

To adjust frequency, send command SFR until the frequency counter becomes10.368 MHz55HZ.

Refer to Things to Do after Replacing IC or X'tal(P.50) for Handset.

Check around Power Supply Circuit/Reset Circuit .

Check BBIC (IC1)

Does Handset make link with Base Unit?

(Correct working unit)

Check around X1 and adjust clock frequency.

NO

NO

NO

NO

Is the voltage of "1.8V" about 1.8 V?

YES

YES

YES

YES

Is the voltage of CP3V about 3.0 V?

Does the RF clock (CLK) oscillate: 10.368 MHzin Handset Test Mode?

YES

Is the voltage of CP2.8V about 2.8 V?

Handset is OK. Check Base Unit.YES

OK

Check the RF part.

NO

NO

NO

Adjust 1.8V voltage to 1.8 V.

Is the voltage of CP4V about 4.0V?

(When LED is ON)

Check D3


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10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part

After All the Checkings or Repai ring1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.

Note:(*1) HS: Handset

(*2) BU: Base Unit

1. Prepare Regular HS(*1) and Regular BU(*2).

2. a. Re-register regular HS(Normal mode) to base unit (to be checked).

If this operation fails in some ways, the base unit is defective.

b. Re-register handset (to be checked) to regular BU (Normal mode).

If this operation fails in some ways, the handset is defective.

Base unit is defective Handset is defective

START

Registration ofRegular HSto

base unit

Registration ofhandset toRegular BU

(other checkings)

Registration of handset to base unit(checked ones)

Registration of Regular HSto Regular BU

Yes

No No

Yes


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10.1.6.2. RF Check FlowchartEach item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.36).

Please refer to the each item.

Note:(*1) Refer to Check Link(P.32).

Start

Linkconfirmation

Normal

1

Controlsignal

confirmation

X'talFrequency

confirmation

TX confirmation

RX confirmation

Rangeconfirmation

NormalTEST RANGE Check.

Check BBIC interface parts.

(RF Block BBIC on BU/HS P.C.B)

Adjust X'tal Frequency. (*1)

Check TX Block.

Check RX Block.

GOOD

6

2

3

4

5

OK

OK

OK

OK

NG

NG NG

NG

NG

NG

OK

OK


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10.1.6.3. Check Table for RF part

Note:(*1)Adjustment Standard (Base Unit)(P.47)

(*2)Adjustment Standard (Handset)(P.48)

No. Item BU (Base Unit) Check HS (Handset) Check

1 Link Confirmation Normal

HS, BU Mode [Normal Mode]

1. Register Regular HS to BU (to be

checked).

2. Press [Talk] key of the Regular HS to

establish link.

1. Register HS (to be checked) to Regular

BU.

2. Press [Talk] key of the HS to establish link.

2 X'tal Frequency confirmation

HS, BU Mode: [Adjustment]

Check X'tal Frequency.

(13.824000 MHz 100 Hz)

Check X'tal Frequency.

(10.368000 MHz 100 Hz)

3 TX confirmation

Regular HS (BU) Mode:

[Test RX Mode]

BU (HS) Mode:

[Test TX_Burst Mode]

1. Place Regular HS 15 cm away from a

checked BU.

2. Confirm "TXDATA" waveform of BU (*1)

and RXDATA waveform of Regular HS by

Digital Oscilloscope.

1. Place Regular BU 15 cm away from a

checked HS.

2. Confirm "TXDATA" waveform of HS (*2)

and "RXDATA" waveform of Regular BU by


4 RX confirmation

Regular HS (BU) Mode:

[Test TX_Burst Mode]

BU (HS) Mode:

[Test RX Mode]

1. Place Regular HS 15 cm away from a

checked BU.

2. Confirm "RXDATA" waveform of BU (*1)

and TXDATA waveform of Regular HS by


1. Place Regular BU 15 cm away from a

checked HS.

2. Confirm "RXDATA" waveform of HS (*2)

and "TXDATA" waveform of Regular BU by


5 Range Confirmation Normal

HS, BU Mode: [Normal Mode]

1. Register Regular HS to BU (to be

checked).

2. Press [Talk] key of the Regular HS to

establish link.

3. Compare the range of the BU (being

checked) with that of the Regular BU.

1. Register HS (to be checked) to Regular

BU.

2. Press [Talk] key of the HS to establish link.

3. Compare the range of the HS (being

checked) with that of the Regular HS.


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10.1.6.4. TEST RANGE CheckCircuit block which range is defective can be found by the following check.

CHART1: Setting of TX Power and RX Sensitiv ity in Range Confirmation TX TEST, RX TEST

Note:

(*1) Refer to Commands(P.46).

Item BU (Base Unit) Check HS (Handset) Check

Range Confirmation TX TEST

(TX Power check)

HS, BU setting

Checked unit: Low TX power (*1)Regular unit: High TX power (*1)

1. Register Regular HS to BU (to be checked).

2. Set TX Power of the BU and the Regular HS

according to CHART1.

3. At distance of about 20m between HS and BU,

Link OK = TX Power of the BU is OK.

No Link = TX Power of the BU is NG.

1. Register HS (to be checked) to Regular BU.

2. Set TX Power of the HS and the Regular BU



Link OK = TX Power of the HS is OK.

No Link = TX Power of the HS is NG.

Range Confirmation RX TEST

(RX sensitivity check)

HS, BU setting

Checked unit: High TX power (*1)

Regular unit: Low TX power (*1)

1. Register Regular HS to BU (to be checked).

2. Set TX Power of the BU and the Regular HS



Link OK= RX Sensitivity of the BU is OK.

No Link = RX Sensitivity of the BU is NG.

1. Register HS (to be checked) to Regular BU.

2. Set TX Power of the Checking HS and the Reg-

ular BU according to CHART1.


Link OK= RX Sensitivity of the HS is OK.

No Link = RX Sensitivity of the HS is NG

BU (to be checked) Regular_HS

TX Power TX Power

BU (Base Unit) TX Power Check Low High

BU (Base Unit) RX Sensitivity Check High Low

HS (to be checked) Regular_BU

TX Power TX Power

HS (Handset) TX Power Check Low High

HS (Handset) RX Sensitivity Check High Low


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10.1.7. Registering a Handset to the Base Unit

10.1.8. Deregistering a Handset

1 Handset:

{MENU}

2 Base unit:

Press and hold {LOCATOR}for about 5 seconds.

L If all registered handsets start ringing, press {LOCATOR} again to stop, thenrepeat this step. (KX-TGD212)

L The next step must be completed within 90 seconds.3 Handset:

Press {OK}, then wait until a long beep sounds.

# 1 3 0

1 {MENU}

2

All handsets registered to the base unit are displayed.L

3

# 1 3 1

: Select the handset you want to cancel.^V{ } i{SELEC.}

: S ^V{ } i{SELEC.} i{OFF}


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10.1.9. Check Handset Transmission


10.1.10. Check Handset Reception


Note:

When checking the RF part, Refer to Check the RF part(P.34).

10.1.11. Check Caller ID

Cross Reference:Telephone Line Interface(P.14)

Calling Line Identification (Caller ID)/Call Waiting Caller

ID(P.16)

Note: Make sure the format of the Caller ID service of the

Telephone company that the customer subscribes to.

It is also recommended to confirm that the customer is really

a subscriber of the service.

Check MIC of handset.

Check handset Tx in Signal Route.

Check speaker of handset.

Check handset Rx in Signal Route.

YES

Did bell ring?(Message indicatorblinks)

Check Calling Line Identification (Caller ID)/Call Waiting Caller ID.

Check bell signal detection inTelephone Line Interface.

BASE UNIT

NO


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11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions

11.1.1. Base Unit

11.1.1.1. KX-TGD210

Remove the 4 screws to removethe cabinet cover.

Remove the solders.

Remove the main P.C. board.

Main P.C. board

4 screws

Solders


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11.1.2. Handset

2 screws

Cabinet body

Cabinet cover

Cabinet cover

Screw

Solders

Main P.C. board

2 charge terminals

Remove the 2 screws.

Insert a plastic card.(Ex. Used SIM card etc.)

between the cabinet body

and the cabinet cover, then

pull it along the gap to open

the cabinet.

Likewise, open the otherside of the cabinet.

Remove the cabinet coverby pushing it upward.

Remove the solders.

Remove the solders to removethe 2 charge terminals.

Remove the screw to removethe Main P. C. board.

Solders


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11.1.3. Charger Unit

Remove the cabinet cover.

Remove the solders to removethe AC adaptor.

Solders

2 charge terminals

Cabinet cover

Remove the 2 charge terminals.

AC Adaptor


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11.2. How to Replace the Handset LCDNote:

The illustrations are simplified in this page.

They may differ from the actual product.

Peel off the FFC (Flexible Flat Cable) from

the LCD, in the direction of the arrow. Take

care to ensure that the foil on the P.C. board

is not damaged.

Fit the heatseal of a new LCD.

Rubber of Soldering Iron

(Part No. PQZZ430PRB)

Tip of Soldering Iron

(Part No. PQZZ430PIR)

Heatweld with the tip of the soldering

iron about 5 to 8 seconds

(in case of 60W soldering iron).

New LCD

0.2 mm

0.2 mm

P. C. board

If interval tolerance between center lines

is less than 0.2 mm, it is o.k.

Horizontal IntervalTolerance

Vertical Interval

Tolerance

OK

NG

NG

NG

(Horizontal interval tolerance ismore than 0.2 mm.)

(Vertical interval tolerance is

more than 0.2 mm.)

(Inclined)


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44


12 Measurements and AdjustmentsThis chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in

Troubleshooting Guide(P.28)

12.1. Equipment Required Digital multi-meter (DMM): it must be able to measure voltage and current.

Oscilloscope.

Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm)Hewlett Packard, 53131A is recommended.

DECT tester: Rohde & Schwarz, CMD 60 is recommended.

This equipment may be useful in order to precisely adjust like a mass production.

12.2. The Setting Method of JIG

Serial JIG cable: PQZZ1CD300E*

PC which runs in DOS mode

Batch file CD-ROMfor setting: PNZZGD210AG1

Note:*: If you have the JIG Cable for TCD500 series

(PQZZ1CD505E), change the following values of

resistance. Then you can use it as a JIG Cable for both

TCD300 and TCD500 series. (It is an upper compatible JIG

Cable.)

12.2.1. Connections (Base Unit)

Connect the AC adaptor.

Connect the JIG Cable GND (black).

Connect the JIG Cable RX (red) and TX (yellow).

Note:*: COM port names may vary depending on what your PC calls it.

Resistor Old value (k) New value (k)

R2 22 3.3

R3 22 3.3

R4 22 4.7

R7 4.7 10

1

2

3

Base unit P. C. board

URXUGND

UTX UTX (yellow)

AC adaptor

1

3

2

3

UGND (black)

URX (red)

To Serial Port

(COM port 1*)

JIG Cable

PC

DC JACK


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45


12.2.2. Connections (Handset)Connect the DC Power or Battery to BATT+ and BATT-.

Connect the JIG cable GND (black) to GND.

Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.

Note:

*: COM port names may vary depending on what your PC calls it.

1

2

3

DC Power

or Battery

Handset P. C. board

1 BATT-

BATT+

2 GND (black)

3

To Serial Port

(com port 1*)

JIG Cable

PC

URX

(yellow)3 UTX

(red)

GND

UTXURX


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46


12.2.3. How to install Batch file into P.C.

Note: ***** varies depending on the country or models.

12.2.4. CommandsSee the table below for frequently used commands.

1.Insert the Batch file CD-ROM into CD-ROM drive andcopy PNZZTG**** folder to your PC (example: D drive).

2.Open an MS-DOS mode window.

3.At the DOS prompt, type "D:" (for example) to select the drive, then press the Enterkey.

4.Type "CDPNZZTG****", then press the Enterkey.

5.Type "SET_COM=X", then press the Enterkey(X: COM port number used for the serial connection on your PC).

6.Type "READID", then press the Enterkey.If any error messages appear, change the port number or

check the cable connection.

If any value appear, go to next step.

7.Type "DOSKEY", then press the Enterkey.

C: Documents and Settings>D:D: >CD PNZZTG****

D: PNZZTG**** >SET_COM=X

D: PNZZTG****>READID

00 52 4F A8 A8

D: PNZZTG****>DOSKEY

D: PNZZTG****>

C: Documents and Settings>D:

D:>CD

PNZZTG****

D: PNZZTG**** >SET_COM=X

D: PNZZTG****>READID

CreateFile error

ERROR 10: Can't open serial port

D: PNZZTG ****>

On your computer, click [Start], select Programs

(All Programsfor Windows XP/Windows Server 2003),

then clickMS-DOS Prompt. (for Windows 95/Windows 98)

Or

Accessories-MS-DOS Prompt. (for Windows Me)

Or

Command Prompt. (for Windows NT 4.0)

Or

Accessories-Command Prompt.

(for Windows 2000/Windows XP/Windows Server 2003)

Command name Function Example

rdeeprom Read the data of EEPROM Type rdeeprom 00 00 FF, and the data from address

00 00 to FF is read out.

readid Read ID (RFPI) Type readid, and the registered ID is read out.

writeid Write ID (RFPI) Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E

98 is written.

hookoff Off-hook mode on Base Type hookoff.

hookon On-hook mode on Base Type hookon.

getchk Read checksum Type getchk.

wreeprom Write the data of EEPROM Type wreeprom 01 23 45. 01 23 is address and 45

is data to be written.


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12.3. Adjustment Standard (Base Unit)When connecting the simulator equipment for checking, please refer to below.

12.3.1. Bottom View

Note:(*1) is referred to No.2 of Check Table for RF part (P.36)

(*2) is referred to Power Supply Circuit/Reset Circuit(P.12)

R321

IC302

R371

C342

R372

R322

C321

F301

C513

C120

C601

C115R113

C113

D113

C111

SA101

R115

R112

C112

R114

R111

Q111

IC601C515

C611

C351

R176

R175

C176

C178

R171

Q171

C175

R172

RA611

R164

C173

R168

C167

C171

IC611

ANT1

STM/CKM/P15

RSTN

VDDC

TDI

TCK

RTCK

TD0

TMS

ANT1_

S-GND

URX UGND

UTX +5.5V

+3.0V

VCCA

VREF

DCP

DCM

GAP1

LT1

L1R

ANT1_

Short

PCB

PNLB2

317Z

A

GRY

PUR

TEL

BRN

YLW

SP

ORG

BLU

DC

+

-

+

-

CHG

DC

5.5V

Oscilloscope

8

Volt Meter

SpectrumAnalyzer

Frequency Counter (*1)

Oscilloscope (*2)

* Send command "SFR", then

the frequency output on this TP.

* Start Monitor


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48


12.4. Adjustment Standard (Handset)When connecting the simulator equipment for checking, please refer to below.

12.4.1. Component View

4

15 H

15 H

100

100

Oscilloscope

AFVOLTMET

ER

C22

C29

C36

C41

C43

C44

C45

C46

C47

C52

C53

C55

C56

C70

C71

RA2

C72

C73

C91

C96

C9 3

C99

C1

C5

STM

F1

RECEIVE

R

C866

SP-PHONE_SPEAKER

ANT-Short

JTAG

CP4V

D13

D14

D21

D22CP3V

R15

R20

R23

Q1

Q2

Q3

Q4

Q6

Q9

R2

R6

R7

R8R9

R45

R60

R61

C69

POWER

C59

CKM

1.8VC11

C12

C13

C15

C19

C30

ANT-Short-G

ND

RA5

C78

C79

C98

IC 4

R1

R76

R77

C190

C191

X1

CHG-

CHG+

C6

CHG_CTRL

IC 1

URX UTX

VBAT GND

C860

STB_A STB_B

STB_C

STB_D

STB_E

RA3

RA7

LCD_SCL

KEY_LED

C859

LCD_CD

C862

LCD_SID

KIN_1

KIN_2

KIN_3

KIN_4

LCD_RESET

LCD_CS WLE

D

C76C77

ANT1_TP

C92 C94 C95

C61

C62

C63

C64

C65

R51

R52

R53

R54

R55

C57

C863

RST

MIC+

M IC - R CV +

RCV-

BLU

E

ORANGE

ORANGE

GREEN

+

BLUE

ORANGE

PbF

PNLB2319Z

A

40

Oscillos

cope

AFVOLTMETER

MICLoadMIC+

+

+

MIC-47

47

OSC

1.1kHz

40

Oscilloscope

AFVOLTMETER

WhenmeasureR

F,short"ANT-Short"and"ANT-Short-GND"withcopperwirewhichlength5mm.

Aftermeasuredo

notforgettoremovethewire.

SpectrumAnalyzer

1.8V

CP3V

DCVoltMeter

1.8V

CP+3.0V

FrequencyCounter

*Sendcommand"S

FR",then

thefrequencyoutp

utonthisTP.

BATT-BATT+

GND

VBAT

DCVOLTMETER

DCPOWERSUPPLY

2.6V


49/72

49


12.5. Things to Do after Replacing IC or X'talIf repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment

data, etc. in memory.

The set doesn't operate if it is not executed.

12.5.1. How to download the data

12.5.1.1. Base Unit

First, operate the PC setting according to The Setting Method of JIG(P.44).Then download the appropriate data according to the following procedures.

Note:(*1) WW: country code, XXX_YYY: revision number

XXX_YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting

Method of JIG(P.44).

Items How to download/Required adjustment

EEPROM (IC611) Adjusted parameter data is stored in memory.

(country version batch file, default batch file,

etc.)

1) Change the address 0001 of EEPROM to AA to download

the data.

2) Default batch file: Execute the command default.bat.

3) Country version batch file: Execute the command

TGD21VEUS_WW_RevXXX_YYY.bat (KX-TGD210)(*1)

4) Clock adjustment

X'tal (X501) System clock Clock adjustment data is in EEPROM, adjust the data again

after replacing it.

1) Apply 5.5V between DCP ad DCM with DC power.

2) Input Command "sendchar sfr", then you can confirm the

current value.3) Check X'tal Frequency.(13.824 MHz 100 Hz).

4) If the frequency is not 13.824 MHz 100 Hz, adjust the

frequency of CLK executing the command "sendchar sfr xx xx

(where xx is the value)" so that the reading of the frequency

counter is 13.824000 MHz 15 Hz.


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12.5.1.2. HandsetFirst, operate the PC setting according to The Setting Method of JIG(P.44).

Then download the appropriate data according to the following procedures.

Note:(*2) WW: country code, XXX_YYY: revision number

XXX_YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting

Method of JIG(P.44).

Items How to download/Required adjustment

EEPROM (IC7) Adjusted parameter data is

stored in memory.

(country version batch file,

default batch file, etc.)

1) Default batch file: Execute the command default.bat.

2) Default batch file (remaining): Execute the command

TGDA20US_DEF_RevXXX_YYY.bat. (*2)

3) Country version batch file: Execute the commandTGDA20US_WW_RevXXX_YYY.bat.(*2)

4) Clock adjustment

5) 2.35 V setting and battery low detection

Battery Monitor Check - 1) Apply 2.25 V between BATT+ and BATT-.

2) Execute the command

sendchar PAD

sendchar LED 0

sendchar CRX 0 1

sendchar AD1

It assumes that the return value is XX.

a) 6c XX 71: No need to adjust

b) XX: 6A ~ 6B: Need to adjust

XX: 72 ~ 74: Need to adjust

Write AD value of 2.25 V to EEPROM.

ex) read data: XX = 6A, write data:YY = 6A read data: XX =73, write data: YY = 73

EEPROM = 0009 (Low Voltage) write YY

Execute the command wreeprom 00 09 01 YY.

EEPROM = 000A (No Voltage) write YY - 1D

Execute the command xwreeprom 00 0A 01 ZZ.

Note:

No Voltage writing data limit is 00.

c) XX: 00 ~ 69: Reject

XX: 75 ~ FF: Reject

Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.

2) Confirm that there is no flashing of Battery lcon.

3) Apply 2.25 V 0.08 V between BATT+ and BATT-.

4) Confirm that there is flashing of Battery lcon.

Battery Clock Adjustment

(X1)

CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.

2) Input Command sendchar sfr, then you can confirm the current value.

3) Check Xtal Frequency. (10.368 MHz 100 Hz).

4) If the frequency is not 10.368 MHz 100 Hz, adjust the frequency of CLK

execute in the command sendchar sfr xx xx (where xx is the value) so that the

reading of the frequency counter is 10.368000 MHz 5 Hz.


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51


12.6. Frequency Table

Ch. (hex) TX/RX Frequency (MHz)

Channel 0 00 1928.448

Channel 1 01 1926.720

Channel 2 02 1924.992

Channel 3 03 1923.264

Channel 4 04 1921.536


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52


13 Miscellaneous

13.1. How to Replace the Flat Package ICEven if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a

soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

13.1.1. Preparation PbF (: Pb free) Solder

Soldering Iron

Tip Temperature of 700 F 20 F (370 C 10 C)

Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with

less experience could overheat and damage the PCB foil.

Flux

Recommended Flux: Specific Gravity 0.82.

Type RMA (lower residue, non-cleaning type)

Note: SeeAbout Lead Free Solder (PbF: Pb free)(P.4)

13.1.2. How to Remove the IC1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is

left at the joint on the board, the new IC will not be attached properly.


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13.1.3. How to Install the IC1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

13.1.4. How to Remove a Solder Bridge1. Lightly resolder the bridged portion.

2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.


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13.2. Terminal Guide of the ICs, Transistors and Diodes

13.2.1. Base Unit

13.2.2. Handset

BC

E

DY2J25000L

C

C

B

E

2SC6054JSLB1ABDM000001

14

85

C2HBCY000151

DSC7003S0L

CathodeAnode

B0ECKM000008B0EDER000009

CE

B

2SA1776P

32

1

4

1

88 67

23 4422

66

45

(Reverse View)

DA2J10100L

Anode

Cathode

Cathode

Anode

C0DBEYY00102 PNWIGD220LAH

C

B

E

14

85

C3FBLY000162

PNWIGDA20LAR

B1ADGE000012B1ABGE000011B1ADCF0000402SC6054JSL

UNR9216J0L B3ACB0000216

(Reverse View)

Anode

Cathode

C1CB00003837

1

(Reverse View)

1

6788

23 4422

66

45

89 pin

(GND)


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55


14 Schematic Diagram

14.1. For Schematic Diagram

14.1.1. Base Unit (Base Unit (Main))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

14.1.2. Handset (Handset (Main))Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.

2. The schematic diagrams may be modified at any time with the development of new technology.

Important Safety Notice:Components identified by mark have special characteristics important for

safety. When replacing any of these components, use only the manufacture's

specified parts.


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14.2. Base Unit (Main)

14.2.1. KX-TGD210

NC: No Components

(1)

(2)

(3)

(4)

(5)(6)

(7)

(8)

(9)

(10)

(11)

(12)

(13)

(14)(15)

(16)

(17)

(18)(19)(20)(21)

URX

EEP_

WP

EEP_

SDA

EEP_

SCL

SPI_DI

JTAG_RTCK

MSG_

LED

JTAG_TDOJTAG_TDIJTAG_TCKJTAG_TMS

UTX

JTAG_

TCK

JTAG_

R

TCK

JTAG_

TDO

JTAG_

TMS

JTAG_

TDI

ANS_

LED

ANS_LED

MSG_LED

KEYS_E

KEYS_D

KEYS_CKEYIN2

KEYIN3

KEYIN1

TXp

+3.0V

C517 0.1 u

RSTN

*C601 NC

TXn

RTCK

STM/CKM/P15

RXp

C518 0.1 u

GND

VBAT

C50

8

10p

RXn

X501

13.824M

VDDC

C516 0.1 u

C511

10u

*R507

NC

+3.0V

LED_VDD

KEYS_C

*WBX01 NC

PARALLEL WIRE

KEYIN2

ANS_LED

KEYIN1

VBAT

KEYIN3KEYS_E

KEYS_D

MSG_LED

*Q652NC

*Q651NC

D472

NC

A

K

D473

NC

A

K

C478

NC

C477

NC

C

515

1u

C513

2.2u

GND

VBAT

RXp

RXn

GND

GND

TXn

L

803

2

.7n

TXp

C8952p

ANT1

1

2

GND

C819

10p

R506

10k

R502

10k

R503

10k

R504

10k

TCK

TMS

TDI

UTX

URX

*SW1

12

SHORT1

SHORT2

SHORT3

SHORT4

SHORT5

C872

1.3p

SHORT6

C8732p

DNGDNG

GNDGND

C8711.5p

C874

15p

*IC601NC

1 *CS

2 DO/IO1

6CLK

7*HOLD/IO3

3 *WP/IO2

8VCC

4 GND 5DI/IO0

C810

1.5p

UGND

C

820

1.5p

GND

C863

1.5p

GND

ANT1_Short

ANT1_S-GND

45

TXp46RXp47RXn48GND_RF49TRSW_p50ANT_n51ATST_n52ATST_p

38

VDD_APU

39

VCC_IF

40

VDD_IF

41

VCC_FE

42

ANT

43

TRSW_n

44

TXn

53TEST54RSTN55NC56VCC_VCO57GPIO[27]58VDDUSB59DM_USB/GPI2860DP_USB/GPI2961VDDC162JTAG_TDO63JTAG_TDI64JTAG_TCK65JTAG_TMS66JTAG_RTCK

67GPIO[0]/SCL_IIC

68GPIO[1]/SDA_IIC

69GPIO[2]

70GPIO[3]

71GPIO[4]

72GPIO[5]

73GPIO[6]

C811

10p

GND

*C651

NC

*C652

NC

*C650

NC

*R652 NC

*R651 NC

TO RF BLOCK

1

9

open-stubSLW=2.0mmL=10.8mm

SLW=0.3mmL=6.5mm

Tx- balunSLW=0.3L=40mm

MSLWm=0.4mmLm=10mm


SLW=0.3mmL=12.45mm

Pre-matching

MSLW=0.25L=2mm

SLW=0.3mmL=6.95mm

ANT-Pattern

SLW=0.2mmL=20mm


MSLW=0.25L=2mm

RF Block

SPP

SPN

W0.2mmL 3.8mm1st layer

W0.15mmL 6.2mm1st layer

SHORT

SHORT

SHORT

SHORT

SHORT

SHORT


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57


KX-TGD210AG1 SCHEMATIC DIAGRAM (Base Unit_Main)

NC: No Components

(1)

(2)

(3)

(4)

(6)

(8)

(9)

(10)

(11)

(12)

(13)

(14)(15)

(16)

(18)

(19)

(17)

(21)(20)

(5)

(7)

1.2V

3.0V

Rx Tx

Caller ID

Bell

UTXURX

SPI_CLK

SPI_DO

BELL

HOOK

HOOK

SPI_CLK

SPI_DO

SPI_DI

BELL

KEYS_C

SPI_CS

KEYIN2

KEYIN3

KEYS_D

KEYIN1

SPI_CS

KEYS_E

EEP_

SCL

EEP_

SDA

EEP_

WP

C120

1000p

R131

10M

L1R+5.5V

C351

1u

R133

330k

C611 0.1u

R501 10

VDDC

C331

NC

DCP

C521 1u

C111

0.0

47u

R141

100k

PNLB2317ZA-GW

PCB

RE1

+3.0V

C142

K0.0

1u

C509

12p

L1T

DCM

C

132

0.0

1u

VBAT

+3.0V

+3.0V

VCCA

Q141

B

EC

+3.0V

+3.0VR112

100k

R113

10k

C115

NC

+3.0V

F3013.0A

CHARGE-

C181

NC

R142

2.7

k(3216)

C504 1u

R145

2.2

k

R111

100k

P101 22

L501

100n

C113

K0.6

8u

R 1 21 3 90 k

C519

0.1u

+5.5V

R 1 22 3 90 k

CHARGE+

C112

0.0

47u

+5.5V

C5010.1u

C5200.1u

VDDC

HAK_CL1

CHG+

GND

R115

NC

R322

100

R321

140

IC302

3IN2 OUT1

1

ADJ

4 OUT2

D361

NC

A

K

C50210u

C503

10u

C505 10u

D362

1SR154

A

K

SA

101

270V

2

1

Q111

D113

A

K

D133

A

K

R164

2.7k

R151

100k

C152

K0.0

1u

R177

1k

Q171

Q161B

C

EC161

10u

R165

27k

R162

27k

C167

1000p

+3.0V

C164

NC

R331

68k

R332

33k

RA6113.3k

1 2 3 4

5678

RA151

1k

1

2 3

4

C342

0.1u

D143

NC

A

K

C184

1u

C321

1u

C506

1u

C510

1u

D101

1

4 3

2

C507

2.2u

R510

10k

C341

330u

6.3

C101 680p

C102 680p

C121 680p

C122 680p

R163

39

R152

130k

R176

1k

R175

3.9

k

R172 680k

R371

1

R372

1

VREF V CCA

VDDC

C176

1u

R114

47k

1

2

D142

25V

C173

0.1u

C171

0.0

22u

R168

4.7

k

R160

820

R171

220

C178

0.0

33u

C175 560p

ZA1NC

1 2

6

79

11

3 4

810

521

GND

*IC611

1 A0

2 A1

6SCL

7WP

3 A2

8VCC

4 GND 5SDA

Q142B

C

E

+5.5V

*IC501

1GPIO[20]

2GPIO[21]

23

MIP

3GPIO[22]

4GPIO[23]

5GPIO[24]

6GPIO[25]

7GPIO[26]

8VDDC2

24

HSMIN

25

HSMIP

26

MPWR

27

HSSPOUTP

28

LOUT

29

SPOUTN

30

VCCPA

81

GPIO[13]

82

GPIO[14]

83

GPIO[15]

84

GPIO[16]

85

GPIO[17]

86

VDDIO2

87

GPIO[18]

88

GPIO[19]

89

GND

9COREOUT

10VBAT

11DOUBCAPN1

12DOUBCAPN

13DOUBCAPP

14DOUBCAPP1

15DOUBOUT

16DCIN0/LIN0

17DCIN1

18DCIN2

19DCIN3/LIN1

20VREF

21VCCA

22MIN

31

SPOUTP

32

PWM1

33

PWM0

34

DCINS

35

XOUT

36

XIN

37

VBAT

_APU

74

GPIO[7]

75

GPIO[8]

76

VDDIO1

77

GPIO[9]

78

GPIO[10]

79

GPIO[11]

80

GPIO[12]

REFERENCE

7XX : FOR DK/BT

3XX : POWER, CHARGE

5XX : BBIC6XX : FLASH, EEPROM, KEY, LCD

(YELLOW)

(GREEN)

4XX : MIC, SP

1XX : TEL LINE

8XX : RF

!


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14.3. Handset (Main)

LCD_RESET

STB_D

LCD_CS

STB_B

STB_C

LCD_SCL

KIN_4

KIN_3

KIN_2

KIN_1

LCD_CD

KEY_LED

LCD_SID

EEP_WP

STB_F

CHARGE_CTRL

CHARGE_DET

STB_F

SOCp

STB_E

KEY_LED

SOCn

LCD_CS

LCD_RESET

LCD_CD

LCD_SCL

LCD_SID

LCD_LED0

EEP_WP

LCD_LED0

KIN_2

KIN_3

STB_D

STB_E

STB_E

KIN_4

STB_A

STB_B

STB_C

STB_C

KIN_1

GND

R611k

R60NC

C69

K0.1u

GND

+1.8V

RF_TXn

RF_TXp

RF_RXn

RF_RXp

C44

K0.1u

R20

F56k

GND

C43

D10p

GND

C15J39p

VBAT

GND

GND

VBAT

+1.8V

C45K0.1u

F 1 2 .5 A

GND

GND

C6K0.1u

R7820

R930k

Q3

R230k

C19K1000p

R610k

GND

C866K0.1u

*LED1

.

*Q6

*LED5

.

*LED2

.

GND

*R15

1.5k

CP4V

*LED3

Amber

*LED4

.

*LED6

.

C96K1u

GND

C9116V K1u

C5K0.1u

C1

220u6.3V

GND

C47

1u

CHG+

JTAG

Q9

3RFP1

4RFP0

5REF_RES

6AVS_XTAL

7XTAL2

8XTAL1

9AVD_XTAL

10RF_SUPPLY1

11P3_4/PARADET

51

QSPI_IO3

52

QSPI_SCK

53

QSPI_IO0

54

VDD1

55

P2_7/BXTAL

76 P2_2/PCM_CLK/CLK10077 WLED_CUR_078 WLED_CUR_179 P2_1/ECZ2/PWM1/LED480 P2_0/ECZ1/PWM0/LED381 LDORF_

Service Manual Kx Tgd210ag1

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