Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin 2007/10/17 Heterogeneous...

2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin

Heterogeneous integration

Presenter : Chia-Min Lin (9535811)


Outline

Motivation Introduction Design concept / Fabrication process Results Conclusion Reference


Motivation

Y. –C. Tung et al., J. MEMS, 2005


Introduction

K. Tsui et al., JMM, 2004

Pick/place method

Connector/socket techniqueSAM technique to

assemble the LED

X. Xiong et al., J. MEMS, 2003


Introduction

Low melting point solder

H. O. Jacobs et al., Science, 2002

Self-assembly, transfer, integration

T. Kraus et al., Adv. Mater., 2005


Design concept / Fabrication process

Liftoff technique

Stamp transfer techniqueH. Onoe et al., MEMS’07, 200

7


Aligning and loading mechanism


Results – Liftoff technique


Results – Stamp transfer technique


Yield and position accuracy


2D and 3D stacking of structures


Bridge structure


Si transfer to glass

M. A. Meitl et al., Nature materials, 2006


ConclusionImage

Tech. Pick/place

SAM SAM Stamp Stamp Stamp

Bonding Connector/socket

Plating Solder Van der waals

OH- Van der waals

Complex 3D 3D 3D 3D 3D 3D

Batch Hard Easy Easy Medium Medium Medium

Assemb. Difficult Easy Easy Medium Medium Medium


Thanks for your attention !


Reference Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama,

”3D integration of heterogeneous MEMS structures by stamping transfer,” 20th IEEE MEMS Conference, Kobe, Japan, 2007, pp175-178.

Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”Three-dimensional integration of heterogeneous silicon micro structures by liftoff and stamping transfer,” J. of Micromech. and Microeng., 17, pp1818-1827, 2007.

Kenneth Tsui, Aaron A Geisberger, Matt Ellis ,and George D Skidmore, “Micromachined end-effector and techniques for directed MEMS assembly,” J. of Micromech. and Microeng., 14, pp542-549, 2004.

Xiaorong Xiong, Yael Hanein, Jiandong Fang, Yanbing Wang, Weihua Wang, Daniel T. Schwartz, and Karl F. Böhringer, ” Controlled Multibatch Self-Assembly of Microdevices,” J. of Microelectromech. Syst., 12, pp117-127, 2003.


Reference Yi-Chung Tung, and Katsuo Kurabayashi, “A single-layer PDMS-o

n-silicon hybrid microactuator with multi-axis out-of-plane motion capabilities-part II: fabrication and characterization,” J. of Microelectromech. Syst., 14, pp558-566, 2005.

Heiko O. Jacobs, Andrea R. Tao, Alexander Schwartz, David H. Gracias, and George M. Whitesides, ” Fabrication of a Cylindrical Display by Patterned Assembly,” Science, 296, pp323-325, 2002.

Tobias Kraus, Laurent Malaquin, Emmanuel Delamarche, Heinz Schmid, Nicholas D. Spencer, and Heiko Wolf, “Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles,” Adv. Mater., 17, pp2438-2442, 2005.’

Matthew A. Meitl, Zheng-Tao Zhu, Vipan Kumar, Keon Jae Lee, Xue Feng, Yonggang Y. Huang, Ilesanmi Adesida, Ralph G. Nuzzo, and John A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Materials, 5, pp33-38, 2006.


Design concept

F1~0

F2=kPDMS x APDMS k:coefficient of bonding energy

F3=ksubstrate x Asubstrate A:contact area

Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin 2007/10/17 Heterogeneous...

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