SEMIKRON SKiM306GD12E4 1200V 300A IGBT Solderless Module 2015 teardown reverse costing report...
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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] August 2015 - Version 1 - Written by Sylvain Hallereau
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Transcript of SEMIKRON SKiM306GD12E4 1200V 300A IGBT Solderless Module 2015 teardown reverse costing report...
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
August 2015 - Version 1 - Written by Sylvain Hallereau
Semikron – SKiM306GD12E4
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8
3. Physical Analysis 13– Synthesis of the Physical Analysis
– Package analysis
– View and dimensions and marking
– Housing
– Base Plate Cross-Section
– DBC Cross-Section
– SKIM 63 Module
– IGBT Analysis
– Dimension
– Gate Supply Line and Guard Ring
– Trench Gate Cross-Section
– Revelation
– Infineon IGBT4 vs IGBT3
– Diode Analysis
– Dimension
– Guard Ring
– Revelation
4. Manufacturing Process Flow 61 – Overview
– IGBT and Diode Process Flow
– Description of the Wafer Fabrication Units
– IGBT Process Flow
– Diode Process Flow
– Package Process Flow
5. Cost Analysis 76– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
– Cost Analysis IGBT
– Wafer Cost Hypothesis
– IGBT Wafer Cost
– Breakdown per process step
– IGBT Probe Cost
– IGBT Die cost
– Cost Analysis Diode
– Wafer Cost Hypothesis
– Diode Wafer Cost
– Breakdown per process step
– Diode Probe Cost
– Diode Die cost
– Cost Analysis SKiM306GD12E4
– Assessing BOM
– DBC Cost
– SKiM306GD12E4 Module Cost
– Yield Synthesis
6. Estimated Manufacturer Price Analysis 107– Manufacturers ratios
– Estimated manufacturer Price
7. Comparison 110– Comparison SKiM306GD12E4 and Infineon FS100R12PT4
Contact
Semikron – SKiM306GD12E4
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 3
Package:
Dimensions: 160.0 x 114 x 33 mm
Number of Pins: 12- screw pin
21- spring pin
Type: SKiM 63 power module
Skim Module
Diode
IGBTDiode:
Code: CAL4-F
Dimensions: XX x XXmm
Electrical Connection: XX µm Al wire bonding
Placement in the package: sintering on DBC
IGBT:
Code: IGC70T120T
Dimension: XX x XX mm
Electrical Connection: XX µm Al wire bonding
Placement in the package: sintering on DBC.
Screw pin
Spring pin
Semikron – SKiM306GD12E4
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 4Details DBC substrate: Cross-Section SEM view
Semikron – SKiM306GD12E4
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5 Diode die: cross-section SEM view
Semikron – SKiM306GD12E4
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 6
Semikron – SKiM306GD12E4
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7
Semikron – SKiM306GD12E4
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8
Semikron – SKiM306GD12E4
Return to TOC
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
o Consulting and Specific Analysis
– North America: Steve LaFerriere, Business Development Manager, Yole IncEmail: [email protected]
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]
– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]
o Report business
– North America: Steve LaFerriere, Business Development Manager, Yole IncEmail: [email protected]
– Europe: Jérôme Azemar, Business Development Manager, European OfficeEmail: [email protected]
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]
– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]
o Financial services
– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]
