PRODUCTSGUIDE

EMBEDDED CREATORS

PRODUCTS GUIDE

SECOnITX-ION p.53

SECOpITX-x2000 p.54

SECOμSBC-i.MX6 p.55

SECOμSBC-T30 p.56

SECOpITX-GX p.57

SBC

QuadMo747-Z5xx p.10

QuadMo747-EXTREME p.11

QuadMo747-E6xx p.12

QuadMo747-GSeries p.13

QuadMo747-x2000 p.14

QuadMo747-X/OMAP3 p.15

QuadMo747-X/i.MX51 p.16

QuadMo747-X/i.MX6 p.17

QuadMo747-X/T20 p.18

QuadMo747-X/T30 p.19

Cross Platform Development Kit p.23

Cross Platform Starter Kit p.24

SECOCQ7-pITX p.25

SECOCQ7-pITX-Xboard p.26

SECOCQ7-mITX2.0 p.27

SECOCQ7-micro p.28

SECOCQ7-MXM p.29

CARMA DevKit p.30

NVIDIA® Kayla GPU DevKit p.31

SECOMExp-iCORE p.41

SECOMExp-iCore-XT p.42

SECOMExp-iCore/E4690 p.43

SECOMExp-ION p.44

SECOMExp-GSeries p.45

SECOMExp-RSeries p.46

SECOMExp-x2000 p.47

SECOCExp-mITX p.48

Qseven® µQseven

COM EXPRESS™

SECOME-945/N270 p.61

SECOMX-945/N270 p.63

SECOCX-mITX p.64

ETX® 3.0 / XTX™

μQ7-OMAP5 p.20

μQ7-T30 p.21

μQ7-i.MX6 p.22

INDEX

Company

SECO, world-leading company in electronic embedded

solutions, over its 30 years of experience has shown the

ability to adapt its know-how to new, challenging customers’

needs, and to provide cutting edge solutions to its partners.

On the strength of its know-how and in contrast with

recent outsourcing policy, SECO has always set the entire

production cycle in Italy, from the development stage to

mass distribution.

Thanks to new, innovative solutions and great research and

design activities together with the partnership with major

scientific Universities and worldwide leading companies,

SECO went International becoming a global market-leading

company providing solutions to modern challenges.

Milestones

1979 SECO Elettronica Snc is set up

1989 SECO introduces its first personal computers onto the Italian market, obtaining

the BEST DESIGN award at the SMAU trade show, a success achieved also

in 1999 with the introduction of the all-in-one Ellipse Personal Computer

1995 SECO founds PSM (Professional Surface Mounting), which becomes its

production unit

2003 Thanks to the constant growth of PSM, the company moves into new facilities

(2.000 sqm) and is ISO 9001:2000 certified

2004 While awaiting the introduction of the new “RoHS, WEE and Green”

regulations, the company invests in a new SMT line for Lead Free production

2006 / 2007 SECO invests in a new premises (1.200 sqm) designed for the

complete systems assembly by PSM

2008 SECO, congatec and MSC found the new embedded standard: Qseven®

and the Qseven Consortium

2009 SECO celebrates its 30th Anniversary with a new company logo

2010 SECO proposes some modifications to Qseven pinout, aimed at allowing the

integration of the new features for ARM architecture

2011 At the Supercomputing Conference in Seattle (USA), the BSC (Barcelona

Supercomputing Center) announces the first cluster in the world based on

256 ARM units, GPU-assisted, featuring a low power consumption HPC

powered by SECO technology

2012 • SECO Inc. in Boston (USA) is set up

• SECOisoneofthefoundingmembersofSGET(Standardization

Group for Embedded Technologies)

• SECOlaunchesCARMA,thefirstenergy-efficientplatformforHPCin

the world

Our Partners

Over the years, SECO has established and consolidated relationships with major international companies in the electronics industry as well as centers of

excellence, universities and research institutes that support the company’s direct and dynamic vision for continued research regarding to new technologies to be

integrated with its increasingly complex projects.

OS Supported

•Microsoft® Windows Embedded®

•Linux

•Android

Consortium

•SGET(StandardizationGroupforEmbeddedTechnologies)

•QsevenConsortium

•PCIIndustrialComputerManufacturersGroup(PICMG)

•PC/104Consortium

•ETXIndustrialGroup

•XTXConsortium

•SFF-SIG

•HDMILicensing

•SDAssociation

Technological Partners

•AMD

•Freescale™

•Intel®

•Microsoft® Windows Embedded®

•NVIDIA®

•Samsung

•TexasInstruments®

Areas of Application

•Automation

•Automotive

•Avionics

•Biomedical

•Defence

•Digitalsignage-Infotainment

•Domotics

•Ehealth-Teleassistance

•Energy

•Gaming

•Handheldelectronics

•Homeentertainment

•Industrial

•Measuringinstrument

•Robotics

•Surveillance

•Telco

•Transportation

•Wellness

•WirelessTechnologies

Our Strategy

•AdvancedInnovation

•DevelopmentofHighPerformanceProductLines

•PowerConsumptionReduction

•FocusonQualityandReliability

•MaximumIntegration

•CustomizationofHardware,FirmwareandSoftwareProducts

•LongTermandHighlyQualifiedTechnicalSupport

Benefits:Module-Based ApplicationLow Power ConsumptionInterchangeability Among ArchitecturesLow Impact on OS MigrationUpgradable SolutionsReduced Time to Market

Fields of Application:Industrial: automation and monitoringData acquisitionMedical: data acquisition Portable devicesTelecommunicationAutomotive - Transport: detection systemsRetail Industry: point of sales and kiosksMultimediaHMI GamingDigital Signage

Qseven® Compact & Cost EfficientQseven® standard has shown itself, as the most compact & cost efficient Computer On Module of the embedded market.The design flexibility of Qseven® architecture is the same oftheotherCOMslikeETX®,XTX™ or COM Express™: replacing the board it is possible to diversify the product range through the use of different architectures.Qseven® standard features PCI Express®,ExpressCard®, Serial ATA®,SecureDigitalI/Ointerface,DisplayPort™ (orTMDSorSDVO)interfaces,USB2.0,HighDefinitionDigitalAudio,LPCinterface,GigabitEthernet,LVDSDisplayinterface.Allthesignalsarrivetothecarrierthrougha230pinsMXMconnector.SECO provides complete system solutions with Qseven®.

SECO is one of the founding members of SGET.

Qseven® STANDARD

Mechanic and CoolingCompactsize• Quadratic 7 cm (~2,76” x ~2,76”)• Rev.2.0allowsforamicroQsevenSize

4x7cm(~2,76”x1,57”)• Solid mechanical mounting• Cost efficient direct edge connector• Rugged 1.2 mm PCB thickness

Cooling interface• Top edge defined for heat transfer• Heat transfer from CPU, Chipset and

DRAM enhanced via copper layers• Heatspreader defined for high power

versions (max. 12 W)

Changes for Rev. 2.0 (Sep. 2012)Signals Added to Qseven Pinout• 2x USB 3.0• 4WireSDIOBusonLPC• I2S interface shared with HDA• UART Interface• eDP(embeddedDisplayPort)sharedwithLVDS• I2C clock on SM-Bus• One-Wire-Bus

Updates• MXMConnectorsfromYamaichi(Automotive

specified), Foxconn, Aces• Shared DisplayPort• HDMI hotplug detection

MXM ConnectorMXM2edgeconnector• Multiple Sources Speedtech, Lotes,

AcesandYamaichi(automotivecertified)

• 230 positions, .020” pitch, SMT• 5.5 and 7.8 mm height versions• Certified for rugged mobile applications

and for high speed serial buses (PEG bus)• Low cost connector• 30µ gold plated versions for industrial

applications• Automotivecertified(Yamaichi)

Qseven® STANDARD Rev. 2.0 specification

10

Qseven®

QuadMo747-Z5xxComputer on Module with Intel®

Atom™ Z5xx series – US15W Chipset

Highlights

Technical features

CPU Intel® Atom™ Z5xx series 1.1 GHz and 1,6 GHz

Chipset Intel® System Controller Hub US15W

DRAM Up to 1GB DDR2 400/533MHz

CACHE 512KB L2

Graphic Interface integrated Intel® GMA500 Graphic accelerator

LVDS Single Channel 18/24 Bit LVDS Transmitter

Resolution up to 1366 x 768

SDVO InterfacePCI-e ports Up to 2 x PCI Express x 1 ports

USB 8x USB 2.0 ports

ETHERNET Gigabit Ethernet port (optional)

SD I/O 1 x 8-bit interface + 1 x μSD slot onboard

Mass Storage Onboard Flash Disk up to 8GB

1 x S-ATA channel

Audio HD Audio Interface

Interface Buses I2C Bus

LPC BUS for legacy peripherals

SM Bus

Power management signalsThermal cooling interfacePower supply +5VDC ± 5%

TDP Typical 5W with Intel® Atom™ Z510

Dimensions 70x70 mm (2.76” x 2.76”)

• Small and Powerful enough to enable Internet experience• Power-efficient ideal for mobile devices• Passive cooling for fan less applications• Extensive connectivity for a turn-key legacy free solution

μSSD SLOT on board

X86

11

Qseven®

QuadMo747-EXTREMEComputer on Module with Intel® Atom™ Z5xxPT series – US15WPTChipset, specifically designed for industrial temperature range

Highlights

Technical features

• Full BOM certified for the Extended Temperature Range (-40°C; +85°C)• Low power consumption module ideal for industrial, automotive, defense and security applications

Industrial Temperature Range, -40°C ÷ +85°CBill of Material specifically selected for Industrial Temperature RangeCPU Intel® Atom™ Z510PT@ 1,1GHz

Intel® Atom™ Z520PT@ 1,33 GHz

Chipset Intel® SCH US15WPT

DRAM up to 1GB DDR2 400/533MHz

CACHE 512KB L2

Graphic Interface integrated Intel® GMA500 Graphic accelerator

LVDS Single Channel 18/24 Bit LVDS Transmitter

Resolution up to 1366 x 768

SDVO interfacePCI-e ports 1 x PCI Express x1 ports

USB 8x USB 2.0 ports

ETHERNET Gigabit Ethernet port (optional)

SD I/O 1 x 4-bit interface

Mass Storage Onboard Flash Disk up to 8GB

1 x S-ATA channel

Audio HD Audio Interface

Interface Buses I2C Bus

LPC BUS for legacy peripherals

SM Bus

Power management signalsThermal cooling interfacePower supply +5VDC ± 5%

Dimensions 70x70 mm (2.76” x 2.76”)

X86

12

Qseven®

QuadMo747-E6xxComputer on Module with Intel®

Atom™ E6xx series CPU+ EG20T Chipset

Highlights

Technical features

• Intel® Atom™ Processor E6xx series & Intel® EG20 Platform Controller Hub chipset• Available with full BOM certified for the extended temperature range of -25°C to +85°C• Integrated Intel® 3D Graphic with 50% performance enhancement• With CAN Bus

CPU Intel® Atom™ E620/E620T @ 600MHz, 3.3W TDP Intel® Atom™ E640/E640T @ 1.0GHz 3.6W TDP Intel® Atom™ E660/E660T @ 1.3GHz 3.6W TDP Intel® Atom™ E680/E680T @ 1.6GHz 4.5W TDPPlatform Controller Hub Intel® PCH EG20TMemory up to 2GB DDR2 onboardGraphic Interface integrated Intel® 2D and 3D graphic controller Dual independent display support MPEG2, MPEG4, H.264, DivX HW video decodingDisplay LVDS Single Channel 18/24 Bit interface SDVO Interface Maximum resolution 1280x768 on LVDS Maximum resolution 1920x1080 on SDVOPCI Express 2x PCI-E x1 lanesUSB 6 x USB 2.0 ports + 1 x USB clientMass Storage Optional onboard SATA Flash Disk up to 32GB Up to 2 x S-ATA Channels 2 x Express Card interfaceETHERNET Gigabit Ethernet InterfaceAudio HD Audio InterfaceSD / MMC / SDIO interface CAN BUS InterfaceExpansion Bus I2C, SM Bus, LPC, SPIFAN Management InterfacePower management signalsPower supply +5VDC AT/ATX modeDimensions 70x70 mm (2.76” x 2.76”)

X86

13

Qseven®

QuadMo747-GSeriesComputer on Module with the new AMD Embedded G-Series Platform

Highlights

Technical features

• The AMD APU Architecture that combines a low power CPU and a discrete-level GPU into a single embedded Accelerated Processing Unit (APU)• Single and Dual x86 cores up to 9W TDP• HW decode support for H.264, VC-1, MPEG2, WMV, DivX, Adobe Flash• Ideal for low power designes in embedded applications such as Digital Signage, xSTB, IP-TV,Thin Clients, Info Kiosks, POS, Gaming

APU AMD T56N, Dual Core @ 1.65 GHz, TDP 18W AMD T40N, Dual Core @ 1.0 GHz, TDP 9W AMD T44R, Single Core @ 1.2 GHz, TDP 9W AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W AMD T16R, Single Core @615MHz, TDP 4.5WController Hub AMD A55E Controller HubMemory Up to 4GB DDR3 / LVDDR3-1066 soldered onboardGraphics integrated AMD GPU Radeon™: HD6320 - AMD T56N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual display support DirectX® 11, OpenGL 4.0, OpenCL™ 1.1 supportedDisplay Single/Dual Channel 18/24 Bit LVDS Interface HDMI interface Additional VGA InterfaceMax Resolutions: LVDS Interface, up to 1920x1200 HDMI, up to 1920x1200 VGA, up to 1920x1200 (up to 2048x1536 with T56N)Mass Storage 2 x external S-ATA channels SATA Flash Disk soldered onboard, up to 32GB SD Memory Card interfaceUSB 8x USB 2.0 portsPCI-e ports 4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4) 2 x Express Card InterfaceETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus I2C Bus LPC BUS for legacy peripherals SM Bus Thermal / FAN managementPower supply +5VDC ± 5% and +5VSB (optional)Dimensions 70x70 mm (2.76” x 2.76”)

X86

14

Qseven®

QuadMo747-x2000Qseven® Rel. 2.0 Compliant Module with Intel® Atom™ CedarViewfamilyProcessorsandIntel® NM10 Express Chipset

Highlights

Technical features

• Qseven® Rel. 2.0 compliant• Based on the new Intel® Atom™ Cedar View dual core N2000 and D2000 CPU families at a 64-bit instruction set and Hyper Threading for an impressive performance/power consumption ratio• Up to 4GB DDR3/LPDDR3 RAM• Multi video interfaces: HDMI/DisplayPort; LVDS; embedded DP; VGA (opt. external adapter)

CPU Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP Intel® Atom™ N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel® Atom™ N2600 @1.6GHz, 1MB Cache, 3.5W TDPChipset Intel® NM10 Express ChipsetMemory up to 4GB DDR3 / LPDDR3 1066MHz Soldered onboard (up to 2GB with N2600)Graphics Integrated Intel® HD Graphics controller Dual independent display supportVideo interfaces HDMI or Display Port interface 18/24 bit single channel LVDS interface (18bit with N2xxx CPUs) Embedded Display Port (eDP) interface Additional VGA interface (optional external adapter is required)Resolutions N2xxx CPUs D2550CPUHDMI & CRT Up to 19200x1200 Up to 1920x1200LVDS interface Up to 1366x768 Up to 1440x900Display Port Up to 1600x1200 Up to 2560x1600eDP Up to 1366x768 Up to 1920x1080Mass Storage Up to 2 x external S-ATA channels Optional SATA Flash Disk soldered on board, up to 128GB Optional SD / SDI/O InterfaceUSB Up to 8 x USB 2.0 portsEthernet Gigabit Ethernet interfaceAudio HD Audio InterfacePCI-express 3 x PCI-e x1 portsInterface Bus I2C Bus LPC BUS SM Bus Thermal / FAN management Optional UART Interface Optional SPI interface FAN connectorDimensions 70 x 70 mm (2,76” x 2,76”)

X86

15

Qseven®

QuadMo747-X/OMAP3Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

Highlights• Very low power consumption• 3D graphics acceleration to support display and gaming effects• Ideal for multimedia devices• Available in Extended Temperature Version

OMAP 3Processors

TM

Applications Processor Texas Instruments® OMAP™ 37xx Family AM3703 (Cortex™ A8, up to 1 GHz core) DM3730 (Cortex™ A8, up to 1GHz core + PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core)Memory Mobile DDR 128 / 256MB / 512 MB onboardFlash Disk 256 MB / 512MB / 1GB NAND Flash eMMC soldered onboard up to 16GBLVDS Single/Dual Channel 18/24 Bit resolution up to 1366 x 768ETHERNET 10/100 Base-T interfaceUSB 1x USB OTG 2x USB 2.0 HostSERIAL PORTS 2 x COM ports CAN interfaceMMC/HC MMC/SD/SDHC/SDIO interfaceAudio AC’97 Audio InterfaceVideo Input Port / Camera ConnectorLPC BusSM BusSPI interfaceI2C busJTAGTemperature 0°C ÷ +70°C (commercial version) -40°C ÷ +85°C (industrial version)Dimensions 70x70 mm (2.76” x 2.76”)Compliant to Qseven® Specifications Rel.1.20

Technical features

ARM

16

Qseven®

Applications Processor Freescale™ i.MX51 Family: Freescale™ i.MX513 @ 800MHz Freescale™ i.MX515 @ 800MHz, with OpenGL ES 2.0 3D graphics accelerator and OpenVG 1.1 2D graphics accelerator integratedMemory DDR2 256 MB / 512MB onboardMass Storage Up to 4GB NAND Flash eMMC soldered onboard MMC / SD / SDHC / SDIO interface μSD Card Slot onboardVIDEO LVDS Single/Dual Channel 18/24 Bit interface DVI Single Link interface (optional) resolution up to 1600 x 1200 ETHERNET 10/100 Base-T interfaceUSB 1x USB OTG 4x USB 2.0 HostSERIAL PORTS 2 x COM ports CAN interface (optional)Audio AC’97 / I2S Audio InterfaceVideo Input Port / Camera Connector4-Wire Touch Screen InterfaceLPC BusSM BusSPI / One Wire interfaceI2C busIntegrated Security Features (i.MX515 only)Temperature 0°C ÷ +70°C (commercial version) -40°C ÷ +85°C (industrial version)Dimensions 70x70 mm (2.76” x 2.76”)Compliant to Qseven® Specifications Rel.1.20

QuadMo747-X/i.MX51Computer on Module based on the Freescale™i.MX51Family

Highlights

Technical features

• Design approved for Motor Sport Applications• Hardware acceleration enables very low power consumption for video and graphics• High level of integration reduces overall system BOM• Very high-performance processing and multimedia capabilities• Available in Extreme Version

i.MX51

ARM

17

Qseven®

QuadMo747-X/i.MX6Computer on Module with Freescale™i.MX6Processor

Highlights

Technical features

• The first scalable multi-core ARM® Cortex™-A9 architecture in Qseven® standard modular solution• Combines and emphasizes high-graphics performance with power-efficient processing capabilities• OpenGL (FULL) and OpenES 2.0 3D Graphics and up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) • Flexible solution enables multi-display platforms to mobile fanless applications • Available full BOM in Industrial Temperature range (-40°C; +85°C)

i.MX6Dual/ 6Quad

ARM

Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clockMemory up to 4GB DDR3 onboard (up to 2GB with i.MX6S)Graphics integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interfaceResolution LVDS, up to 1920x1200 HDMI, up to 1080pMass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard MMC/SD/SDIO interface 1 x µSD card slot onboardPCI-Express 1 x PCI-Express x1 laneUSB 1x USB OTG 4x USB 2.0 HostEthernet Gigabit Ethernet interfaceAudio AC97 Audio InterfaceVideo Input Port / Camera ConnectorSerial ports 2 x serial ports CAN Bus interfaceInterfaces LPC BUS for legacy peripherals SM Bus SPI I2C busAlso available in industrial temperature range, -40°C ÷ +85°CDimensions 70x70 mm (2.76” x 2.76”)

18

Qseven®

QuadMo747-X/T20ComputeronModulewithNVIDIA® Tegra® T20 Processor

Highlights

Technical features

• Dual Core System on Chip for Mobile Devices• Ideal for Web Browsing and Video HD applications• Support for Flash Technology• High performance 3D acceleration with high framerates

Qseven® Standard FeaturesProcessor NVIDIA® Tegra® T290 w/ Dual ARM® CORTEX -A9 MPCore™ CPU, 1.0GHz per coreMemory up to 1GB DDR2 onboardGraphic Interface embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video ProcessorDisplay LVDS Single/Dual Channel 18/24 Bit interface HDMI InterfaceVideo Resolution Up to 1080p on HDMI Up to 1680 x 1050 on LVDSPCI Express 2x PCI-E x1 lanes (Relaxed Ordering Mode only)USB 6 x USB 2.0 portsMass Storage On board IDE Flash Disk up to 2GB eMMC, up to 16GB, soldered onboard 2 x S-ATA Channels ETHERNET 10/100 Mbps Ethernet InterfaceAudio AC ‘97 Audio InterfaceMMC / SDIO interface 4 bit SD/MMC interfaceExpansion Bus I2C, SM Bus, LPC, SPICAN Bus InterfaceThermal Cooling Interface Power management signalsPower supply +5VDC AT/ATX modeDimensions 70x70 mm (2.76” x 2.76”)QuadMo747-X/T20 Specific FeaturesVideo Input Port / Camera ConnectorOne-Wire InterfaceJTAG interfaceSerial ports 2x RS-232 ports

ARM

19

Qseven®

QuadMo747-X/T30ComputeronModulewithNVIDIA® Tegra® T30Processor

Highlights

Technical features

• A Quad-Core ARM® Cortex™-A9 Low Power CPU for powerful graphics and Extreme Multitasking• Graphics engine powered by the 12 cores-ULP GeForce GPU with Dedicated Processors for 1080p Video Playback• Capable of reproducing High Resolution 3D Videos

Processor NVIDIA® Tegra® T30 w/ Quad ARM® CORTEX -A9 MPCore™ CPU, 1.3 GHz per coreMemory up to 2GB DDR3L onboardGraphic Interface embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video ProcessorDisplay LVDS Single/Dual Channel 18/24 Bit interface HDMI 1.4a InterfaceVideo Resolution Up to 1080p on HDMI Up to 1920 x 1080 on LVDSPCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices)USB 6 x USB 2.0 portsMass Storage eMMC, up to 32GB, soldered onboard 1 x S-ATA Channels microSD Slot onboard 4 bit SD/MMC interfaceETHERNET Gigabit Ethernet InterfaceAudio HD Audio InterfaceExpansion Bus I2C, SM Bus, LPC, SPISerial ports 2 serial ports (Tx, Rx signals) CAN Bus InterfaceVideo Input Port / Camera ConnectorOne Wire InterfaceThermal Cooling InterfacePower management signalsPower supply +5VDC AT/ATX modeDimensions 70x70 mm (2.76” x 2.76”)

ARM

20

µQseven

μQ7-OMAP5μQseven Rel. 2.0 Compliant Module withTexas Instruments OMAP™ 5 Processor

Highlights

Technical features

• ARM® Cortex™-A15-based module in Qseven® standard• Energy-efficient architecture in only 7x4 cm (2.76”x1.57”)• Able to drive multiple displays in HD resolution• Dedicated graphics cores and integrated DSP @ 466 MHz

OMAP 5Processors

TM

ARM

Applications Processor Texas Instruments® OMAP™5430 processor: 2x ARM Cortex-A15 MPCore, up to 1.7GHz per core for symmetric multiprocessing + 2x ARM Cortex–M4 cores for low-power offload and real-time responsivenessMemory up to 2GB LPDDR2 PoPIntegrated Graphics Image signal processor (ISP) IVA HD video accelerator miniC64x DSP core @ 466MHz PowerVR™ SGX544-MP2 3D graphics Supports up to three independent displaysVideo interfaces HDMI interface, resolution up to 1080p60 18/24 bit single/dual channel LVDS interfaceMass Storage eMMC soldered onboard 2 x SD/MMC interfaces SATA interfaceUSB 1x USB OTG LS/FS/HS/SS (USB 3.0) 2x USB 2.0 hostNetworking 10/100Mbps Ethernet interface WiFi 802.11 b/g/n Bluetooth 2.1Audio I2S / AC’97 Audio InterfaceSerial ports 2 x serial ports 1 x CAN Bus portCamera interface Dedicated connector for serial/parallel cameraOther interfaces SPI 2 x I2C bus 3 x PWM Channels 1 x Capture input GPIOQseven® Power management CompliantDimensions 40x70 mm (μQseven, 1.57” x 2.76”)

21

µQseven

μQ7-T30μQsevenRel.2.0CompliantModulewithNVIDIA® Tegra® T30 Processor

Highlights

Technical features

• µQseven module based on the Tegra® 3 SoC, for an energy-efficient and cost effective solution in only 7x4 cm (2.76”x1.57”)• Quad-Core ARM® Cortex™-A9 Low Power CPU for powerful graphics and extreme multitasking in mobile applications• Graphics engine powered by the 12 cores-ULP GeForce GPU with Dedicated Processors for 1080p Video Playback• Capable of reproducing high res. 3D Video • Designed for digital signage applications

Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™-A9 MPCore™ CPU, 1.3 GHz per coreMemory up to 1GB DDR3L onboardIntegrated Graphics embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video ProcessorVideo interfaces LVDS Single/Dual Channel 18/24 Bit interface HDMI interface DSI interfaceResolution up to 1080p on HDMI up to 1600x1200 on LVDSMass Storage eMMC, up to 16GB, soldered onboard 2 x SD/SDIO/MMC 4-bit interface SATA interfaceUSB 3 x USB 2.0 hostPCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices)Networking Gigabit Ethernet InterfaceAudio HD Audio InterfaceSerial ports 2 x serial portsOther interfaces SPI I2C bus 2 x PWM Channels SM BusQseven® Power management CompliantDimensions 40x70 mm (μQseven, 1.57” x 2.76” )

ARM

22

µQseven

i.MX6Dual/ 6Quad

μQ7-i.MX6μQseven Rel. 2.0 Compliant Module with Freescale™ i.MX6Processor

Highlights

Technical features

• µQseven module based on the ARM® Cortex™-A9 i.MX6 SoC, a fully scalable solution from a high performance Quad Core CPU to an energy-efficient and cost-effective Solo Core solution• OpenGL/ES 2.0 3D Graphics and up to 4 independent displays• A flexible solution, suitable for high end, multi display solutions as well as energy-saving smart portable devices • Available full BOM in Industrial Temperature range (-40°C; +85°C)

ARM

Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clockMemory up to 2GB DDR3 onboard (up to 1GB with i.MX6S)Graphics Integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interfaceResolution LVDS, up to 1920x1200 HDMI, up to 1080pMass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard 2 x MMC/SD/SDIO interfacePCI-Express 1 x PCI-Express x1 laneUSB 1x USB OTG 4x USB 2.0 HostEthernet Gigabit Ethernet interfaceAudio I2S / AC’97 Audio InterfaceSerial ports 2 x serial ports CAN Bus interfaceInterfaces SM Bus SPI I2C busDimensions 40x70 mm (μQseven, 1.57” x 2.76”)

23

The Development kit contains the following material:• Cross Platform Carrier Board• LVDS Display (7” - 800x480 and/or 10” – 1024x768, at choice)• 4-wire T/S, already assembled on LCD display• LVDS to TTL 24-bit display converter• TTL to RS-232 Transceiver board• 19VDC Notebook Power Adapter, with Power Cords for connection to EU CEE 7/16, US NEMA 1-15, UK BS 1363A, JP JIS8303

• FFC cable for interconnection of Cross Platform Carrier Board to ARM Qseven® module camera connector• USB 2.0 Plug “A” – Plug “mini B” for USB client connection• Connection cables for adapter boards included in the kit• Connection cable for LVDS display• 4-Wire Touch Screen cable adapterSince the Cross Platform can be used with any SECO Qseven CPU Module, the Development Kit DOESN’T CONTAIN any Qseven® module. The module has to be purchased separately.

DEVELOPMENT KIT CONTENTS

Technical features of SECOCQ7-XboardSupported Modules All Qseven® CPU Modules Expansion Slots 1 x PCI Express x 1 Slot miniPCI express Slot Gigabit Ethernet InterfaceMass Storage 2 x S-ATA connectors Hard Disk Power Connector 2 x SD/MMC slots SDI/O Internal HeaderI/O 6 x USB 2.0 standard “A” connector USB Client connector 4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface) 1 x CAN Interface 4 x GPI/O 3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard) Internal FPGA, with possibility of defining up to 64 User I/O’s JTAG connection LPC Bus interface SPI interface I2C applications included: EEPROM, Light Sensor, I/O Extender, SIM Card slot A/D ConverterAudio Triple Audio Jack 2 x S/P-DIF connectors (In & Out) AC’97 and HD Audio Codecs integrated, jumper selectable Direct Digital Audio InterfaceVideo VGA DB-15HD + DVI-D Single Link connector LVDS LCD and Backlight connector, with voltage selection Video Camera Interface, NTSC/PAL/SECAM video decoder integratedPower +5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application Smart Battery Management Li-ION Single Cell Battery ManagementFAN 3 pin Header, +5/+12V configurable with Tachometric signalTemperature Operating: 0° … +60°C Storage: -20° … +80°CDimensions 270 x 170 mm (10,63” x 6,69”)

Highlights• Qseven® development board with a wide range of interfaces• Available with complete BOM and schematics

Cross Platform Development KitDevelopment kit for Qseven philosophy, compatible with both x86 and ARM Qseven® modules. Compliant to Qseven® specifications rel. 1.20

• Schematics • Design Review

The ChameleonPhilosophy

Qseven®DEVELOPMENT KIT

• BOM

24

Cross Platform Starter KitCarrier Board for Qseven® QuadMo747modulesonpicoITXForm Factor

• 1x SECOCQ7-pITX-Xboard• 1x Notebook Power Adapter, with power cord and adapters for use in Europe, UK, USA and Japan• 1x TTL to RS-232 serial converter• Connection cables• Quick start guide

The Development Kit DOES NOT CONTAIN any Qseven® module. The module has to be purchased separately.

CROSS PLATFORM STARTER KIT CONTAINS:

Supported Modules All Qseven® Rel.1.20 Embedded Computer ModulesExpansion Slots 1 x miniPCI Express slot SIM Card slot for miniPCI Express modemsMass Storage 1 x S-ATA connector μSD Card SlotI/O Up to 7x USB ports (1 x USB client) 1 x Gigabit/FastEthernet connector 1 x optional additional FastEthernet port 8 x GPIO on 10-Pin Header Connector 1 x RS-232 (RS-422 / RS-485 configurable) 1 x TTL-level serial port CAN Interface 4-Wire Touch Screen controller integrated SM Bus Pin Header I2C Bus, SPI interfaceAudio AC’97 and HD Audio Codec, jumper selectable Line In, Mic In on internal pin headers Earphone pin headerVideo LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI ConnectorCMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTCPower 12V Power jack Internal Pin Header for Power, Lid, Sleep and Reset Button Power On Status LEDTemperature Operating: 0° ÷ +60°C Available in extreme version, -40°C ÷ +85°CDimensions 100 x 72 mm (3,94” x 2,83”)Qseven® specifications rel.1.20 compliant

• Schematics• BOM• Design Review

The ChameleonPhilosophy

Qseven®

Technical features of SECOCQ7-pITX-Xboard

DEVELOPMENT KIT

25

SECOCQ7-pITXCarrier Board for Qseven®QuadMo747modulesonpicoITXForm Factor

Technical features

Expansion Slots 1 x miniPCI Express (alternative to 1GbE)Mass Storage interface 1 x S-ATA connectors 1 x SD Card SlotI/O 2 x Double USB on the Front Panel 1 x USB Client on the Front Panel 1 x USB internal 2 x GbE on Front Panel (1 alternative to miniPCI Express Slot) 2 x Serial Ports (1 x RS232 full modem, RS-485 configurable, 1x TX/RX signals at TTL level) 9 x GPIO on 10 Pin Header ConnectorAudio Line In – Mic In on 8 Pin Connector Hearphone on 5pin Header Speaker on 5pin HeaderVideo Analog VGA on 12 Pin Header LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin HeaderCMOS Battery On Board Lithium Battery for CMOS Backup and RTCSmart Battery ConnectorPower 12V Power jack 5 Pin Header for Power and Reset Button Optional 12V Micro- Fit jackTemperature Operating: 0° ÷ +60°C Storage: -20° ÷ +80°CDimensions 100 x 72 mm (3,94” x 2,83”)

Highlights

• Pico ITX standard form factor Qseven® carrier board • Optimized for x86 modules SDVO to VGA output

Qseven®CARRIERBOARD

26

SECOCQ7-pITX-XboardCarrier Board for Qseven®QuadMo747modulesonpicoITXFormFactor

Technical features

Expansion Slots 1 x miniPCI Express slot SIM Card slot for miniPCI Express modemsMass Storage 1 x S-ATA connector μSD Card SlotI/O Up to 7x USB ports (1 x USB client) 1 x Gigabit/FastEthernet connector 1 x optional additional FastEthernet port 8 x GPIO on 10-Pin Header Connector 1 x RS-232 (RS-422 / RS-485 configurable) 1 x TTL-level serial port CAN Interface 4-Wire Touch Screen controller integrated SM Bus Pin Header I2C Bus, SPI interfaceAudio AC’97 and HD Audio Codec, jumper selectable Line In, Mic In on internal pin headers Earphone pin headerVideo LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI ConnectorCMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTCPower 12V Power jack Internal Pin Header for Power, Lid, Sleep and Reset Button Power On Status LEDTemperature Operating: 0° ÷ +60°C Available in extreme version, -40°C ÷ +85°CDimensions 100 x 72 mm (3,94” x 2,83”)Qseven® specifications rel. 1.20 compliant

Highlights

• Pico ITX standard form factor Qseven® carrier board • Cross Platform (ARM and x86) compatibility• Also available in industrial temperature range

SECOCQ7-pITX-Xboard is available also as boxed solution

B901

The ChameleonPhilosophy

Qseven®CARRIERBOARD

27

SECOCQ7-mITX2.0mini-ITXformfactorCarrierBoardforQseven® modules Rel. 2.0 compliant

Technical features

Compliant to Qseven® Specifications rel. 2.0Mass Storage 1 x S-ATA connector 1 x mSATA slot 1 x SD/MMC/SDIO Card SlotVideo 1 x Dual Channel 24 bit LVDS / Dual embedded Display port (eDP) connector Backlight Connector 8-pin socket for external DID EEPROM 1 x HDMI connectorAudio HD Audio Codec Standard triple audio Stereo Jack S/P-DIF Out 3 Pin Header for Digital Audio Internal Pin Header for I2S Audio interface Internal Pin Header for 2nd Line In + 2nd Mic InUSB 2 x USB 2.0 ports + 1 x USB 3.0 port on the front side Factory options: 1 additional USB 3.0 port on front side or 1 x USB Client on front side + 2 x USB 2.0 internal portsPCI Express PCI Express x4 interface on PCI-e x16 slotEthernet 1 x Gigabit Ethernet RJ-45 connectorSerial ports 1 x RS-232 DB-9 male connector 1 x CAN Bus DB-9 connectorI/O SPI and LPC internal connectors 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Thermal Management, Watch Dog) I2C EEPROM SocketCamera Interface connectorsCMOS Battery On Board Lithium Battery for CMOS Backup and RTCPower ATX Standard power Connector (AT mode config.)FAN 3 pin Header, with fan speed control, +12V or +5VTemperature Operating: 0° … +60°C Storage: -20° … +80°CDimensions 170 x 170 mm (6,7” x 6,7”)

Highlights

• Mini ITX standard form factor Qseven® Rev.2.0 carrier board• PCI Express x4 connector• USB 3.0

Qseven®CARRIERBOARD

28

SECOCQ7-microMicro carrier Board Rel. 2.0 compliant for µQseven modules

Highlights

Technical features

• Qseven® Rel.2.0 compliant carrier board optimized for µQseven modules • Extremely small and cost effective micro• Optional Wi-Fi module

Supported Modules μQseven Embedded Computer ModulesMass Storage 1 x S-ATA connector SATA Power 2-pin connector μSD Card SlotI/O: Up to 4x USB ports (1 x USB client) Optional WiFI module 1 x Gigabit/FastEthernet connector 1 x RS-232 Serial port I2C BusAudio Audio interface pin headerVideo LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI ConnectorCMOS Battery Internal connector for cabled rechargeable Lithium Battery for CMOS Backup and RTCPower 12V Power jack Internal Pin Header for Power, Sleep and Reset Button Power On Status LEDTemperature Operating: 0° ÷ +60°CDimensions 90 x 50 mm (3,54” x 1,97”)Qseven® specifications rel. 2.0 compliant

Qseven®CARRIERBOARD

29

Highlights

• Cross Platform (ARM and x86) compatibility• MXM 3.0 connector for mobile GPUs• Multi display outputs (3x HDMI; 1x LVDS)

SECOCQ7-MXMThe Qseven®CarrierBoardSECOCQ7-MXMistheonlyCarrierBoardavailable in the market able to expand the capabilities offered by Qseven® CPU modules with advanced graphical performances given by MXMGraphiccards.

Technical features

Supported Modules Qseven® Modules offering HDMI and PCI Express x 4 / x1 interfaces MXM 3.0 compliant Graphic cards, both Type “A” and Type “B”Mass Storage interface 1 x S-ATA connector μSD Card SlotPCI-e x4 link between MXM 3.0 and Q7 modulesVideo HDMI connection from Qseven® module Dual HDMI connection derived from Display Ports #A and #C of MXM Graphic Cards LVDS connection from Qseven® moduleEthernet 1 Ethernet port directly managed by Qseven® CPU module 1 x optional embedded PCI-e Gigabit Ethernet controller on the Carrier BoardUSB 2 x USB 2.0 standard ports Internal Pin header for 2 additional USB 2.0 ports 1 USB On-The Go portAudio Embedded AC’97 or HD Audio CodecCMOS Battery On Board Lithium Battery for CMOS Backup and RTCPower 19VDC Power inputTemperature Operating: 0° ÷ +60°CDimensions 200 x 140 mm (7.87” x 5.51”)

Qseven®CARRIERBOARD

30

CARMA DevKitThe CUDA® on ARM DevKit, codename CARMA, is a GPU computing development kit created to support the growing demandforenergy-efficientcomputinginitiativesaroundtheworld.PoweredbyanNVIDIA® Tegra® 3 quad-core ARM-based processorandanNVIDIA® CUDA®-enabled GPU, the CARMA DevKit supports energy-efficient HPC projects using ARM-based GPU computing.

CARMA specs:• Energy-efficient Tegra® 3 quad-core ARM A9 processor with 2 GB processor memory• NVIDIA® Quadro® 1000M GPU with 96 CUDA® cores and 2GB DDR3 memory• 270 single precision GFlops performance• 4x PCIe Gen1 link connecting processor to GPU• 1 Gigabit Ethernet network support• Direct attach storage support with SATA port• HDMI• USB ports

CARMA DevKitSOFTWARE

DEVELOPMENT KIT

PACKAGE CONTENT

• QuadMo747-X/T30- Qseven® 1.2 specs module, NVIDIA® TEGRA® 3 with 2 GB RAM and 4GB eMMC• NVIDIA® Quadro® 1000M• CARMA carrier board• Power supply• Cable kit

31

NVIDIA® Kayla GPU DevKitSECO mITX GPU DevKit (P/N SECO_mITX_GPU_DEVKIT)

NVIDIA® Tegra®3SoConQsevenprovidedinastandardPCformfactor,supportingNVIDIAGraphicsDriversandCUDA5.0Toolkit

PRODUCT SPECS:• Energy-efficient Tegra® 3 quadcore A9 processor with 2 GB processor memory• x16 PCIe mechanical connector (x4 electrical)• 1 Gbps Ethernet network support • Direct attach storage support with SATA port• HDMI• USB Ports• Camera Interface Connectors• ATX Standard Power connector (AT mode)

PACKAGE CONTENT

• QuadMo747-X/T30 - Qseven v1.2 module, NVIDIA® Tegra® 3 with 2 GB RAM and 4 GB eMMC• SECO mITX Carrier Board• Cable Kit

Qseven®SOFTWARE

DEVELOPMENT KIT

32

33

Qseven®

QuadMo747-Z5xx QuadMo747-EXTREME

CPU Intel® Atom™ Z5xx series 1.1 GHz and 1,6 GHz

Chipset Intel® System Controller Hub US15W

DRAM Up to 1GB DDR2 400/533MHz

CACHE 512KB L2

Graphic Interface integrated Intel® GMA500 Graphic accelerator

LVDS Single Channel 18/24 Bit LVDS Transmitter

Resolution up to 1366 x 768

SDVO InterfacePCI-e ports Up to 2 x PCI Express x 1 ports

USB 8x USB 2.0 ports

ETHERNET Gigabit Ethernet port (optional)

SD I/O 1 x 8-bit interface + 1 x μSD slot onboard

Mass Storage Onboard Flash Disk up to 8GB

1 x S-ATA channel

Audio HD Audio Interface

Interface Buses I2C Bus

LPC BUS for legacy peripherals

SM Bus

Power management signalsThermal cooling interfacePower supply +5VDC ± 5%

TDP Typical 5W with Intel® Atom™ Z510

Dimensions 70x70 mm (2.76” x 2.76”)

Industrial Temperature Range, -40°C ÷ +85°CBill of Material specifically selected for Industrial Temperature RangeCPU Intel® Atom™ Z510PT@ 1,1GHz

Intel® Atom™ Z520PT@ 1,33 GHz

Chipset Intel® SCH US15WPT

DRAM up to 1GB DDR2 400/533MHz

CACHE 512KB L2

Graphic Interface integrated Intel® GMA500 Graphic accelerator

LVDS Single Channel 18/24 Bit LVDS Transmitter

Resolution up to 1366 x 768

SDVO interfacePCI-e ports 1 x PCI Express x1 ports

USB 8x USB 2.0 ports

ETHERNET Gigabit Ethernet port (optional)

SD I/O 1 x 4-bit interface

Mass Storage Onboard Flash Disk up to 8GB

1 x S-ATA channel

Audio HD Audio Interface

Interface Buses I2C Bus

LPC BUS for legacy peripherals

SM Bus

Power management signalsThermal cooling interfacePower supply +5VDC ± 5%

Dimensions 70x70 mm (2.76” x 2.76”)

QuadMo747-E6xx

CPU Intel® Atom™ E620/E620T @ 600MHz, 3.3W TDP Intel® Atom™ E640/E640T @ 1.0GHz 3.6W TDP Intel® Atom™ E660/E660T @ 1.3GHz 3.6W TDP Intel® Atom™ E680/E680T @ 1.6GHz 4.5W TDPPlatform Controller Hub Intel® PCH EG20TMemory up to 2GB DDR2 onboardGraphic Interface integrated Intel® 2D and 3D graphic controller Dual independent display support MPEG2, MPEG4, H.264, DivX HW video decodingDisplay LVDS Single Channel 18/24 Bit interface SDVO Interface Maximum resolution 1280x768 on LVDS Maximum resolution 1920x1080 on SDVOPCI Express 2x PCI-E x1 lanesUSB 6 x USB 2.0 ports + 1 x USB clientMass Storage Optional onboard SATA Flash Disk up to 32GB Up to 2 x S-ATA Channels 2 x Express Card interfaceETHERNET Gigabit Ethernet InterfaceAudio HD Audio InterfaceSD / MMC / SDIO interface CAN BUS InterfaceExpansion Bus I2C, SM Bus, LPC, SPIFAN Management InterfacePower management signalsPower supply +5VDC AT/ATX modeDimensions 70x70 mm (2.76” x 2.76”)

X86

Technical features

34

Qseven®

QuadMo747-GSeries

APU AMD T56N, Dual Core @ 1.65 GHz, TDP 18W AMD T40N, Dual Core @ 1.0 GHz, TDP 9W AMD T44R, Single Core @ 1.2 GHz, TDP 9W AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W AMD T16R, Single Core @615MHz, TDP 4.5WController Hub AMD A55E Controller HubMemory Up to 2GB DDR3 / LVDDR3-1066 soldered onboardGraphics integrated AMD GPU Radeon™: HD6320 - AMD T56N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual display support DirectX® 11, OpenGL 4.0, OpenCL™ 1.1 supportedDisplay Single/Dual Channel 18/24 Bit LVDS Interface HDMI interface Additional VGA InterfaceMax Resolutions: LVDS Interface, up to 1920x1200 HDMI, up to 1920x1200 VGA, up to 1920x1200 (up to 2048x1536 with T56N)Mass Storage 2 x external S-ATA channels SATA Flash Disk soldered onboard, up to 32GB SD Memory Card interfaceUSB 8x USB 2.0 portsPCI-e ports 4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4) 2 x Express Card InterfaceETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus I2C Bus LPC BUS for legacy peripherals SM Bus Thermal / FAN managementPower supply +5VDC ± 5% and +5VSB (optional)Dimensions 70x70 mm (2.76” x 2.76”)

QuadMo747-x2000

CPU Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP Intel® Atom™ N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel® Atom™ N2600 @1.6GHz, 1MB Cache, 3.5W TDPChipset Intel® NM10 Express ChipsetMemory up to 4GB DDR3 / LPDDR3 1066MHz Soldered onboard (up to 2GB with N2600)Graphics Integrated Intel® HD Graphics controller Dual independent display supportVideo interfaces HDMI or Display Port interface 18/24 bit single channel LVDS interface (18bit with N2xxx CPUs) Embedded Display Port (eDP) interface Additional VGA interface (optional external adapter is required)Resolutions N2xxx CPUs D2550CPUHDMI & CRT Up to 19200x1200 Up to 1920x1200LVDS interface Up to 1366x768 Up to 1440x900Display Port Up to 1600x1200 Up to 2560x1600eDP Up to 1366x768 Up to 1920x1080Mass Storage Up to 2 x external S-ATA channels Optional SATA Flash Disk soldered on board, up to 128GB Optional SD / SDI/O InterfaceUSB Up to 8 x USB 2.0 portsEthernet Gigabit Ethernet interfaceAudio HD Audio InterfacePCI-express 3 x PCI-e x1 portsInterface Bus I2C Bus LPC BUS SM Bus Thermal / FAN management Optional UART Interface Optional SPI interface FAN connectorDimensions 70 x 70 mm (2,76” x 2,76”)

X86

Technical features

35

Qseven®

QuadMo747-X/i.MX51QuadMo747-X/OMAP3

OMAP 3Processors

TM

Applications Processor Texas Instruments® OMAP™ 37xx Family AM3703 (Cortex™ A8 up to 1 GHz core) DM3730 (Cortex™ A8, up to 1GHz core + PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core)Memory Mobile DDR 128 / 256MB / 512 MB onboardFlash Disk 256 MB / 512MB / 1GB NAND Flash eMMC soldered onboard up to 16GBLVDS Single/Dual Channel 18/24 Bit resolution up to 1366 x 768ETHERNET 10/100 Base-T interfaceUSB 1x USB OTG 2x USB 2.0 HostSERIAL PORTS 2 x COM ports CAN interfaceMMC/HC MMC/SD/SDHC/SDIO interfaceAudio AC’97 Audio InterfaceVideo Input Port / Camera ConnectorLPC BusSM BusSPI interfaceI2C busJTAGTemperature 0°C ÷ +70°C (commercial version) -40°C ÷ +85°C (industrial version)Dimensions 70x70 mm (2.76” x 2.76”)Compliant to Qseven® Specifications Rel.1.20

Applications Processor Freescale™ i.MX51 Family: Freescale™ i.MX513 @ 800MHz Freescale™ i.MX515 @ 800MHz, with OpenGL ES 2.0 3D graphics accelerator and OpenVG 1.1 2D graphics accelerator integratedMemory DDR2 256 MB / 512MB onboardMass Storage Up to 4GB NAND Flash eMMC soldered onboard MMC / SD / SDHC / SDIO interface μSD Card Slot onboardVIDEO LVDS Single/Dual Channel 18/24 Bit interface DVI Single Link interface (optional) resolution up to 1600 x 1200 ETHERNET 10/100 Base-T interfaceUSB 1x USB OTG 4x USB 2.0 HostSERIAL PORTS 2 x COM ports CAN interface (optional)Audio AC’97 / I2S Audio InterfaceVideo Input Port / Camera Connector4-Wire Touch Screen InterfaceLPC BusSM BusSPI / One Wire interfaceI2C busIntegrated Security Features (i.MX515 only)Temperature 0°C ÷ +70°C (commercial version) -40°C ÷ +85°C (industrial version)Dimensions 70x70 mm (2.76” x 2.76”)Compliant to Qseven® Specifications Rel.1.20

QuadMo747-X/i.MX6

i.MX6Dual/ 6Quadi.MX51

ARM

Technical features

Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clockMemory up to 4GB DDR3 onboard (up to 2GB with i.MX6S)Graphics integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interfaceResolution LVDS, up to 1920x1200 HDMI, up to 1080pMass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard MMC/SD/SDIO interface 1 x µSD card slot onboardPCI-Express 1 x PCI-Express x1 laneUSB 1x USB OTG 4x USB 2.0 HostEthernet Gigabit Ethernet interfaceAudio AC97 Audio InterfaceVideo Input Port / Camera ConnectorSerial ports 2 x serial ports CAN Bus interfaceInterfaces LPC BUS for legacy peripherals SM Bus SPI I2C busAlso available in industrial temperature range, -40°C ÷ +85°CDimensions 70x70 mm (2.76” x 2.76”)

36

Qseven®

QuadMo747-X/T20

QuadMo747-X/T30

Qseven® Standard FeaturesProcessor NVIDIA® Tegra® T290 w/ Dual ARM® CORTEX -A9 MPCore™ CPU, 1.0GHz per coreMemory up to 1GB DDR2 onboardGraphic Interface embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video ProcessorDisplay LVDS Single/Dual Channel 18/24 Bit interface HDMI InterfaceVideo Resolution Up to 1080p on HDMI Up to 1680 x 1050 on LVDSPCI Express 2x PCI-E x1 lanes (Relaxed Ordering Mode only)USB 6 x USB 2.0 portsMass Storage On board IDE Flash Disk up to 2GB eMMC, up to 16GB, soldered onboard 2 x S-ATA ChannelsETHERNET 10/100 Mbps Ethernet InterfaceAudio AC ‘97 Audio InterfaceMMC / SDIO interface 4 bit SD/MMC interfaceExpansion Bus I2C, SM Bus, LPC, SPICAN Bus InterfaceThermal Cooling Interface Power management signalsPower supply +5VDC AT/ATX modeDimensions 70x70 mm (2.76” x 2.76”)QuadMo747-X/T20 Specific FeaturesVideo Input Port / Camera ConnectorOne-Wire InterfaceJTAG interfaceSerial ports 2x RS-232 ports

Processor NVIDIA® Tegra® T30 w/ Quad ARM® CORTEX -A9 MPCore™ CPU, 1.3 GHz per coreMemory up to 2GB DDR3L onboardGraphic Interface embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video ProcessorDisplay LVDS Single/Dual Channel 18/24 Bit interface HDMI 1.4a InterfaceVideo Resolution Up to 1080p on HDMI Up to 1920 x 1080 on LVDSPCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices)USB 6 x USB 2.0 portsMass Storage eMMC, up to 32GB, soldered onboard 1 x S-ATA Channels microSD Slot onboard 4 bit SD/MMC interfaceETHERNET Gigabit Ethernet InterfaceAudio HD Audio InterfaceExpansion Bus I2C, SM Bus, LPC, SPISerial ports 2 serial ports (Tx, Rx signals) CAN Bus InterfaceVideo Input Port / Camera ConnectorOne Wire InterfaceThermal Cooling InterfacePower management signalsPower supply +5VDC AT/ATX modeDimensions 70x70 mm (2.76” x 2.76”)

ARM

Technical features

37

Qseven®

μQ7-T30 μQ7-i.MX6μQ7-OMAP5

Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™-A9 MPCore™ CPU, 1.3 GHz per coreMemory up to 1GB DDR3L onboardIntegrated Graphics embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-VideoProcessorVideo interfaces LVDS Single/Dual Channel 18/24 Bit interface HDMI interface DSI interfaceResolution up to 1080p on HDMI up to 1600x1200 on LVDSMass Storage eMMC, up to 16GB, soldered onboard 2 x SD/SDIO/MMC 4-bit interface SATA interfaceUSB 3 x USB 2.0 host PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices)Networking Gigabit Ethernet InterfaceAudio HD Audio InterfaceSerial ports 2 x serial portsOther interfaces SPI I2C bus 2 x PWM Channels SM BusQseven® Power management CompliantDimensions 40x70 mm (μQseven, 1.57” x 2.76”)

OMAP 5Processors

TM

i.MX6Dual/ 6Quad

ARM

Technical features

Applications Processor Texas Instruments® OMAP™5430 processor: 2x ARM Cortex-A15 MPCore, up to 1.7GHz per core for symmetric multiprocessing + 2x ARM Cortex–M4 cores for low-power offload and real-time responsivenessMemory up to 2GB LPDDR2 PoPIntegrated Graphics Image signal processor (ISP) IVA HD video accelerator miniC64x DSP core @ 466MHz PowerVR™ SGX544-MP2 3D graphics Supports up to three independent displaysVideo interfaces HDMI interface, resolution up to 1080p60 18/24 bit single/dual channel LVDS interfaceMass Storage eMMC soldered onboard 2 x SD/MMC interfaces SATA interfaceUSB 1x USB OTG LS/FS/HS/SS (USB 3.0) 2x USB 2.0 hostNetworking 10/100Mbps Ethernet interface WiFi 802.11 b/g/n Bluetooth 2.1Audio I2S / AC’97 Audio InterfaceSerial ports 2 x serial ports 1 x CAN Bus portCamera interface Dedicated connector for serial/parallel cameraOther interfaces SPI 2 x I2C bus 3 x PWM Channels 1 x Capture input GPIOQseven® Power management CompliantDimensions 40x70 mm (μQseven, 1.57” x 2.76”)

Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clockMemory up to 2GB DDR3 onboard (up to 1GB with i.MX6S)Graphics Integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interfaceResolution LVDS, up to 1920x1200 HDMI, up to 1080pMass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard 2 x MMC/SD/SDIO interfacePCI-Express 1 x PCI-Express x1 laneUSB 1x USB OTG 4x USB 2.0 HostEthernet Gigabit Ethernet interfaceAudio I2S / AC’97 Audio InterfaceSerial ports 2 x serial ports CAN Bus interfaceInterfaces SM Bus SPI I2C busDimensions 40x70 mm (μQseven, 1.57” x 2.76”)

38

Qseven®

SECOCQ7-pITXSECOCQ7-Xboard

Expansion Slots 1 x miniPCI Express (alternative to 1GbE)Mass Storage interface 1 x S-ATA connectors 1 x SD Card SlotI/O 2 x Double USB on the Front Panel 1 x USB Client on the Front Panel 1 x USB internal 2 x GbE on Front Panel (1 alternative to miniPCI Express Slot) 2 x Serial Ports (1 x RS232 full modem, RS-485 configurable, 1x TX/RX signals at TTL level) 9 x GPIO on 10 Pin Header ConnectorAudio Line In – Mic In on 8 Pin Connector Hearphone on 5pin Header Speaker on 5pin HeaderVideo Analog VGA on 12 Pin Header LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin HeaderCMOS Battery On Board Lithium Battery for CMOS Backup and RTCSmart Battery ConnectorPower 12V Power jack 5 Pin Header for Power and Reset Button Optional 12V Micro- Fit jackTemperature Operating: 0° ÷ +60°C Storage: -20° ÷ +80°CDimensions 100 x 72 mm (3,94” x 2,83”)

Supported Modules All Qseven® CPU Modules

Expansion Slots 1 x PCI Express x 1 Slot miniPCI express Slot Gigabit Ethernet Interface

Mass Storage 2 x S-ATA connectors Hard Disk Power Connector 2 x SD/MMC slots SDI/O Internal Header

I/O 6 x USB 2.0 standard “A” connector USB Client connector 4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface) 1 x CAN Interface 4 x GPI/O 3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard) Internal FPGA, with possibility of defining up to 64 User I/O’s JTAG connection LPC Bus interface SPI interface I2C applications included: EEPROM, Light Sensor, I/O Extender, SIM Card slot A/D Converter

Audio Triple Audio Jack 2 x S/P-DIF connectors (In & Out) AC’97 and HD Audio Codecs integrated, jumper selectable Direct Digital Audio Interface

Video VGA DB-15HD + DVI-D Single Link connector LVDS LCD and Backlight connector, with voltage selection Video Camera Interface, NTSC/PAL/SECAM video decoder integrated

Power +5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application Smart Battery Management Li-ION Single Cell Battery Management

FAN 3 pin Header, +5/+12V configurable with Tachometric signal

Temperature Operating: 0° … +60°C Storage: -20° … +80°C

Dimensions 270 x 170 mm (10,63” x 6,69”)

SECOCQ7-pITX-Xboard

Expansion Slots 1 x miniPCI Express slot SIM Card slot for miniPCI Express modemsMass Storage 1 x S-ATA connector μSD Card SlotI/O Up to 7x USB ports (1 x USB client) 1 x Gigabit/FastEthernet connector 1 x optional additional FastEthernet port 8 x GPIO on 10-Pin Header Connector 1 x RS-232 (RS-422 / RS-485 configurable) 1 x TTL-level serial port CAN Interface 4-Wire Touch Screen controller integrated SM Bus Pin Header I2C Bus, SPI interfaceAudio AC’97 and HD Audio Codec, jumper selectable Line In, Mic In on internal pin headers Earphone pin headerVideo LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI ConnectorCMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTCPower 12V Power jack Internal Pin Header for Power, Lid, Sleep and Reset Button Power On Status LEDTemperature Operating: 0° ÷ +60°C Available in extreme version, -40°C ÷ +85°CDimensions 100 x 72 mm (3,94” x 2,83”)Qseven® specifications rel. 1.20 compliant

CARRIER BOARD

CARRIER BOARD

CARRIER BOARD

Technical features

39

Qseven®

SECOCQ7-pITX-Xboard SECOCQ7-MXM

Supported Modules Qseven® Modules offering HDMI and PCI Express x 4 / x1 interfaces MXM 3.0 compliant Graphic cards, both Type “A” and Type “B”Mass Storage interface 1 x S-ATA connector μSD Card SlotPCI-e x4 link between MXM 3.0 and Q7 modulesVideo HDMI connection from Qseven® module Dual HDMI connection derived from Display Ports #A and #C of MXM Graphic Cards LVDS connection from Qseven® moduleEthernet 1 Ethernet port directly managed by Qseven® CPU module 1 x optional embedded PCI-e Gigabit Ethernet controller on the Carrier BoardUSB 2 x USB 2.0 standard ports Internal Pin header for 2 additional USB 2.0 ports 1 USB On-The Go portAudio Embedded AC’97 or HD Audio CodecCMOS Battery On Board Lithium Battery for CMOS Backup and RTCPower 19VDC Power inputTemperature Operating: 0° ÷ +60°CDimensions 200 x 140 mm (7.87” x 5.51”)

Compliant to Qseven® Specifications rel. 2.0Mass Storage 1 x S-ATA connector 1 x mSATA slot 1 x SD/MMC/SDIO Card SlotVideo 1 x Dual Channel 24 bit LVDS / Dual embedded Display port (eDP) connector Backlight Connector 8-pin socket for external DID EEPROM 1 x HDMI connectorAudio HD Audio Codec Standard triple audio Stereo Jack S/P-DIF Out 3 Pin Header for Digital Audio Internal Pin Header for I2S Audio interface Internal Pin Header for 2nd Line In + 2nd Mic InUSB 2 x USB 2.0 ports + 1 x USB 3.0 port on the front side Factory options: 1 additional USB 3.0 port on front side or 1 x USB Client on front side + 2 x USB 2.0 internal portsPCI Express PCI Express x4 interface on PCI-e x16 slotEthernet 1 x Gigabit Ethernet RJ-45 connectorSerial ports 1 x RS-232 DB-9 male connector 1 x CAN Bus DB-9 connectorI/O SPI and LPC internal connectors 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Thermal Management, Watch Dog) I2C EEPROM SocketCamera Interface connectorsCMOS Battery On Board Lithium Battery for CMOS Backup and RTCPower ATX Standard power Connector (AT mode config.)FAN 3 pin Header, with fan speed control, +12V or +5VTemperature Operating: 0° … +60°C Storage: -20° … +80°CDimensions 170 x 170 mm (6,7” x 6,7”)

SECOCQ7-mITX2.0 SECOCQ7-micro

Supported Modules μQseven Embedded Computer ModulesMass Storage 1 x S-ATA connector SATA Power 2-pin connector μSD Card SlotI/O: Up to 4x USB ports (1 x USB client) Optional WiFI module 1 x Gigabit/FastEthernet connector 1 x RS-232 Serial port I2C BusAudio Audio interface pin headerVideo LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI ConnectorCMOS Battery Internal connector for cabled rechargeable Lithium Battery for CMOS Backup and RTCPower 12V Power jack Internal Pin Header for Power, Sleep and Reset Button Power On Status LEDTemperature Operating: 0° ÷ +60°CDimensions 90 x 50 mm (3,54” x 1,97”)Qseven® specifications rel. 2.0 compliant

CARRIER BOARD

CARRIER BOARD

CARRIER BOARD

Technical features

Benefits:FAST DevelopmentFlexibilityInnovative and UpgradableEasy Cabling

Fields of Application:Industrial: automation and monitoring; data acquisitionMedical: data acquisition; test and monitoring appliancesTelecommunicationAutomotive – Transport: detection systemsRetail Industry: point of sales and kiosksMultimediaGaming Machines

High – End Bandwidth For High – End PerformancesCOM (Computer on Module) Express™ is a standard form factor introduced in 2005 by PICMG. This standard is an answer to the market request for more performance combined with more flexibility adopting the latest technology improvements available from CPUs and Chipsets. The COM Express™ module is available in 2 formats: the Basic, with dimensions of 125 x 95 mm, which is suited for highly power sensitive devices, and the Compact, with dimensions of 95x95 mm, which is a good trade-offbetweenperformanceandsmallsize.COM Express™ is also designed to accomodate next generations of PCI Express and Serial ATA interfaces, doubling the data rates of actual generation.

COM EXPRESS™

41

COM EXPRESS™

COM EXPRESS™

SECOMExp-iCORECOM-Express™ Module with Intel® Core™i3/i5/i7/Celeron® Processor and Intel® HM55 Express Chipset with DualChannel Memory

Highlights

Technical features

• COM EXPRESS TYPE II (Basic)• Intel Core i3, i5, i7 CPUs integrated• Intel Turbo Boost Technology• Multiple Display Inteface Supported

CPU Intel® Core™ i3-330E @ 2.13GHz, 3MB Cache, 35W TDP Intel® Core™ i5-520E/520M@2.4GHz, 3MB Cache, 35W TDP Intel® Core™ i7-660UE @ 1.33GHz, 4MB Cache, 18W TDP Intel® Core™ i7-620LE @ 2GHz, 4MB Cache, 25W TDP Intel® Core™ i7-610E @ 2.53GHz, 4MB Cache, 35W TDP Intel® Celeron® U3405@ 1.06GHz, 2MB Cache, 18W TDP Intel® Celeron® P4505@ 1.86GHz, 2MB Cache, 35W TDPChipset Intel® HM55 Express ChipsetMemory up to 8GB of 1066MHz DDR3 on two SO-DIMMs Supporting dual channelGraphics integrated Intel® HD graphics controller with dual independent display supportLVDS Single/Dual Channel 18/24 Bit LVDS TransmitterResolutions Up to 2048 x 1536 on CRT interface Up to 1920 x 1200 on LVDS interfacePEG PCI Express Graphics x16 interfaceMass Storage 1 x P-ATA channel 4 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports 4x PCI Express x1 portsETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus PCI Bus LPC BUS for legacy peripherals SM BusPower supply +12VDC and +5VSB for ATX modeDimensions 125x95 mm (COM Express Basic)

42

COM EXPRESS™

SECOMExp-iCore-XT Highlights

Technical features

Industrial temperature range COM-Express™ Module with Intel®Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory

• COM EXPRESS TYPE II (Basic)• Intel Core i3, i5, i7 CPUs integrated• Intel Turbo Boost Technology• Multiple Display Inteface Supported• Temperature range: -40°C ÷ +85°C

TEMPERATURE RANGE: -40°C ÷ +85°CCPU Intel® Core™ i7-660UE @ 1GHz, 4MB CacheChipset Intel® HM55 Express ChipsetMemory 1066MHz DDR3 selected modules on two SO-DIMMs Supporting dual channelFSB 100MHzGraphics integrated Intel® HD graphics controller Dual independent display supportLVDS Single/Dual Channel 18/24 Bit LVDS TransmitterResolutions Up to 2048 x 1536 on CRT interface Up to 2560 x 1600 @ 60Hz with Display Port Up to 1920 x 1200 @ 60Hz using HDMI/DVIPEG PCI Express Graphics x16 interface Multiplexed with HDMI, DVI and Display PortMass Storage 1 x P-ATA channel 4 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports 4x PCI Express x1 portsETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus PCI Bus LPC BUS for legacy peripherals SM BusPower supply +12VDC and +5VSB for ATX modeDimensions 125x95 mm (COM Express Basic)

43

COM EXPRESS™

SECOMExp-iCore/E4690COM-Express™ModuleExtension(DVI)withIntel® Core™ i7/Celeron® Processor and Intel® HM55 Express Chipset with AMD Radeon™GraphicsE4690DiscreteGPUonboard

Highlights

Technical features

• COM EXPRESS™ TYPE II (Basic) with Intel Core i3, i5, i7 CPUs • Graphic Controller AMD Radeon Graphics™ E4690 Integrated on board• The most powerful graphics COM express solution available in the market • High res multi display support• Suitable for medical, gaming, digital signage and parallel processing applications

CPU Intel® Core™ i7-660UE@1.33GHz, 4MB Cache, 18W TDP Intel® Core™ i7-620LE@2GHz, 4MB Cache, 25W TDP Intel® Celeron® U3405@1.06GHz, 2MB Cache, 18W TDP

Chipset Intel® HM55 Express Chipset

Memory up to 4GB of 1066MHz DDR3 SO-DIMMs

Graphics AMD Radeon™ Graphics E4690 Discrete GPU on board with 512MB 128-bit GDDR3 dedicated memory; Up to 3 independent displays using ad-hoc Carrier board CRT, Dual LVDS, DVI/HDMI interfaces HDMI max resolution 1080p CRT, max pixel clock 400MHz E4690 24-bit dual channel LVDS interface, max. resolution 2048 x 1536 CPU’s LVDS interface, max resolution 1600 x 1200 (available only on ad-hoc Carrier boards)

USB 8 x USB 2.0 ports

PCIe Ports 6 x PCI Express ports

ETHERNET Gigabit Ethernet interface

SATA interface 4 x Serial ATA ports

Audio HD Audio Interface

Interface Bus PCI Bus LPC Expansion Bus for legacy peripherals I2C Bus

SM Bus

WDT & Real Time ClockPower supply +12VDC and +5VSB (optional)

Dimensions 125x95 mm (COM Express Basic Form factor)

44

COM EXPRESS™

SECOMExp-IONCOM-Express™ Module with Intel® Celeron®T3100/Intel® Atom™N270CPUandNVIDIA® ION Chipset with Dual Channel Memory

Highlights

Technical features

• NVIDIA® CUDA™ technology• Full HD video decode and display with true-fidelity• 10x Faster Graphics and Video Transcoding 1• Low TDP for thin thermal solution

CPU Intel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction Set Chipset NVIDIA® MMP9 Embedded ION® ChipsetMemory up to 4GB of 1066MHz DDR3 on two SO-DIMMs supporting dual channelGraphics integrated NVIDIA® GeForce 9400 Graphic Controller, with 16 graphic/computational coresLVDS Single/Dual Channel 18/24 Bit LVDS TransmitterResolutions Up to 1600 x 1200 on LVDS Up to 1920 x 1440 on CRT interfacePEG PCI Express Graphics x16 interfaceMass Storage 1 x P-ATA channel 4 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports 3x PCI Express x1 portsETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus PCI Bus LPC BUS for legacy peripherals SM Bus I2C BusPower supply +12VDC and +5VSB for ATX modePower consumption ~ 11W during ACPI O.S. Idle Status 17W average, 20W peak during stress test (with 4GB DDR3)Operating temperature -25°C ÷ +70°C with finned heatsinkDimensions 125x95 mm (COM Express Basic)

45

COM EXPRESS™

APU AMD T56N, Dual Core @ 1,65GHz, TDP18W AMD T48N, Dual Core @ 1,4GHz, TDP18W AMD T40N, Dual Core @ 1,0GHz, TDP9W AMD T40E, Dual Core @ 1,0GHz, TDP6.4W AMD T52R, Single Core @ 1,5GHz, TDP18W AMD T44R, Single Core @ 1,2GHz, TDP9W AMD T40R, Single Core @ 1,0GHz, TDP5.5W AMD T16R, Single Core @615MHz, TDP 4.5WController Hub AMD A55E Controller HubMemory up to 8GB of 1033MHz DDR3 on two SO-DIMMsGraphics integrated AMD GPU Radeon™: HD6320 - AMD T56N HD6310 - AMD T52R and T48N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual independent display support DirectX® 11, OpenGL 4.0, OpenCL™ 1.1 supportedVideo Outputs Dual DisplayPort or HDMI interface 18/24 Bit Single/Dual Channel LVDS (alternative to second DisplayPort / HDMI interface) CRT interfaceMax Resolutions LVDS Interface, up to 1920x1200 HDMI, up to 1920 x 1200 Display Port: Up to 2560 x 1600 – AMD T56N, T48N, T52R Up to 1920 x 1200 – AMD T40N, T44R, T40E, T40R CRT: Up to 2048 x 1536 – AMD T56N, T48N and T52R Up to 1920 x 1200 – AMD T40N, T44R, T40E, T40RUSB 8x USB 2.0 portsPCI BusPCI-e ports 6x PCI Express x1 ports 2x ExpressCard interfacesETHERNET Gigabit Ethernet portPATA One Ultra DMA 133/100/66/33 PortSATA Four Serial ATA portsAudio HD Audio InterfaceInterface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management Power ManagementReal time ClockPower supply +12VDC and +5VSB for ATX modeCOM Express Basic Form factor, Type II, Extension HDMI/DisplayPort

SECOMExp-GSeriesCOM-Express™ Module with AMD Embedded G-Series Platform

Highlights

Technical features

• Able to drive two independent displays using the LVDS / HDMI / DisplayPort interfaces• An excellent solution for high performance, low power applications• DirectX® 11 support, OpenGL 3.2 and OpenCL™ support

46

COM EXPRESS™

SECOMExp-RSeriesCOM-Express™ Type 6 Module based on the AMD Embedded R-Series Platform

Highlights

Technical features

• Latest AMD R-series APU (CPU+GPU) architecture• Up to 4 independent displays, up to 2560x1600 resolution• Designed for digital signage, gaming and multimedia applications

APU AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W AMD R-252F, Dual Core @ 2.4 GHz, TDP 17WController Hub AMD A70M Controller HubMemory up to 8GB of 1600MHz DDR3 on two SO-DIMMsGraphics integrated AMD GPU Radeon™: HD7620G - AMD R-460L HD7600G - AMD R-452L HD7500G - AMD R-260H HD7400G - AMD R-252F 4 independent display support DirectX® 11, OpenGL 4.2, OpenCL™ 1.1 supportedVideo Outputs 3 x Digital Display Interfaces 18/24 Bit Single/Dual Channel LVDS CRT interfaceMax Resolutions LVDS Interface, up to 1920x1200 CRT interface, up to 1920x1600 Digital Display interfaces, up to 2560x1600USB 8 x USB 2.0 ports 4 x USB 3.0 portsPCI-e ports 7x PCI Express x1 ports 2x Express Card interfaces 1 x PCI-e x8 (PEG) interfaceETHERNET Gigabit Ethernet interfaceSerial ports 2 x TX/RX ports @ TTL Level, optionalDisk Interface 4 x SATA 6Gb/s portsAudio HD Audio InterfaceInterface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management SPI Interface Power Management Optional Trusted Platform Module (TPM)Real Time ClockPower supply +12VDC and +5VSB for ATX modeCOM Express Basic Form factor, Type 6

47

COM EXPRESS™

SECOMExp-x2000COM-Express™ Module with Intel® Atom™CedarViewfamilyProcessors and Intel® NM10 Express Chipset

Highlights

Technical features

• COM Express Type II (Compact) based on Intel® Atom™ Cedar View CPU family• A native dual core multi Threads solution with optimal performance/power consumption ratio• New SGX535 graphics engine, DirectX 10.1 and OpenGL 3.0 support • Hardware accelerated video decoding for MPEG-2, MPEG-4 part 2, VC1, WMV9 and all important H.264

CPU Intel® Atom™ D2550 @ 1.86GHz, 1MB Cache, 10W TDP Intel® Atom™ N2800 @ 1.86GHz, 1MB Cache, 6.5W TDP Intel® Atom™ N2600 @ 1.6GHz, 1MB Cache, 3.5W TDPChipset Intel® NM10 Express ChipsetMemory up to 4GB of 1066MHz DDR3 SO-DIMM (up to 2GB with N2600)Graphics integrated Intel® HD graphics controller Dual independent display supportVideo Outputs CRT interface Up to 2 x HDMI / Display Port interface Native Single Channel 18/24 bit LVDS interface OR DP to Single/Dual Channel 18/24bit LVDS bridgeResolutions CRT Interface, up to 1920 x 1200 HDMI/DVI, up to 1920 x 1200 Display Port: Up to 1600 x 1200 with N2xx CPU’s Up to 2560 x 1600 with N2xx CPU’s Native LVDS: Up to 1366 x 768 with N2xx CPU’s Up to 1440 x 900 with D2550 DP-to-LVDS bridge: Up to 1600 x 1200 with N2xx CPU’s Up to 1920 x 1200 with D2550Mass Storage 2 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports Up to 3 x PCI Express x1 portsEthernet Gigabit Ethernet interfaceAudio HD Audio InterfaceInterface Bus PCI Bus 2 x Express Card Interfaces LPC Bus, I2C Bus, SM Bus SPI interface 4 x GPI, 4 x GPO Watch Dog Timer FAN managementPower supply +12VDC and +5VSB (optional)Dimensions 95x95 mm (COM Express Compact)

48 48

COM EXPRESS™

SECOCExp-mITXCarrier Board for COM-Express™modulesTYPEII(Basic)onminiITXformfactor

Highlights

Technical features

• General Purpose For COM EXPRESS™ TYPE II (Basic)• Mini ITX form factor• Extensive Connectivity

Supported Modules All COM Express™ TYPE II Embedded Computer Modules Expansion Slots 1 x PCI 1 x PCI Express x16 2 x miniPCI Express (one connected to SIM Card Slot) Up to 2 Gigabit Ethernet ports on front panel connectorMass Storage interface 2 x S-ATA connectors 1 x P-ATA 44 pin connector 1 x Compact Flash Socket 1 x SD Card SlotI/O 4 x USB on the Front Panel 1 x USB internal connector 2 x Serial Ports (1 x DB-9 male connector on Front Panel, 1 x 10 pin Header Connector) 1 x LPT 26-pin Box header PS/2 Keyboard and Mouse Connector LPC Bus interface 1 x 40 pin connector for additional featureAudio HD Audio Codec 2 x triple audio connector for 7.1 Surround audio 1 x Toslink Fiber Optical SP/DIF connectorVideo Analogic VGA DB-15HD connector on Front Panel LVDS Interface, 34 pin 2mm pitch header Backlight Connector, 10 pin 2.54mm pitch header TV Out connector (6 pin 2mm pitch header)CMOS Battery On Board Lithium Battery for CMOS Backup and Real Time ClockPower ATX Standard power Connector, 20 + 4 poles, AT mode configurableFAN 3 pin Header, +5/+12V configurable with Tachometric signalTemperature Operating: 0° … +60°C Storage: -20° … +80°CDimensions 170 x 170 mm (6,7” x 6,7”)

CARRIERBOARD

49

COM EXPRESS™

SECOMExp-iCore-XTSECOMExp-iCORE

CPU Intel® Core™ i3-330E @ 2.13GHz, 3MB Cache, 35W TDP Intel® Core™ i5-520E/520M@2.4GHz, 3MB Cache, 35W TDP Intel® Core™ i7-660UE @ 1.33GHz, 4MB Cache, 18W TDP Intel® Core™ i7-620LE @ 2GHz, 4MB Cache, 25W TDP Intel® Core™ i7-610E @ 2.53GHz, 4MB Cache, 35W TDP Intel® Celeron® U3405@ 1.06GHz, 2MB Cache, 18W TDP Intel® Celeron® P4505@ 1.86GHz, 2MB Cache, 35W TDPChipset Intel® HM55 Express ChipsetMemory up to 8GB of 1066MHz DDR3 on two SO-DIMMs Supporting dual channelGraphics integrated Intel® HD graphics controller with dual independent display supportLVDS Single/Dual Channel 18/24 Bit LVDS TransmitterResolutions Up to 2048 x 1536 on CRT interface Up to 1920 x 1200 on LVDS interfacePEG PCI Express Graphics x16 interfaceMass Storage 1 x P-ATA channel 4 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports 4x PCI Express x1 portsETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus PCI Bus LPC BUS for legacy peripherals SM BusPower supply +12VDC and +5VSB for ATX modeDimensions 125x95 mm (COM Express Basic)

TEMPERATURE RANGE: -40°C ÷ +85°CCPU Intel® Core™ i7-660UE @ 1GHz, 4MB CacheChipset Intel® HM55 Express ChipsetMemory 1066MHz DDR3 selected modules on two SO-DIMMs Supporting dual channelFSB 100MHzGraphics integrated Intel® HD graphics controller Dual independent display supportLVDS Single/Dual Channel 18/24 Bit LVDS TransmitterResolutions Up to 2048 x 1536 on CRT interface Up to 2560 x 1600 @ 60Hz with Display Port Up to 1920 x 1200 @ 60Hz using HDMI/DVIPEG PCI Express Graphics x16 interface Multiplexed with HDMI, DVI and Display PortMass Storage 1 x P-ATA channel 4 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports 4x PCI Express x1 portsETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus PCI Bus LPC BUS for legacy peripherals SM BusPower supply +12VDC and +5VSB for ATX modeDimensions 125x95 mm (COM Express Basic)

Technical features

50

COM EXPRESS™

SECOMExp-ION

CPU Intel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction SetChipset NVIDIA® MMP9 Embedded ION® ChipsetMemory up to 4GB of 1066MHz DDR3 on two SO-DIMMs supporting dual channelGraphics integrated NVIDIA® GeForce 9400 Graphic Controller, with 16 graphic/computational coresLVDS Single/Dual Channel 18/24 Bit LVDS TransmitterResolutions Up to 1600 x 1200 on LVDS Up to 1920 x 1440 on CRT interfacePEG PCI Express Graphics x16 interfaceMass Storage 1 x P-ATA channel 4 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports 3x PCI Express x1 portsETHERNET Gigabit Ethernet portAudio HD Audio InterfaceInterface Bus PCI Bus LPC BUS for legacy peripherals SM Bus I2C BusPower supply +12VDC and +5VSB for ATX modePower consumption ~ 11W during ACPI O.S. Idle Status 17W average, 20W peak during stress test (with 4GB DDR3)Operating temperature -25°C ÷ +70°C with finned heatsinkDimensions 125x95 mm (COM Express Basic)

CPU Intel® Core™ i7-660UE@1.33GHz, 4MB Cache, 18W TDP Intel® Core™ i7-620LE@2GHz, 4MB Cache, 25W TDP

Intel® Celeron® U3405@1.06GHz, 2MB Cache, 18W TDP

Chipset Intel® HM55 Express Chipset

Memory up to 4GB of 1066MHz DDR3 SO-DIMMs

Graphics AMD Radeon™ Graphics E4690 Discrete GPU on board with 512MB 128-bit GDDR3 dedicated memory; Up to 3 independent displays using ad-hoc Carrier board CRT, Dual LVDS, DVI/HDMI interfaces HDMI max resolution 1080p CRT, max pixel clock 400MHz E4690 24-bit dual channel LVDS interface, max. resolution 2048 x 1536 CPU’s LVDS interface, max resolution 1600 x 1200 (available only on ad-hoc Carrier boards)

USB 8 x USB 2.0 ports

PCIe Ports 6 x PCI Express ports

ETHERNET Gigabit Ethernet interface

SATA interface 4 x Serial ATA ports

Audio HD Audio Interface

Interface Bus PCI Bus LPC Expansion Bus for legacy peripherals I2C Bus

SM Bus

WDT & Real Time ClockPower supply +12VDC and +5VSB (optional)

Dimensions 125x95 mm (COM Express Basic Form factor)

SECOMExp-iCore/E4690SECOMExp-GSeries

APU AMD T56N, Dual Core @ 1,65GHz, TDP18W AMD T48N, Dual Core @ 1,4GHz, TDP18W AMD T40N, Dual Core @ 1,0GHz, TDP9W AMD T40E, Dual Core @ 1,0GHz, TDP6.4W AMD T52R, Single Core @ 1,5GHz, TDP18W AMD T44R, Single Core @ 1,2GHz, TDP9W AMD T40R, Single Core @ 1,0GHz, TDP5.5W AMD T16R, Single Core @615MHz, TDP 4.5WController Hub AMD A55E Controller HubMemory up to 8GB of 1033MHz DDR3 on two SO-DIMMsGraphics integrated AMD GPU Radeon™: HD6320 - AMD T56N HD6310 - AMD T52R and T48N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual independent display support DirectX® 11, OpenGL 4.0, OpenCL™ 1.1 supportedVideo Outputs Dual DisplayPort or HDMI interface 18/24 Bit Single/Dual Channel LVDS (alternative to second DisplayPort / HDMI interface) CRT interfaceMax Resolutions LVDS Interface, up to 1920x1200 HDMI, up to 1920 x 1200 Display Port: Up to 2560 x 1600 – AMD T56N, T48N, T52R Up to 1920 x 1200 – AMD T40N, T44R, T40E, T40R CRT: Up to 2048 x 1536 – AMD T56N, T48N and T52R Up to 1920 x 1200 – AMD T40N, T44R, T40E, T40RUSB 8x USB 2.0 portsPCI BusPCI-e ports 6x PCI Express x1 ports 2x ExpressCard interfacesETHERNET Gigabit Ethernet portPATA One Ultra DMA 133/100/66/33 PortSATA Four Serial ATA portsAudio HD Audio InterfaceInterface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management Power ManagementReal time ClockPower supply +12VDC and +5VSB for ATX modeCOM Express Basic Form factor, Type II, Extension HDMI/DisplayPort

Technical features

51

COM EXPRESS™

SECOCExp-mITX

Supported Modules All COM Express™ Type II Embedded Computer Modules Expansion Slots 1 x PCI 1 x PCI Express x16 2 x miniPCI Express (one connected to SIM Card Slot) Up to 2 Gigabit Ethernet ports on front panel connectorMass Storage interface 2 x S-ATA connectors 1 x P-ATA 44 pin connector 1 x Compact Flash Socket 1 x SD Card SlotI/O 4 x USB on the Front Panel 1 x USB internal connector 2 x Serial Ports (1 x DB-9 male connector on Front Panel, 1 x 10 pin Header Connector) 1 x LPT 26-pin Box header PS/2 Keyboard and Mouse Connector LPC Bus interface 1 x 40 pin connector for additional featureAudio HD Audio Codec 2 x triple audio connector for 7.1 Surround audio 1 x Toslink Fiber Optical SP/DIF connectorVideo Analogic VGA DB-15HD connector on Front Panel LVDS Interface, 34 pin 2mm pitch header Backlight Connector, 10 pin 2.54mm pitch header TV Out connector (6 pin 2mm pitch header)CMOS Battery On Board Lithium Battery for CMOS Backup and Real Time ClockPower ATX Standard power Connector, 20 + 4 poles, AT mode configurableFAN 3 pin Header, +5/+12V configurable with Tachometric signalTemperature Operating: 0° … +60°C Storage: -20° … +80°CDimensions 170 x 170 mm (6,7” x 6,7”)

SECOMExp-x2000SECOMExp-RSeries

CPU Intel® Atom™ D2550 @ 1.86GHz, 1MB Cache, 10W TDP Intel® Atom™ N2800 @ 1.86GHz, 1MB Cache, 6.5W TDP Intel® Atom™ N2600 @ 1.6GHz, 1MB Cache, 3.5W TDPChipset Intel® NM10 Express ChipsetMemory up to 4GB of 1066MHz DDR3 SO-DIMM (up to 2GB with N2600)Graphics integrated Intel® HD graphics controller Dual independent display supportVideo Outputs CRT interface Up to 2 x HDMI / Display Port interface Native Single Channel 18/24 bit LVDS interface OR DP to Single/Dual Channel 18/24bit LVDS bridgeResolutions CRT Interface, up to 1920 x 1200 HDMI/DVI, up to 1920 x 1200 Display Port: Up to 1600 x 1200 with N2xx CPU’s Up to 2560 x 1600 with N2xx CPU’s Native LVDS: Up to 1366 x 768 with N2xx CPU’s Up to 1440 x 900 with D2550 DP-to-LVDS bridge: Up to 1600 x 1200 with N2xx CPU’s Up to 1920 x 1200 with D2550Mass Storage 2 x S-ATA channelsUSB 8x USB 2.0 portsPCI-e ports Up to 3 x PCI Express x1 portsEthernet Gigabit Ethernet interfaceAudio HD Audio InterfaceInterface Bus PCI Bus 2 x Express Card Interfaces LPC Bus, I2C Bus, SM Bus SPI interface 4 x GPI, 4 x GPO Watch Dog Timer FAN managementPower supply +12VDC and +5VSB (optional)Dimensions 95x95 mm (COM Express Compact)

APU AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W AMD R-252F, Dual Core @ 2.4 GHz, TDP 17WController Hub AMD A70M Controller HubMemory up to 8GB of 1600MHz DDR3 on two SO-DIMMsGraphics integrated AMD GPU Radeon™: HD7620G - AMD R-460L HD7600G - AMD R-452L HD7500G - AMD R-260H HD7400G - AMD R-252F 4 independent display support DirectX® 11, OpenGL 4.2, OpenCL™ 1.1 supportedVideo Outputs 3 x Digital Display Interfaces 18/24 Bit Single/Dual Channel LVDS CRT interfaceMax Resolutions LVDS Interface, up to 1920x1200 CRT interface, up to 1920x1600 Digital Display interfaces, up to 2560x1600USB 8 x USB 2.0 ports 4 x USB 3.0 portsPCI-e ports 7x PCI Express x1 ports 2x Express Card interfaces 1 x PCI-e x8 (PEG) interfaceETHERNET Gigabit Ethernet interfaceSerial ports 2 x TX/RX ports @ TTL Level, optionalDisk Interface 4 x SATA 6Gb/s portsAudio HD Audio InterfaceInterface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management SPI Interface Power Management Optional Trusted Platform Module (TPM)Real Time ClockPower supply +12VDC and +5VSB for ATX modeCOM Express Basic Form factor, Type 6

CARRIER BOARD

Technical features

Benefits:Compact DimensionsRugged SolutionCost Effective

Fields of Application:Industrial: automation and monitoring; data acquisitionDigital Signage: kiosks, info-point, panel PCSecurity: video surveillance, networking control

Clever Turn-key SolutionsSECO’s Embedded Single Board Computer product line includes awiderangeofstandardarchitecturessuchasnITXandpITX.Typical fields of application are gaming (slot or video poker machines), digital signage (kiosks or info-point devices) and industrial (processes control machines).

SECOSBCsareprovidingalltherequiredI/O’sformostindustrialapplicationssuchason-boarddigitalandanalogI/O,onboardbootable flash.

SECO’s Single board computers are compact and with a high level of integration. Together with their low power consumption they become the obvious choice for a wide range of applications.

Plug-cards such as DIMMs or storage units, cables and display interfaces along with pre-loaded operating systems complete the offer of SECO’s turn-key solutions with long term availability.

SBC

53

SBCSBC

SECOnITX-IONSingle Board Computer with Intel® Celeron® T3100 or Intel® Atom™N270CPUandNVIDIA® MMP9 Embedded ION™Chipsetonnano-ITXformfactor

Highlights

Technical features

• Highly-integrated compact board• Low Power Consumption and low heat dissipation• NVIDIA GeForce 9400 graphics

Processor Intel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction SetChipset NVIDIA® MMP9 Embedded ION™

Memory up to 4GB DDR3 on a SO-DIMM socketGraphic Controller integrated controller NVIDIA® GeForce 9400M 16x graphics cores max analog resolution 2048 x 1536 max digital resolution 2560 x 1600Video DVI Interface LVDS Interface HDMI Interface CRT InterfaceMass Storage Interface 2x SATA Compact Flash SocketUSB 4 x USB 2.0 ports (standard connector) 2 x USB 2.0 ports (internal Pin Headers)ETHERNET Gigabit Ethernet ConnectorAudio dual jack for HD AudioExpansion Slots 1x miniPCI Express connector 1 x Serial Port (RS-232 / RS-485 configurable) SM Bus Pin Header GPIO Pin HeaderFAN 3 pin Headers for CPU and Chipset temperature, with Tachometric signalPower supply +12VDC connector, AT/ATX modeDimensions 120x120 mm (4.72” x 4.72”)

54

SBC

SECOpITX-x2000Single Board Computer with Intel® Atom™CedarViewfamilyProcessors and Intel®NM10ExpressChipsetinPico-ITXform factor

Highlights

Technical features

• Space and power saving SBC with the long term support of the embedded market• Based on Intel® Atom™ Cedar View dual core N2000 and D2000 CPU family at 64-bit instruction set and Hyper Threading for impressive performance/power consumption ratio• Suitable for fanless and low cost applications

CPU Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP Intel® Atom™ N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel® Atom™ N2600 @1.6GHz, 1MB Cache, 3.5W TDPChipset Intel® NM10 Express ChipsetMemory up to 4GB DDR3 1066MHz SO-DIMM (up to 2GB with N2600)Graphics Integrated Intel® HD Graphics controller Dual independent display supportVideo interfaces HDMI Connector 18/24 bit single channel LVDS internal connector VGA interface (optional external adapter is required)Resolutions Up to 1920x1200 on HDMI and CRT Up to 1366 x 768 on LVDS interface with N2xx CPUs Up to 1440x 900 on LVDS interface with D2550 CPUsMass Storage 2 x standard S-ATA connectorI/O 2 x standard USB 2.0 ports 4 x internal USB 2.0 ports FAN connectorEthernet up to 2 x Gigabit Ethernet connectorAudio HD Audio Codec LineOut, Mic In internal connectorPower supply +12VDC Power JackRTC battery with lead cable and connectorDimensions 100 x 72 mm (3,93” x 2,83”)

55

SBC

SECOµSBC-i.MX6Single Board Computer with Freescale™ i.MX6Processor

Highlights

Technical features

• The power of the Freescale™ i.MX6 SoC in a credit card sized SBC• Scalable multi-core ARM® Cortex™-A9 architecture• It combines and emphasizes the high-graphics performance with the power-efficient processing capabilities• Flexible solution suitable for the digital signage applications. A multi-display platform for mobile fanless applications • Best benefit-cost ratio

i.MX6Dual/ 6Quad

Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors: Single core i.MX6S up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clockMemory up to 2GB DDR3 onboard (up to 1GB with i.MX6S)Graphics integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q) Supports up to 3 independent displays (up to 2 displays with i.MX6DL and i.MX6S)Video interfaces HDMI Connector 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interfaceResolutions LVDS, up to 1920x1200 HDMI, up to 1080pMass Storage eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express)I/O 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA)Ethernet Gigabit Ethernet connectorAudio AC’97 Audio Codec LineOut, Mic In internal connectorSerial ports 1 x RS-232 serial portPower supply +12VDC Power JackRTC battery with lead cable and connectorDimensions 80 x 67 mm (3,15” x 2,64”)

56

SBC

SECOµSBC-T30SingleBoardComputerwithNVIDIA® Tegra® T30 Processor

Highlights

Technical features

• The power of the NVIDIA® Tegra® 3 SoC in a credit card sized SBC• Impressive graphics capabilities• Quad-Core A9 ARM® Cortex™-A9 Low Power CPU for high graphics and mobile applications• Graphics engine powered by the 12 cores ULP GeForce GPU• Extreme multitasking, 1080p Video Playback dedicated Processors and able to play high res 3D video• A cost effective solution suitable for digital signage apps where a compact size and a low power consumption is necessary

Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™ -A9 MPCore™ CPU, 1.3 GHz per coreMemory up to 1GB DDR3L onboardGraphics embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video Processor Supports up to 2 independent displaysVideo interfaces HDMI Connector Dual Channel 18/24 bit LVDS interfaceResolutions LVDS, up to 1920x1080 HDMI, up to 1080pMass Storage eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express)I/O 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA)Ethernet Gigabit Ethernet connectorAudio HD Audio Codec LineOut, Mic In internal connectorSerial ports 1 x RS-232 serial portPower supply +12VDC Power JackRTC battery with lead cable and connectorDimensions 80 x 67 mm (3,15” x 2,64”)

57

SBC

SECOpITX-GX Single Board Computer with the brand new AMD Embedded G-SeriesSOCinPico-ITXformfactor

Highlights

Technical features

• The smallest standard SBC in the market in Pico-ITX form factor• Connectivity oriented• Dual LAN (WiFi+Bluetooth opt.) • Multidisplay support (LVDS - HDMI - eDP - VGA) • USB 3.0 support

SOC

AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25WAMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15WAMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15WAMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W

Memory Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V(DDR3-1333MHz @1.5V with GX-210HA)

Graphics

Embedded AMD HD RADEON GPUsHD8400E @600MHz (GX-420CA), HD8330E @500Mhz (GX-415GA)HD8280E @450MHz (GX-217GA), HD8210E @300Mhz (GX-210HA)Dual independent display support

Video interfacesHDMI Connector18 bit single channel LVDS or embedded Display Port internal connectorVGA interface (requires external optional Video Adapter)

Resolutions

Up to 1920x1200 on HDMIUp to 2048x1536 on CRTUp to 2560 x1600 with embedded Display Port (eDP)Up to 1440 x 900 on LVDS 18bit interface (up to 1920x1200through external adapter)

Mass Storage 2 x standard S-ATA connectors microSD Card Slot

I/O

2 x standard USB 3.0 Type A connectors4 x internal USB 2.0 portsHalf miniPCI-e slotFAN connectorFront Header Expansion connector

Ethernet Up to 2 x Gigabit Ethernet connector

Audio HD Audio CodecLineOut, Mic In internal connector

Power supply +12VDC Power Jack

RTC battery with lead cable and connector

Dimensions 100 x 72 mm (3,93” x 2,83”)

COMING SOON

58

SBC

Processor Intel® Celeron® T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel® Atom™ N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction SetChipset NVIDIA® MMP9 Embedded ION™

Memory up to 4GB DDR3 on a SO-DIMM socketGraphic Controller integrated controller NVIDIA® GeForce 9400M 16x graphics cores max analog resolution 2048 x 1536 max digital resolution 2560 x 1600Video DVI Interface LVDS Interface HDMI Interface CRT InterfaceMass Storage Interface 2x SATA Compact Flash SocketUSB 4 x USB 2.0 ports (standard connector) 2 x USB 2.0 ports (internal Pin Headers)ETHERNET Gigabit Ethernet ConnectorAudio dual jack for HD AudioExpansion Slots 1x miniPCI Express connector 1 x Serial Port (RS-232 / RS-485 configurable) SM Bus Pin Header GPIO Pin HeaderFAN 3 pin Headers for CPU and Chipset temperature, with Tachometric signalPower supply +12VDC connector, AT/ATX modeDimensions 120x120 mm (4.72” x 4.72”)

SECOnITX-ION SECOpITX-x2000

CPU Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP Intel® Atom™ N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel® Atom™ N2600 @1.6GHz, 1MB Cache, 3.5W TDPChipset Intel® NM10 Express ChipsetMemory up to 4GB DDR3 1066MHz SO-DIMM (up to 2GB with N2600)Graphics Integrated Intel® HD Graphics controller Dual independent display supportVideo interfaces HDMI Connector 18/24 bit single channel LVDS internal connector VGA interface (optional external adapter is required)Resolutions Up to 1920x1200 on HDMI and CRT Up to 1366 x 768 on LVDS interface with N2xx CPUs Up to 1440x 900 on LVDS interface with D2550 CPUsMass Storage 2 x standard S-ATA connectorI/O 2 x standard USB 2.0 ports 4 x internal USB 2.0 ports FAN connectorEthernet up to 2 x Gigabit Ethernet connectorAudio HD Audio Codec LineOut, Mic In internal connectorPower supply +12VDC Power JackRTC battery with lead cable and connectorDimensions 100 x 72 mm (3,93” x 2,83”)

Technical features

59

SBC

SECOµSBC-i.MX6 SECOµSBC-T30 SECOpITX-GX

Processor NVIDIA® Tegra® T30 w/ Quad ARM® Cortex™ -A9 MPCore™ CPU, 1.3 GHz per coreMemory up to 1GB DDR3L onboardGraphics embedded NVIDIA® ULP GeForce® GPU Integrated High Definition Audio-Video Processor Supports up to 2 independent displaysVideo interfaces HDMI Connector Dual Channel 18/24 bit LVDS interfaceResolutions LVDS, up to 1920x1080 HDMI, up to 1080pMass Storage eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express)I/O 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA)Ethernet Gigabit Ethernet connectorAudio HD Audio Codec LineOut, Mic In internal connectorSerial ports 1 x RS-232 serial portPower supply +12VDC Power JackRTC battery with lead cable and connectorDimensions 80 x 67 mm (3,15” x 2,64”)

i.MX6Dual/ 6Quad

Processor Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors: Single core i.MX6S up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clockMemory up to 2GB DDR3 onboard (up to 1GB with i.MX6S)Graphics integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™ (OpenVG™ accelerator only available with i.MX6D and with i.MX6Q) Supports up to 3 independent displays (up to 2 displays with i.MX6DL and i.MX6S)Video interfaces HDMI Connector 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interfaceResolutions LVDS, up to 1920x1200 HDMI, up to 1080pMass Storage eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express)I/O 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA)Ethernet Gigabit Ethernet connectorAudio AC’97 Audio Codec LineOut, Mic In internal connectorSerial ports 1 x RS-232 serial portPower supply +12VDC Power JackRTC battery with lead cable and connectorDimensions 80 x 67 mm (3,15” x 2,64”)

SOC

AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25WAMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15WAMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15WAMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W

Memory Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V(DDR3-1333MHz @1.5V with GX-210HA)

Graphics

Embedded AMD HD RADEON GPUsHD8400E @600MHz (GX-420CA), HD8330E @500Mhz (GX-415GA)HD8280E @450MHz (GX-217GA), HD8210E @300Mhz (GX-210HA)Dual independent display support

Video interfacesHDMI Connector18 bit single channel LVDS or embedded Display Port internal connectorVGA interface (requires external optional Video Adapter)

Resolutions

Up to 1920x1200 on HDMIUp to 2048x1536 on CRTUp to 2560 x1600 with embedded Display Port (eDP)Up to 1440 x 900 on LVDS 18bit interface (up to 1920x1200through external adapter)

Mass Storage 2 x standard S-ATA connectors microSD Card Slot

I/O

2 x standard USB 3.0 Type A connectors4 x internal USB 2.0 portsHalf miniPCI-e slotFAN connectorFront Header Expansion connector

Ethernet Up to 2 x Gigabit Ethernet connector

Audio HD Audio CodecLineOut, Mic In internal connector

Power supply +12VDC Power Jack

RTC battery with lead cable and connector

Dimensions 100 x 72 mm (3,93” x 2,83”)

COMING SOON

Technical features

ETX ® 3.0

60

Benefits:FAST DevelopmentFlexibilityInnovative and UpgradableEasy Cabling

Fields of Application:Industrial: automation and monitoring; data acquisitionMedical: data acquisition; test and monitoring appliancesTelecommunicationAutomotive – Transport: detection systemsRetail Industry: point of sales and kiosksMultimedia - Gaming Machines

Winning FormulaTheETX®(EmbeddedTechnologyeXtended)architectureisbasedupon2elements:theETX®CPUModuleandtheETX®

Baseboard.TheETX®CPUmoduleshaveacompactsize(95x114mm)and4standardhighdensityconnectorsthroughwhichISAbus,PCIbusandthemostcommonI/OsignalsinaPCareconveyedtotheETX® Baseboard. The connectors are placed on the baseboard which is generally designed on customer’s requirements.AbouttheETX® baseboards, SECO provides solutions off-the-shelf but also offers its know-how for the design of custom baseboards.This solution enables the customer to maintain the same mechanics or the chassis where the embedded CPU system is positioned and diversify or update the performances of theproductsimplychangingtheETX® CPU module. Another possibility is to offer a wider range of final products offering different performances simply using different CPU modules,avoiding additional design costs.The thermal dissipation of the system strictly depends on the mechanics of the final system and the mounted CPU: from the standard heat spreader kit through heat sinks, fans or heat pipes.FlexibleandtailoredsolutionsarethebenefitsofanETX® system.

ETX ® 3.0

61

SECOME-945/N270ETX® Module with Intel® Atom™ N270 and945GME–ICH7-MDHExpressChipset

Highlights

Technical features

• ETX® 3.0 compliant• Cost Sensitive Module• Low Power Consumption• Available in Extended Temperature Version

CPU Intel® Atom™ N270 1,6GHz with TDP 2.5WChipset Intel® 82945GME + Intel® 82801GHM (ICH7M-DH)Memory up to 2GB of 533/667MHz DDR2 of SO-DIMMsFSB 533MHzGraphics Intel® Graphics Media Accelerator 950Resolutions Up to 2048 x 1536 QXGA 75Hz Dual display supportedLVDS 18 or 24 bit, single or dual channel interfaceUSB 4x USB 2.0 portsExpansion bus ISA Bus, PCI busETHERNET 10/100Mbps Ethernet port, Realtek RTL8103EPATA One Ultra ATA/100/66/33 Port SATA Up to 2x S-ATA connectors on ETX® moduleSerial Ports 2x (TTL level signals)Parallel Port 1x (optionally, shared with Floppy Disk Drive Port)Audio AC’97 Internal Audio Codec VIA VT1613Watch Dog TimerReal time ClockTemperature, Fan Speed and Voltage MonitoringPower supply +5VDC (+5VSB needed for ATX mode)Temperature Operating: -20°C ÷ +70° CDimensions 114x95 mm (4.5” x 3.7”)

62

XTX™

Benefits:FAST DevelopmentHigh-speed buses supportFlexibilityInnovative and Upgradable

Fields of Application:Industrial: automation and monitoring; data acquisitionMedical: data acquisition; test and monitoring appliancesTelecommunicationAutomotive – Transport: detection systemsRetail Industry: point of sales and kiosksMultimediaGaming Machines

EXpress Technology for ETX®

TheXTX™(EXpressTechnologyforETX® ) architecture is based, liketheoneofETX®,on2elements:theXTX™ CPU Module and theXTXBaseboard.XTX™wasdevelopedasanevolutionoftheETX® standard, with thesameformfactorof95x114mmandthesame4standardhigh-density connectors through which the signals are conveyed to the Baseboard, but adding new features.FollowingthetrendofthenewI/Otechnologies,XTX® removes the ISA signals, a bus less and less used in modern embedded applications, and adds the new high-speed serial buses like PCI Express™ and Serial ATA®.ThephilosophyoftheXTX™ architecture remains the same of theETX®: flexibility in offering different performances in the final applicationand/oreasyupgradeofperformancessimplyusingdifferent CPU modules, avoiding additional design costs.The thermal dissipation of the system strictly depends on the mechanics of the final system and the CPU mounted and implies thesamesolutionsoftheETX® systems.SECO provides its know-how in developing and manufacturing BaseboardsalsofortheXTX™standard,inordertosupplytothe customer a complete embedded PC system, for fastest and easiest integration on the customer’s site.

63

XTX™ XTX™

SECOMX-945/N270XTX™ Module with Intel® Atom™ N270 and945GME–ICH7-MDHExpressChipset

Highlights

Technical features

• Cost effective• Low Power Consumption• Available in Extended Temperature

CPU Intel® Atom™ N270 1,6GHz with TDP 2.5WChipset Intel® 82945GME + Intel® 82801GHM (ICH7M-DH)Memory up to 2GB of 533/667MHz DDR2 of SO-DIMMsFSB 533MHzGraphics Intel® Graphics Media Accelerator 950Resolutions Up to 2048 x 1536 QXGA 75Hz Dual display supportedLVDS 18 or 24 bit, single or dual channel interfaceUSB 6x USB 2.0 portsExpansion bus PCI bus, 4x PCI Express x1 portsETHERNET 10/100Mbps Ethernet port, Realtek RTL8103EPATA One Ultra ATA/100/66/33 Port SATA Up to 2x S-ATA portsSerial Ports 2x (TTL level signals)Parallel Port 1x (optionally, shared with Floppy Disk Drive Port)Audio AC’97 Internal Audio Codec VIA VT1613Watch Dog TimerReal time ClockTemperature, Fan Speed and Voltage MonitoringPower supply +5VDC (+5VSB needed for ATX mode)Temperature Operating: -20°C ÷ +70° CDimensions 114x95 mm (4.5” x 3.7”)

64

Qseven®

SECOCX-mITXCarrierBoardforXTX™modulesonminiITXstandard • General Purpose for XTX CPU modules

• Mini ITX form factor• Extensive Connectivity

Suppored Module All XTX™ Embedded Computer ModulesExpansion Slots 1x PCI 2x PCI Express x 1 1x miniPCI Express 1x Gigabit Ethernet on front panel connector 1x Fast Ethernet on front panel connectorMass Storage Interface 2x SATA 1x PATA 1x Compact Flash Socket 1x SD Card SlotI/O 4x USB on the Front Panel 2x Serial Ports (1x Front Panel Connector, 1x 10 Pin Header Connector) 1x LPT PS/2 Keyboard and Mouse LPC Bus Interface 1x 40 Pin Connector for Additional FeaturesSound Line In Line Out Mic In on the Front PanelVideo Analog VGA on the Front Panel LVDS Interface, 34 Pin 2 mm Header Backlight Connector, 10 Pin 2.54 mm Header TV Out (CN13)CMOS Battery On Board Lithium Battery for CMOS backup and real time clockPower ATX Standard Power Conn. (AT Mode Config.)FAN 3 Pin Header 12 V and Tacho SignalTemperature Operating: 0 .. +60°C Storage: -20 .. +80°CDimensions 170 x 170 mm (6,7”x6,7”)

Highlights

Technical features

XTX™ CARRIERBOARD

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SECO s.r.l.Via Calamandrei, 9152100 Arezzo - ITALYPh +39 0575 26979Fax +39 0575 350210info@seco.comwww.seco.com

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