Samsung_Analyst_Day_LSI_6.pdf

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The sixth of seven slide decks from Samsung's Analyst Day 2013, this deck discusses Samsung's LSI unit, which makes chips for Samsung's Galaxy line and the iPhone, among other devices.

Transcript of Samsung_Analyst_Day_LSI_6.pdf

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    Samsung System LSI Business

    NS (Stephen) Woo, Ph.D. President & GM of System LSI

    Samsung Electronics

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    Disclaimer

    The materials in this report include forward -looking statements which can generally be identified by phrases such as Samsung

    Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or

    phrases of similar implications . Similarly, such statements that describe the company's business strategy, outlook, objectives,

    plans, intentions or goals are also forward -looking statements. All such statements are subject to certain risks and uncertainties

    that could cause actual results to differ materially from those in the presentation files above.

    For us, particular uncertainties which could adversely or positively affect our future results include:

    prices

    IM (IT & Mobile communications), DS (Device Solutions)

    results

    These uncertainties may cause our actual results to be materially different from those expressed in this report.

  • System Semiconductor Industry

    Samsung System LSI : Now

    Looking Forward

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    Market of Mobile Device

    2012 2013 2014(E) 2015(E)

    0.3

    0.5

    0.5

    0.5

    0.6

    0.6

    0.7

    0.7

    * Source : Gartner, Strategy Analytics, 2013 3Q

    Premium Mid + Low

    (billion units)

    0.8

    1.0

    1.2 1.3

    Smartphone

    9%

    22%

    * Source : Gartner, 2013 3Q

    (billion units)

    2012 2013 2014(E) 2015(E)

    0.1

    0.2

    0.3

    0.4

    0.07

    0.05

    0.06

    0.12

    0.07

    0.19

    0.09

    0.26

    Premium Mid + Low

    Tablet

    25%

    58%

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    Computing Power

    Com

    putin

    g/B

    andw

    idth

    New applications require higher computing/bandwidth

    Resolution

    Single Camcording

    1080p Video

    Dual Camcording

    Web browsing

    Location Based Service

    Voice Command

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    Display Trend

    Higher resolution

    HD-class Display

    FHD-class Display

    WQHD (2,560x1,440)

    HD (1,280x720)

    UHD (3,840x2,160)

    Re

    solu

    tio

    n

    2011 2013 2015(E)

    FHD (1,920x1,080)

    Display

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    Camera Sensor Trend

    Image quality enhancement is also improving

    Face Detection

    2009 2011 2013 2007 2015(E)

    3Mp

    8Mp

    13Mp

    Re

    solu

    tio

    n

    5Mp

    16Mp

    20Mp

    Face Detection

    Wide Dynamic Range

    Image Stabilization

    Camera Sensor

    Wide Dynamic Range

    Image stabilization

  • System Semiconductor Industry

    Samsung System LSI : Now

    Looking Forward

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    Three business areas

    AP Connectivity

    SOC

    Image Sensor Display Driver IC Smart Card IC Power Management IC

    LSI

    Foundry

    Foundry

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    vt

    Product Portfolio

    WiFi/BT GPS

    Smartphone

    IoT

    Powerful CPU/GPU

    Low Power Camera Sensor

    Pixel Leadership

    Slim Solution

    Low Power Consumption

    High Density e-SE Module NFC

    SIM

    Full line up for next FHD

    Lower Power solution

    Fast Speed (New Architecture) T-con

    eDRAM

    Backlight control

    Display Driver IC

    T-Con

    PMIC Power

    Sequence Control

    & I2C Interface

    PMIC line: AP & OLED

    High Efficiency

    High Accuracy

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    1. AP (Application Processor)

    Focusing on high performance with low power consumption

    Game changing technology :

    big.LITTLE octa core

    big LITTLE

    CPU Leadership

    Richer 3D graphics with

    Energy efficiency

    Powerful GPU

    Advanced mobile process &

    design methodologies

    Low Power

    Low High

    Low High

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    Computing Power

    *DMIPS : Dhrystone Million Instructions Per Second

    2009 2010 2011 2008

    10,000

    20,000

    30,000

    (DMIPS)

    2012 2013

    * Source : Samsung Electronics Co., Ltd., ARM

    Cortex-A8 1.0GHz

    ARM11 800MHz

    Cortex-A9 Dual 1.2GHz

    Cortex-A9 Quad 1.4GHz

    Cortex-A15 2.xGHz

    Cortex-A15 Octa 1.6GHz

    Has been leading AP industry since 2009

    Innovation in both Architecture & Silicon Technology

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    Heterogeneous architecture for energy efficiency

    big.LITTLE Architecture

    Best of both worlds: high performance and low energy

    1 2

    3 4

    1 2

    3 4

    big C-A15

    LITTLE C-A7

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    big.LITTLE Architecture

    20% gain at performance and energy, respectively

    + 20%

    Higher is Better

    big.LITTLE Conventional

    *Source : Samsung Electronics Co., LTD, 2013 2Q

    *Conventional : big CPU only

    Performance

    -15 ~ 20%

    Lower is Better

    big.LITTLE Conventional

    *Source : Samsung Electronics Co., LTD, 2013 2Q

    Energy

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    Advanced Silicon Process

    Process Node

    Vdd 90/65nm

    Strained Si

    45nm

    ULK

    32nm

    1st Gen HK/MG

    20nmm

    1st Gate Last HK/MG

    1.2V

    1.1V

    1.0V

    0.9V 0.8V

    0.7V

    10nm

    2nd Gen FinFET

    14nm

    1st Gen FinFET

    *Vdd : Supplying voltage of drain

    28nm

    2nd Gen HK/MG

    1.0V

    2014(E) 2013 2012 2010 2006, 2009

    Leadership in low-power, advanced silicon process

    * Source : Samsung Electronics Co., Ltd.