Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service...

43
SG H - P408 SERVICE Manual G SM TELEPH ONE CONTENTS 1. Sp ecification 2. C ircuit D escrip tion 3. Flow Ch art of Troubleshooting 4. Exp lod ed Views and Parts List 5. Electrical Parts List 6. BlockDiag ram s 7. PCB Diag ram s G SM TELEPH ONE 2 ABC DEF MNO GHI PQRS WXYZ JKL TUV 3 4 5 6 7 8 0 9

Transcript of Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service...

Page 1: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

SGH-P408

SERVICE Manual

GSM TELEPHONE CONTENTS

1. Specification

2. Circuit Description

3. Flow Chart of Troubleshooting

4. Exploded Views and Parts List

5. Electrical Parts List

6. Block Diagrams

7. PCB Diagrams

GSM TELEPHONE

2 ABCDEF

MNOGHI

PQRS WXYZ

JKL

TUV

3

4 5 6

7 8

0

9

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ELECTRONICS

Samsung Electronics Co.,Ltd. JUNE. 2003Printed in Korea.

Code No.: GH68-03690A

BASIC.

This Service Manual is a property of Samsung Electronics Co.,Ltd.Any unauthorized use of Manual can be punished under applicableInternational and/or domestic law.

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1. SGH-P408 Specification

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GSM900Phase 1

EGSM 900Phase 2

DCS1800Phase 1

PCS1900

Freq. Band[MHz]Upl ink/Downlink

890~915935~960

880~915925~960

1710~17851805~1880

1850~19101930~1990

ARFCN range 1~1240~124 &975~1023

512~885 512~810

Tx/Rx spac ing 45MHz 45MHz 95MHz 80MHz

Mod. Bi t rate/Bi t Per iod

270.833kbps3.692us

270.833kbps3.692us

270.833kbps3.692us

270.833kbps3.692us

Time SlotPer iod/Frame Period

576.9us4.615ms

576.9us4.615ms

576.9us4.615ms

576.9us4.615ms

Modula t ion 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl

Sensi t iv i ty -102dBm -102dBm -100dBm -100dBm

TDMA Mux 8 8 8 8

Cel l Radius 35Km 35Km 2Km -

1. GSM General Specification

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TX Power

control levelGSM900

5 33±2 dBm

6 31±2 dBm

7 29±2 dBm

8 27±2 dBm

9 25±2 dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3dBm

18 7±3 dBm

19 5±3 dBm

TX Power

control levelDCS1800

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control levelPCS1900

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

2. GSM TX power class

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2. SGH-P408 Circuit Description

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1. SGH-P408 RF Circuit Description

1) RX PART

1. ASM(U1005)ð 510Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic

controlling.

2. ASM Control Logic (U701, U702, U703)ð Truth Table

VC1 VC2 VC3

GSM Tx Mode H L L

DCS /PCS Tx Mode L H L

PCS Rx Mode L L H

GSM / DCS Rx Mode L L L

3. FILTERTo convert Electromagnetic Field Wave to Acoustic Wave and then pass thespecific frequency band.

- GSM FILTER (C1003,C1004,L1001)ð For filtering the frequency band between 925 ~ 960 MHz

- DCS FILTER (C1005,C1006,L1002)ð For filtering the frequency band 1805 and 1880 MHz.

- PCS SAW FILTER (F1003,C1009,C1010,L1006)ð For filtering the frequency band between 1930 and 1990 MHz

4. TC-VCXO (OSC801)

To generate the 13MHz reference clock to drive the logic and RF.After additional process, the reference clock is applied to the U900 Rx IQdemodulator and Tx IQ modulator.The oscillator for RX IQ demodulator and Tx modulator are controlled byserial data to select channel and use fast lock mode for GPRS high classoperation.

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5. Si 4200 (U901)

This chip integrates three differential-input LNAs.The GSM input supports the E-GSM, DCS input supports the DCS1800, PCSinput supports the PCS1900. The LNA inputs are matched to the 200 ohmdifferential output SAW filters through eternal LC matching network.Image-reject mixer downconverts the RF signal to a 100 KHz intermediatefrequency(IF) with the RFLO from SI4133T frequency synthesizer.The RFLO frequency is between 1737.8 ~ 1989.9 MHz.The Mixer output is amplified with an analog programmable gainamplifier(PGA), which is controlled by AGAIN.

The quadrature IF signal is digitized with high resolution A/D converts (ADC).

6. Si 4201 (U900)The SI4201 down-converts the ADC output to baseband with a digital100 KHz quadrature LO signal.Digital decimation and IIR filters perform channel selection to remove blockingand reference interface signals. After channel selection, the digital output isscaled with a digital PGA, which is controlled with the DGAIN. DACs drive adifferential analog signal onto the RXIP, RXIN, RXQP, RXQN pins to interfaceto standard analog-input baseband IC.

2) TX PART

Baseband IQ signal fed into offset PLL, this function is included insideof U902 chip.SI4200 chip generates modulator signal which power level is about 1.5dBmand fed into Power Amplifier(U1008).The PA output power and power ramping are well controlled by AutoPower Control circuit. We use offset PLL below,

Modulation

Spectrum

200kHz offset

30 kHz bandwidth

GSM -35dBc

DCS -35dBc

PCS -35dBc

400kHz offset

30 kHz bandwidth

GSM -66dBc

DCS -65dBc

PCS -66dBc

600kHz ~ 1.8MHz offset

30 kHz bandwidth

GSM -75dBc

DCS -68dBc

PCS -75dBc

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2. Baseband Circuit description of SGH-P408

1) PSC2106

1. Power Management

Seven low-dropout regulators designed specifically for GSM applicationspower the terminal and help ensure optimal system performance and longbattery life.A programmable boost converter provides support for 1.8V, 3.0V, and 5.0VSIMs, while a self-resetting, electronically fused switch supplies power toexternal accessories. Ancillary support functions, such as an LED driver andtwo call-alert drivers, aid in reducing both board area and systemcomplexity.A three-wire serial interface unit(SIU) provides access to control and

configuration registers. This interface gives a microprocessor full control ofthe PSC2106 and enables system designers to maximize both standby andtalk times.Supervisory functions. including a reset generator, an input voltage monitor,and a thermal monitor, support reliable system design. These functionswork together to ensure proper system behavior during start-up or in theevent of a fault condition(low microprocessor voltage, insufficient batteryenergy, or excessive die temperature).

2. Battery Charge Management

A battery charge management block provides fast, efficient charging of asingle-cell Li-ion battery. Used in conjunction with a current-limited voltagesource and an external PMOS pass transistor, this block safely conditionsnear-dead cells and provides the option of having fast-charge and top-offcontrolled internally or by the system's microprocessor.

3. Backlight LED Driver

The backlight LED driver is a low-side, programmable current sourcedesigned to control the brightness of the keyboard and LCD illumination.The driver is enabled by EN_LED, and its current setting is determined byLED[0:2]. Provided EN_LED is '1', the driver can be programmed to sinkfrom 12.5mA to 100mA in 12.5mA steps. LED_DRV is capable of sinking100mA at a worst-case maximum output voltage of 0.6V. For efficient use,the LEDs is connected between the battery and the LED_DRV output.

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4. Vibrator Motor Dirver

The vibrator motor driver is a low-side, programmable voltage sourcedesigned to drive a small dc motor that silently alerts the user of anincoming call. The driver is enabled by EN_VIB, and its voltage setting isdetermined by VIB[0:2]. Provided EN_VIB is a logic 1, the driver can beprogrammed to maintain a motor voltage of 1.1V to 2.5V in 20mV steps andwhile sinking up to 100mA. For efficient use, the vibrator motor should beconnected between the main battery and the VIB_DRV output.

2) Connector

1. LCD Connector

LCD is consisted of main LCD(color 65K STN LCD) and small LCD(4-grayLCD). Chip select signals of EMI part in the trident, CLCD_EN_FO andGLCD_EN_FO,can enable Each LCD. LED_EN_FO signal enables white LED of main LCDand EL_EN_FO signal enables EL of small LCD.These two signals are from IO part of the DSP in the trident. RST signalfrom 2006 initiates the initial process of the LCD.16-bit data lines(D(0)_FO~D(15)_FO) transfers data and commands to LCDthrough emi_filter. Data and commands use A(2)_FO signal. If this signal ishigh, Inputs to LCD are commands. If it is low, Inputs to LCD are data. Thesignal which informs the input or output state to LCD, is required. But thissystem is not necessary this signal. So CP_WEN_FO signal is used to writedata or commands to LCD.Power signals for LCD are V_bat and V_ccd.SPK1P and SPK1N from CSP1093 are used for audio speaker. AndVIB_EN_FO from enables the motor.

2. JTAG Connector

Trident has two JTAG ports which are for ARM core and DSPcore(DSP16000). So this system has two port connector for these ports.Pins' initials for ARM core are 'CP_' and pins' initials for DSP core are'DSP_'.CP_TDI and DSP_TDI signal are used for input of data. CP_TDO andDSP_TDO signals are used for the output of the data. CP_TCK andDSP_TCK signals are used for clock because JTAG communication is asynchronous. CP_TMS and DSP_TMS signals are test mode signals. Thedifference between these is the RESET_INT signal which is for ARM coreRESET.

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3. IRDA

This system uses IRDA module, HSDL_3201, HP's. This has signals,IRDA_EN(enable signal), IRDA_RX(input data) and IRDA_TX(output data).These signals are connected to PPI of trident. It uses two power signals.V_ccd is used for circuit and V_bat is used for LED.

4. Keypad connector

This is consisted of key interface pins among PPI in the trident,KEY_ROW[0~4] and KEY_COL[0~4]. These signals compose the matrix.Result of matrix informs the key status to key interface in the trident. Somepins are connected to varistor for ESD protection. And power on/off key isseperated from the matrix.So power on/off signal is connected with PSC2106 to enable PSC2106.SVC_GREEN, SVC_RED and SVC_BLUE are from OCTL of CSP1093.These signals decide the color of LED, service indicator.Eighteen key LED use the V_bat supply voltage. These are connected toBACKLIGHT signal in the PSC2106.This signal enables LEDs with current control. FLIP_SNS informs the statusof folder (open or closed) to the trident. This uses the hall effect IC,A3210ELH.A magnet under main LCD enables A3210ELH which is on the key FPCB.

5. EMI Filtering

This system uses the shunt capacitors to reduce noise from LCD part. Somecontrol signals are connected to LCD without EMI filtering.

3) IF connetor

It is 24-pin connector, and uses 18-pin at present. They are designed to useSDS, DEBUG, DLC-DETECT, JIG_ON, VEXT, VTEST, VF, CF, VBAT and GND.They connected to power supply IC, microprocessor and signal processor IC.

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4) Audio

AOUTAP from CSP1093 is connected to the main speaker. AOUTAN isconnected to the speaker via audio-amp. AOUTBN and AOUTBP are connectedto the ear-mic speaker via ear-jack. MICIN and MICOUT are connected to themain MIC. And AUXIN and AUXOUT are connected to the Ear-mic.YMU762MA3 is a LSI for portable telephone that is capable of playing highquality music by utilizing FM synthesizer and ADPCM decorder that areincluded in this device.As a synthesis, YMU762MA3 is equipped 16 voices with differenttones. Sincethe device is capable of simultaneously generating up to synchronous with theplay of the FM synthesizer, various sampled voices can be used as soundeffects.Since the play data of YMU762MA3 are interpreted at anytime through FIFO,the length of the data(playing period) is not limited, so the device canflexiblysupport application such as incoming call melody music distributionservice. The hardware sequencer built in this device allows playing of thecomplex music without giving excessive load to the CPU of the portabletelephones. Moreover, the registers of the FM synthesizer can be operateddirectly for real time sound generation, allowing, for example, utilization ofvarious sound effects when using the game software installed in the portabletelephone.YMU759 includes a speaker amplifier with high ripple removal rate whosemaximum output is 550mW (SPVDD=3.6V). The device is also equipped withconventional function including a vibartor and a circuit for controlling LEDssynchornous with music.For the headphone, it is provided with a stereophonic output terminal.For the purpose of enabling YMU762MA3 to demonstarte its full capablities,Yamaha purpose to use "SMAF:Synthetic music Mobile Application Format" as adata distribution format that is compatible wiht multimedia. Since the SMAFtakes a structure that sets importance on the synchronization between soundand images, various contents can be written into it including incoming callmelody with words that can be used for traning karaoke, and commercialchannel that combines texts, images and sounds, and others. The hardwaresequencer of YMU762MA3 directly interprets and plays blocks relevant tosysthesis (playing music and reproducing ADPCM with FM synthesizer) that areincluded in data distributed in SMAF.

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5) Memory

This system uses SHARP's memory, LRS1826A.It is consisted of 128M bits flash memory and32M bits psuedo SRAM. It has16 bit data line, D[0~15] which is connected to trident, LCD or CSP1093. Ithas 22 bit address lines, A[1~22]. They are connected too. CP_CSROMEN andCO_CSROM2EN signals, chip select signals in the trident enable two memories.They use 3 volt supply voltage, V_ccd and 1.8 volt supply voltage, Vcc_1.8a inthe PSC2006. During wrting process, CP_WEN is low and it enables writingprocess to flash memory and pseudo SRAM. During reading process, CP_OENis low and it output information which is located at the address from thetrident in the flash memory or SRAM to data lines. Each chip select signals inthe trident select memory among 2 flash memory and 2 SRAM. Reading orwriting procedure is processed after CP_WEN or CP_OEN is enabled. Memoriesuse FLASH_RESET, which is buffered signal of RESET from PSC2106, for ESDprotection. A[0] signal enables lower byte of pseudo SRAM and UPPER_BYTEsignal enables higher byte of pseudo SRAM.

6) Trident

Trident is consisted of ARM core and DSP core. It has 20K*16bits RAM144K*16bits ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in theARM core. DSP is consisted of timer, one bit input/output unit(BIO), JTAG, EMIand HDS(Hardware Development System). ARM core is consisted of EMI,PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller,TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous SerialInterface), ACC(Asynchronous communications controllers), timer, ADC,RTC(Real-Time Clock) and keyboard interface.DSP_AB[0~8], address lines of DSP core and DSP_DB[0~15], data lines ofDSP core are connected to CSP1093. A[0~20], address lines of ARM core andD[0~15], data lines of ARM core are connected to memory, LCD and YMU759.ICP(Interprocessor Communication Port) controls the communication betweenARM core and DSP core.CSROMEN, CSRAMEN and CS1N to CS4N in the ARM core are connected toeach memory. WEN and OEN control the process of memory. ExternalIRQ(Interrupt ReQuest) signals from each units, such as, YMU, Ear-jack,Ear-mic and CSP1093, need the compatible process.Some PPI pins has many special functions. CP_KB[0~9] receive the statusfrom key FPCB and are used for the communicatios usingIRDA(IRDA_RX/TX/EN) and data linkcable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR). And UP_CS/SCLK/SDI, controlsignals for PSC2006 are outputted through PPI pins. It has signal port for

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charging(CHG_DET, CHG_STAT0), SIM_RESET and FLIP_SNS with which weknows open.closed status of folder. It has JTAG control pins(TDI/TDO/TCK) forARM core and DSP core. It recieves 13MHz clock in CKI pin from externalTCXO and receives 32.768KHz clock from X1RTC. ADC(Analog to DigitalConvertor) part receives the status of temperature, battery type and batteryvoltage. And control signals(DSP_INT, DSP_IO and DSP_RWN) for DSP core areused. It enables main LCD and small LCD with DSP IP pins.

7) CSP1093

CSP1093 integrates the timing and control functions for GSM 2+ mobileapplication with the ADC and DAC functions. The CSP1093 interfaces to thetrident, via a 16-bit parallel interface. It serves as the interface that connectsa DSP to the RF circuitry in a GSM 2+ mobile telephone. DSP can load 148bits of burst data into CSP1093’s internal register, and program CSP1093’sevent timing and control register with the exact time to send the burst. Whenthe timing portion of the event timing and control register matches the internalquarter-bit counter and internal frame counter, the 148 bits in the internalregister are GMSK modulated according to GSM 2+ standards. The resultingphase information is translated into I and Q differential output voltages that canbe connected directly to an RF modulator at the TXOP and TXON pins. TheDSP is notified when the transmission is completed. For receiving basebanddata, a DSP can program CSP1093’s event timing and control register with theexact time to start receiving I and Q samples through TXIP and TXIN pins.When that time is reached, the control portion of the event timing and controlregister will start the baseband receive section converting I and Q samplepairs. The samples are stored in a double-buffered register until the registercontains 32 sample pairs. CSP1093 then notifies the DSP which has ample timeto read the information out before the next 32 sample pairs are stored. Thevoice band ADC converter issues an interrupt to the DSP whenever it finishesconverting a 16-bit PCM word. The DSP then reads the new input sample andsimultaneously loads the voice band output DAC converter with a new PCMoutput word. The voice band output can be connected directly to a speaker viaAOUTAN and AOUTAP pins and be connected to a Ear-mic speaker viaAOUTBN and AOUTBP pins.

8) X-TAL(13MHz)

This system uses the 13MHz TCXO, TCO-9141B, Toyocom. AFC control signalform CSP1093 controls frequency from 13MHz x-tal. It generates the clockfrequency. This clock is fed to CSP1093,Trident,YMU759 and Silab solution.

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3. SGH-P408 Flow Chart of Troubleshooting

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1. Power On

Current consumption>=100mA

' Power On ' does not work

Voltage >= 3.3V

Download again

Charge the Battery

pin#11 >= 2.8V Check U100 and C117

pin#39 and pin#42 =2.8V

Check U100 and C116

Freq = 13MHz ,Vrms ≥ 300mV

andVpp ㆃ 900mVpp

Check the clock generationcircuit

(related to OSC801)

END

No

Yes

Yes

Yes

Yes

Yes

No

No

No

No

pin#9 = 1.8VNoYes

Check the V bat. Voltage

Check the pin of U100

Check the clock signal at pin#3 ofOSC801

Check the initial operation

Check the currentconsumption

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SGH-P408 Flow Chart of Troubleshooting

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39

37VLDO_4

33VLDO_5

VLDO_642

VLDO_7 40

30

VREF

12VRTC

48

VSI M

4

VIB_

DR

V

VL4S_A3635

VL4S_B

VL5S_A3231

VL5S_B

9VLDO_1

11VLDO_2

VLDO_3

UP_IO

54 UP_RST

3 VACC2 VBAT

VDD1210

38VDD34

34VDD5

41VDD67

VEXT1

17SCLK

15SDI16SDO

50

SIM

_CLK

SIM

_IO

51

SIM

_RST

49

UP_CLK5352

LED

2_D

RV

20 PSW1_BUFPWR_KEEP21

46PWR_SW1NPWR_SW2

47

19RESETN

RIN

G_D

R V

5

55 RING_PWM

RTC_ALMN13

GNDGND

5859

GNDGNDG

60

6

GN

DD

1

GN

DQ

28

INTRQ14

LED

1_D

RV

78

CSN18

EN_32223

EN_4[0]EN_4[1]

2425

EN_5EN_5A

2627

EN_5B

57

U100

44 ADC_AUX1ADC_AUX245

ADC_TRIG56

43 BTEMPC

REF

29

R10510

C1051UF

VCCA

13

2

VCCD 56

4

Q102

Q101

3

12

VRF VPAC

1UFC111

470NFC112

3

2

VOSC

VBAT

4

Q100

1

U102

2

5

6

3

1

47K,1%R107

10K,1%R108

NCR112

R1093K

78GG

910G

330KR102

CN100

1122

33 4 455

6 6

G

VRTCVCCD

100PFC113

10K,1%R111

VCCB

100NFC106

VCC_1.8A

C1142.2UF

U101

DRIVE6

GND2

1 ISENSE

PROG 43 VCC

5VSENSE

VBAT

R101NC

VRTC

33PFC101

33PFC103

33PFC104

2.2UFC102

10NFC115

R110NC

C100100NF

1UFC110

C11810UF6.3V

2NEG

1POS

VBAT

M1

C1091UF1UF

C108

C1171UF

C11910UF10V

1UFC116

1.2K,1%

VBAT

TA_VEXT

CHG_DET

BACKLIGHT_2

R103

UP_SCLKUP_CS

RSTKEY_ROW(0)

KEY_COL(2)EN_VRF

EN_VPAC

JIG_ON

SIMCLKSIMRST

CHG_ON

ICHRGTA_VEXT

XOENA

BACKLIGHT_1

PWR_KEEP

PWR_ON

RTCALARM

UP_SD I

SIMDATA

VREF

TA_VEXT

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SGH-P408 Flow Chart of Troubleshooting

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3-3

2. Initial

The pin #9 of U100 =1.8V and

the pin #11 of U100 ㆃ2.825V ?

Initialization Failure

Check the U100(If it has some problem, it has to be

replaced.)

END

No

Yes

Is the pin #19 ofU100

"Low -> High"?

Yes

Check the U601There is 32.768kHz

wave forms at the C614and C616

Check the LCD Part

Yes

No

No

Yes

Yes

Yes

The Voltage is "High"at the C110, C111,

C112

Check the Audio Part

No

Check the U100(If it has some problem, it has to be

replaced.)

Check the U700The pin #25 of U100 is"High"

Check the U100

LCD display is O.KNo

No

Yes

Yes

Sound is O.KNo

Page 16: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-4

This Document can not be used without Samsung's authorization

IRDA

LCD CONNECTOR

JTAG CON

C211

C22533PF

C217

33PF

33PF

VCCD

C2321UF

100NFC200

TP200

0R205

TP202

C21433PF

VBAT

33PFC230

C21233PF

C234100PF100PF

C233

VBAT

VCCD

C21033PF

C237100PF 100PF

C241C240100PF100PF

C239

1NFC221 C226

33PFC22033PF 33PF

C228

10R200

100PFC236

TP205

10NFC205

TP204

C22933PF

33PFC209C206

33PF

TP203

TP201

330NFC201

33PFC224

TXD7

VCC3

VLED8

C2311UF

4AGND

GND11

10GND2

GND311

2NC

6RXD

SD5

SHIELD9

LED200

TP210

33PFC213

667

788

9 9

3 3

303031

3132

3233

3334

34

445 5 22

2223

2324

2425

2526

2627

2728

2829

29

15 151616

17 17

181819

1922

202021

21

CN200

1 1

101011 1112 12

1313

14 14

1NFC202

TP208TP209

TP206TP207

100PFC238

C20733PF

C21833PF

33PFC216

33PF

C208

C227

33PF

33PFC219 C223

33PF

100PFC235

33PF 33PFC204C203

VCCB

C22233PF

DSP_TDODSP_TDIDSP_TMSDSP_TCK

CP_WEN

EL_EN

C21533PF

CAM_D(1)

SPK1NYMU_VIB_EN

CAM_D(9)CAM_D(11)CAM_D(13)CAM_D(15)SVC_GREENSVC_BLUE

CP_TDORSTCP_TDICP_TMSCP_TCK

LED_ENCAM_OEN

CAM_D(0)CAM_D(2)CAM_D(4)

CAM_D(10)

CAM_D(6)CAM_A

CAM_CLCD_ENCAM_WENCAM_D(7)CAM_D(5)CAM_D(3)

IRDA_RXIRDA_EN

IRDA_TX

SPK1PRST

SVC_REDCAM_D(14)CAM_D(12)

CAM_D(8)

Page 17: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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3-5

3. Sim Part

Is there any Signalspin#52, #53, #54 of

U100?

"Insert SIM" is displayed on the LCD

Check the U601

Check the SIM Card

END

No

Yes

Yes

Yes

No

Check the U100Is there any Signalspin#49, #50, #51 of

CN100?

Page 18: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-6

This Document can not be used without Samsung's authorization

VEXT

GND

GND

DEBUG_TXDSDS_RXD

BP_VF

DEBUG_DSRVTEST

DEBUG_RXD

DEBUG_DTR

CF

DLC_DETECT

GND

JIG_ON

DEBUG_RTSDEBUG_CTS

VEXT

I/F CONNECTOR

SDS_TXD

DEBUG_DCD

DEBUG_RI

VBAT

ZD305 ZD307ZD304

47K

VCCD

ZD303

R304

R301

1K

14

R3021 K

ZD308

VBAT

C301220NF

C300100NF

1213

11

45

R3031 K

17

ZD300

1 2 3

1516

2

ZD306

CN300-1

1

R3061 K

1KR305

18

202122

19

VCCD

ZD302

47KR300

1 2 3

45

10

6

ZD301

89

7

45

TA_VEXT

DLC_DETECT

3SDS_RXD

JIG_ON

SDS_TXD

DEBUG_RXDDEBUG_TXD

DEBUG_RI

BP_VF

DEBUG_CTSDEBUG_RTS

DEBUG_DCD

DEBUG_DTR

DEBUG_DSR

Page 19: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

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3-7

4. Charging Part

The pin #17, #18 ofCN300 is TA_VEXT

ㆃ 5V?

Abnormal charging operation

The pin #3 of U102 is"low"?

Replace TA or Check CN300

Check the U102

Check the Q101

END

No

Yes

Yes

Yes

No

NoThe pin #3 of Q101 is

"low"?

The pin #5 of U101 is3.2~4.2V"? Check the U101

No

Yes

The ICHRG = 1V(duringcharging)and ㆃ 180mV(fullcharging)?

No

Solder again or change R108

Yes

Page 20: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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3-8

This Document can not be used without Samsung's authorization

EAR_MIC_P

EAR_SPK_NEAR_MIC_N

EAR_SPK_P

JACK_IN

AUDIO

MAIN_MIC

NCC405

100NFC408

R40482K

120K

R403

C40191NF

150PFC419

R42156K4.7NF

C421

C412

6.3V4.7UF

100NFC402

ZD40

3

R405

C41633UF

33K

R40212

100KR40112

ZD40

5

R400

VBAT

C410NC

3.3K

R40

8

10KR407

R409

R411680

NCC415

56K

ZD40

2

ZD40

1

C407

C401120PF

220PF

C4131NF

C4208PF

C414100NF

6.3V

C4044.7UF

R420

1KR419

18KR418

10K

2.2KR410

VR

EF

VSS

8

/CS29

3

/IRQ

/RD31

/RST

4

28 /WR

MT R

5

NC

PLL

C

6

17

SP

OU

T 1

SP

OU

T 2

18

15SPVDD

SPVS

S

16

7

VDD

9

EQ1 12

13EQ2

EQ3 14

HPOUT-L/MONO 10

11HPOUT-R

IOVDD32

LED

2

19

CLK

I

D027

26 D1

25

D2

D3

24 23

D4

D5

22

D6

21

D7

20

1V+

U401

30 A0

1

COM2

6 GND

IN1 4IN28

5NC1

7 NC2

NO1 2NO210

VCCD

U400

3COM1

9

CN401

1

2

3

4

56

VCCD

C40322NF

NCC418

NCR417

NC

R416

0

56KR415

10K R414

R4122.2K

R413

33PFC411

1UF

C417

C4020

1UFC409

150PFC40181NF

VCCDVCCA

Q400

2 3

1

C400

VCCA

SPK1P

SPK1N

YMU_SPK1N

YMU_SPK1P

YMU_LED

CP_WEN

100NF

JACK_IN

AOUTBP

YMU

_VIB

_EN

AOUTAP

AOUTAN

AUDIO_AMP_EN

AOUTBN

D(4

)

D(3

)

D(1)

D(0)

CP_OEN

A(0)

YMU_EN

AUXOUT

AUXIN

MICOUT

MICIN

EAR_SWITCH

D(2

)

YMU

_SPK

1P

CLK13M_YMU

YMU

_SPK

1N

YMU_IRQRST

D(5

)

D(6

)

D(7

)

Page 21: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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3-9

5. Microphone Part

Is the assembled statusof microphone O.K?

Microphone does not work

C420 ㆃ 2.0V

Reassemble the microphone

Solder the microphone again orReplace C409,C416,R407,R409,R410,R411

END

No

Yes

Yes

Yes

Yes

No

Is microphone ok? No Check U700

Check the reference voltage on mic path

Page 22: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-10

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MEMORY

D6 T2 T3

E7

T4 F6

C503 10N F

D8 S-CE2

D9 S-VC C

S-_CE 1 G10

F3 S-_LB

F5 S-_OE

S-_UB F4

B8 S-_WE

D5 T1

H1 NC NC H2

H3 NC A1 0 NC

NC A1 1 A1 2

NC H1 1 NC

C6 S-A17

H8 GN D GN D

A9 D3 GN D

A1 NC

NC H1 2

1 NC NC

2

NC A2

D1 0 F-VC C F-VP P E4

H9 F-_OE

F-_RS T D4

C3 F-_WE

E3 F-_WP

H7 F1-_CE F2-_CE H10

C10 C8

DQ6 DQ7 B10

F8 DQ8 DQ9 F7

F-A17 G4

F-A21 C5

F-RY/_BY C4

E6 D7 DQ12

DQ13 C7 B9

DQ14 DQ15 B7

E9 DQ2 DQ3

E1 0 C9

DQ4 DQ5

H4 G6 A6

A7 G5 B4 A8

A9 B6

F9 DQ0 DQ1

F10

E8 DQ10 DQ11

A5 B3 A16

G3 A18 A19 E5

G8 A2

A20 A3

A3 G7 H5 A4

A5

H6 A0 A1 G9

B5 A10 A11 A4

A8 A12 A13 A7

A6 A14 A15

U50 0

VCCD

C500 100N F

10NF C504

10 R501

C502 100NF 100N F

C501

VCCD

VCCD

WR_PROTECT

R502 10

D(6)

D(7)

D(8)

D(9)

CP_CSROMEN

CP_WEN

CP_OEN

UPPER_BYT E A(0)

CP_CSROM2EN

CP_CSRAMEN

FLASH_RESET

A(10)

A(11)

A(12)

A(13)

A(14)

A(15)

A(16)

D(0)

D(1)

D(10)

D(11)

D(12)

D(13)

D(14)

D(15)

D(2)

D(3)

D(4)

D(5)

D(0:15)

A(1:22 )

A(7)

A(8)

A(17)

A(18)

A(19)

A(20)

A(21)

A(22)

A(6)

A(5)

A(4)

A(3)

A(9)

A(2) A(1)

Page 23: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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3-11

6. Speaker Part

Is the terminal of SpeakerO.K.?

There is no sound from Speaker

Are there any signalsat the C220,C227? Check LCD or Replace CN200

Check U401

Is there anysignals

at the pin#5 and

END

No

Yes

Yes

Yes

No

No

The type of soundfrom the Speaker is

Melody

Replace the Speaker

YesNo

The pin#4of U400 is

No

No

Yes

YesYes

Check U400

Is there any signalsat the pin#2 andpin#10 of U400?

The pin#4of U400 is

No

Check U700

Page 24: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-12

This Document can not be used without Samsung's authorization

JTAG

TRIDENT

100N F C60 5

10N F

C604

10K,1%

R60 2 47K

R603

TM S

TCK

TD O

TD I

HP_

PW R

TRST

33K,1% R605

F_W

E 100PF C615

C617

VCC_1.8A

10N F

10NF

C601

33K,1% R604

22PF C61 6

RX

TX

47K R600

VRTC VCC_1.8 A

VCCB

VCCD

27P F C606

22NF C60 7

10NF C608

VCCD

VCC_1.8A

OSC601

1M

R601

VCCB

100K C402 1

VCC_1.8A

2 VO VS 1

VCCD

U602

GND 3

GN

D

L1009 NC

VBAT

R606 10

10NF

C602 C600

10NF

C603

220N F

VBAT

220N F

C609 C612

10N F

C61 1

10NF

C610

10NF

T5 P2

XPA9/IRQ3

R5

XPW

M1

E8 XRTCALARM_N

N1 0

XS

M0_

CLK

XS

M0_

DAT

A U

1 2

D12 XTIC_MODE

XVR

EF F1

0 M

1 7

XPA3

4_T_

REQ

B

L13

XPA3

5_A2

2 XP

A36_

A23_

CS5

N

N1 5

N1 4 XPA3/CS4N

P16 XPA4/OEN

P15 XPA5/WAITN XPA6/BE1N

T15

M9 XPA7/IRQ1 XPA8/IRQ2

G4

G5

XPA2

8_IO

M 0

F1

XPA2

9_IO

M 1

XPA2/CS3N M1 1

XPA3

0_IM

0 F3

E

1 XP

A31_

IM1

XPA3

2_C

S0N

H1 4

XPA3

3_T_

REQ

A

N1 7

M1 4

XPA2

0/C

P_M

IS O

L1

XPA2

1/C

P_SC

K K4

J6

XP

A22/

SSN

XPA2

3/PW

M2

H6

XPA2

4/PW

M3

H5

M3

XPA2

5_O

M0

G2

XPA2

6_O

M1

XPA2

7_SM

1_C

LK

N1

G6

XPA1

3_TX

1 XP

A14_

RX1

G

3

H4

XPA1

5/TX

0 XP

A16/

RX0

L3

E4

XPA1

7_D

RQ

0 XP

A18_

T_AC

K

P13 L2

XPA1

9/C

P_M

OS I

XPA1/CS2N

G8

XCP_

TM S

XCP_

TRST

N F9

XCP_WEN C1 3

XFR

STB

F4

XOSC32OUT C6

M1 5 XPA0/CS1N

XPA10/IRQ4 N2

K5

XPA1

1/IR

DAR

X XP

A12/

IRD

ATX

R2

T3

XCP_

KB5/

SOU

T 0

XCP_

KB6/

SOU

T 1

U3 P3

XCP_

KB7/

SOU

T 2

T4

XCP_

KB8/

SOU

T 3

XCP_

KB9/

SOU

T 4

N3

XCP_

TCK

D

7

D1 3

XC

P_TD

O

D5

XCP_D8 C4 B4 XCP_D9

XCP_

TD I

C7 L4

XCP_

KB0/

SIN

0 XC

P_KB

1/SI

N1

L5

M4

XCP_

KB2/

SIN

2 XC

P_KB

3/SI

N3

T1

XCP_

KB4/

SIN

4

D2

XCP_D14 D3 E3 XCP_D15

XCP_D2 F8 F7

XCP_D3 XCP_D4 C5

D6 XCP_D5

E7 XCP_D6 XCP_D7

C1 7

XCP_CSRAMEN A1 3 A1 2 XCP_CSROME N

A6 XCP_D0 XCP_D1

B5

B3 XCP_D10 XCP_D11 C1

C2 XCP_D12 XCP_D13

L15 XCP_A20 XCP_A21 L16

XCP_A3 D1 5

XCP_A4 B15 C1 4

XCP_A5 XCP_A6 A1 6

A1 5 XCP_A7

B17 XCP_A8 XCP_A9

G1 3 G1 7 XCP_A14

XCP_A15 J12

XCP_A16 K12 K13

XCP_A17 XCP_A18

K14 L14 XCP_A19

E14 XCP_A2

D11

B7 XBSW N

M12 XCPTSTSTOP_CKO

XCP_A0_BEON B13

XCP_A1 F11

XCP_A10 D1 6 F14 XCP_A11 G1 4 XCP_A12

XCP_A13

K6

VSSA

E10

VSS_

DPL

L E1

5

A7 X1RTC X2RTC

D10

XAG0 B11 A11

XAG1

E11 XAG2 XAG3

L9

VSS

VSS

A3

VSS

F6

G9

VSS

VSS

G1 0

H

7 VS

S

H1 1

VS

S VS

S J7

VS

S

D8

VRTC

A2

VSS

K7

VSS

L6

VSS

VSS

L10

M7

VSS

VSS

L8

VSS

J11

U2

P8

VDD

E VD

DE

U15

U

16

VDD

E VD

DE

N1 6

E1

6 VD

DE

VDD

E E1

7

G1 6

VD

D_D

PLL

R16

R

17

VD D

VD

D

A5

C16

VD

D

C11

VD

DA

VDD

E B1

B14

VDD

E

M1

VDD

E VD

DE

G12

F15 TRST

E2

VD D

VD D

L1

7

VD D

G

1 R

1 VD

D

VD D

R

4 T1

3 VD

D

VD D

L12 IOBIT#2

1 N

C

NC

2 C

12

RST

B

U5 RW N

H13 TCK

H12 TD I

TD O F12

TM S

T7 R7

DB#6 DB#7

M6 DB#8 P7

N7 DB#9

INT#0 N4

IO7 R12

K11 IOBIT#1

M8 U11 DB#12

DB#13 T11 DB#14 R11

P10 DB#15

DB#2 R6 P6 DB#3

DB#4 U7 DB#5

R14 AB#6

T14 AB#7 AB#8 T17

CK

I F1

7

CK O G15

P5 DB#0 DB#1 U6

N8 DB#10 DB#11

AB#0 U13 M10

AB#1 AB#2 R13 AB#3

N11 P11

AB#4 AB#5

P12

10N F

C613

U601

C614 22PF

A(16)

A(15)

A(14)

A(13)

A(12)

A(11)

A(10)

A(1)

A(0)

A(22)

ICHRG

26M_INPUT_SSV

D(10)

D(1)

D(0)

CP_CSROME N CP_CSRAMEN

A(9)

A(8)

A(7)

A(6)

A(5)

A(4)

A(3)

A(21)

A(20)

A(2)

A(19)

A(18)

A(17)

YMU_EN FLIP_SNS_2

CLCD_EN

YMU_IRQ

CP_CSROM2EN

CP_WEN

D(9)

D(8)

D(7)

D(6)

D(5)

D(4)

D(3)

D(2)

D(15)

D(14)

D(13)

D(12)

D(11)

DEBUG_DTR DEBUG_RTS

YMU_LED

WR_PROTECT DEBUG_DSR

DLC_DETECT

RTCALARM

SIMCLK SIMDAT A

VREF

FLIP_SNS CAM_INT

CP_INT

UPPER_BYTE DEBUG_DCD

CP_OEN

SDS_TX D SDS_RX D

DEBUG_TX D DEBUG_RX D

JACK_IN EAR_SWITCH

UP_SD I

CHG_DET

UP_SCLK UP_CS

CHG_ON AUDIO_AMP_EN

DEBUG_RI SIMRST PWR_KEEP

DEBUG_CTS

IRDA_EN

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

KEY_COL(3)

KEY_COL(4)

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(4)

CP_TC K

CP_TD O

CP_TM S

TR_RST

FLASH_RESET

CLK32K

IRDA_RX IRDA_TX

DSP_IO

LED_E N EL_EN

TR_RST

DSP_RWN

DSP_TCK

DSP_TD I

DSP_TD O

DSP_TM S

TR_RST

BP_VF

TR_RST

CP_TD I

DSP_DB(1)

DSP_DB(10)

DSP_DB(11)

DSP_DB(12)

DSP_DB(13)

DSP_DB(14)

DSP_DB(15)

DSP_DB(2)

DSP_DB(3)

DSP_DB(4)

DSP_DB(5)

DSP_DB(6)

DSP_DB(7)

DSP_DB(8)

DSP_DB(9)

DSP_INT

TR_RST RS T

DSP_AB(0)

DSP_AB(1)

DSP_AB(2)

DSP_AB(3)

DSP_AB(4)

DSP_AB(5)

DSP_AB(6)

DSP_AB(7)

DSP_AB(8)

CLK13M_TR

DSP_DB(0)

DSP_DB(15:0)

D(0:15)

A(0:20)

KEY_ROW(0:4)

KEY_COL(0:4)

DSP_AB(8:0)

RS T CP_TDO CP_TD I CP_TM S CP_TC K

CP_WEN VBAT JIG_O N SDS_RX D SDS_TX D

Page 25: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

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3-13

U1005 CHECKpin15 ≥ -65dBm ?

7. EGSM Reciever

CONTINUOUS RX ONRF INPUT : 62CHAMP : -50dBm

NORMAL CONDITIONcatch the channel?

Check soldered status ofL1000, L1003

U901pin 12,13≥-20dBm ?

U1005 CHECKpin1, 2 ≥ -65dBm ?

U901 CHECKpin21,22 ≥ -65dBm ?

U902 CHECKpin5,25,28 :

3V ?

CN1001resolder or change

U1005resolder or change

C1003,C1004,L1001resolder or change

U100pin33 , C110check or resolder

U902 CHECKpin 7 : 13MHz ?Vp-p : 860mV?

U902 change orresolder

U901 CHECKpin 14,23,26,32:

clean 2.8V?

C804,R803resolder

OSC801 change orresolder

U100pin39, C111check or resolder

U901 pin3,4Vp-p : 240mV?

U900 CHECKpin6, 20 : 2.8V ?

U900resolder or change

U901 pin1, 2Vp-p : 250mV ?

U901resolder or change

U900 pin 2,3,4,5Vp-p : 100mV ?

CHECKU700

NO

YES

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

NO

YES

YES

YES

YESYES

YES YESYES

YES

YES

YES

YES

YES

OSC801 CHECKpin 3 : 13MHz ?Vp-p : 950mV?

U100pin33, C110check or resolder

NO

OSC801 CHECKpin 4 : clean

3V ?

NO

Page 26: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-14

This Document can not be used without Samsung's authorization

CSP109 3

4

220N F C703

U701

2

5

6

3

1

C700 100PF

VCCA

TP712

33PF C71 4

TP713

U702

2

5

6

3

1

4

XTALB N11

E8 E10 VSS

VSS G5 G10 VSS

VSS H5

VXVCM B1 1

XOENA N7 N5

XOENAQ

XTALA N1 2

K5 VSS

H10 VSS K8 VSS

VSS K10

VSS K6 E5 VSS

VSS E7 VSS

VDD1 F1 P6 VDD2

VDD3 A1

VDDA E1 3

VDDB K1 3

F1 4 VDDC

P13 VDDD

VRE G D1 1

N8

TMS P10

TXI N H1 2 TXIP

J10 J14 TX P

J13 TXQN TXQP

H1 3

UC B3 A2

UC

RXQN RXQP

N14

SERCK K9 M8

SERD A P9 SERLE1

SERLE2 M7

TCK N9 TDI N10

TDO

RAREF1 RAREF2

L1 3

C13 REF C

RESETN A10

N6 RFOVL

RWN K4

RXI N M13

L1 1 RXI P

P14

OCTL3 B6 B7 OCTL4

OCTL5 D5 A6 OCTL6

OCTL7 E6 C7 OCTL8

OCTL9 C8

K1 4

MICOUT B1 2

NC 1 2

NC

B4 OCTL0 OCTL1 A5

A9 OCTL10 OCTL11 E9

B5 OCTL2

L4 DINT R

E1 1 GNDA

GNDB K1 1

F1 0 GNDC

GNDD L1 0

IO K2

MC K7

MICI N A13

J5 DB2 DB3 J1

H3 DB4 DB5 G3

F5 DB6 DB7 G2

F2 DB8 DB9 E2

DAIRN

J2 DB0 DB1 H2

D2 DB1 0 DB1 1 D4

E1 DB1 2 DB1 3 E4

C2 DB1 4 DB1 5 B1

AOUTBN AOUTB P

D1 3

A14 AUXI N B1 4

AUXOUT

L5 CINTR

DAICK B1 0 B9

DAIDI

B8 DAIDO

D1 0

P1 N1 AB5

AB6 M2 L2 AB7

AB8 K1

G12 AF C

G13 AOUTAN

F1 3 AOUTAP

E1 4

U70 0

T

AB0 P5 N4 AB1

AB2 N3 P2 AB3

AB4

C702 68PF C70 1

68PF

TP711 TP710

10NF C71 3

10N F C712

5.1K R701

100NF C705

1U F C704

R705 2.4

10NF C710

10N F C711

3

1

4

VCC D

VCC D

U703

2

5

6

R70 6 2.4

C70 6 10NF

VCC D

10NF C707

VCC D

C708 10N F

VCC D

10N F C709

33PF C716

33PF C715

TX_EN

PCS_RX_EN

TXQP

XOEN A

SVC_BLUE SVC_GREEN

TX_BAND_SE L

TXPOWE R

SYN_EN

GSM_TX_EN

DCS_TX_EN

DSP_INT

CLK13M_M C

MICI N

EN_VR F EN_VPAC

SI_EN

SVC_RED

RXIN

RXIP

RXQN

RXQP

TXIN TXIP

TXQN

AOUTBP

SERDAT SERLE

AOUTAP AOUTAN

MICOUT

CLK32K

AOUTBN

RS T

DSP_RWN DSP_I O

DSP_AB(0:8 )

DSP_DB(0:15 ) DSP_AB(8)

AF C

AUXI N

CP_INT

DSP_AB(0)

DSP_AB(1)

DSP_AB(2)

DSP_AB(3)

DSP_AB(4)

DSP_AB(5)

DSP_AB(6)

DSP_AB(7)

DSP_DB(0)

DSP_DB(1)

DSP_DB(10)

DSP_DB(11)

DSP_DB(12)

DSP_DB(13)

DSP_DB(14)

DSP_DB(15)

DSP_DB(2)

DSP_DB(3)

DSP_DB(4)

DSP_DB(5)

DSP_DB(6)

DSP_DB(7)

DSP_DB(8)

DSP_DB(9)

SERCLK

AUXOUT

Page 27: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

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3-15

8. EGSM transmitter

U1005 pin12 : about2~3 dBm?

CN1001, C1000check&change

U1005pin13 : 2.8 V?

U700check & change

BetweenL1008&C1007

≒ 4~5dBm?

U1005check & change

C1014 :3.7 V?

NO NO

YES

YES

YES

NO

NO BATTERY, U100check & change

BetweenR1008& U1001

: 1.2V?

YES

NO R1008check & change

R1001:≒ -5dBm ?

YES

C1016 :3V?

YES

YES

U1001change

NO

U700check

U700check & change

YES

NO

U901pin14,23,26,32 :

2.8V ?

U100pin39,C111change orresolder

YES

U901pin9,10,12,13:-20dBm ?

U901pin5,6,7,8:1.7V ?

YES

U700change

NO

NO

U1001change orresolder

YES

U902pin5,25,28 : 3V ?

NO U100 pin33,C110change or resolder

NO

U902pin 7 : 13MHz?Vp-p: 950mV

YES

U902pin9,10,11,1213: 3V?

YES

YES

U901change orresolder

OSC801pin 3 : 13MHz?Vp-p : 950mV

OSC801change orresolder

U700check orchange

0SC801pin 4 : 3V

?

U100pin33,C110change orresolder

U902change orresolder

NONO

YES

NO

YES

NO

CONTINUS TX ON CONDITIONTX POWER DAC:500 CODE

APPLIEDCH:62

RBW : 100KHzVBW : 100KHzSPAN : 10MHz

REF LEV. : 10dBmATT. : 20dB

NO

Page 28: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-16

This Document can not be used without Samsung's authorization

X-TAL(13MHz )

(From SI4201)

KEY-XBS

12

UP KEY-XBS

12

SEN D

15 0 R811

C805 10N F

C806 10N F

15PF C801

45

12

R806 15 0

R807

VOL_D N LS10N2-T

3

LEFT KEY-XBS

12

15 0

3

12

10 R80 1

30PF

KEY-XB S

12

KEY-XBS RIGHT

12

C802

KEY-XBS 0

12

SH KEY-XB S

SLS-

NNBL

102T

S

LED819

SLS-

NNBL

102T

S

SLS-

NNBL

102T

S

LED813 LED814

SLS-

NNBL

102T

S

LED802

150 R808

I KEY-XBS

12

R809 150

12

C803 10N F

KEY-XB S 9

12

2 KEY-XBS

12

C804 10N F

2

GND

3

OUT

VC

C 4

VT 1

* KEY-XBS

VCCD

OSC801

TCO-9141 B

45

12

SLS-

NNBL

102T

S

LED820

15 0

LS10N2-T VOL_U P

3

7

12

VBA T

R814

8 KEY-XBS

12

KEY-XBS

LED804 LED805

SLS-

NNBL

102T

S

C807

VCCD

SLS-

NNBL

102T

S

200

100NF

150 R81 7

R802

R82 1 150 15 0

R81 9

LED82 1L ED822

SLS-

NNBL

102T

S

0 R820

SLS-

NNBL

102T

S

KEY-XB S

12

LED80 1

SLS-

NNBL

102T

S

1

12

KEY-XBS DOWN

12

6

KEY-XBS T

12

KEY-XBS

CLEA R

12

END_PW R KEY-XBS

12

R81 6 150

KEY-XBS

150 R815

LED810 LED811

SLS-

NNBL

102T

S

12

DD-DOM-4PIE F1

12

SLS-

NNBL

102T

S

KEY-XBS 5

12

4 KEY-XBS

SLS-

NNBL

102T

S

150 R81 2

LED808 LED80 7

100N F C808

SLS-

NNBL

102T

S

R813 150

CAM_MENU LS10N2-T

34 5

12

R803

R818 0

10 0

2 OUT

1 VC C

VOSC

F2 KEY-XBS

12

U802 A3212ELH-SAMSUNG

GND

3

560 R800

U803 A3212ELH-SAMSUNG

GND

3

2 OUT

1 VC C

R810 150

FLIP_SNS_ 2 FLIP_SN S

KEY_COL(4)

KEY_COL(3)

KEY_ROW(3)

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(4)

BACKLIGHT_1 BACKLIGHT_ 2

AFC

CLK13M_R F

CLK13M_YMU

PWR_ON

KEY_COL(2)

KEY_COL(1)

KEY_COL(0)

KEY_ROW(4:0)

KEY_COL(4:0 )

CLK13M_T R

CLK13M_M C

13MHZ_BB

Page 29: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

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3-17

U1005 CHECKpin15 ≥ -65dBm ?

U1005 CHECKpin 3,4 ≥ -65dBm ?

9. DCS Reciever

CONTINUOUS RX ONRF INPUT : 698CH

AMP : -50dBm

NORMAL CONDITIONcatch the channel?

Check soldered status ofL1000, L1003

U901pin 12,13≥-20dBm ?

U901 CHECKpin19,20 ≥ -65dBm ?

U902 CHECKpin5,25,28 :

3V ?

CN1001resolder or change

U1005resolder or change

C1005,C1006,L1002resolder or change

U100pin33 , C110check or resolder

U902 CHECKpin 7 : 13MHz ?Vp-p : 860mV?

OSC801 CHECKpin 4 : clean

3V ?

U902 change orresolder

U901 CHECKpin 14,23,26,32:

clean 2.8V?

R803,C804change or resolder

OSC801 change orresolder

U100pin39, C111check or resolder

U901 pin3,4Vp-p : 240mV?

U900 CHECKpin6, 20 :

2.8V ?

U900resolder or change

U901 pin1, 2Vp-p : 250mV ?

U901resolder or change

U900 pin 2,3,4,5Vp-p : 100mV ?

CHECKU700

NO

YES

NO

NO

NO

NO NO

NO

NO

NO

NO

NO

NO

NO

YES

YES

YES

YES

YES

YES YES YES

YES

YES

YES

YES

YES

OSC801 CHECKpin 3 : 13MHz ?Vp-p : 950mV?

U100 pin33, C110check or resolder

NO

Page 30: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-18

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(XOUT_EN)

SI-LA B

MICRO STRIP LINE

VOSC

22NF C906

6

XI N

7

XOU

T

19

4 RXQN 3

2 RXQP

SCLK

17 18

SD I

SD O 15

16

SEN

B

20

VDD

A VD

DC

21 22

GN

D

23

GN

D

24

GN

D

12 IO N

IO P 11

14 PDNB

RXI N 5 RXI P

U900

CKN

10 9

CKP

GND 1

GN

D

8

GND 13

GN

D

C904

VRF

100P F

C907 47PF

C908 33PF

22NF

C920 22NF

C909

C917 100PF

VRF

C905 22NF

100PF

23

14

VDD

2

32

VDD

3

26

VDD

4

VOSC C916

RFL

O N

12

RFL

O P

24 RFOD

RFO

G

25

TXIN 6 TXIP 5

8 TXQN

TXQP 7

VDD1

L2

PDN

B

31

20 RFID N

RFID P 19

22 RFIG N

RFIG P 21

18 RFIP N

RFIP P 17

13

GN

D

35

GN

D

36 G

ND

IFLO

N

10 9

IFLO

P

1 IO N

IO P 2

L1

29 28

CKN

4 CKP

16

DIA

G 1

DIA

G 2

15

GN

D

11

GN

D

27 30

GN

D

GN

D

33 34

U90 1

3

22N F C913

C91 9 100PF

C915 10P F

C912 10PF

100PF

C914 100PF

VOSC

C911

C903 22N F

22N F C910

VRF VRF

C918 100PF

L90 0 3.9nH

VOSC

VOSC

SEN B

11

VDD

D

5

28

VDDI

VDDR 25

7 XI

N

19

RFL

B

17

RFL

C

16

RFL

D RFLO N

23

24

RFLO P 12

SCLK

SD I 13

10

SD O

IFLA

3 2 IF

LB

26

IFLO N

IFLO P 27

8

NC

14

NC

PDNB

9

RFL

A 20

4 G

ND

6 G

ND

GN

D

15

GN

D

18

GN

D

21

22

GND

GND 29

30

GND

U902

GN

D 1

GND

31

32

GND

DPCS_PAM_I N

PCS_LNA_IN_P

PCS_LNA_IN_N

XOENA

SERCL K

SERDAT

SERL E

13MHZ_BB SI_EN

DCS_LNA_IN_P

TXI N

TXI P

TXQN

TXQP

SYN_EN

SERDAT

SI_EN

GSM_LNA_IN_N

GSM_LNA_IN_P

DCS_LNA_IN_N

GSM_PAM_IN

RXI P

RXIN

RXQP

RXQN

CLK13M_RF

SERLE

SERCLK

CLK13M_RF

Page 31: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

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3-19

U1005 CHECKpin6 ≥ -65dBm ?

F1003 CHECKpin 4,6 ≥ -65dBm ?

10. PCS RecieverCONTINUOUS RX ONRF INPUT : 660CH

AMP : -50dBm

U1005 CHECKpin15 ≥ -65dBm ?

CN1001resolder or change

U901pin 12,13≥-20dBm ?

U901 CHECKpin17,18 ≥ -65dBm ?

U902 CHECKpin5,25,28 :

3V ?

U1005resolder or change

C1017,F1003resolder or change

C1009,C1010,L1006resolder or change

U100pin33 , C110check or resolder

U902 CHECKpin 7 : 13MHz ?Vp-p : 860mV?

OSC801 CHECKpin 4 : clean

3V ?

U902 change orresolder

U901 CHECKpin 14,23,26,32:

clean 2.8V?

R803,C804change or resolder

OSC801 change orresolder

U100pin39, C111check or resolder

U901 pin3,4Vp-p : 240mV?

U900 CHECKpin6, 20 :

2.8V ?

U900resolder or change

U901 pin1, 2Vp-p : 250mV ?

U901resolder or change

U900 pin 2,3,4,5Vp-p : 100mV ?

CHECKU700

NO

YES

NO

NO

NO

NO NO

NO

NO

NO

NO

NO

NO

NO

YES

YES

YES

YES

YES

YES YES YES

YES

YES

YES

YES

YES

OSC801 CHECKpin 3 : 13MHz ?Vp-p : 950mV?

U100 pin33, C110check or resolder

NO

NORMAL CONDITIONcatch the channel?

Check soldered status ofL1000, L1003

NO

YES

Page 32: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-20

This Document can not be used without Samsung's authorization

TRANSMITTER & RECEIVER

0.75PF

C100 2

8.2nH L1002 C1006

0.75PF

1.8N H L100 3

9 P

CS

OU

T 11

TX

EN

3

VB

ATT

4

VCC

10

8 VCC2 VCC2 12

VR

AM

P

6 5 V

RE

G

U1001

BA

ND

21

D

CS

I N

GN

D

13

GS

MI N

7

GS

MO

UT

0.75PF

C1005

4

6 OUT 2

300 R1006

F1003

1 G1 G2

35 G3

IN 2 OUT 1

VPA C

0.75PF

C1010

C1015

L1006 7.5NH

PCSRX 6

33PF

DCS/PCSTX

EGSMRX 1 2 EGSMRX

EGSMTX 12

7

GG

14

U1005

15

ANT

DCSRX 3 4 DCSRX 10

33nH L1001

C100 7 47PF

4

3 IN

1 OU T

C100 8 1P F

CN1001

2

GND GND

VBA T

C1003 0.75PF

3.3nH L100 7

6.3V 100U F C1013

L1000 4.7n H

18nH L1008

R1007 30 0

18 R1004

47PF C1000

33PF C1012

100K,1% R100 8

30 0 R1003

R1000 18

R1002 300

180 R100 5

180 R100 1

10PF C101 7

0.75PF C1004

0.75PF

1 1

2 2

3 3

C1009

ANT1

33PF

1N F C1014

DCS_TX_EN PCS_RX_EN

C1016

GSM_LNA_IN_P

GSM_LNA_IN_N

DCS_LNA_IN_N

DCS_LNA_IN_P

PCS_LNA_IN_N

PCS_LNA_IN_P

GSM_TX_EN

GSM_PAM_IN

DPCS_PAM_IN

TX_BAND_SEL

TX_EN TXPOWER

Page 33: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

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3-21

11. DPCS transmitter

U1005 pin10 : about2~3 dBm?

CN1001, C1000check&change

U1005pin11 : 2.8 V?

U702,U703check & change

BetweenL1001&L1007:

≒ 4~5dBm?

U1005check & change

C1014 :3.7 V?

NO NO

YES

YES

YES

NO

NO BATTERY, U100check & change

BetweenR1008& U1001

: 1.2V?

YES

NO R1008check & change

R1005:≒ -5dBm ?

YES

C1016 :3V?

YES

YES

U1001change

NO

U700check

U700check & change

YES

NO

U901pin14,23,26,32 :

U100pin39,C111change orresolder

YES

U901pin9,10,12,13:-20dBm ?

U901pin5,6,7,8:1.7V ?

YES

U700change

NO

NO

U1001change orresolder

YES

U902pin5,25,28 : 3V ?

NO U100 pin33,C110change or resolder

NO

U902pin 7 : 13MHz?Vp-p: 950mV

YES

U902pin9,10,11,1213: 3V?

YES

YES

U901change orresolder

OSC801pin 3 : 13MHz?Vp-p : 950mV

OSC801change orresolder

U700check orchange

0SC801pin 4 : 3V

?

U100pin33,C110change orresolder

U902change orresolder

NONO

YES

NO

YES

NO

CONTINUS TX ON CONDITIONCH:698CH(DCS), 660CH(PCS)TX POWER CODE:350 CODE

APPLIEDRBW : 100KHzVBW : 100KHzSPAN : 10MHz

REF LEV. : 10dBmATT. : 20dB

NO

Page 34: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-22

This Document can not be used without Samsung's authorization

12. Camera part

"Camera" function does not work

Yes

Check the connectCN1101

NoConnect the camera module

Yes

U1104 pin 5 = 3.0VNo

Check U1104 and C1134

Yes

U1106 pin 4 = 2.5V

Yes

NoCheck U1106, C1135 and R1106

U1102 pin 3 = 27MHzNo

Check U1102 and C1126

Yes

Check U1109 pin4 haslow-active signal.

NoCheck U1107, U1112 and U1109

Yes

Check U1108 pin4 haslow-active signal.

Yes

NoCheck U1110, U1111 and U1108

END

Page 35: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Flow Chart of Troubleshooting

3-23

This Document can not be used without Samsung's authorization

CAM ASIC

CAMERA DSP

CCD

CAM POWE R

C1110

C112 5 100N F

100N F

C112 4 100NF

C1113 100NF

C110 3 100N F

VCC_CAM

C111 6

VCC_1.8 A

VCCD

47N F

NC C1144

VCCD

R1104 10 K

3 34

4 5 56 6 7 78 8 9 9

1 1

10 10 11 11 12 12

13 13 14 14 15 15 16 16

2 2

C1123

CN1101

5 OU T

4 REF_BYP

10NF

U1104

3 EN

GND 2

1 IN

1 EN

GND

3

5 IN

2

NC

4 O

UT

100N F

MIC5213-2.5BC5

U1106

C110 4

RB520S-30

VCC_CAM

RB520S-30 D1101

100N F

D1103 100NF

C1122

C111 4

100N F C1115

MCKI

VTRE F C1126 10NF

VBA T

C1120 100N F

10NF

C1105

R110 3 1M

C1102 10N F

33UF 6.3V

C1134

100N F

120 K R1102

C110 9

2

GN D

1

OE

OU T 3

VDD 4

VCCD

SG-8002CESC(27MHz )

U110 2

33U F 6.3V

C1107

F4

A1 VSS VSS F2

J2 VSS VSS K6

J9 VSS VSS E10

B9 VSS VSS

A5 C8

WR

E4 XRST

E8 B5

VDD2.5

G1 VDD 3 VDD 3

H6 K10 VDD 3

VDD 3 E9 A10 VDD 3

VDD 3 B2

VREF

D1 D2

SDA

C3 TEST0 TEST1

C2 D3 TEST2

B1 VDD2.5 VDD2.5 E2

K1 VDD2.5 VDD2.5

NC 1 2 NC

PCLK F1

RD B8

J5 REGRES

G6 SCANEN SCANMO D

K7

SCL

F9

LD 6 F10

LD 7 F8 F7 LD 8

LD 9 G10

LRD K9 G7 LW R

E1 MCK I

J7 NC

G8

LD12 H10

LD13 H9 H8 LD14

LD15 J10

D9 LD 2 LD 3 D10

E7 LD 4 LD 5

A8 INT

K8 LA

LCS J8

LCS2 H7

C10 LD 0 LD 1

D8

G9 LD10 LD11

B3

D3 A3

D4 C4 B4 D5

D6 A4 D5 D7

D8 C5 B6 D9

F3 HREF

A2

D1 D4

D10 A6 C6

D11 D12

D6 A7 D13

D14 B7 C7 D15

D2

K3 J3

CD7 H3 CD8 K2 CD9

CKI C1

CLKSEL E3

CS C9 D7 CS2

D0

H2 H1

CD13 CD14

G3 G2

CD15

CD2 G5 K4

CD3 CD4

J4 H4

CD5 CD6

A0 A9

B10 A1

CAMPW R J6

CD0 K5 H5

CD1

CD10 J1 G4

CD11 CD12

C1133

U1101

C1132 10NF

C1131 10N F1 0NF

C1119

VCC_CAM

100N F

6.3V 33UF C110 6

0 R1107

C1129 10NF

C113 0 10N F

R1105 68

10N F C1108

R1101 5.6K

VBAT VCC_CAM

C111 1 100NF

1U F C113 5

C1100

PCLK

C111 7 100N F

10NF

C1127 10NF

YOUT 100N F C1121

K7 Y2 Y3

H7 G7 Y4

Y5 K8 J8 Y6

Y7 H8

C3 YIN

A2

G3 VSS(V)

VSSAD A4 C2

VSSAMOS

C6 VSSHCCD VSSVA D1

K9 VSSVCO

Y0 H6

Y1 J7

VNS1 VNS2 F3

VREF G8

VSS(D) F8 H1 VSS(D)

VSS(D) J1

VSS(D) J5

VSS(D) J6

VSS(V) D9

VDD(V) VDD(V)

F1

C4 VDDAD VDDAMOS

C1

VDDHCCD C5 E3 VDDVA

VDDVCO H9

C8 VLO W

F2

J4 UV7

VCNT H10

E9 VDD(D) VDD(D) F9

H3 VDD(D) VDD(D) K4

VDD(D) K5

E8

E2 SEN

UV0 K2 H2

UV1 UV2 J2

G5 UV3 UV4 J3

UV5 K3

UV6 H4

PS2 PS3

B7

J10 R

REF E1

REFH D4 A3

REFL

G2 REGRES

SCL G4

SDA G1

A6 NSU B

PCLK K6

PDO J9

A8 PI1 PI2 B9

B8 PI3

PS1 A7 C7

HT2 HTR B5

LIQUI D A9

G9 MCKI NC A1

A10 NC NC K1

F10 NC NC K10

CP1B

D7 CP2A

C10 CP2B

CP2C C9

H5 CS

GOU T B1

HREF G1 0

HT1 B6 A5

D8 BF2A BF2B D1 0

D2 CAP1 CAPA2 B2

CAPB2 B4 B3 CAPC1

CINS D3

E10

U1103

BF1 B10

C1128 10NF

220N F C110 1

VCC_CAM

C111 2 100N F

100NF

HZREF

C1118

RB520S-30 D1102

CLCD_EN

CAM_SCL

CAM_OE N

26M_INPUT_SS V CP_WE N CP_OE N

MCK I

VTREF HZREF

PCLK

Y(5)

Y(6)

Y(4)

Y(3)

CAMPWR_O N

A(3) A(2)

PS2 PS3 PH1 PH2

PR

CINS PI2 PI3

PI1

PS1

VDD NSUB_D C

NSUB_PLU S

D(12 )

D(11 )

D(10 )

D(1)

D(0)

Y(1)

Y(0)

UV(7)

UV(6)

UV(5)

UV(4)

UV(3)

UV(2)

Y(7)

Y(2)

UV(1)

UV(0)

CAM_WEN

CAM_D(9)

CAM_D(8)

CAM_D(7)

CAM_D(6)

CAM_D(5)

CAM_D(4)

CAM_D(3)

CAM_D(2)

CAM_D(15)

CAM_D(14)

CAM_D(13)

CAM_D(12)

CAM_D(11)

CAM_D(10)

CAM_D(1)

CAM_D(0)

CAM_CLCD_EN

CAM_A

CAM_IN T

D(9)

D(8)

D(7)

D(6)

D(5)

D(4)

D(3)

D(2)

D[15 ]

D(14 )

D(13 )

PDO

D(0:15)

UV(0:7)

UV(0

:7 )

Y(0:

7)

Y(0:7)

CAM_D(0:15)

UV(0:7)

VD D

CAM_SD A CAM_SCL

REGRE S

RST

CAMPWR_ON

Y(0:7)

Y(4)

PCLK

REGRES

PI1 PI2 PI3

PS1 PS2 PS3

UV(0)

UV(1)

UV(2)

UV(3)

UV(4)

UV(5)

UV(6)

UV(7)

VTREF

Y(0)

Y(1)

Y(2)

Y(3)

Y(5)

Y(6)

Y(7)

NSUB_DC

HZREF

PD O

CINS

PH 1 PH 2

PR

MCKI

CAM_SDA

NSUB_PLUS

Page 36: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

SAMSUNG Proprietary-Contents may change without notice

4. SGH-P408 Exploded View and its Parts list

4-1

This Document can not be used without Samsung's authorization

1. Cellular phone Exploded View

1

2

3

4

5

67

9

12

10

11

13

1514

16

17

1819

20

2122

23

24 25

26

2728

29

30

31

32

34

33

8

Page 37: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

SAMSUNG Proprietary-Contents may change without notice

SGH-P408 Exploded view and its Part list

4-2

This Document can not be used without Samsung's authorization

2. Cellular phone Parts list

Location

NO.Description SEC CODE Remark

1 FOLDER UPPER GH75-02835A

2 MAIN LCD GH07-00253A

3 MOTOR 3101-001295

4 SPEAKER 3001-001423

5 FOLDER LOWER GH75-02834A

6 SCREW 6001-001479

7 FOL/SCREW COVER GH73-01508A

8 WINDOW LCD GH72-05737B

9 FPCB GH59-00802A

10 HINGE HOUSING GH75-02571A

11 SCREW 6001-001456

12 SCREW 6001-001834

13 HINGE WASHER GH71-01152A

14 CAMERA RING GH71-01136A

15 CAMERA GH59-00803A

16 CAMERA KNOB GH71-01137A

17 HINGE HOUSING CAP GH72-06417A

18 SIDE COVER GH71-00719A

19 SCREW 6001-001670

20 SIDE CAP GH71-01577A

21 FRONT COVER GH75-02833A

22 VOLUME KEY GH75-02838A

23 KEYPAD GH75-02836A

24 MAIN PBA GH92-01366A

25 DOME SHEET GH59-00781A

26 MIC GH59-00626A

27 CONN COVER GH73-01445A

28 ANTENNA GH42-00248A

29 REAR COVER GH75-02837A

30 SCREW 6001-001155

31 REAR SCREW COVER GH73-01507A

32 RF COVER GH73-01506A

33 SHOT KEY GH75-02887A

34 BATTERY GH43-00839A

Page 38: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Exploded view and its Part list

4-3

This Document can not be used without Samsung's authorization

3. Test Jig (GH80-00865A)

3-1. RF Test Cable

(GH39-00090A)

3-2. Test Cable

(GH39-00127A)

3-3. Serial Cable

3-4. Power Supply Cable 3-5. DATA CABLE

(GH39-00159A)

3-6. TA

(GH44-00171C)

Page 39: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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5. SGH-P408 MAIN Electrical Parts List

5-1

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SEC Code Design LOC

GH92-01366A -

0404-001172 D1101,D1102,D1103

0406-001083 ZD300,ZD301

0406-001152 ZD302

0501-000225 Q400

0502-001201 Q101

0504-000168 Q100,Q102

0504-001042 U701,U702,U703

0506-001052 U102

0601-001547 LED801,LED802,LED804

0601-001547 LED805,LED807,LED808

0601-001547 LED810,LED811,LED813

0601-001547 LED814,LED819,LED820

0601-001547 LED821,LED822

0604-001146 LED200

1001-001183 U400

1009-001010 U802,U803

1109-001260 U500

1201-001889 U1001

1203-001720 U1104

1203-002127 U101

1203-002704 U1106

1203-002902 U100

1204-001960 U401

1204-001982 U1103

1204-001984 U700

1205-002268 U901

1205-002185 U900

1209-001219 U602

1209-001434 U902

1405-001018 ZD308

1405-001082 ZD303,ZD304,ZD305

1405-001082 ZD306,ZD307,ZD401

SEC Code Design LOC

1405-001082 ZD402,ZD403,ZD405

2007-000138 R803

2007-000140 R302,R303,R304,R305

2007-000140 R306,R419

2007-000141 R410,R412

2007-000144 R701

2007-000148 R1104,R407,R413,R420

2007-000157 R300,R301,R600,R602

2007-000159 R409,R415,R421

2007-000161 R404

2007-000162 R400

2007-000163 R1102,R403

2007-000170 R1103,R601

2007-000172 R105,R200,R501,R502

2007-000172 R606,R801

2007-000242 R1108

2007-000758 R102

2007-000775 R405

2007-000982 R1101

2007-001119 R411

2007-001288 R1000,R1004

2007-001301 R1105

2007-001306 R806,R807,R808,R809

2007-001306 R810,R811,R812,R813

2007-001306 R814,R815,R816,R817

2007-001306 R819,R821

2007-001307 R1001,R1005

2007-001308 R802

2007-001323 R109

2007-001325 R408

2007-001333 R418

2007-002797 R800

2007-003001 R401,R402

Page 40: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Electrical Parts List

5-2

This Document can not be used without Samsung's authorization

SEC Code Design LOC

2007-007008 R1002,R1003,R1006

2007-007008 R1007

2007-007107 R1008

2007-007137 R103

2007-007139 R107

2007-007142 R108,R111,R603

2007-007200 R705,R706

2007-007308 R604,R605

2007-007771 R1107,R820

2007-007771 R113,R205,R414

2007-007771 R818

2203-000233 C113,C233,C234,C235

2203-000233 C236,C237,C238,C239

2203-000233 C240,C241,C615,C700

2203-000233 C904,C911,C914,C916

2203-000233 C917,C918,C919

2203-000254 C1100,C1102,C1105

2203-000254 C1108,C1123,C1126

2203-000254 C1127,C1128,C1129

2203-000254 C1130,C1131,C1132

2203-000254 C1133,C115

2203-000254 C205,C503,C504,C601

2203-000254 C602,C603,C604,C608

2203-000254 C610,C611,C612,C613

2203-000254 C617,C706,C707,C708

2203-000254 C709,C710,C711,C712

2203-000254 C713,C803,C804,C805

2203-000254 C806

2203-000278 C1017,C912,C915

2203-000311 C401

2203-000386 C801

2203-000438 C1014,C202,C221

2203-000438 C4018,C4019,C413

SEC Code Design LOC

2203-000585 C407

2203-000628 C614,C616

2203-000679 C606

2203-000812 C101,C1012,C1015

2203-000812 C1016,C103,C104,C203

2203-000812 C204,C206,C207,C208

2203-000812 C209,C210,C211,C212

2203-000812 C213,C214,C215,C216

2203-000812 C217,C218,C219,C220

2203-000812 C222,C223,C224,C225

2203-000812 C226,C227,C228,C229

2203-000812 C230,C411,C714

2203-000812 C715,C716,C908

2203-000854 C418

2203-000995 C1000,C1007,C907

2203-001153 C701,C702

2203-000359 C4020,C419

2203-001259 C420

2203-001405 C403,C607,C903,C905

2203-001405 C906,C909,C910,C913

2203-001405 C920

2203-001412 C802

2203-002494 C112

2203-002677 C1002,C1003,C1004

2203-002677 C1005,C1006,C1009

2203-002677 C1010

2203-005061 C100,C1103,C1104

2203-005061 C1109,C1113,C1114

2203-005061 C1117,C1118,C301

2203-005061 C1119,C1120,C1121

2203-005061 C1122,C1124,C1125

2203-005061 C300,C400,C402,C408

2203-005061 C414,C500,C501,C502

Page 41: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Electrical Parts List

5-3

This Document can not be used without Samsung's authorization

SEC Code Design LOC

2203-005061 C605,C705

2203-005065 C1135,C231,C232,C409

2203-005065 C417,C704,C108,C109

2203-000885 C421

2203-005288 C1008

2203-005481 C1116

2203-005482 C106,C200,C807,C808

2203-005482 C1110,C1111,C1112

2203-005482 C1115

2203-005496 C1101,C600,C609,C703

2203-005509 C201

2203-005796 C114

2203-006053 C110,C111,C116,C117

2203-006201 C102

2404-001086 C404,C412

2404-001100 C1106,C1107,C1134

2404-001105 C118

2404-001134 C1013

2404-001151 C416

2404-001268 C119

2703-001722 L1008

2703-001729 L1003

2703-001747 L1000

2703-001751 L900

2703-002542 L1001

2703-002543 L1006

2703-002544 L1002

2703-002207 L1007

2801-004025 OSC601

2809-001260 OSC801

2804-001492 U1102

2904-001410 F1003

2909-001191 U1005

SEC Code Design LOC

3404-001152 CAM_MENU,VOL_DN

3404-001152 VOL_UP

3705-001226 CN1001

3709-001187 CN100

3710-001673 CN300

3711-004621 U201

3711-005078 CN200

3711-005079 CN1101

3722-001715 CN401

4302-001130 M1

GH09-00023A U601

GH13-00018A U1101

GH71-00434A ANT1

Page 42: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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6. SGH-P408 Block Diagrams

This Document can not be used without Samsung's authorization

6-1

1. RF Solution Block Diagram

Antenna

ASM

RF

FILTER

RF

FILTER

SI4200

SI4133T

π/ 2

RF

PLL

PGA

SERIAL DATA

INTERFACE

GSM:890MHz~915MHz

PCS:1850MHz~1910MHz

PAM

GSM:925MHz~960MHz

PCS:1930MHz~1990MHz

I,Q

CSP1093 TRIDENT

DSP16000

ARM7TDMI

UI

SERIAL

DATA,

CLK,

LE

RF

FILTER

DCS:1805MHz~1880MHz

L

N

APGA

A D C

A D C

IF

PLL

DCS:1710MHz~1785MHz

D E T

100KHz

CHANNEL

FILTER

D A C

D A C

PGA

PGA

R X

TCVCXO13 MHz

C L K

A F C

T X

I,Q

SI4201

Page 43: Samsung SGH-P408 service manual - Freedeblocage77.free.fr/sam/root/Samsung SGH-P408 service manual.pdf · Chip select signals of EMI part in the trident, CLCD_EN_FO and GLCD_EN_FO,

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SGH-P408 Block Diagrams

This Document can not be used without Samsung's authorization

6-2

2. Base Band Solution Block Diagram

TRIDENT

B'D B'D conn.

Audio

Keypad

LCD

Memory part

X-TAL32.768KHz

RF SOLUTION

- RF IC- PAM- MAIN VCO- TX VCO- IF VCO

GPIO

POWER

(DC/DC,CHARGER,

SIM)

X-TAL

13MHz

RS232

CSP1093

Audio Part

LCD

KEYBOARD

SRAM

(16M)

FLASHROM

(128M)

TXIPTXINTXQPTXQNRXIPRXINRXQPRXQNSERCKSERLESERDARFOVLTXPOCTL

<RF DIRVER>TXI/QRX I/QTXP

SERCKSERLESERDAOCTL

IORWN

AB[8:0]DB[15:0]

INT1IRQxPAxRSTB

IORWN

AB[8:0]DB[15:0]

INT1IRQxPAxRSTB

ARM

JTAG/ICE

DAICKDAIRNDAIDODAIDI

DAIDSPJTAG JTAG

GPRS

ACC

PPI(Programmable

Peripheral I/O)

RTC

JTAG/ICE

DSP16000

ARM7TDMI

EMI

Camera Solution

Camera DSPCamera Asic

CCD

Y[0:7]UV[0:7]PCLK

Y[0:7]UV[0:7]PCLK

CAM_D[0:15]CAM_A

CAM_WENCAM_CLCD_EN

NSUB_DCNSUB_PLUS

CINSVDD

D[0:15]CP_OENCP_WENCAM_INTCLCD_EN

CCD conn.