Samsung Galaxy S9 Processors Packages...Company Profile & Supply Chain o Samsung o Galaxy S...
Transcript of Samsung Galaxy S9 Processors Packages...Company Profile & Supply Chain o Samsung o Galaxy S...
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 1
22 Boulevard Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Samsung Galaxy S9 Processors PackagesSamsung Exynos 9810 vs. Qualcomm Snapdragon 845Packaging report by Stéphane ELISABETHJune 2018 – version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o APE I/O vs.Footprint/Line-Space Comparison
o Reverse Costing Methodology
Company Profile 11
o Samsung
o Galaxy Series – Processors
o Galaxy Series – APE Die
o Qualcomm
o Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 Specifications
o Package-on-Package Technology
o Samsung Galaxy S9+ Teardown – SM-965F/N & SM-965U
Physical Analysis (Exynos 9810 & Snapdragon 845) 26
o Summary of the Physical Analysis 27
o Packaging 30
Package Memory: X-Ray view & Marking
Package Views, Marking & Dimensions
Package PCB Deprocessing
Package Opening
Board Cross-Section: mSAP vs. Subtractive PCB, Dimensions
Package Cross-Section: TMV, Cu Core, Molding, Capacitors
Summary of Physical Data
o Application Processor 64
Die Views, Marking & Dimensions
Die Cross-Section
Die Process Characteristics
Physical Comparison 76
o Samsung Exynos 9810 vs. Snapdragon 845
o Samsung’s APE
o Qualcomm’s APE
o APE’s PoP Technology: iPoP, MCeP, inFO, HBW PoP
Manufacturing Process 82
o APE Die Front-End Process & Fabrication Unit
o Packaging Process Flow & Fabrication unit
Cost Analysis 117
o Summary of the cost analysis 118
o Yields Explanation & Hypotheses 119
o APE die 122
Wafer & Die Front-End Cost
Preparation Wafer Cost
o Packaging 130
Panel Cost
Front-End Cost per Process Steps
Component Cost
Customer Feedback 134
Company services 136
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 3
Overview / Introductiono Executive Summaryo APE Comparisono Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Executive Summary
• Depending on the World region, the Samsung Galaxy S9 Plus has several differences. The international version features an Exynos 9810 chipset with mSAP technology for the main board PCB while the US version features the Snapdragon 845 Chipset with standard main board PCB.
• The Exynos 9810 is an embedded die package with in-house packaging technology, using two moldings to improve the well-known Through Molded Via (TMV) technology. In the previous generation of the 800 series, Qualcomm has always used Shinko’s MCeP packaging Technology. In this report, we will show the differences and the innovation of both packages, including molding compound, substrate, decoupling capacitors. The detailed comparison between both APE packages will give the pros and the cons of the PoP technologies.
• This report reviews the Exynos 9810 and the Snapdragon 845, including a complete package analysis, cost analysis, and price estimate for the chips. Also included is a physical and cost comparison of the different solutions. Finally, it features a technical and physical comparison between the previous generation of the Exynosand the Snapdragon Series, and the other APE packaging solution from Huawei and Apple.
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 4
Overview / Introductiono Executive Summaryo APE Comparisono Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Executive Summary
• Two references of application processors has been analyzed.
End-users OEM
Device Integration
Componentprovider
Packaging Assembly & test Services
Packaging Technology
Footprint(mm²)
DieManufacturer
Die Area(mm²)
I/ONumber
PCB/RDLMinimumL/S (µm)
Pitch (mm)
SamsungGalaxy S9
Series
Samsung Samsung FC-PoP14.9 x 13.4
(198)Samsung
11.5x10.5(121)
1,131 11/11 0.4
Qualcomm Shinko MCeP12.4 x 12.4
(154)9.77x9.14
(90)911 10/10 0.4
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 5
Overview / Introductiono Executive Summaryo APE Comparisono Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Application Processor I/O Count & Footprint
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 6
Overview / Introduction
Company Profile & Supply Chain o Samsungo Galaxy S – Processors o Galaxy S – APE Die o Qualcommo Exynos 9810 vs. S845o Galaxy S9+ Teardown
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Samsung Galaxy S9 Plus Teardown
Samsung Galaxy S9+ Opened View©2018 by System Plus Consulting
Samsung Galaxy S9+ Opened View©2018 by System Plus Consulting
Copper Heatsink Pipe
Heat dissipation cover
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 7
Overview / Introduction
Company Profile & Supply Chain o Samsungo Galaxy S – Processors o Galaxy S – APE Die o Qualcommo Exynos 9810 vs. S845o Galaxy S9+ Teardown
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Samsung Galaxy S9 Plus Teardown – EU Version – SM-G965F/N
Samsung Galaxy S9+ Main Board©2018 by System Plus Consulting
Front View
Back View
APE Exynos 8
RFFE
RF Transceiver
The Exynos 9810 application processor is under the SDRAM chip in PoP mode (Package on Package).
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 8
Overview / Introduction
Company Profile & Supply Chain o Samsungo Galaxy S – Processors o Galaxy S – APE Die o Qualcommo Exynos 9810 vs. S845o Galaxy S9+ Teardown
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Samsung Galaxy S9 Plus Teardown – US Version – SM-G965U
Samsung Galaxy S9+ Main Board©2018 by System Plus Consulting
Front View
Back View
APE Snapdragon 845
RFFE
RF Transceiver
The Snapdragon 845 application processor is under the SDRAM chip in PoP mode (Package on Package).
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
APE Assembly©2018 by System Plus Consulting
Summary of the Physical Analysis
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Exynos 9810 – Package Views & Dimensions
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Exynos 9810 – Package Opening
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Exynos 9810 – Board Cross-section – PCB substrate
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Exynos 9810 – Package Cross-section
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Summary of Physical Data
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Snapdragon 845 – Package Cross-section
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso SM-G965F/N
o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary
o Application Processor Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Exynos 9810 – Die Cross-Section – CMOS Transistor
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Exynos 9810 vs. S845o Samsung’s APEo Qualcomm’s APEo APE’s PoP Technology
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
Package Comparison – Samsung’s APE
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Exynos 9810 vs. S845o Samsung’s APEo Qualcomm’s APEo APE’s PoP Technology
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
OEMs Package Comparison – PoP Technology
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chain o Yield hypothesiso APE Wafer & Die Costo Packaging Cost
Feedbacks
About System Plus
Packaging Cost
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING• Qualcomm VIVE® QCA9500 High Density WiGig/WiFi802.11ad Chipset for the 60 GHz Band• Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X• NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• Status of Panel Level Packaging 2018• Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrate Like PCB Trends• Status of the Advanced Packaging Industry 2017• Equipment and Materials for Fan-Out Packaging 2017
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 21
COMPANYSERVICES
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
Contact
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve LAFERRIEREEastern [email protected]
Troy BLANCHETTEWestern [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi [email protected]
Mavis WANGGREATER [email protected]
NANTESHeadquarter
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
ORDER FORM
Please process my order for “Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP” Reverse Costing® – Structure, Process & Cost Report Ref: SP18406
Full Structure, Process & Cost Report : EUR 3,490*
Annual Subscription offers possible from 3 reports, including this report as the first of the year. Contact us for more information.
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP• In EUR
Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439
• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797
Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING
22, bd Benoni GoullinNantes Biotech44200 Nantes – France
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: June 2018
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTSAMSUNG’S GALAXY S9 PLUS PROCESSOR PACKAGES
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas -Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
1. INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2. PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.
3. REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.
4. TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the
total invoice amount when placing his order.
5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6. DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.
7. ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).
8. FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
9. CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10. RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.
11. APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES