Russell Peak Senior Researcher Manufacturing Research Center Georgia Tech

Techniques and Tools for Product-Specific Analysis TemplatesTowards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics

Russell Peak

Senior Researcher

Manufacturing Research Center

Georgia Tech

2002 International Conference on Electronics Packaging (ICEP)JIEP/ IMAPS Japan, IEEE CPMT Japan Chapter

Dai-ichi Hotel Seafort, Tokyo, JapanApril 17-19, 2002

http://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/

2

Abstracthttp://eislab.gatech.edu/pubs/conferences/2002-jiep-icep-peak/

Techniques and Tools for Product-Specific Analysis TemplatesTowards Enhanced CAD-CAE Interoperability for Simulation-Based Design and Related Topics

Design engineers are becoming increasingly aware of “analysis template” pockets that exist in their product domain. For example, thermal resistance and interconnect reliability analysis are common templates for electronic chip packages, while tire-roadway templates exist to verify handling, durability, and slip requirements. Such templates may be captured as paper-based notes and design standards, as well as loosely structured spreadsheets and electronic workbooks. Often, however, they are not articulated in any persistent form.

Some CAD/E software vendors are offering pre-packaged analysis template catalogs like the above; however, they are typically dependent on a specific toolset and do not present design-analysis idealization associativity to the user. Thus, it is difficult to adapt, extend, or transfer analysis template knowledge. As noted in places like the 2001 International Technology Roadmap for Semiconductors (ITRS), domain- and tool-independent techniques and related standards are necessary.

This paper overviews infrastructure needs and emerging analysis template theory and methodology that addresses such issues. Patterns that naturally exist in between traditional CAD and CAE models are summarized, along with their embodiment in a knowledge representation known as constrained objects. Industrial applications for airframe structural analysis, circuit board thermomechanical analysis, and chip package thermal resistance analysis are noted.

This approach enhances knowledge capture, modularity, and reusability, as well as improves automation (e.g., decreasing total simulation cycle time by 75%). The object patterns also identify where best to apply information technologies like STEP, XML, CORBA/SOAP, and web services. We believe further benefits are possible if these patterns are combined with other efforts to enable ubiquitous analysis template technology. Trends and needs towards this end are discussed, including analogies with electronics like JEDEC package standards and mechanical subsystems.

3

Nomenclature ABB-SMM transformation idealization relation between design and analysis attributes APM-ABB associativity linkage indicating usage of one or more i

ABB analysis building blockAMCOM U. S. Army Aviation and Missile CommandAPM analyzable product modelCAD computer aided designCAE computer aided engineeringCBAM context-based analysis modelCOB constrained objectCOI constrained object instanceCOS constrained object structureCORBA common ORB architectureDAI design-analysis integrationEIS engineering information systemsESB engineering service bureauFEA finite element analysisFTT fixed topology templateGUI graphical user interfaceIIOP Internet inter-ORB protocolMRA multi-representation architectureORB object request brokerOMG Object Management Group, www.omg.comPWA printed wiring assembly (a PWB populated with components)PWB printed wiring boardSBD simulation-based designSBE simulation-based engineeringSME small-to-medium sized enterprise (small business)SMM solution method modelProAM Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)PSI Product Simulation Integration project (Boeing)STEP Standard for the Exchange of Product Model Data (ISO 10303).VTMB variable topology multi-bodyXAI X-analysis integration (X= design, mfg., etc.)XCP XaiTools ChipPackage™

XFW XaiTools FrameWork™

XPWAB XaiTools PWA-B™

4

Contents

Motivation Introduction to Information Modeling and

Knowledge Representation Analysis Template Applications International Collaboration on Engineering

Frameworks Recommended Solution Approach

5

Motivation: Product ChallengesTrend towards complex multi-disciplinary systems

Source: www.ansys.com

MEMS devices

3D interconnects

http://www.zuken.com/solutions_board.asp

Demanding End User Applications

6

Motivation: Engineering Tool Challenges2001 International Technology Roadmap for Semiconductors (ITRS)

http://public.itrs.net/Files/2001ITRS/Home.htm

Design Sharing and Reuse– Tool interoperability– Standard IC information model– Integration of multi-vendor and internal design

technology– Reduction of integration cost

Simulation module integration– Seamless integration of simulation modules – Interplay of modules to enhance design effectiveness

7

Advances Needed in Engineering Frameworks2001 International Technology Roadmap for Semiconductors (ITRS)

http://public.itrs.net/Files/2001ITRS/Home.htm

8

AnalogyPhysical Integration Modules Model Integration Frameworks

Multidisciplinary challenges require innovative solution approaches

RF, Digital, Analog, Optical, MEMS

Wafer Level PackagingSystem-On-a-Package (SOP)

Stacked Fine-Pitch BGA

www.shinko.co.jp

www.prc.gatech.edu

2001 ITRS

Design System Architecture

9

Interoperability

Requires techniques beyond traditional engineering– Information models

» Abstract data types» Object-oriented languages (UML, STEP Express, …)

– Knowledge representation» Constraint graphs, rules, …

– Web/Internet computing» Middleware, agents, mobility, …

Emerging field: engineering information methods– Analogous to CAD and FEA methods

Seamless communication between people, their models, and their tools.

10

Contents




11

“Collaborative Modeling” vs. “Tool Usage”

Existing Tools

Tool A1 Tool An...Content

Coverage Gaps

IntegrationGaps

Product Model - integrated information model- knowledge representation

12

Example Information Model in Express (ISO 10303-11) spring system tutorial

SCHEMA spring_systems;

ENTITY spring; undeformed_length : REAL; spring_constant : REAL; start : REAL; end0 : REAL; length0 : REAL; total_elongation : REAL; force : REAL;END_ENTITY;

ENTITY two_spring_system; spring1 : spring; spring2 : spring; deformation1 : REAL; deformation2 : REAL; load : REAL;END_ENTITY;

END_SCHEMA;

FF

k

L

deformed state

Lo

L

x2x1

P

k1 k2

2u1u

13

Instance Model and Example Application

spring system tutorial

Fragment from an instance model - (a.k.a. Part 21 “STEP File” - ISO 10303-21)#1=TWO_SPRING_SYSTEM(#2,#3,1.81,3.48,10.0);#2=SPRING(8.0,5.5,0.0,9.81,9.81,1.81,10.0);#3=SPRING(8.0,6.0,9.8,19.48,9.66,1.66,10.0);

14

PWB Stackup Design & Analysis Tool

15

Application-Oriented Information Model - Express-G notation PWB Stackup Design & Analysis Tool

16

Contents




17

Analysis Template Catalog:Chip Package Simulation

thermal, hydro(moisture), fluid dynamics(molding), mechanical and electrical behaviors PakSi-TM and PakSi-E tools

http://www.icepak.com/prod/paksi/ as of 10/2001 Chip package-specific behaviors:

thermal resistance, popcorning, die cracking, delaminating, warpage & coplanarity, solder joint fatigue, molding, parasitic parameters extraction, and signal integrity

18

Analysis Template Methodology & X-Analysis Integration Objectives (X=Design, Mfg., etc.)

Goal:Improve engineering processes via analysis templates

with enhanced CAx-CAE interoperability Challenges (Gaps):

– Idealizations & Heterogeneous Transformations– Diversity: Information, Behaviors, Disciplines, Fidelity, Feature Levels, CAD/CAE

Methods & Tools, …– Multi-Directional Associativity:

DesignAnalysis, Analysis Analysis Focus:

Capture analysis template knowledge for modular, regular design usage

Approach: Multi-Representation Architecture (MRA)

using Constrained Objects (COBs)

19

X-Analysis Integration Techniquesfor CAD-CAE Interoperability

http://eislab.gatech.edu/tools/XaiTools/

a. Multi-Representation Architecture (MRA)

1 Solution Method Model

ABB SMM

2 Analysis Building Block

4 Context-Based Analysis Model3

SMMABB

APM ABB

CBAM

APM

Design Tools Solution Tools

Printed Wiring Assembly (PWA)

Solder Joint

Component

PWB

body3body2

body1

body4

T0

Printed Wiring Board (PWB)

SolderJoint

Component

AnalyzableProduct Model

b. Explicit Design-Analysis Associativity

c. Analysis Module Creation Methodology

I n f o r m a l A s s o c i a t i v i t y D i a g r a m

C o n s t r a i n e d O b j e c t - b a s e d A n a l y s i s M o d u l eC o n s t r a i n t S c h e m a t i c V i e w

P l a n e S t r a i n B o d i e s S y s t e m

P W A C o m p o n e n t O c c u r r e n c e

CL

1

m a t e r i a l ,E( , )g e o m e t r y

b o d y

p l a n e s t r a i n b o d y , i = 1 . . . 4P W B

S o l d e rJ o i n t

E p o x y

C o m p o n e n tb a s e : A l u m i n a

c o r e : F R 4

S o l d e r J o i n t P l a n e S t r a i n M o d e l

t o t a l h e i g h t , h

l i n e a r - e l a s t i c m o d e l

A P M A B B

3 A P M 4 C B A M

2 A B Bc

4b o d y 3b o d y

2b o d y

1h oT

p r i m a r y s t r u c t u r a l m a t e r i a l

ii

i

1 S M M

D e s i g n M o d e l A n a l y s i s M o d e l

A B B S M M

s o l d e rs o l d e r j o i n t

p w b

c o m p o n e n t

1 . 2 5

d e f o r m a t i o n m o d e l

t o t a l h e i g h t

d e t a i l e d s h a p e

r e c t a n g l e

[ 1 . 2 ]

[ 1 . 1 ]

a v e r a g e

[ 2 . 2 ]

[ 2 . 1 ]

cT c

T s

i n t e r - s o l d e r j o i n t d i s t a n c ea p p r o x i m a t e m a x i m u m

s j

L s

p r i m a r y s t r u c t u r a l m a t e r i a l

t o t a l t h i c k n e s s


P l a n e S t r a i n

g e o m e t r y m o d e l 3

a

s t r e s s - s t r a i nm o d e l 1



B o d i e s S y s t e m

x y , e x t r e m e , 3

T 2

L 1

T 1

T 0

L 2

h 1

h 2

T 3

T s j

h s

h c

L c

x y , e x t r e m e , s jb i l i n e a r - e l a s t o p l a s t i c m o d e l


p r i m a r y s t r u c t u r a l m a t e r i a l l i n e a r - e l a s t i c m o d e l

c o m p o n e n to c c u r r e n c e

s o l d e r j o i n ts h e a r s t r a i nr a n g e

[ 1 . 2 ]

[ 1 . 1 ]l e n g t h 2 +

3 A P M 2 A B B 4 C B A M

F i n e - G r a i n e d A s s o c i a t i v i t y

ProductModel Selected Module

Analysis Module Catalogs

MCAD

ECAD

Analysis Procedures

CommercialAnalysis Tools

Ansys

Abaqus

Solder Joint Deformation Model

Idealization/Defeaturization

CommercialDesign Tools

PWB

Solder Joint

Component

APM CBAM ABB SMM

Ubiquitous Analysis(Module Usage)

Ubiquitization(Module Creation)

CAE

Physical Behavior Research,Know-How, Design Handbooks, ...

20

COB-based Constraint Schematic for Multi-Fidelity CAD-CAE Interoperability

Flap Link Benchmark Example

Material Model ABB:

Continuum ABBs:

E

One D LinearElastic Model

T

G

e

t

material model

polar moment of inertia, J

radius, r

undeformed length, Lo

twist,

theta start, 1

theta end, 2

r1

12

r3

0L

r

J

rTr

torque, Tr

x

TT

G, r, , ,J

Lo

y

material model

temperature, T

reference temperature, To

force, F

area, A


total elongation,L

length, L

start, x1

end, x2

E

One D LinearElastic Model

(no shear)

T

e

t

r1

12 xxL

r2

oLLL

r4

A

F

edb.r1

oTTT

r3

L

L

x

FF

E, A,

LLo

T, ,

yL

Torsional Rod

Extensional Rod

temperature change,T

cte,

youngs modulus, E

stress,

shear modulus, G

poissons ratio,

shear stress, shear strain,

thermal strain, t

elastic strain, e

strain,

r2

r1)1(2

EG

r3

r4Tt

Ee

r5

G

te

1D Linear Elastic Model

material

effective length, Leff

linear elastic model

Lo

Extensional Rod(isothermal)

F

L

A

L

E

x2

x1

youngs modulus, E

cross section area, A

al1

al3

al2

linkage

mode: shaft tension

condition reaction

allowable stress

stress mos model

Margin of Safety(> case)

allowable

actual

MS

Analysis Modules of Diverse Behavior & Fidelity

(CBAMs) MCAD Tools

Materials LibrariesIn-House, ...

FEA Ansys

Abaqus*

CATIA Elfini*

MSC Nastran*

MSC Patran*

...

General MathMathematica

Matlab*

MathCAD*

...

Analyzable Product Model(APM)

Extension

Torsion

1D

1D

Analysis Building Blocks(ABBs)

CATIA, I-DEAS* Pro/E* , UG *, ...

Analysis Tools(via SMMs)

Design Tools

2D

flap_link

critical_section

critical_simple

t2f

wf

tw

hw

t1f

area

effective_length

critical_detailed

stress_strain_model linear_elastic

E

cte area

wf

tw

hw

tf

sleeve_1

b

h

t

b

h

t

sleeve_2

shaft

rib_1

material

rib_2

w

t

r

x

name

t2f

wf

tw

t1f

cross_section

w

t

r

x

R3

R2

R1

R8

R9

R10

6R

R7

R12

11R

1R

2

3

4

5

R

R

R

R

name

linear_elastic_model

wf

tw

tf

inter_axis_length

sleeve_2

shaft

material

linkage

sleeve_1

w

t

r

E

cross_section:basic

w

t

rL

ws1

ts1

rs2

ws2

ts2

rs2

wf

tw

tf

E

deformation model

x,max

ParameterizedFEA Model

stress mos model


allowable

actual

MS

ux mos model


allowable

actual

MS

mode: tensionux,max

Fcondition reaction

allowable inter axis length change

allowable stress

ts1

B

sleeve1

B ts2

ds2

ds1

sleeve2

L

shaft

Leff

s

rib1 rib2

material

effective length, Leff

deformation model

linear elastic model

Lo

Torsional Rod

G

J

r

2

1

shear modulus, G

cross section:effective ring polar moment of inertia, J

al1

al3

al2a

linkage

mode: shaft torsion

condition reactionT

outer radius, ro al2b

stress mos model

allowable stress

twist mos model


allowable

actual

MS


allowable

actual

MS

allowabletwist

Flap Link Extensional Model

Flap Link Plane Strain Model

Flap Link Torsional Model* = Item not yet available in toolkit (all others have working examples)

Parts LibrariesIn-House*, ...

LegendTool AssociativityObject Re-use

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An Introduction to X-Analysis Integration (XAI) Short Course Outline

Part 1: Constrained Objects (COBs) Primer– Nomenclature

Part 2: Multi-Representation Architecture (MRA) Primer – Analysis Integration Challenges – Overview of COB-based XAI

Part 3: Example Applications» Airframe Structural Analysis (Boeing)» Circuit Board Thermomechanical Analysis

(DoD, JPL/NASA)» Chip Package Thermal Analysis (Shinko)

– Summary

Part 4: Advanced Topics & Current Research

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Chip Package Products Shinko

Plastic Ball Grid Array (PBGA) Packages

Quad Flat Packs (QFPs)

23

Flexible High Diversity Design-Analysis Integration

Electronic Packaging Examples: Chip Packages/Mounting Shinko Electric Project: Phase 1 (completed 9/00)

EBGA, PBGA, QFP

CuGround

PKG

Chip

Analysis Modules (CBAMs) of Diverse Behavior & Fidelity

FEAAnsys

General MathMathematica

Analyzable Product Model

XaiTools

XaiToolsChipPackage

ThermalResistance

3D

Modular, ReusableTemplate Librariestemperature change,T

material model

temperature, T

reference temperature, To

cte,

youngs modulus, E

force, F

area, A stress,


strain,

total elongation,L

length, L

start, x1

end, x2

mv6

mv5

smv1

mv1mv4

E

One D LinearElastic Model(no shear)

T

e

t

thermal strain, t

elastic strain, e

mv3

mv2

x

FF

E, A,

LLo

T, ,

yL

r1

12 xxL

r2

oLLL

r4

A

F

sr1

oTTT

r3L

L

m a t e r i a l

e f f e c t i v e l e n g t h , L e f f

d e f o r m a t i o n m o d e l

l i n e a r e l a s t i c m o d e l

L o

T o r s i o n a l R o d

G

J

r

2

1

s h e a r m o d u l u s , G

c r o s s s e c t i o n :e f f e c t i v e r i n g p o l a r m o m e n t o f i n e r t i a , J

a l 1

a l 3

a l 2 a

l i n k a g e

m o d e : s h a f t t o r s i o n

c o n d i t i o n r e a c t i o n

t s 1

A

S l e e v e 1

A t s 2

d s 2

d s 1

S l e e v e 2

L

S h a f t

L e f f

s

T

o u t e r r a d i u s , r o a l 2 b

s t r e s s m o s m o d e l

a l l o w a b l e s t r e s s

t w i s t m o s m o d e l

M a r g i n o f S a f e t y( > c a s e )

a l l o w a b l e

a c t u a l

M S

M a r g i n o f S a f e t y( > c a s e )

a l l o w a b l e

a c t u a l

M S

a l l o w a b l et w i s t Analysis Tools

Design Tools

PWB DB

Materials DB*

Prelim/APM Design ToolXaiTools ChipPackage

ThermalStress

Basic3D**

** = Demonstration module

BasicDocumentation

AutomationAuthoringMS Excel

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COB-based Analysis TemplateTypical Highly Automated Results

FEATemperature Distribution

Thermal Resistancevs.

Air Flow Velocity

Auto-CreatedFEA Inputs

(for Mesh Model)

Analysis Module Tool

COB = constrained

object

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Pilot & Initial Production Usage Results

Product Model-Driven Analysis

Analysis Model Creation ActivityWith TraditionalPractice

With VTMBMethodology* Example

Create initial FEA model (QFP cases) 8-12 hours 10-20 minutes QFP208PIN

Create initial FEA model (EBGA cases) 6-8 hours 10-20 minutes EBGA352PIN

Create initial FEA model (PBGA cases) 8-10 hours 10-20 minutes PBGA256PIN

Create variant - small topology change 0.3-6 hours (10-20 minutes) - Moderate dimension change

(e.g., EBGA 600 heat sink size variations)

Create variant - moderate topology change (6-8 hours)- (10-20 minutes) - Add more features

(e.g., increase number of EBGA steps)

Create variant - large topology change (6-8 hours)+ (10-20 minutes)-or N/A

Add new types of features

(e.g., add steps to EBGA outer edges)

Reduced FEA modeling time > 10:1 (days/hours minutes) Reduced simulation cycle > 75%

Enables greater analysis intensity Better designs Leverages XAI / CAD-CAE interoperability techniques

– Objects, Internet/web services, ubiquitization methodology, …

References[1] Shinko 5/00 (in Koo, 2000)[2] Shinko evaluation 10/12/00

VTMB = variable topology multi-body technique [Koo, 2000]

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Analysis Template Merits Provides methodology for bridging associativity gap Multi-representation architecture (MRA)

& constrained objects (COBs):– Address fundamental issues

» Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained

– Enable analysis template methodology Flexibility & broad application

Increase quality, reduce costs, decrease time (ex. 75%):» Capture engineering knowledge in a reusable form » Reduce information inconsistencies» Increase analysis intensity & effectiveness

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Contents




28

Product Enclosure

ExternallyVisible Connectors

Printed Circuit Assemblies

Die

Package

Packaged Part

InterconnectAssembly

Printed Circuit Substrate

Die

Adapted from Rockwell Collins Inc.

Today: - Monolithic software applications; Few interchangeable “parts” Next Steps: - Identify other formal patterns and use cases

(natural subsystems / levels of “packaging”)

- Define standard architectures and interfaces among subsystems

Towards Greater Standards-Based Interoperability Target Analogy with Electronics Systems

Generic Geometric Modeling Tools,Math Tools, FEA Tools,

Requirements & Function Tools, … Product-SpecificSimulation-Based

Design Tools

Linkages to OtherLife Cycle Models

Extended MRA

SMMs

ABBs

CBAMs

APMs

Middleware

Russell Peak - Georgia Tech, Atlanta GA, USA

Mike Dickerson - JPL/NASA, Pasadena CA, USA

Lothar Klein - LKSoft, Kuenzell, Germany

Steve Waterbury - NASA-Goddard, Greenbelt MD, USA

Greg Smith - Boeing, Seattle WA, USA

Tom Thurman - Rockwell Collins, Cedar Rapids IA, USA

Jim U'Ren - JPL/NASA, Pasadena CA, USA

Ken Buchanan - ATI/PDES Inc., Charleston SC, USA

Progress on Standards-Based Engineering Frameworks that include STEP AP210 (Electronics), PDM Schema, and AP233 (Systems)

An Engineering Framework Interest Group (EFWIG) Overview

2002 NASA-ESA Workshop onAerospace Product Data Exchange

ESA/ESTEC, Noordwijk (ZH), The NetherlandsApril 9-12, 2002 ISO 10303 series

30

Scope of Engineering Framework Interest Group A PDES Inc. Systems Engineering Subproject

http://eislab.gatech.edu/efwig/

Interoperability in multi-disciplinary engineering development environments– Emphasis dimensions:

» Organizational Level: engineering group/department» Domains: systems & s/w engineering, electromechanical, analysis» Design stages: WIP designs at concept, preliminary, and detailed

stages

– Awareness of design interfaces to other life cycle phases: » pursuit & order capture, mfg., operation/service, and disposal

An international consortium for standards-based collaborative engineering

http://pdesinc.aticorp.org/

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User/Owner/Operator

Acquisition Authority

Systems Engineering

Management Marketing

User/Owner/Operator

Business Strategy Concept RFP Proposal Contract

Management InfoManagement Info

Mechanical ElectricalChemical

Digital

Civil

Controls

Communications

LogisticsMaintenance

Manufacture

STEPISO SC4

Specifications

Software

UMLISO SC7

EngineeringDisciplines

What is the context of Systems Engineering?

2002-04 - Mike Dickerson, NASA-JPL

32

Spacecraft Development Using ISO 10303 and Other Standards

Mechanical Engineering• Standard: AP203, AP214• Software Pro-E, Cadds, SolidWorks, AutoCad, SDRC IDEAS, Unigraphics, others• Status: In Production• Aerospace Industry Wide, Automotive Industry

Electrical Engineering• Standard: AP210• Software Mentor Graphics• Status: Prototyped• Rockwell, Boeing

Cabling• Standard: AP212• Software MentorGraphics• Status: Prototyped• Daimler-Chrysler, ProSTEP

Structural Analysis• Standard: AP209• Software: MSC Patran, Thermal Desktop• Status: In Production• Lockheed Martin, Electric Boat

Thermal Radiation Analysis• Standard: STEP-TAS• Software: Thermal Desktop, TRASYS• Status: In Production• ESA/ESTEC, NASA/JPL & Langely

Software Engineering• Standard::UML - (AP233 interface In Development)• Software:Rational Rose, Argo, All-Together• Status: In Production• Industry-wide

Machining• Standard:: STEP-NC/AP224•Software:: Gibbs, •Status:: In Development / Prototyped•STEP-Tools, Boeing

Inspection• Standard: AP219• Software: Technomatics, Brown, eSharp • Status: In Development• NIST, CATIA, Boeing, Chrysler, AIAG

Systems Engineering• Standard: AP233• Software: Statemate, Doors, Matrix-X, Slate, Core, RTM• Status: In development / Prototyped• BAE SYSTEMS, EADS, NASA

PDM• Standard: STEP PDM Schema/AP232• Software: MetaPhase, Windchill, Insync• Status: In Production • Lockheed Martin, EADS, BAE SYSTEMS, Raytheon

Life-Cycle Management• Standard: PLCS• Software: SAP • Status: In Development• BAE SYSTEMS, Boeing, Eurostep

File: SLIDE_STEP-in-Spacecraft-Development-Ver4.ppt

Fluid Dynamics• Standard: CFD• Software - • Status: In Development• Boeing,

Optics• Standard: NODIF• Software - TBD • Minolta, Olympus

Propulsion• Standard: STEP-PRP• Software:- • Status: In Development• ESA, EADS

2001-12-16 - Jim U’Ren, NASA-JPL

33

Product Enclosure

External Interfaces

Printed Circuit Assemblies(PCAs/PWAs)

Die/Chip Package

Packaged Part

InterconnectAssembly

Printed Circuit Substrate (PCBs/PWBs)

Die/Chip

STEP AP 210 (ISO 10303-210) Domain: Electronics DesignR

~800 standardized concepts (many applicable to other domains)Development investment: O(100 man-years) over ~10 years

Adapted from 2002-04 - Tom Thurman, Rockwell-Collins

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Rich Features in AP210: PWB tracesAP210 STEP-Book Viewer - www.lksoft.com

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Rich Features in AP210: Via/Plated Through Hole

Z-dimension details …

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Rich Features in AP210: Electrical Component

The 3D shape is generated from these “smart features” which have electrical functional knowledge. Thus, the AP210-based model is much richer than a typical 3D MCAD package model.

210 can also support the detailed design of a package itself (its insides, including electrical functions and physical behaviors).

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Rich Features in AP210: 3D PCB Assembly

38

PWA/PWB Assembly Simulation using AP210

Rules (FromDefinitionFacility)

Generic Manufacturing Equipment Definitions

SpecificManufacturing Equipment Used

User Alerted on Exceptions to ProducibilityGuidelines

2002-03 - Tom Thurman, Rockwell-Collins

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AnalogyPhysical Integration Modules Model Integration Frameworks

Challenge:Integrating

DiverseTechnologies

RF, Digital, Analog, Optical, MEMS

Wafer Level PackagingSystem-On-a-Package (SOP)

Stacked Fine-Pitch BGA

www.shinko.co.jp

www.prc.gatech.edu

2001 ITRS

Design System Architecture

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Recommended Solution Approach Philosophy: Consider engineering design environments

as analogous to electronic packaging systems Leverage international collaboration with other industries Follow systems engineering approach

– Decompose problem into subsystems» Architectures, components (standards, tools, …), and techniques

– Identify & define gaps– Identify existing solutions where feasible– Define solution paths

» Identify who will “supply”/develop these “components”– Develop & prototype solutions– Advocate solution standardization and vendor support– Test in pilots– Deploy in production usage

Russell Peak Senior Researcher Manufacturing Research Center Georgia Tech

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Transcript of Russell Peak Senior Researcher Manufacturing Research Center Georgia Tech