RTC Magazine

An RTC Group Publication

The magazine of record for the embedded computing industry

www.rtcmagazine.comJuly 2011

Java and Android Add Power to Embedded

Small Modules in Powerful Medical Systems

SCADA Systems Add Integrated Security

THE RIGHT FIT

SMALL FORM FACTORS:FINDING

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RTC MAGAZINE JULY 2011 3

TABLEOFCONTENTSVOLUME 20, ISSUE 7

Digital Subscriptions Avaliable at http://rtcmagazine.com/home/subscribe.php

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Technology in conTexTSorting out Small Form Factors

The Right COM for the Right App: Sorting out Small Form FactorsDan Demers, congatec US

Graphics Performance Drives Ever More Capable Small Form Factor DesignsChristine Van De Graaf, Kontron

Technology connecTeDSupervisory Control Systems

SCADA Security for Critical InfrastructureFrank Dickman

Technology in SySTeMSEmbedded Java and Android

Android—Google’s Mobile Platform and its Capabilities for EmbeddedBill Weinberg, LinuxPundit.com and Olliance Group

Real-Time Java Virtual Machine Undergoes OverhaulKelvin Nilsen, Atego Systems

Technology DePloyeDSmall Modules in Medical Devices

Challenges and Opportunities for the Medical Device Industry: Meeting the New IEC 62304 StandardMartin Bakal, IBM Rational

Modules Mobilize Medical CareColin McCracken, American Portwell Technology

DeParTMenTS

EditorialThe Changing Face of Embedded

Industry InsiderLatest Developments in the Embedded Marketplace

Small Form Factor ForumWhere Have All the RTOSs Gone?

Products & TechnologyNewest Embedded Technology Used by Industry Leaders

eDiTor’S rePorTThe Growth of Wireless Connectivity

Wi-Fi to Become Even More Versatile and UbiquitousTom Williams

55Compact and Rugged Fanless Embedded Computer with 100G Shock Resistance

53Mini-ITX Platform Provides Multiple Displays for Signage and Gaming

3U OpenVPX PCI Express and Ethernet Hybrid Switch Offers up to Ten Times More Bandwidth

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SMALL FORM FACTORS:Finding the Right Fit

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4 JULY 2011 RTC MAGAZINE

Publisher PRESIDENT John Reardon, [email protected]

Editorial

EDITOR-IN-CHIEF Tom Williams, [email protected]

CONTRIBUTING EDITORS Colin McCracken and Paul Rosenfeld

MANAGING EDITOR Marina Tringali, [email protected]

COPY EDITOR Rochelle Cohn

Art/Production

CREATIVE DIRECTOR Jason Van Dorn, [email protected]

ART DIRECTOR Kirsten Wyatt, [email protected]

GRAPHIC DESIGNER Christopher Saucier, [email protected]

GRAPHIC DESIGNER Maream Milik, [email protected]

LEAD WEB DEVELOPER Hari Nayar, [email protected]

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HOME OFFICE The RTC Group, 905 Calle Amanecer, Suite 250, San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050, www.rtcgroup.com

Editorial Office Tom Williams, Editor-in-Chief 1669 Nelson Road, No. 2, Scotts Valley, CA 95066 Phone: (831) 335-1509

JULY 2011

Published by The RTC GroupCopyright 2010, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.

The magazine of record for the embedded computing

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EDITORIALJULY 2011

Tom Williams Editor-in-Chief

I t doesn’t seem so long ago that when at some non-technical social event I was asked the question, “So what do you do?” my answer would inevitably be followed by, “Uh, what is em-

bedded computing?” The answer to that last question has gotten more involved lately. Time was, you could get the idea across with some simple examples—factory automation, medical instruments, communication systems—and at least elicit an, “Oh yeah, right.”

Today that is getting more complicated because what we once considered embedded systems are becoming more pervasive and are increasingly touching people’s daily lives in ways that are more direct than they once were. If the gas pump has an embedded pro-cessor behind it, that may escape notice because the pump still does what we are used to it doing—pumping gas and displaying the amounts. Never mind that you can also pay at the pump with your ATM card. We do that everywhere. The POS system is likewise a thing that has crept into all our lives without much fanfare. The fact that it is equipped with a bar code scanner networked to a database and also to the card processing system often is unremarkable.

But when things that were formerly inanimate objects be-gin to interact with us, we do notice. The rapid spread of digi-tal signage that is increasingly able to interact with the person viewing it gets people’s attention as something new in the world. The emergence of bar or restaurant tables whose surfaces are an interactive graphical touch screen display that can bring up a menu and is also able to sense if your drink is low, is something that brings the existence of embedded intelligence to our general consciousness in ways that are definitely noticed.

And we need hardly mention the staggering number and functionality of smartphones, special-and general-purpose tab-lets, and e-readers, all of which are subsumed in a seemingly seamless web of connectivity. Now many of these devices bleed over into what is called “consumer electronics,” which is outside the prevue of RTC. Discussions of the design of smartphones and TVs definitely belong somewhere else, but the lines have blurred just a bit because these things are increasingly knit together in an ever growing web of wired and wireless connectivity that spans the factory floor, the electric utility, the private home and a plethora of mobile devices, including autonomous and semi-autonomous machine-to-machine systems of all sorts.

Driving these trends is the sheer computational power that is available on low-cost, low-power silicon. Integrated on this new silicon is not only compute power, but also high-end graphics and connectivity. As our friends Colin and Paul point out in this issue’s SFF Forum, the compute power makes it possible to use operating systems like Windows, Linux and Android in systems with all but the tightest timing requirements. And even there, the option exists to use an RTOS for real-time on one core of a multi-core processor and one of the others on another core. Add to that the 3D graphics capability on chips such as the new Fusion G-Series from AMD, and we have high-end GUIs for even the most embedded applications. It is now literally possible to monitor and control industrial processes using a smartphone.

The other major element of the changing face of embedded is the surge in connectivity. The combination of the Internet with its attendant “Cloud,” the Smart Grid with its integral network, Wi-Fi, mesh networks like ZigBee and the 4G/LTE cellular build-out will soon usher in the era of ubiquitous connectivity. This infra-structure will connect devices in industry, transportation, medical and other commercial fields with people and devices in individual homes. Many of these will, of course, be consumer devices. But the growing digital infrastructure and the attached computing power along with what will be increasingly intuitive graphical user interfaces will tend to meld them into an interactive whole.

The person in their kitchen using a GUI to set the dishwasher (a consumer device) to monitor the utility network (a major in-dustrial system) to turn on when the rates are favorable is part of a larger interaction. The utility monitors overall usage to see if it must invoke demand response agreements with large indus-trial and commercial users to limit their usage to agreed levels. This will in turn affect when the rates change and when the dish-washer ultimately turns on.

Today we track UPS and FedEx shipments at home—an activity that is only made possible by a vast array of M2M systems with GPS and RFID capability interacting over high-speed networks. Such sys-tems were, of course, developed to aid the shippers, but the addition of customer access is a definite bonus in terms of customer satisfac-tion. We can expect the spread of high-end GUIs and universal con-nectivity to result in many more such examples great and small.

The Changing Face of Embedded

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INDUSTRYINSIDERJULY 2011


Freescale Semiconductor and QNX Expand Relationship for QorIQ and PowerQUICC Processors

QNX Software Systems Limited and Freescale Semicon-ductor have agreed to collaborate on the development of solutions for Freescale’s QorlQ and Power-QUICC processor families. The companies intend to share IP, invest jointly in product and technology roadmaps, and work together on go-to-market activities.

Joint development will ini-tially focus on the use of QNX operating system software, mid-dleware, development tools and engineering services to create so-lutions for the medical, industrial automation and general embed-ded markets. The collaboration is expected to produce pre-inte-grated and optimized solutions that deliver new levels of QNX software performance, ease-of-

use and energy efficiency for Fre-escale’s QorlQ and PowerQUICC processors.

The EnOcean Alliance Grows to 200 Member Companies

The EnOcean Alliance, a consortium aimed at promoting and establishing innovative auto-mation solutions for sustainable buildings, has announced that it has signed up its 200th member company, NanoSense. NanoSense develops products using EnOcean and KNX technologies that regulate and optimize air qual-ity inside buildings. Created in April 2008 by Distech Controls, EnOcean, Masco, MK Electric, Omnio and Thermokon, the En-Ocean Alliance now counts 200 member companies from 20 dif-ferent countries. Collectively, Alliance members support 750 interoperable products deployed in over 200,000 buildings world-wide that use energy harvesting

wireless technology designed for building automation systems. Other Alliance members include General Electric, Siemens, Mas-co, Leviton, Honeywell and Texas Instruments.

The EnOcean Alliance has created an ecosystem around en-ergy harvesting wireless technol-ogy to create an industry standard, continue product interoperabil-ity and promote the technology among members. EnOcean-based energy harvesting solutions are battery-less and wireless, and therefore operate independent of an external energy source. The sensors “harvest and store” tiny amounts of energy from motion, light or temperature differences. The harvested power is sufficient to transmit a wireless signal and intelligently control lighting, heating and air conditioning sys-tems. In many cases they deliver recurring savings of 20-30 per-cent in new building installations and up to 80 percent savings in

retrofit scenarios. Maintenance, cabling requirements and instal-lation time are also considerably reduced.

Altera Joins Imec’s Advanced CMOS Scaling Program for 3-D Process Technology Development

Imec has announced it has entered into a three-year research collaboration with Altera to de-velop advanced CMOS scaling technologies. Altera joins a grow-ing number of fabless semicon-ductor companies that are part of Imec’s Insite program, which pro-vides member companies insight into near-term and future IC tech-nology options. The initial collab-oration between Imec and Altera will focus on the development of 3-D process technologies target-ing Altera’s product families.

The Imec Insite program makes information from Imec’s advanced process technology research programs available for the product design community in IDMs, fabless, fablite and sys-tem design companies in formats that can be used for early assess-ment of the impact and potential of those technologies for product roadmaps. Imec’s solution allows for early feedback toward technol-ogy specification, early decisions on required architectural design changes, and faster learning cy-cles for technology adoption with reduced risks. The program al-lows Imec to derive specifications for next-generation technologies from future system requirements.

Microsemi Completes Acquisition of AML Communications, Inc.

Microsemi Corporation has announced its acquisition of AML Communications. “We are pleased to move forward with AML’s contribution to

IPSO Alliance Welcomes New Members, Interoperability Testing, Standards Helping Drive “Internet of Things”

The IPSO Alliance has announced four new members. They include GreenWave Reality, a global innovator in energy management and demand response systems, providing an affordable, easy-to-use, standards-based home energy management solution that includes intelligent lighting. GreenWave has joined IPSO as a Promoter member. The additional members are Corporative Intelligence Laboratory S.L. of Spain (Cilab), the company behind Green Asset Management (GAM), which is a platform based on distributed computing, focusing in the optimization of the way we use resources at an urban/community scale; ElectroTest Sweden, a company that works for IPv6/6LoWPAN interoperable and standard products for energy conversation in buildings; and Sensus, a leading utility infrastruc-ture company offering smart meters, communication systems, software and services for the electric, gas and water industries. They have all joined as Contributor members.

Over the course of six months, IPSO will be conducting a series of interoperability tests at the IP layer, run-ning both within a single PHY/MAC as well as demonstrating interoperability across multiple PHY/MAC layers. The IPSO Alliance welcomes the publication of a new routing standard—RPL, an IP routing protocol designed for IPv6 smart object networks, has been approved by the Internet Engineering Task Force (IETF) as an official international standard.

The IETF has also completed the draft of the 6LoWPAN-HC, a header compression format for highly efficient IPv6 packet delivery over IEEE 802.15.4 low-power wireless personal area networks (WPAN). This is key to con-necting smart objects such as meters, sensors or control devices, and smart appliances over the Internet. The IPSO organizations that participated in the early testing of 6LoWPAN-HC include Atmel, Cisco, NXP, Sensinode, SICS, Sigma Designs and Watteco SAS.

RTC MAGAZINE JULY 2011 9RTC MAGAZINE JULY 2011 9

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831.93 (-0.73%)This data is as of July 11, 2011. To follow the RTEC10 Index in real time, visit www.rtcmagazine.com.

COMPANY PRICE CHANGE 52-WEEK HIGH 52-WEEK LOW MARKET CAP

Adlink Technology 2.07 -1.970% 2.10 2.06 $248.92M

Advantech 3.15 3.535% 3.15 3.05 $1,738.58M

Concurrent Computer 6.10 0.329% 6.20 6.07 $56.30M

- Elma Electronic 523.63 0.000% 523.63 523.63 $119.64M

Enea 6.48 -0.937% 6.57 6.36 $114.44M

Interphase Corporation 4.98 -0.994% 4.98 4.98 $34.30M

Kontron 10.33 -3.046% 10.71 10.24 $575.35M

Mercury Computer Systems 18.83 -0.999% 18.94 18.63 $568.26M

Performance Technologies 2.15 -1.152% 2.17 2.09 $23.85M

PLX Technology 3.52 -2.194% 3.55 3.51 $156.74M

RadiSys Corporation 7.92 -5.602% 8.50 7.90 $192.52M

the Microsemi family,” stated James J. Peterson, Microsemi President and Chief Executive Officer. “RF components are in-creasingly important in today’s defense programs and Unmanned Aerial Vehicle (UAV) systems and this acquisition brings scale and complementary technology to Microsemi’s fast-growing RF component and subsystems prod-uct offering. As we execute on the integration of AML, we expect to deliver ever more advanced RF so-

lutions to our customers, increase our sellable available market, and drive shareholder returns.”

The financial contribution from AML for Microsemi’s fiscal third quarter is uncertain at this time but will be immaterial to re-sults. As a reminder, in its fiscal second quarter earnings confer-ence call, the company forecast sequential revenue growth on the order of 3%-5%, excluding the ef-fect of any pending acquisition.

MIPS and Actions Semiconductor to Bring Android Honeycomb to 1.3 GHz Chipset for Tablets

MIPS Technologies and Actions Semiconductor have an-nounced that they are collabo-rating to bring Android 3.0, also known as “Honeycomb,” to a new 1.3 GHz MIPS-based chipset from Actions. Honeycomb is the newest version of the Android op-erating system designed specifi-

cally for tablets and other large format products. After recently announcing that it is porting Hon-eycomb to the MIPS architecture, MIPS is now porting Honeycomb to MIPS-based tablets, with sup-port from Actions.

The new high-performance system-on-chip (SoC) from Ac-tions leverages a superscalar MIPS32 74Kf core (with floating point unit) running at 1.3 GHz. In addition to Android, the new chip incorporates an OpenGL ES 2.0

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INDUSTRY INSIDER

3D graphics processing unit, USB 2.0 OTG, HDMI 1.3, support for multi-format high-definition 1080p video encoding and de-coding, and other advanced func-tionality. Actions and MIPS will also work together to enable the platform with Adobe Flash Player 10.2 optimized for the MIPS ar-chitecture.

Matrox and Trenton Partner to Provide Integrated Hardware Systems for Video Walls

Matrox Graphics and Tren-ton Systems have announced a new technology partnership to deliver video wall solutions for the AV market, beginning with the Trenton TVC4401 4U rack-mount system. The new Matrox-certified system can combine up to six, single-slot Matrox Mura MPX display controller boards—for up to 24 high-definition inputs and outputs—while leveraging the board’s 64 Gbit/s duplex data transfer to ensure display of HD input captures, at full resolution and frame rate. Matrox Mura MPX hardware can be controlled using network commands or a fully integrated video wall soft-ware suite. Designed to enable AV integrators deploying video wall solutions across a wide range of project sizes, Trenton systems with Matrox Mura MPX boards meet collaborative display wall requirements for small-scale cor-porate boardroom and digital sig-nage configurations to large-scale control rooms.

Trenton TVC4401 key fea-tures include a computer platform suitable for control rooms, op-eration centers and other mission-critical environments, as well as digital signage and presentation systems that require stable, reli-able video wall technology. The system motherboard supports up to six Mura MPX display control-ler boards—for up to 24 high-def-inition inputs and outputs—from a single, lightweight and rugged system. A scalable video con-troller solution maximizes dis-play wall application flexibility, and multi-functional Mura MPX

boards facilitate video switching, signal conversion, scaling and de-interlacing from a single board.

EVENT CALENDARAugust 9, 2011Real-Time & EmbeddedComputing ConferenceDenver, COrtecc.com

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August 23, 2011 Real-Time & EmbeddedComputing ConferenceIrvine, CArtecc.com

August 25, 2011Real-Time & EmbeddedComputing ConferenceSan Diego, CArtecc.com

August 25, 2011MEDS-Medical Electronic Device Solutions ConferenceSan Diego, CAmedsmag.com

September 13, 2011Real-Time & EmbeddedComputing ConferenceOttawa, ON rtecc.com

September 15, 2011Real-Time & EmbeddedComputing ConferenceMontreal, QCrtecc.com

September 13-15, 2011Intel Developers ForumSan Francisco, CAintel.com/idf

September 26-29, 2011Embedded Systems ConferenceBoston, MAesc.eetimes.com/boston

If your company produces any type of industry event, you can get your event listed by contacting: [email protected].

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FORUMColin McCracken & Paul Rosenfeld

SMALL FORM FACTOR

Gone to graveyards, every one? Or so it seems in the 32-bit em-bedded space these days. A real-time operating system, unlike a typical desktop operating system, is designed from the ground

up around a real-time scheduler. OSs can be categorized by size, fea-tures, determinism and number of threads. Why should we meditate about RTOSs long-time passing? Because software requirements ulti-mately steer processor decisions and determine memory footprint.

Gone to Mentor?A long time ago in a galaxy far, far away, VRTX was the

ultimate versatile real-time executive from Hunter & Ready (aka Ready Systems), which merged with Microtec Research and ulti-mately got swallowed by Mentor Graphics. From the 16-bit 68K/x86 architecture wars to early MIPS-based set-top boxes to early Motorola ARM7-SoC-based cell phones to the Hubble space telescope, VRTX covered the entire span from microcontroller version to full-featured RTOS. With such an impressive slate of embedded apps, where did this beloved RTOS go?

Mentor, fundamentally a respected EDA/simulation and software development tools company, never managed to take VRTX to the next level. After burial, Mentor got a second chance with the acquisition of Accelerated Technology (the “other” ATI) and their Nucleus OS just as the dot-com bubble was bursting. Nucleus clings to life these days in embedded networking stacks, dealt the same Linux blow as the other RTOSs.

Gone to Intel?Wind River’s VxWorks, dating three decades back to those

same early days, got a major leg up during the PowerPC network-ing telecom/datacom boom of the late ’90s until the bubble burst. In its own PAC-MAN style, Wind River gobbled up major com-petitor Integrated Systems with pSOS and TakeFive Software, and finally got swallowed by a bigger gobbler. Along the way, Wind River adopted its own Linux framework, since you have to join ’em if you can’t lick ’em.

Gone to planes, trains and automobiles?QNX, once a mainstay in medical devices due to kernel-level

modularity, early adoption of POSIX APIs and its GUI, swept into Harmon’s car infotainment strategy, then spun out again. A number of telematics and navigation systems continue to use it. New owner Research In Motion (RIM) has big plans—the ultimate “smart car” wireless and infotainment platform. Meanwhile, Green Hills

Software differentiated itself as a premier development tools ven-dor, then developing Integrity as a focused offering to a high-value segment—Avionics DO-178 certification. LynxOS migrated from HP printers to DO-178 as well, with a side dish of Linux.

Gone to data centers, board vendors, and pseudo- and non-real-time?At its peak, RadiSys acquired Microware and its OS-9 oper-

ating system. High-availability real-time continues to survive as a niche. OS-9 seems to have a better position in its sandbox than the mother ship in this new world order of commodity express. The data center market appears to have swallowed the remains of VenturCom’s RTX extensions for WinNT and WinXP on the strength of Citrix Systems. Cloud computing, 64-bit virtualiza-tion to share the cost of expensive processors, hypervisors and software-as-a-service seem to be the order of the day, not real-time computing. “Real what?” you say?

Gigahertz computing reduces latencies and cache miss penal-ties. So with billions of transistors at our disposal, why not throw the glut of performance at a desktop-class OS and simply tolerate the occasional missed deadline from the long tail of the non-deter-ministic bell curve? Engineering students and recent grads in Sili-con Valley are enamored by the latest venture capital bubbles—free Android apps and social networking. Alas, the science of real-time design has succumbed to realities of engineering budgets, time-to-market pressures, and a new generation of Visual C++ developers with affordable low-end and mid-range x86 processors that can actually meet and exceed 5- to 7-year lifecycle requirements.

Gone to the open-source community?From real-time Linux flavors to Symbian to dozens of other

open-source GPL purpose-built OSs, there is no questioning the impact of the open-source community over the years. Even Mi-crosoft had to reduce WinCE royalties and open-source some modules. At the end of the day, it appears that the new generation of developers likes cheap, rich, open-source application platforms like Android and Linux more than hard real time. Or perhaps the real cause of death was the expensive royalties that came along for the ride? If the question “do you need real time?” is answered with “what’s the cost?” it’s clear that hard real time is not a hard requirement. Just don’t take the cover off the medical robot that is going to operate on you.

When will they ever learn?

Where Have All the RTOSs Gone?

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EDITOR’S REpORT


I t may already seem like it is everywhere—in just about every home with more than one computer, in airports, coffee shops

and offices—but the most popular form of wireless digital connectivity is aiming to become even more widespread and more available in vast numbers of devices, both industrial and consumer. Wi-Fi, now sup-ported since 1999 by the Wi-Fi Alliance, a growing consortium of over 400 companies, has long had a product certification program that ensures that certified devices work to-gether and has since 2000 certified some 10,000 different devices. Annual shipments are predicted to reach one billion units this year and to top two billion by 2015.

These have primarily been PC and net-working devices along with handsets and con-sumer electronics. Now, the Wi-Fi Alliance is launching new programs and specifications to extend the reach of the wireless network technology even further and will inevitably encompass a wide range of connected em-bedded devices. It has long been a truism that technologies that become popular and wide-spread and achieve performance at low cost in the PC arena inevitably migrate into the em-bedded world. It is no different with Wi-Fi.

The first of these initiatives is the Wi-Fi Certified Hotspot program. Hotspots are Wi-Fi access points managed by hotspot providers in such places as hotels, airports, coffee shops that can be offered for free in connection with some other service or for a

connection fee according to the policy of the provider. Today there are over 750,000 such hotspots but these are predicted to number in the millions in just a couple of years. There are a number of reasons such as the just plain popularity of Wi-Fi, but there is also a genu-ine need to offload the cellular networks.

Over the next two years, data traffic on mobile networks it expected to grow to four times the volume of voice traffic, approach-ing five million terabytes in a year. According to Wi-Fi Alliance Technical Director, Greg Ennis, “Wi-Fi will always be faster than 3G or 4G, but when people are mobile and can’t use Wi-Fi, they use the cellular network.” The build-out of Wi-Fi is expected to make it more available to the mobile data user and, of course, we can also expect voice-over-Wi-Fi as well, using VoIP technology.

The Wi-Fi certification program is in-tended to make it much easier for users to get connected at service provider Wi-Fi hotspots by providing automatic provision-ing, authentication and network selection. There will also be provisions for easier and more automatic roaming agreements among service providers. The certification program will cover the various types of devices as well as the hotspots themselves. Thus a sub-scriber to one service provider could auto-matically connect through the hotspot pro-vided by another and the billing information would be automatically transferred.

Key elements of the Certified Hotspot program would include automated net-work discovery and selection. Thus a de-vice contacting a hotspot would automati-cally select an available network based on subscriber information, operator policies or network optimization. Automated ac-cess would be granted based on creden-tials, SIM cards or other subscriber infor-mation, which would also be used under the terms of roaming agreements. In the rarer cases where a new account needed to be established, this would also be made as smooth as possible using a common meth-odology across vendors. Finally, all over-the-air transmissions will be encrypted using WPA2 technology (Figure 1).

Wi-Fi Direct—Up Close and PersonalGreg Ennis remarks, “People tend to

think of Wi-Fi as wireless Internet, but that’s only one use of Wi-Fi.” The next step ap-pears to be to move into the peer-to-peer per-sonal area networking realm that has until now been the province of Bluetooth. There was also a now abandoned attempt to set up

by Tom Williams, Editor-in-Chief

With increasing user demand and a rich set of certification programs, Wi-Fi is poised to become a nearly universal medium for wireless digital connectivity.

Wi-Fi to Become Even More Versatile and Ubiquitous

The Growth of Wireless Connectivity

Discovery Registration Provisioning Access

Provide key networkinformation beforeassociation to choose the best network

Create new account (if needed) Provide credentials

and subscription policy on the device (if needed)

Mobile device states

Leverage WPA2 Enterprise for authentication and provide notification of session expiration, renewal

FIGURE 1

The process of connecting via a Wi-Fi Certified Hotspot.


EDITOR’S REpORT


a wireless USB technology. Bluetooth does not have sufficient range and compatibility to cover all the applications that its proponents had once envisioned for it. Now Wi-Fi Direct will be able to directly connect devices with-out a Wi-Fi network or hotspot available.

Wi-Fi Direct will have three modes: a one-to-one configuration, a one-to-many configuration and a concurrent Wi-Fi AP and peer-to-peer configuration (Figure 2). The one-to-one arrangement is expected to be a very common mode. Devices will be able to connect directly to one another to share content or applications. This will al-low such things as printing directly from a camera, sharing video games, displaying pictures from a phone on a TV, etc. The pos-sible applications in the embedded world are many as well, such as configuring devices or gathering data from devices with a handheld unit or even a smartphone. The potential for the configuration of machine-to-machine autonomous and semi-autonomous systems is also looking very attractive.

The one-to-many configuration allows users to quickly connect peripherals such as a camera, speakers or printers to a PC or to quickly set up an ad hoc network of computers to do things like share images or a presentation with a group without the need for a projector or a screen. It will be possible to connect some, but not all, leg-acy devices in such a scheme. Wi-Fi Direct Connect-certified devices will be able to connect to multiple other devices.

The third configuration allows some devices, such as PCs, to link directly to a group of Wi-Fi Direct Connect-certified devices and also share a network connec-tion with the group via a hotspot. In this scenario, two different security domains exist—one for the group and one for the WLAN. Wi-Fi Direct Connect has manage-ment features built in so that an IT manager or a hotspot provider can disable this kind of cross-connection. This would be used by a hotspot provider, for example, who does not want multiple devices sharing a connec-tion on a hotspot that wants to charge for each connected device. In addition, not all Wi-Fi Direct devices will be able to support this simultaneous WLAN connection.

The setup of a Wi-Fi Direct connection or connections is not automatic; it requires active agreement, so it supports the secu-

rity of letting a user directly identify who is being given access. One device must spe-cifically request access and the other device must specifically grant permission. The Wi-Fi Protected Setup specifies the pro-cess that consists of a user pushing a button (or pressing or clicking a virtual button on a screen), which causes a window to pop up on the other device. Once the request is acknowledged, a secure connection is es-tablished using WPA2 security protocols. Over-the-air transmissions are encrypted with government-grade Advanced Encryp-tion Standard (AES) technology.

According to the Wi-Fi Alliance’s Ennis, “The one-to-one configuration may be the predominate one. It super-sedes Wireless USB and much of what Bluetooth wishes it could do. Doing peer-to-peer applications at Wi-Fi speed can support video and at Wi-Fi ranges.”

Other HorizonsAnd it doesn’t look like Wi-Fi is stop-

ping here. There are at least two other initiatives on the horizon. One is to move Wi-Fi into the 60 GHz range, which will allow it to deliver multi-gigabit data rates (up to 7 Gbit/s), albeit at a shorter range than traditional Wi-Fi. This effort cor-responds to work being done in IEEE 802.11ab and now apparently in coopera-tion with the WiGig Alliance. In addition, there is a move to define Wi-Fi operation in the 5 GHz band, which could deliver a gigabit data rate. This corresponds to work being done on IEEE 802.11ac, which aims at providing a multi-station throughput of at least 1 Gbit/s and a single link through-put of at least 500 Mbit/s.

Wi-Fi is also moving into the health-care arena, and the Alliance is working closely with the medical Continua Al-liance that seeks to establish standards for communicating medical devices. The concurrent emergence of the Smart Grid and the Smart Home has recently led to the Association of Home Appliance Man-ufacturers (AHAM) specifying Wi-Fi as a top rated technology along with ZigBee and HomePlug Green PHY. In addition, what the FCC has called “Super Wi-Fi” is looking to move into the television white spaces that have been opened up since the specification of digital transmission. These

are attractive for outdoor networking and the use of Wi-Fi in extended areas such as neighborhoods or college campuses.

Wi-Fi appears to have reached a criti-cal mass in terms of user demand, which is propelling sales of Wi-Fi-enabled de-vices leading to wider use and the certified hotspot effort that will make it yet more widespread and easier to use. The emer-gence of the Smart Grid connected to what was already an increasingly networked home is fueling the demand for a network-ing technology that can pull together the Smart Grid, the networked home, office and factory and the overall Internet.

Wi-Fi Alliance[www.wi-fi.org].

Discovery Registration Provisioning Access

Provide key networkinformation beforeassociation to choose the best network

Create new account (if needed) Provide credentials

and subscription policy on the device (if needed)

Mobile device states

One-to-one configuration

One-to-many configuration

Concurrent Wi-Fi andpeer-to-peer connection

P2P Client:Printer

P2P Client:TV

P2P Client:TV

Wi-Fi AP

legacy Client:Printer

Legacy Client:Printer

P2P Client:Camera

P2P Client:Camera

P2P GroupOwner:Laptop

P2P Group Owner:Laptop

P2P Group Owner:Phone

One-to-many configuration

P2P Client:TV

legacy Client:Printer

P2P Client:Camera

P2P GroupOwner:Laptop

Concurrent Wi-Fi AP andpeer-to-peer connection

P2P Client:TV

Wi-Fi APLegacy Client:Printer

P2P Client:Camera

P2P Group Owner:Laptop

FIGURE 2

The three configuration modes made possible by Wi-Fi Certified Direct Connect.

16 JULY 2011 RTC MAGAZINE16 JULY 2011 RTC MAGAZINE

TEChNOLOGY INCONTEXTSorting out Small Form Factors


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Small form factors are not a new in-vention, but the need to reduce size, weight and power has boosted their

demand and resulted in several design considerations. PC/104 revolutionized modular industrial computers with its small size of 3.4” x 3.6” almost two de-cades ago. However, since then the small form factor (SFF) module concept has multiplied into a barely manageable diver-sity of small factor boards and so called standards.

Generally SFF boards can be classi-fied into three major groups:

• Single Board Computers (SBC) where all functionality is designed into a sin-gle board with no further extensions

• Stackable Computer Modules (de facto the PC/104 family), which can be configured from a bare SBC to large bus systems with arbitrary ex-pansion options realized by standard-ized modules

• Computer-on-Modules (COM) that concentrate the main computing func-tions into a standardized module sit-ting on top of a standard or custom designed baseboard

Basic SFF ChoicesSBCs provide the highest level of

vertical integration and lowest production costs especially with higher volumes. If it is not possible to buy a baseboard off-the-shelf, it is necessary to create a custom board with all the needed functions. The effort to develop this takes a significant amount of time and qualified engineers due to the complexity of today’s super-fast and super-miniaturized chips—some with

.600 or .500 or even .400 mm pin pitches on the printed circuit board.

Stackable computer modules, namely the PC/104 family, are beneficial because almost anything can be purchased off-the-shelf. This makes hardware development easy and decreases development time by requiring as little as planning, purchas-ing and stacking. So what are the down-sides here? PC/104 systems are great for specific application segments that need something simple and robust as long as

by Dan Demers, congatec US

Among small form factors, COMs have become the most advanced and popular choices. Still, there are important criteria for selecting the right module from even this small group.

the Right coM for the Right App: Sorting out Small Form Factors

FIGURE 1

COM evolution from ETX to Qseven.



TECHNOLOGY IN CONTExT


the demands for computing power, graph-ics performance and maximum thermal design power are not too high. However, the connectors and system overhead are relatively expensive, and most of the eco-

system available is still based on the ISA bus.

Since technology has been moving away from ISA and parallel buses over the last two decades, the once uniform

PC/104 world has fractured into too many subsets of variations and upgrades. Today there is PC/104, PC/104-Plus, PCI/104, PCI/104-Express, PCIe/104 and SUMIT-ISM. This often leads to a quite challeng-ing mix-and-match within the ecosystem. What used to be an unbeatable benefit can become a severe burden now in new proj-ects. Many of the traditional products and components have reached end-of-life and are difficult to replace. Cooling may also be a little tricky as thermal design power is limited. The current CPU generation Atom and AMD Gseries are the first, and often only choice for midrange fanless applications today. For some applications like panels, the cubical outline may be a problem and the question remains: Will PCIe/104 or SUMIT-ISM finally make the race, and will the ecosystem follow?

In terms of standards, COMs are a lot easier, but just four families prove to be actual standards and not simply logo-clubs. They are ETX, with its well estab-lished facelift XTX, and COM Express as the current absolute market leader for midrange- to high-end COMs. In addi-tion, there is the relatively new Qseven that is emerging as the first choice for low power, mobile and ultra-mobile COM ap-plications.

Shared COM BenefitsCOMs are the easiest—and typically

most efficient—way to outsource the “dif-ficult part” of the latest computer tech-nology with its ultra-fine pin grids and highly EMC-sensitive high-speed signals as high-end computer technology is usu-ally not a core competency of most com-panies. COMs come highly pre-integrated and ensure short development cycles. The split between general part (COM) and application-specific part (baseboard) enables easy-to-manage scaling and up-grading options. Switching to the latest computing technology with less power consumption and higher performance can be as easy as simply swapping the mod-ule. COMs themselves are universal and not bound to a specific application—they add up across companies and applications to large numbers resulting in lower prices. Higher numbers and richer diversity of ap-plications also result in fewer design flaws and higher product quality of the COM.

FIGURE 2

Size comparison and signal set of actual Qseven COM.

Requirement ETX XTXCOM Express

Type2Qseven

ISA compatibility X

ETX compatibility X X

Legacy I/O required X X

PEG for ext Graphics X

TDP > 40W X X X

TDP > 12W X X X

TDP > 5W X X X X

TDP < 5W X

Supply Voltage 5 V 5 V 12 V 5 V

Handheld/Ultramobile X

Batteries/PoE X

x86 X X X X

ARM X

High-Speed I/O X X X

TABLE 1

Comparison of COM family features.




All these advantages make COMs the most efficient way to keep pace with today’s trends toward higher complex-ity, smaller size, less weight and lower power consumption on the technical side, and cost reductions and shorter time-to-market on the commercial side (Table 1). Figure 1 shows a visual evolution and size comparison of these modules.

ETX, introduced in1998, was the first true standard for COMs. It comes with full legacy I/O and PS/2 support and has a size of 2.4” x 2.9” (95 x 114 mm²). ETX be-came an established standard in 2000, and due to its maximum possible TDP of 40 watts it has a wide installed base mainly in the industrial computing and automa-tion market segment. Other industries with large installed bases of ETX COMs are medical, transportation and gaming. Together with PC/104, ETX is the most significant SFF standard with unlimited ISA support. Today ETX modules are mainly used in legacy projects with a need to support the more than twenty-year-old ISA bus.

Typical applications with need for ISA support are industrial control and automa-tion. Since the end-of-life of Intel’s 855 chipset, today’s ETX COMs are mainly featuring VIA, Geode or Atom Proces-sors; some recent boards use AMD’s Gseries processors upgrading graphics performance to an actual level.

XTX was introduced in 2005 and is a fully compatible facelift to ETX with na-tive SATA support (4 Ports) and 4 PCIe lanes replacing the ISA bus on the fourth connector. This boosts I/O performance from 133 Mbytes/s to 2.5 G bits per PCIe lane enabling up-to-date high-speed in-terfaces on the baseboard. If ETX com-patibility is required and no ISA bus is needed, XTX is first choice. It’s a low-effort upgrade path from ETX to today’s technology and high-performance proces-sors beyond the 855 chipset as well as the gateway to dual core power. XTX can be used as a form factor compatible, smooth transition platform on the way from ISA and PCI technology to today’s high-speed serial buses (PCIe). The main market seg-ments are the classical ETX segments of industrial computing and automation, medical, transportation and gaming.

COM Express was introduced as

a standard by the PICMG in 2005. The main goal was to introduce a universal, scalable and legacy-free COM standard. Sizes initially specified by PICMG were 2.4” x 3.2”(95 x 125mm², basic) and 2.6” x 3.9”(110 x 155 mm², extended). A large group of COM Express manufacturers has agreed on an additional and most popular size of 2.4” x 2.4” (95 x 95 mm², compact), which is roughly the size of a PC/104 board (90 x 96 mm²). Apart from a new connector design and these multiple size variants, there are some significant new features: 6 PCIe Lanes, a PEG Port with another 16 PCIe Lanes, SDVO Inter-face, on-COM Gbit LAN and a change of the supply voltage from 5 to 12 volts. The maximum allowed specified TDP was

also raised from 40 (ETX/XTX) to 188 watts (extended), enabling the most pow-erful high-end processors and graphics chip sets. Legacy-free, and pushed by the PICMG, COM Express is the most popu-lar COM standard today and has the rich-est ecosystem and vendor support. There is a great choice of embedded x86 proces-sors for COMs spanning from single-core low-power Atom to high-performance quad-core i7.

Market segments are midrange/high-end gaming, midrange/high-end medical, midrange/high-end digital signage, in-dustrial computing, automation, telecom-munications, transportation and high-end POI/POS/kiosks.

Qseven is the most recent COM stan-

Interface ETX XTX COM Express Type2

Qseven

ISA yes no no no

LPC no yes yes yes

32 Bit PCI yes yes yes yes

PCIe no 4 lanes 6 lanes + PEG 4 lanes

PEG no no yes, shared with SDVO

no

USB2.0 4 6 8 8

LAN 10/100 MBit 10/100 MBit 10/100/1000 MBit 10/100/1000 MBit

PATA 2 Kanäle 2 Kanäle 1 Kanal no

SATA 2 connectors for wire link (ETX 3.0

only)

4 Ports 4 Ports 2 Ports

SDVO no optional with proprietary feature

connector

yes(shared with PEG I/F)

yes(shared with HDMI / Display Port)

LVDS 1x24 Bit 1x24 Bit 2x 24 Bit 2x 24 Bit

Legacy I/O yes yes no no

PS/2 (kb/mouse) yes yes no no

SMBus / I²C yes yes yes yes

CAN/SPI no/no no/no no/no yes/yes

Express Card/SDIO no/no no/no yes/no yes/yes

HDA no (analogue only) yes yes yes

Connector 4x 100 Pin Board-to-Board

4x 100 Pin Board-to-Board

1 or 2x 220 pin Board-to Board

230 pin MXM2 SMT Edge connector

Size 95x114 95x114 95x95 (compact)95x125 (basic)

110x155 (extended)

70x70

Architecture x86 only x86 only x86 only x86/ARM

max TDP 40 W 40 W 188 W (extended) 12 W

Supply Voltage 5V 5V 12V 5V

TABLE 2

COM selection criteria.



dard (Figure 2). It was created to support small-sized, low-power, mobile and ultra-mobile applications. It measures just 1.6” x 1.8” (70 x 70 mm²) and does not require an expensive board-to-board connector but rather an inexpensive, but reliable, 230 pin edge connector using an MXM card slot as known from mobile Graphic cards. The TDP is limited to 12W, but even more important, the specified supply voltage is 5 volts so that a mobile device can run ef-

ficiently on 2 lithium cells. Qseven sup-ports no legacy beyond 32-bit PCI and LPC and just 4 PCIe lanes and no PEG. Onboard graphics support 2 LVDS ports and SDVO (shared with HDMI/Display Port). New are CAN, SPI and Card SDIO interfaces to ensure maximum flexibility for mobile applications. Qseven is not an x86-only platform; ARM is also speci-fied and supported with the latest version as well. A very useful new feature is a

common software API for industrial ap-plications like watchdog timer, I²C Bus, display brightness control, BIOS storage area and reading of system temperatures. This enables a safe and easy exchange of boards from different manufacturers without software adaptations.

Preferred Market segments for Qseven are handheld and ultra-mobile devices, Panel PCs, entry-level gaming, entry-level/midrange medical, entry-level digital signage, industrial computing, low-power industrial computing, automation, transportation, entry-level and mobile POI/POS/Kiosks, any kind of battery or PoE operated x86 computing device.

So How to Choose? The way to find your favourite SFF

COM is easy. First check your legacy and compatibility needs. If you need ISA, go ETX. If you need ETX compatibility and no ISA, go XTX. An overview of the se-lection criteria for the major COM mod-ules is given in Table 2.

If you start a new, legacy-free proj-ect it’s likely to choose COM express or Qseven for longevity and latest technol-ogy. If your TDP exceeds 12W, choose COM Express. If you need a PEG Port to use an external graphics card, choose COM Express. If you build a handheld, mobile or ultra-mobile device your choice is most likely Qseven. If you consider a non-x86 Platform, your choice is most likely Qseven. If you run on batteries or Power-over Ethernet (PoE), your choice is most likely Qseven. If (small) size matters, then your choice is most likely Qseven.

Finally, always keep in mind that when you decide to use a COM, you still need a baseboard. The best COM is worth nothing without good support from your COM vendor or distributor.

congatec USSan Diego, CA.(858) 457-2600.[www.congatec.com].

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TEChNOLOGY INCONTEXT


I t is well known that many embedded market applications have evolved to smaller, space-constrained designs

that also require long-term availability and cost-effective embedded computing solutions. Small form factors have steadi-ly filled this need by delivering increased computing power and improved perfor-mance across a range of platforms and markets. Yet as designers are working with some of the most versatile and energy-effi-cient processors ever developed, graphics performance is one important feature that has not kept up so readily. This limitation has forced embedded designers to con-stantly search for technologies that can deliver high-end graphics performance in a long-life, small form factor system.

Today that challenge is being over-come, as new developments in integrated graphics are fueling greater design op-tions in small form factor platforms. By integrating high-performance graphics, manufacturers are serving up a range of new performance options in small form factors such as COMs, Pico-ITX and PC/104. This represents a new learning curve for designers—understanding the design features and options that deter-

mine the ideal platform for peak perfor-mance, reduced development cost and fastest time-to-market.

AMD Processors Fuel Improvements

The recently introduced AMD Embed-ded G-Series gives designers a new alterna-tive to increase graphics performance. This industry first integrates high-performance graphics directly into the silicon, eliminat-ing the need for an add-on graphics card. The AMD Embedded G-Series is the first to include a Fusion Accelerated Processing Unit (APU), joining x86 computing capa-bilities and the parallel computing power of a general-purpose graphics processing unit (GPGPU) within a single computing entity. This gives designers discrete-level graphics capabilities, dramatically improv-ing standard graphics-intensive small form factor applications. The integrated AMD Radeon HD6310 supports DirectX 11 as well as OpenGL 4.0, for extremely realistic 2D or 3D graphics with high frame rates and resolutions of up to 2560 x 1600 pixels. A dedicated graphics card is not required, allowing space savings and extremely high performance in a cost-effective system.

by Christine Van De Graaf, Kontron

Evolving pin-outs and integrated on-chip graphics options are enabling richer visual applications that will extend the idea of what have been considered embedded systems.

Graphics performance Drives Ever More Capable Small Form Factor Designs

Sorting out Small Form Factors

FIGURE 1

The Kontron micro-ETXexpress-OH is based on the new energy-efficient and highly integrated AMD Embedded G-Series Accelerated Processing Units (APUs). Integrating a powerful parallel processing and graphics unit, in addition to the processor, this strikingly small Computer-on-Module stands apart because of its extremely high graphics performance as compared to other modules offered in a compact footprint.

Untitled-1 1 12/6/10 9:53:30 AM

www.onestopsystems.com




Computer-on-Modules (COMs), for example—already an attractive embedded design solution in infotainment, transpor-tation, medical devices and digital signage systems—can now incorporate integrated, high-performance graphics. This in turn allows designers to bypass less ideal de-sign alternatives for achieving high-level graphics performance. The Kontron mi-croETXexpress-OH Computer-on-Mod-ule (COM) features the AMD platform with support for DirectX 11, OpenGL 3.2, OpenCL and Microsoft DirectCompute. As a result, the graphics unit speeds paral-lel processing tasks for solutions designed to process parallel vector algorithms.

More on COMsMounted directly onto a carrier

board, these highly integrated comput-ers are well suited to applications requir-ing any or all of the following: a small footprint; high performance; low power consumption; design flexibility and scal-ability; or simple customization. A stan-dard processor, bus, system memory and I/O components are incorporated into the COM platform—and should the applica-tion require greater computing power or better energy efficiency, the COM itself can be readily swapped for one support-

ing the necessary level of performance or power consumption.

COMs are especially designed for systems that can take advantage of off-the-shelf features while also implementing a good deal of customization in the carrier board over a long-term deployment. Cus-tomization can last multiple generations by simply swapping out one CPU module for another. This means that COMs work well not only for systems that require scal-ability from generation to generation, but also within a single generation. By inte-grating graphics performance onto the module, OEMs can readily swap in next-generation graphics when they upgrade to newer, higher performance modules, fur-ther extending the life of the carrier board within future product generations.

With the AMD Embedded G-Se-ries on the COM module, designers can achieve additional power savings through the integrated graphics technology, as the x86 CPU is “unloaded” when decoding video streams via the Universal Video Decoder 3.0 (Figure 1). This sets a new benchmark with system power usage. Fur-ther, the AMD Embedded G-Series APUs include five different performance ver-sions, ranging from the AMD T44R with a 1.0 GHz single-core AMD 64 CPU and

9 watt TDP, to the AMD T56 N with a 1.6 GHz dual-core CPU and 18 watt TDP. The power consumption of the AMD G-Series is 9 and 18 watts, much lower than other graphics-based processor solutions. This level of features and performance within a single platform enables OEMs to fine-tune the performance and power consumption to the precise requirements of the application.

The AMD Embedded G-Series also supports decoding of up to three HD videos in parallel, 1080p BluRay videos with HDCP, and HD MPEG-2 and DivX (MPEG-4) videos. Up to four displays are supported by a wide variety of interfaces, including DisplayPort, DVI and HDMI, as well as the embedded interfaces LVDS and VGA at a maximum resolution of 2560 x 1600 pixels.

Time-to-market is greatly accelerated for COMs-based designs incorporating this high level of flexibility and graphics performance. A resulting design is very thin and ideal for high volume, long-life applications. It is suitable for either sta-tionary or mobile applications, and can be integrated into a number of designs such as mobile terrain mapping or in-vehicle GPS systems. COMs are also an excellent op-tion for point-of-sale kiosks used in more rugged locations such as a train station or on board a vehicle. In the medical field, COMs are used in cart-mounted patient monitoring medical systems and lower-end portable ultrasound systems. These are all diverse areas that share a common thread—they are likely to evolve applica-tions and exceed end-user expectations based on improved graphics performance.

Design OptionsCOMs with advanced integrated

graphics capabilities offer a simplified yet very powerful performance option, best illustrated in contrast to alternative de-sign choices. For instance, graphics con-trol can be delegated to the carrier board, however OEMs would need to develop the customization and design it directly into the carrier board. This would limit the flexibility of the system, and upgrading or adding new graphics functionality would require custom attention.

While add-on graphics cards are another choice, they add cost and are a

FIGURE 2

With up to 4 Gbyte DDR3 RAM, the Kontron MICROSPACE MSM-eO offers enough resources to speed up memory-intensive applications. Along with LVDS and VGA, the module also has a digital display interface (DDI) for DisplayPort, HDMI or DVI signals, allowing the flexible connection of a wide variety of monitor types. A total of two independent full HD displays (up to 1920 x 1080 pixels) can be controlled.



less than ideal option for a robust system. Designed to sit at a right angle next to the COM, add-on graphics cards take up space and may become a potential failure point as vibration can affect signal integ-rity if the card were to shift in its slot. An MXM card offers an alternative that sits next to the board, but the fact that it is connected via sockets similar to those used for memory can result in a failure point within the system. Neither option offers the most robust or rugged con-nection. Beyond this, graphics cards are manufactured primarily for the fickle commercial market that expects frequent change via improved features and perfor-mance every few months rather than the seven years commonly required for em-bedded systems.

Further, the Type 6 COM Express pin-out is another new consideration for designers, enabling a performance jump from devices incorporating an ear-lier pin-out option and enhancing fourth generation graphics architectures used in advanced video applications. Type 6 is essentially based on pin-out Type 2, the most widely adopted COM Express pin-out type to date. Type 6 reallocates legacy PCI pins from Type 2 to support the digi-tal display interface and additional PCI Express lanes.

Improved patient care is just one of many areas primed to reap the benefits

of the Type 6 pin-out. Systems equipped with more powerful graphics display and processing features give medical profes-sionals the ability to simultaneously use multiple displays that contain different forms of patient information. For exam-ple, general health information or records could be accessed and viewed on one dis-play, while a second showed vitals such as blood pressure or respiration. This type of system would eliminate the need for a costly workstation while providing all the interactive, real-time data access required for proper treatment.

The Type 6 pin-out also considers fu-ture design options; the pins formerly as-signed to the IDE interface (pin-out Type 2) are now reserved for future technologies still in development. This gives design-ers more to work with including broader native display choices and higher serial bandwidth than previously available.

The addition of native support for the newest display interfaces simplifies carrier board design, which reduces time-to-mar-ket and TCO for graphics-intensive appli-cations. PCI Express support for Type 6 is extensive and underscores the trend to migrate from legacy parallel interfaces toward pure serial embedded system de-signs for higher bandwidth and reduced latency. System designers have a smooth transition to next-generation devices via faster drives and peripherals.

FIGURE 3

The Kontron 2.5-inch Pico-ITX embedded single board computer (SBC) KTA55/pITX is the smallest SBC platform based on the AMD Embedded G-Series with Fusion technology. With an extensive range of dedicated interfaces, extremely small footprint (100 x 72 mm) and low power requirements, this embedded SBC is the fastest and most cost-effective entry in the development of graphics-intensive small form factor applications.

©2011 Measurement Computing Corporation 10 Commerce Way, Norton, MA 02766

[email protected]

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PC104 and Pico-ITX Offer Additional Platforms

While COMs are suitable in certain situations, there are additional viable op-tions that should be considered to meet other application requirements. PC/104 is a standard, off-the-shelf form factor with all customization done through standard add-on cards that stack. A good fit for low volume and any range of life, PC/104 is easy to obtain, quite simple to work with, and available from many different sources. These boards are stackable—six high—suitable for applications that are not limited in height. PC/104 is optimal for industrial control and industrial au-tomation (e.g., a user interface such as a control station). The correct combination of programming and peripheral boards can manage a range of operations in a single system, and provide even greater performance with integrated graphics fea-tures that offer increased design flexibility and options.

For example, a sophisticated graphics environment could incorporate a module based on the accelerated processing units

of the AMD Embedded G-Series, and in-clude a 64-bit CPU, programmable graph-ics unit and a DDR3 memory controller. Supporting the latest 3D graphics libraries such as OpenGL 3.2 and DirectX11, the MSM-eO is well suited as an upgrade for existing PC/104-Plus designs that demand greater graphics performance with low power consumption. Its integrated, unified video encoder takes the load off the pro-cessor when displaying high-resolution videos such as 1080i/p, enabling designers to manage extremely compact multimedia applications, such as mobile infotainment systems, vending machines and mobile battery-operated systems (Figure 2).

Pico-ITX is an alternative standard platform; while it can use standard or cus-tom add-on cards, custom add-ons cards are used more frequently. With most of the integration already on the board, add-ons are executed through pin headers compared to the stack-up connectors on PC/104. While there are also fewer ven-dors supplying this form factor, it is an excellent choice when higher volume and longer life are key considerations. Pico-

ITX is well suited for small boxes—for example, point-of-sale or point-of-infor-mation systems such as kiosks or digital signs (Figure 3).

In brief, PC/104 is a good choice when looking at low volume, short life and minimal customization. Pico-ITX is a good fit if not much customization is re-quired, a very small footprint is desirable, the inclusion of cables is not an issue, and the design can go into a box. However, for a great deal of customization, long life and high volume in a very thin package, COMs are a more suitable solution. With all three platform options, however, add-on graph-ics cards are unnecessary because newly integrated graphics features are more than sufficient, even for demanding embedded applications.

The growth of multimedia content requires support for enhanced graphics functionality that is not only rugged and reliable, but can also protect design in-vestments for long-term deployment and provide a continuous upgrade path for OEMs. COMs are well suited to these de-sign challenges and are making the most of new pin-out options, updated specifi-cations, and a range of new features and functionality embedded in the latest sili-con alternative such as AMD’s Embed-ded G-Series platform. Other small form factor platforms such as Pico-ITX and PC/104 integrate improved graphics tech-nology as well—ensuring ready access to increased graphics performance across a range of platforms, and driving designers to expand their knowledge of embedded small form factor options to select when and why one platform is more appropriate than another.

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Advanced Micro DevicesSunnyvale, CA.(408) 749-4000.[www.amd.com].

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by Frank Dickman, Consulting Engineer

The economy of every developed coun-try in the world depends on the sup-ply of oil, gas and water, as fuels for

transportation, heat, electric current pro-duction and survival. The average Ameri-can consumes 2 gallons of gasoline, 220 cubic feet of natural gas for heating and cooking, 30 kilowatt-hours of electricity (produced primarily from fossil fuels), and 150 gallons of water a day. The supply is an essential part of the critical infrastructure. Providing and protecting the security of that supply is a clear-cut mandate.

Distributed Control Systems (DCS), Supervisory Control And Data Acqui-sition (SCADA), Programmable Logic Controllers (PLCs) and other legacy con-trol systems have been used for decades in power plants and grids, oil and gas re-fineries, air traffic and railroad manage-ment, pipeline pumping stations, phar-maceutical plants, chemical plants, auto-mated food and beverage lines, industrial processes, automotive assembly lines and water treatment plants. After 9/11, utili-ties quickly recognized that these systems needed even more security in the wake of the increased reports of malicious viruses,

hacking and the cyberwar capabilities as discussed in numerous whitepapers.

As a result, utilities realized that many industrial control networks would benefit from diverse firewalls behind the front-office firewalls and encrypted vir-tual private network (VPN) connectivity. Here is how one leading and progressive utility is securing the industrial control networks of their extensive network in-frastructure. The utility operates or man-ages and operates water facilities in 23 U.S states. They support over 300 remote field sites company-wide, with an exten-sive network of underground piping. For over 30 years, they have used a variety of methods to connect to their remote sites, including modems, leased lines, dry pairs and licensed radio.

In 2009, they were proactively plan-ning to increase the security of their SCADA control networks. The systems engineering group, corporate IT depart-ment and an outside consulting firm were involved in the project and the security product evaluations. A leading IT net-work solution was initially considered, as this path reflected the corporate office network standard. But there were other important considerations.

There are a wide range of security technologies that can be used to protect

the corporate network, but these are less successful within a production network. Software-based solutions (personal fire-walls, anti-virus software) cannot run on some proprietary operating systems, due to lack of compatibility, and often can’t be integrated into systems that use older pro-cessor technology because these lack the necessary performance.

According to the systems engineering project manager, “We needed an indus-trial solution, particularly for our remote sites. We needed a solution that was easy to configure, powered by 24 VDC, met our IT security standards, and could hold up to years of operation in a harsh envi-ronment. In the past, we had mixed results using office network-grade products that were expensive, required special skills to configure, and failed frequently.”

Finding a SolutionIn early 2010, the utility was intro-

duced to the family of mGuard industrial network security devices from Phoenix Contact, created and developed by their subsidiary, Innominate Security Tech-nologies. The system was designed for harsh environments and includes small, industrial-rated modules that incorpo-rate router, firewall, encrypted VPN tun-nels, filtering of incoming and outgoing

One major utility secures its automation networks with attached security devices that can utilize existing IP addresses and trap and report unauthorized attempts at access.

SCADA Security for Critical Infrastructure

Supervisory Control Systems



TECHNOLOGY CONNECTED


connectivity, authentication and other functions to provide layers of distributed “defense-in-depth,” economically and without disturbing production. Two sim-ple applications are illustrated in Figures 1 and 2.

In the first example, a plug and play module is used to provide encrypted vir-tual private network (VPN) tunnels to one or more devices. Communication with protected devices is limited to authorized, authenticated users. In Stealth mode, the module cloaks itself in the IP address of the protected device, then screens and discards unauthorized packets, including malware and hacker probes (Figure 1).

In the second example, the same in-dustrial module is being used as a secure router, segmenting a flat network into se-cure subnets to protect individual produc-tion lines, secure confidential department information, and provide a secondary and tertiary Internet firewall (defense-in-depth). A distributed router application on a production floor eliminates the need for traditional telecom closets and expen-sively long cable runs (Figure 2).

Devices are available in various industrial-rated designs—for DIN-rail mounting, for 19-inch rack mounting in cabinets, as PCI cards or as dongle-style patch cords for roaming technicians. The hardened, industrial version has been in production since 2005 and has proven ef-fective in tens of thousands of demanding installations. Rated IP 20 for mounting in NEMA enclosures, they are easily in-stalled and enabled by technicians, rather than IT network administrators. Custom-ers in the automotive and other industries have already used these versions with excellent results in providing security for older production systems. Clients include a major natural gas and electricity pro-vider, a defense and telecommunications provider, and numerous manufacturing facilities.

After review of the technology, the utility’s IT Department was receptive to

the concept as it would allow process per-sonnel to deploy and maintain their own networks, freeing up IT administrators for other tasks. The company installed a dozen devices as a test bed.

The ability for the mGuard module to do AES-256 encryption along with its industrial design was key. By default, the device is configured in its most secure configuration. Previously, it would require a day’s time of an experienced IT techni-cian, whereas now a new VPN device can be rolled out in 10 minutes. This equip-ment is very easy for someone with mini-mal network knowledge to install.

Installation can be as simple as mounting the device, providing 24 VDC power, plugging in the network cable and using a patch cord to connect to the server, human machine interface (HMI) PC, or production equipment cell to be protected.

Using the Internet capability of the pro-duction control console, with a password protected login, the security device can be set up and enabled in moments from a template on the device manufacturer’s website.

In Stealth mode these devices are completely transparent, automatically as-suming the MAC and IP address of the equipment to which they are connected, so that no additional addresses are re-quired for the management of the network devices. This was a feature that appealed to initially skeptical IT personnel. No changes need to be made to the network configuration of the existing systems in-volved. Yet the devices operate invisibly and transparently, monitoring and filter-ing traffic to the protected systems by providing a stateful packet firewall, ac-cording to rules that can be configured via

NetworkMultiple Device Protection

NetworkSingle Device Protection

192.168.1.0/24

192.168.1.24

192.168.1.2

192.168.1.24

192.168.1.34192.168.1.27192.168.1.1192.168.1.1

192.168.1.76 192.168.1.76

mGuardStealth

mGuardStealth

192.168.1.0/24

FIGURE 1

Example of industrial network security that provides drop-in installation for devices that are difficult to upgrade, regardless of operating system and require no client configuration. The strategy provides stealth mode and multi-stealth mode to protect one device or a subnetwork.




templates from a centrally located server, or by using the default configuration. And with bi-directional wire speed capability, the devices will not add any perceptible bottlenecks or latency to a 100 Mbit/s Eth-ernet network.

If required, the security of networked equipment may be further enhanced. Con-figuration of specific user firewall rules can restrict the type and duration of access to authorized individuals, who may log in and authenticate themselves from their lo-cations, PCs and IP addresses. Virtual Pri-vate Network functions provide for secure authentication of remote stations and the encryption of data traffic. Optional Com-mon Internet Files System (CIFS) integrity monitoring functionality can protect file systems against unexpected modifications of executable code—by Stuxnet-derived malware for instance—by sending alerts to administrators. An overall view of an integrated solution is shown in Figure 4.

The utility is implementing multiple measures into its SCADA network in or-der to actively monitor the system. They are currently using network segmentation, VLANS and centralized firewalls and are looking to introduce intrusion detec-tion (IDS) and intrusion prevention (IPS) systems into the network. The mGuard is a tool that allows them to perform these functions.

The company needed to protect re-mote terminal units (RTUs) and program-mable logic controllers (PLCs), remote card access and video systems. As indus-trial systems migrate toward an Internet Protocol (IP) network, more timely infor-mation and control is available. All new PLCs have IP capability. Power moni-toring is another example. All new vari-able frequency drives (VFDs) for motors, switchgear, pumps, compressors and gen-erators have power efficiency monitoring capabilities that need to be tied into the SCADA systems. Following field trials, the appliances were utilized to provide protection from vulnerabilities through firewall, VPN, routing and trap functions.

Currently the security modules are deployed in multiple locations through-out the Northeast. The devices are used for both the SCADA networks and the security networks at remote unmanned locations. The mGuard devices have

mGuardRouter

1:1 NAT

mGuardRouter1:1 NAT

mGuardRouter1:1 NAT

IP Address10.10.N.0/24

IP Address10.10.2.0/24

IP Address10.10.1.0/24

Production Cell 1192.168.10.0/24

Production Cell 2192.168.10.0/24

Corporat Network10.1.10.0/16

Subnet192.168.1.0/24

mGuardRouter

Production Cell N192.168.10.0/24

mGuard RouterMasquerade NAT

Internet

FIGURE 2

In NAT router applications the module solves duplicate IP applications without changing local machine IP addresses; it can connect identical subnets into single central protection networks at the end user’s site. It can also deploy at the plant floor rather than in a 19-inch commercial rack.

FIGURE 3

These mGuard security appliances protect industrial automation networks. They are cost-effective, network transparent, simple to install and easily managed. Available fiber connectivity can provide Gigabit bandwidth.



been interfaced with the existing Cisco infrastructure. The utility reports saving money on remote support from staff and outside contractors. Site visits are no lon-ger required for minor code changes and troubleshooting.

The network described here belongs to a water utility company managing and operating water facilities in 23 U.S. states. However, the application is also pertinent to any automated manufacturing environ-ment, as well as extended or wide ranging distribution networks, such as those oper-ated for natural gas, crude oil, power, pet-rochem refining, steam, water distribution and other critical infrastructure delivery systems. Each of these utility applica-tions include a harsh environment, remote facilities, access control, video security, rotating equipment —whether pumps, compressors or turbines—and control equipment applications delimited by sim-ple PLCs. All of these systems can include built-in IP capability and are vulnerable to virus propagation and deliberate hacking, by individuals, foreign governments and non-government failed states.

Frank Dickman, Consulting EngineerChicago, IL.(847) 318-7750.[[email protected]].

Innominate Security TechnologiesBerlin, Germany.[www.innominate.com].

InternetVPN gateway

Remote user Remote maintenanceservice center

VPN tunnel

VPN tunnel

Back office network

*VPN, firewall, anti-virus

Factory network

Production cell

Gateway

e-mail server(Linux)

Extranet server(Sun Solaris)

SAP R/3 serverCentral managementstation (ISCM)

Gateway

Production cell

Quality assurancesystem Server farm

FIGURE 4

Overview of an integrated network solution.

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TEChNOLOGY INSYSTEMS





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Google Android deployment has been rising steadily since the in-troduction of the mobile/embedded

OS in 2008. While most adoption has cen-tered on building smartphones and more recently tablets with the Google applica-tions OS, Android presents embedded de-velopers of all stripes with a feature-rich low-cost platform, replete with 200,000+ ready-to-run applications.

Of equal importance is the state of Android IP (intellectual property). While the Android platform and shrink-wrap ap-plications in the Android Market build on Open Source Software (OSS), the realities of working with Google in the mobile/wireless ecosystem increasingly involve closed technology and a closing ecosys-tem around it.

Expanding Application SpaceAndroid got its start and to this day

enjoys its greatest success in mobile hand-set designs. As of Q2 2011, 250+ models of Android-based phones have been de-

ployed in mobile marketplaces from North America to Europe to Asia and beyond. While focused on smartphones, Android has benefited from work by a broader co-alition of silicon suppliers, integrators, “commercialization” services providers and individual developers, such that to-

day the platform is increasingly useful for building a range of device types.

Almost from the first release of An-droid platform code, device manufactur-ers (OEMs) also experimented with using Android as an OS for tablets and netbooks. With the unparalleled success of the Apple

by Bill Weinberg, LinuxPundit.com and Olliance Group

The universe of embedded applications for Android is rapidly expanding, and the technical evolution of Android is meeting the needs of embedded developers. Still, there are remaining gaps in performance and other capabilities that are needed to address a wider swatch of embedded application types.

Android—Google’s Mobile platform and its Capabilities for Embedded

Embedded Java and Android

Version Name Date Features1.0 N/A Sep 08 Full handset function support, including telephony, camera, browser,

email, SMS/MMS, maps, video, Bluetooth, WiFi, etc.

1.1 N/A Feb 09 Maintenance release for T-Mobile G1

1.5 Cupcake Apr 09 Built on 2.6.27 Linux kernel. Virtual keyboard, widgets, video recording, browser cut/paste, Bluetooth A2DP, AVRCP profiles

1.6 Donut Sep 09 2.6.29 kernel. Updated CDMA/EVDO. Higher screen resolutions. GestureBuilder toolkit. Text-to-speech. Turn-by-turn navigation.

2.0/2.1 Éclair Oct 09 2.6.29 kernel. Exchange support. HTML5. Multitouch events. UI updates and live wallpaper.

2.2 Froyo May 10 2.6.32 kernel. Performance and footprint enhancements. JIT in Dalvik. Chrome Javascript engine. Internet tethering/WiFi hotspot. Adobe Flash and high-DPI screen support.

2.3 Gingerbread Dec 10 2.6.35 kernel. Updated UI, esp. for large screen, native VoIP. NFC support. Enhanced power management. Concurrent Dalvik garbage collection. New sensors. EXT4 FS. Native SDK.

3.0 Honeycomb Feb 11 Tablet-only release. 2.6.36 kernel. Virtual and “holographic” UI. Tabbed browsing. New multi-taslking UI. Dual-pane UI in email, contacts. Hardware acceleration and multi-core CPU support.

TABLE 1

Android release history and key features.



TECH IN SYSTEMS


product line, OEMs and users of course look to Android-based designs as poten-tial iPad killers, or at least as a way to get some piece of this lucrative market away from Cupertino. Early attempts at build-ing tablets and also netbooks based on Android have proven disappointing, both in terms of user experience and commer-cial impact.

Google’s response to “untutored” use of Android on these types of devices has been:

• Releasing the Linux-based Chrome OS, first as a free-standing platform, and more recently in partnership with device OEMs as a preloaded device OS

• Forking the Android code base for tablet designs

• Holding back release of source code to Android 3.0 to give OHA members and select OEMs more time to create better integrated tablet-type products

The release of Android Honeycomb to (select) OEMs will hopefully result in shipment of Android-based tablets with capabilities beyond the current crop of de-vices like the Motorola XOOM and Sam-sung Galaxy—maybe even real competi-tion for the Apple iPad.

The first vision for “Android beyond mobile” focused on building devices for the digital connected home—set-top boxes (STB), digital television (DTV), digital and personal video recorders (DVR/PVR) and Internet TV. To support these types of applications, MIPS Technologies and Android Commercialization companies have optimized the Android Dalvik vir-tual machine for the MIPS architecture and provided device drivers, CODECs, etc. for MIPS-based hardware. More ex-perimental equivalents also exist for other processors.

Android is enjoying a number of design wins for In-Vehicle Infotainment (IVI). While Genivi and its member OEMs have selected native Linux-based plat-

forms (MeeGo and Ubuntu Mobile, Men-tor, MontaVista and Wind River embed-ded Linux), several Asian device OEMs are building after-market GPS and other IVI systems using Android, especially for connected IVI systems with traffic report-ing and other two-way communications beyond satellite-based positioning.

Two years ago, FreeScale and Mentor Graphics announced support for Power Architecture in Android, specifically to target applications in networking and net-work appliances, storage, printing and im-aging, multimedia and industrial control. While not really “blessed” by Google, ports like these mean that in theory at least, Android will find design-wins span-ning the gamut of embedded and indus-trial computing.

In its relatively short three-year his-tory, Android has evolved dramatically, with a staccato release cycle spanning three major releases and a fork. Table 1

recounts the history of the platform, with a brief summary of features and special attention to the version of the Linux ker-nel underlying the Android stack. Another way to look at the Android release history is to track contributions from Google and community sources, and how parallel de-velopment branches relate to one another (Figure 1).

Android and EmbeddedAndroid is extremely attractive to

embedded developers because of its func-tional richness, with capabilities dwarfing practically all RTOS-type platforms, and a full application framework more com-plete than embedded Linux toolkits.

Android strengths lie in the area of supporting user applications and selec-tively exposing underlying capabilities today associated with mobile/wireless functionality—it’s a smartphone OS, after all. Smartphones aggregate an impres-

Eclair Experimental

FroYo

Google ContributionCommunity ContributionBranch CreatedRelease Cut

Public devel branch

Public release (i.e. stable API) branch

Google private branch

2.1FroYo Experimental

Legend

Eclair Release

Upstream Projects(WebKit, SDK, kernel,...)

FIGURE 1

Android releases and contributions.


TECH IN SYSTEMS


sive array of functions in a small pack-age, but are not necessarily representative of the gamut of intelligent devices. Let’s examine a few requirements that typically characterize device applications in areas

beyond mobile, and how Android meets those needs as shown in Table 2.

Android IP – Open or Closed?The original excitement over the An-

droid platform and an attribute of its ongo-ing success is the ostensible open source nature of the platform and licensing of the project code. Superficially, Android does appear to be an open source project as in-dicated by the top-level use of Apache 2.0 license and the underlying open source components including the Linux kernel, BSD libraries, SQLite, Webkit, etc. In addition, the software development kit (SDK) is based on Eclipse and there is an enthusiastic worldwide developer commu-nity.

However, a closer examination of the inner workings of the Open Handset Al-liance (OHA) and the Android “project” reveals greater complexity as well as trou-bling signs of an increasingly closed and proprietary OS and ecosystem. Yes, there is an open source license in use, but the top-level Apache license does not cover all code in the platform. There are many other open source licenses involved—19 to be exact—and there is also proprietary code. In addition, not all versions of An-droid are generally available in source form, e.g., Honeycomb.

The OHA itself is not an open, merit-based community because membership is by invitation only through Google and the OHA member companies. This means that the uptake of patches and other input from non-OHA submitters is limited or zero. In addition, OHA members are required to sign an anti-fragmentation agreement (AFA), and the contents of that document are under NDA.

The Android Market and Applica-tions are not exactly kosher open source either. The included “hygiene” apps are not all open source, and app developers are increasingly subject to Google over-sight (e.g., the recent ejection of two ISVs with gaming emulator apps). In addition, OHA members are discouraged from building their own app stores.

Anyone familiar with working in actual open source communities will im-mediately perceive how Android is more open in name than in practice. For readers less familiar with open source best prac-tices, it is instructive to hold the Android project up to the standard Open Source definition created by the Open Source Initiative (opensource.org) as laid out in Table 3.

2. Source code made available Google holding back source to Android Honeycomb

3. Derived works may be created and distributed AFA limits OHA members’ ability to derive/distribute. Differentiation in UI home screen, widgets

4. Integrity of the author's source code may be protected if modification by patches allowed

OK for actual FOSS components, but not all of Android platform

5. No discrimination against persons or groups Google favors select OHA members

6. No discrimination against fields of endeavor Google currently favors only handset/tablet OEMs

7. Distribution of license without further execution OK

8. License must not be specific to a product OK

9. License must not restrict other software License(s) themselves do not restrict, but AFA may

10. License must be technology-neutral OK

TABLE 3

Android vs. OSI Open Source definition.

Footprint While designed for mobile device deployment, Android is not exactly small.. The footprint for a working ARM-based deployment started out at 64 MB RAM for Android 1.0 with more recent versions deploying in 256 MB RAM with several GB of flash storage. Not outrageous by today’s abundant provisioning standards.

Opportunities to reduce this footprint include removing core applications, class libraries, UI components and other types of “shaving”. Overly aggressive downsizing of platform components, however, seriously impacts interoperability and application support, and failure to pass the Android Compatibility Test Suite (CTS).

Real-time Responsiveness

In most of the smartphones that today host Android, latency-sensitive functions are handled by dedicated hardware – separate baseband radio processors, multimedia engines, graphics processors, etc. When real-time response is required from the applications processor (APU) running Android, that work is handled by underlying mechanisms in the Linux kernel and its native low-latency capabilities.

Throughput Early versions of Android and first-generation ports to non-ARM hardware boasted unimpressive performance from the Dalvik engine that powers most of the platform. Ongoing investments in performance by Google, OHA members and 3rd parties (e.g., Dalvik JIT in 2.2) have yielded impressive gains in performance, akin to gains in mainstream Java performance. Now, Dalvik-based programs approach native/compiled C/C++ code for most benchmarks. Moreover, as of SDK 2.3, developers can choose to use a standard native API set instead of Dalvik execution.

Security Android benefits from several layers of security and security mechanisms. At the lowest level, it builds on capabilities supplied by the underlying Linux kernel and separation provided by the Linux process model. Overlaid on this foundation is a “sandbox” model for Dalvik applications and security attributes and mechanisms (e.g., encryption) of various components of Android frameworks. As with other OSes, as vulnerabilities surface, patches are made available to address actual and hypothetical threats.

CPU Support Most Android deployment and board support today targets ARM silicon, with development-level support for x86. While Google only endorses ARM-based deployment, commercial and community support now covers other mainstream silicon, including Atom, MIPS, and Power Architecture.

Device Drivers The Android HAL supports several types of standard I/O devices: touchscreens, sensors, etc. To accommodate devices and device-types beyond this core set, the shortest path is to use device support for the Linux kernel underlying Android.

TABLE 2

Android and typical embedded device requirements.


TECH IN SYSTEMS

The Oracle SuitAndroid, like many mobile platforms

before it, provides a virtual machine ex-ecution engine (Dalvik), similar to Java. When Google launched Android, they stated that the re-implementation of Java was necessary for technical reasons—claiming “Java is broken.” At the time, Java IP owner Sun did not pursue the mat-ter, and chose instead to promote authentic “Coffee Cup” licensed implementations and its own mobile platform JavaFX Mo-bile to compete with Google’s new mobile OS. Fast forward to 2011—Sun is now a division of Oracle, Google’s stalwart com-petitor and a fierce protector of its IP port-folio, including Java.

In 2010, Oracle initiated legal ac-tion against Google for copyright viola-tions and patent infringement, and in 2011 many of the particulars of the suit were disclosed to the public. Analysis of the claims seems to reveal that sev-eral counts regarding patents indeed have merit. Without a strong patent portfolio for counter claims and cross licensing, Google is exposed to damages, and An-droid deployers will likely have to foot the bill for run-time royalties—$5.00/copy or more, according to one analysis.

This legal challenge won’t soon top-ple Android from its mobile leadership position, but it will likely make it more ex-pensive for OEMs to build “mass market” smartphones from it. So much for free software and free beer in one cute green container!

Certainly, Android is not ideal for all types of device designs. It presents a daz-zling array of features and capabilities for mobile/wireless devices and an attractive OS option for other intelligent devices. In particular, Android is a viable alternative for designs that benefit from a graphical user interface, field-upgrade capability, a complement of ready-to-use applications, and both Java-style and native C/C++ run-times. It is a less attractive choice for

• Headless devices• Devices with extremely limited RAM

and persistent storage• Closed-box designs• Legacy support for RTOS APIs and

other specialized interfaces• Systems with pervasive hard real-time

/ low-latency response needs

• Designs built on “minority” CPU fam-ilies or special-purpose silicon

I have encountered development teams building applications of these out-lying types who nonetheless favor An-droid as option. Enthusiasm for the plat-form is so great (as it was for embedded Linux) that Android is often deployed not because of its attributes, but in spite of them.

Bill Weinberg(408) 568-2492.[www.linuxpundit.com].

Untitled-7 1 7/6/11 6:12:18 PM

www.innovative-dsp.com


TEChNOLOGY INSYSTEMS





Ad Index









S ince 1997, the PERC Ultra virtual machine has enabled developers of Java applications to deploy in con-

texts that require compliance with real-time constraints. Unlike traditional Java virtual machines, this real-time virtual machine integrates real-time garbage col-lection, fixed priority scheduling, extend-ed thread priority ranges, priority inheri-tance for Java’s built-in mutual exclusion mechanisms, and priority ordered queues in the implementation of Java’s wait and notify services. As an example of the differentiated behavior of the real-time virtual machine’s garbage collector, see Figure 1.

When this same workload is run on a traditional virtual machine, the appli-cation code typically runs without inter-leaved garbage collection until the alloca-tion pool is depleted, at which time all of the application threads suspend until gar-bage collection completes. With this rela-tively small heap, the stop-and-wait time to complete garbage collection would be in the range of 2 to 3 seconds. With much larger heap sizes, the time spans during

which application code is suspended while garbage collection replenishes the alloca-tion pool may exceed 30 seconds.

PERC Ultra was the first real-time

virtual machine on the market. Early PERC Ultra development priorities tended to further emphasize the strengths that uniquely qualified the technology for use in mission-critical real-time applications.

by Kelvin Nilsen, Atego Systems

Enhancements are embodied “under the hood” of the PERC Ultra virtual machine, providing benefits to end users without requiring changes to application source code, configuration management, or automatic build scripts.

Real-Time Java Virtual Machine Undergoes Overhaul

Embedded Java and Android

550 600 650 700

100%

10%

20%

30%

Real Time (seconds)

Allo

cata

ble

Mem

ory

(Mby

tes) CPU Utilization (Percent)

80%

60%

40%

40%

20%

FIGURE 1

Trace of memory subsystem during execution of simulated air traffic control application running in steady state. Blue represents the CPU time consumed by the application threads and red represents the CPU time consumed by the garbage collector, using the scale on the right-hand side of the chart. Yellow represents the amount of memory available to satisfy allocation requests at each moment in time, as indicated by the scale on the left. Garbage collection is running at a lower priority than the application threads, but consumes larger percentages of the CPU because the CPU is otherwise idle.


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TECH IN SYSTEMS


This technology has been deployed in hundreds of thousands of devices, dem-onstrating in excess of 99.999% up time in application domains as diverse as in-dustrial automation, telecommunications infrastructure, in-vehicle telematics and critical national defense systems. This real-time virtual machine now fills criti-

cal roles in manufacturing state-of-the-art semiconductors, connecting long-distance telephone calls, delivering DSL broad-band services to homes and offices, and implementing ballistic missile defense for the U.S. Department of Defense.

In more recent years, the market for real-time virtual machines has evolved and

expanded. New vendors have responded to the market opportunity and are now of-fering support for commercial real-time virtual machine products. More impor-tantly, today’s users of real-time virtual machines are typically looking for much more than just the ability to meet real-time deadlines with Java code running on real-time operating systems. In particu-lar, today’s real-time Java developers are likely to be working on very complex ap-plications that have a combination of real-time and non-real-time components. Of-ten, much of the software that comprises a modern real-time application consists of off-the-shelf software components sup-plied by third parties. In order to simplify the integration of third-party commercial software and open-source technologies, it has been increasingly important to main-tain full compatibility with the most re-cent releases of the Java run-time environ-ment. Oracle’s continuing support for the OpenJDK project has improved compat-ibility by supplying independent virtual machine developers with access to fully compatible open-source implementations of the standard Java libraries.

While it may be appropriate to sacri-fice performance in order to achieve pre-dictable deterministic behavior for those parts of an application that have real-time constraints, the parts of an application that do not have real-time constraints often have very demanding throughput require-ments and cannot tolerate any sacrifice of potential performance optimization. Enabling new configuration options and increasing access to common Java optimi-zation techniques have been critical moti-vators for the technology upgrade.

The real-time virtual machine’s tool chain is illustrated in Figure 2. The same basic flows between components of this tool chain have been in place for over ten years. In the classic implementation, both the JIT and AOT compilers are the same proprietary technology, implemented in Java. With release 6.0 of PERC Ultra, the default JIT and AOT compilers are now implemented with an open-source tech-nology known as the low-level virtual ma-chine (LLVM). The technology is char-acterized as a virtual machine because it takes as input a portable LLVM interme-

source files

object file

Java Compiler

Native Linker

ROMizer™Static Linker

.class files

augmented.class files

PERCAccelerato™

AOT Compiler

Loader

JIT Compiler

Comp. classesPERC VM lib

AOT Compiler

PERC Virtual Machine

Interp .classes

FIGURE 2

The classic PERC Ultra tool chain. The PERC Accelerator translates Java byte code into machine code using an ahead-of-time (AOT) compiler. The ROMizer preloads and prelinks multiple Java class files into a binary image which can be preloaded into ROM or loaded at startup from a file. The Loader and JIT Compiler of the PERC Virtual machine are optional components which can be omitted to reduce footprint and improve security.

ARM

MIPS

PPC

x86

...

Java-specificoptimizations on

byte code

Translate byte codeto LLVM assembler

Standard LLVMOptimizations

LLVM CodeGenerator

Java-specificoptimizations onLLVM assembler

FIGURE 3

Integration of the LLVM technology within the PERC Ultra virtual machine.


TECH IN SYSTEMS

diate representation. LLVM includes a va-riety of optimization passes that improve the efficiency of programs by manipulat-ing intermediate representations, and a code generation pass that translates the in-termediate representation to one of many possible target machine languages.

The LLVM technology emerged from a research project that began in 2000 at the University of Illinois at Urbana-Cham-paign. The graduate student who led the LLVM research, Chris Lattner, completed his Ph.D. in 2005 and was subsequently hired by Apple Computer where he over-sees the development and maintenance of various LLVM-based development tools for Mac OS X and iOS. LLVM has been used in a large number of research efforts and in at least one other commercial offer-ing, the implementation of Adobe’s Hydra language compiler.

The LLVM translation technology has also been grafted onto the back of the GNU GCC compiler tool chain. In this context, it was shown to generate code that is approximately 20% faster than the code generated by the default GCC compiler, and to perform its translations 18-42% faster than the default GCC com-piler. Other reasons that LLVM represents a better code generation technology than GCC are that it is designed to support both ahead-of-time and just-in-time compila-tion, efficient and accurate garbage collec-tion, and more modern CPU architectures and code optimization strategies.

Integrating LLVM within the PERC Ultra environment consists of several steps (Figure 3). First, the Java byte code is translated into the LLVM intermediate representation. The translation of byte code to LLVM assembly language rep-resents all aspects of the code generation model. The current translation to LLVM assembler represents a translation that im-plements the exact same run-time model as the classic PERC Ultra virtual machine. Second, certain Java language-specific optimizations such as method in-lining, elimination of redundant array subscript checking, and memory allocation optimi-zations must be integrated to enhance the LLVM technology. We found it necessary to add language-specific optimizations to the LLVM framework because LLVM it-

self is a low-level generic virtual machine that does not have a good understanding of the rules that characterize legal trans-formations on Java programs.

A third integration step, which has not yet been completed, involves enhance-ments to the real-time virtual machine itself. These enhancements, which are enabled by the more powerful code gen-eration capabilities of LLVM, will allow a

future version of the real-time virtual ma-chine to provide even better performance and determinism. Since these more ag-gressive optimizations require changes to the virtual machine’s binary interface, we chose to perform the LLVM integration in two phases. This allows us to manage the complexity and reduce risks. During the first phase, we focused our changes en-tirely on integrating the LLVM compiler

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TECH IN SYSTEMS

technologies without making any changes to the run-time environment. This has allowed us to depend on the stable foun-dation provided by the existing real-time garbage collection implementation, the debugger and profiler implementations, the current code generation and inter-preter models, and the existing integration of native (C-language) libraries. Since the LLVM code generation model exactly

matches the code generation model of the classic PERC Ultra virtual machine, there is full interoperability between code gen-erated by the classic PERC Ultra JIT and AOT compilers and code produced by the new LLVM compiler.

Among the additional refinements anticipated for a future implementation of the real-time virtual machine is a change to the stack memory model to reduce the

costs of entering and exiting methods. In addition, a change to the garbage collection barrier protocol will reduce the overhead of coordinating with garbage collection and improve reaction times to asynchro-nous events.Finally, a change to the thread preemption model will allow improved caching of memory-sensitive information between thread context switches. This third integration step consists of making changes to the LLVM assembly language that is translated from the Java byte code.Figure 3 illustrates the flow of information between the various LLVM components.

LLVM integration within the PERC Ultra real-time virtual machine has re-sulted in significant performance gains. We’ve measured an overall improvement of 56.6% on CaffeineMark, 20% on jByte-Mark Integer index, and 62.9% improve-ment on jByteMark Floating Point index. In general, performance improvements re-sult from the more efficient compiler op-timizations that are built into the LLVM virtual machine. Remember that further performance benefits will be realized upon completion of the next phase of in-tegration, which involves optimizations of the PERC Ultra run-time execution model and corresponding changes in the transla-tion of Java byte code to LLVM assem-bler.

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Untitled-5 1 2/17/09 4:47:07 PM

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42 MONTH 2011 RTC MAGAZINE

technology deployed





Ad Index









The recent IEC 62304 standard for medical device software is causing companies worldwide to step back and examine their software development processes with considerable

scrutiny. While software development and testing is still an inte-gral part of overall system design and production, the IEC 62304 standard focuses on software as a separate lifecycle process with specific needs for risk management and safety assessment.

With IEC 62304, the world has changed, literally—country by country—for medical device manufacturers. This doesn’t mean, however, that complying with IEC 62304 must slow down your medical device software development. By applying best practices guidance and process automation, companies have a new opportunity to improve on their fundamental business goals, while getting through regulatory approvals faster.

Changes in the Medical Device FieldThe IEC 62304 standard points to the more powerful role

that software plays in the medical device industry. Once hardware

was king. Older systems used software, of course, but it wasn’t the focus, Software was primarily used for algorithmic work. Not to overly generalize, but the focus of management was on building hardware that worked correctly; software was just a necessary element of overall implementa-tion. Now with complex UIs, easy-to-use at-home medical devices and systems, etc., software has taken on a much more vital role.

Today, software is where the consumer value lies in systems engineering, and em-bedded software is creating opportunities for competitive differentiation. Thus, soft-ware developers are beginning to play a greater role in the design, architecture and functionality of medical devices. Tried and true software development methods are also being woven into the overall product engineering process. These methods must recognize that changes occur to require-ments over the course of the lifecycle, and be able to adopt the appropriate levels of flexibility in order to cope.

Rapid changes in supply chains and changes in requirements mid-stream dur-ing a given product delivery cycle are caus-ing some degree of chaos for engineering teams, including the software development teams. Now, the IEC 62304 standard re-

quires traceability in the software delivery process (the ability to ensure that requirements map to each ele-ment in the software process). But as software teams working in this bold new world seek to adopt agile techniques to better meet deadlines and expectations, they are struggling to embrace the demand for traceability, which is simply not the “sweet spot” for agile development. So the question is, how do we introduce more rigor to the development process, and meet the needs of this new industry standard?

The Hard Part Is SoftwareCoordinating people, processes and tools is never easy. So

why does a greater role for the software component make the ef-fort even harder? The primary difficulty has to do with the nature of software itself. While the best thing about software is that it is soft (i.e., relatively easy to change), this is also its riskiest attri-bute. Most software is constrained only by human imagination; the quality of software is judged not by precise mathematics and physical tolerances, but by the degree to which it satisfies a user’s expectations, which can be highly subjective.

Agile and iterative delivery methods, which enforce frequent stakeholder review of the working software under development,

by, Martin Bakal, IBM Rational

Medical device manufacturers are facing new requirements from the FDA. The IEC 62304 standard demands documentable traceability between requirements and code through the entire development process.

challenges and opportunities for the Medical device Industry: Meeting the new Iec 62304 Standard

Small Modules in Medical Devices



technology deployed


help guide software projects toward more satisfactory outcomes. But, as noted earlier, software practitioners following the more “pure agile” methods—such as Scrum or XP—may find that the new emphasis on requirements in IEC 62304 demands a more formal, less “agile-feeling” lifecycle. Pure agile methods need to be scaled up with additional guidance from configuration and re-quirements management practices, at minimum. Modeling your architecture is another great way to scale up your process to meet the requirements expected of IEC 62304.

The IBM Rational organization has recently provided some clear guidelines for scaling agile methods for larger, more dis-ciplined software development activity. Called “Disciplined Agile Delivery,” the new guidelines provide teams of any size many of the benefits of traditional methodologies while retain-ing the results-oriented spirit of agile development. Of course, it will not always be the case that a development team working on the software components for a medical device will be a large team, but the traceability required by the IEC 62304 standard demands more than a purely agile approach, and Disciplined Agile Delivery (DAD) offers a solution. DAD is itself a very big topic. Suffice it to say that the overall quality management concerns introduced by the new IEC 62304 standard are ad-dressed by DAD.

The Specification DetailsThe history of standards for systems manufacturers provides

some context for the IEC 62304 standard. Figure 1 shows the relationship of prior product engineering standards that impact the design and implementation of medical device software. The emergence of IEC 62304 is big news, in part, because it requires systems teams to manage this larger environment of industry requirements around a clearer understanding of software as the “brains” of the system.

Let’s consider what the software team manages as the soft-ware evolves not only to meet design specifications, but also this large complement of regulatory compliance mandates. For start-ers, the IEC 62304 standard demands additional rigor around traceability, reporting, architecture and requirements manage-ment. What follows isn’t a comprehensive list, but it covers sev-eral of the essential guidelines and how they affect software de-livery teams.

IEC 62304 states that requirements analysis must be part of the software development process. The requirements analysis discipline establishes the high-level requirements of the system being designed, and derives lower-level requirements from those until the process produces requirements with sufficient informa-tion to enable coding. These lower-level requirements detail the complete system, including potential faults and interfaces be-tween systems. These can be developed iteratively in an agile process, but the IEC 62304 standard demands that they must be documented.

Requirements also need to link to other phases of the pro-cess, including the software architecture, test cases and so forth.

The general idea is that someone can look at a requirement and understand what should be implemented and what tests must be performed to prove the requirements are met. Requirements typi-cally are written by systems engineers as simple text early in the design process as they capture ideas on paper.

Another discipline required by an IEC 62304 guided process is architectural design. This turns the requirements into a coher-ent architecture so developers can understand how the require-ment will be met and ensure there aren’t any overlaps or holes in the requirements as described. Graphical images often are used to help development teams visualize an architecture emerging from the requirements. The graphics should map to the actual code, which provides the means for traceability from require-ments all the way to the code.

A key part of the overall process is failure mode and effect analysis (FMEA). FMEA is a powerful tool for explaining the potential failures to a regulatory agency. It shows how the iden-tified failure points map to the requirements and the tests that need to be run in order to prove that the failure can be handled correctly. Fault Tree Analysis (FTA) is a graphical way to help analyze the system to see where a failure is likely to occur. Typi-cally used during the early analysis phase of development, FTA diagrams show how failures interrelate. FTA diagrams combined with FMEA create a comprehensive strategy for identifying, un-derstanding and tracking potential failures.

Another important discipline is testing: The IEC 62304 stan-dard discusses both integration and system testing. Integration testing ensures that different components actually work together and do not cause unanticipated behaviors. System testing treats the whole system like a black box and ensures that high-level re-

Medical devicemanagement standardsISO 14971ISO 13485

Medical deviceprocess standardIEC 62304

Other sources ofinformationIEC/ISO 12207,IEC 61508-3,IEC/ISO 90003, ...

Implementationof medical

device software

Medical device product standardsIEC 60601-1IEC 61010-1

Gives specific direction for creation of a safe medical device

lays out a foundation todevelop a medical device

affects affects

affects

inspires

requ

ires

Gives detailed direction how to develop and maintain safe software system

Gives additional guidelines, techniques, etc that may be used

FIGURE 1

Relationship of systems engineering standards to medical devices software, including electrical, mechanical, and other standards.


technology deployed

quirements are met by the system itself. Each testing discipline is critical for meeting the requirements of IEC 62304. They also are quite useful for ensuring your device works as expected.

While developing reports isn’t specifically listed as an IEC 62304 requirement, in the end a report is what needs to be sent to the regulatory agencies. That report needs to include all the in-formation listed above and explain how they trace between each other to make a comprehensive whole software system for the medical device.

Getting to IEC 62304 ComplianceThe needs described above are met through software devel-

opment tools specifically geared for systems delivery, which is often divided into multiple categories: systems engineering, proj-ect management, software engineering and test management, for example. These categories ideally interconnect across the sys-tems delivery lifecycle in performing distinct tasks and creating distinct lifecycle work products.

Typically, hardware and software teams today use simi-lar processes for development. The standard V diagram in Figure 2 shows the typical stages both teams use for anal-ysis, design, implementation and testing. The challenge is that the teams operate separately, limiting their ability to synchronize key steps. What’s more, alignment is hindered by the use of different languages and tools. To achieve rapid code development and the associated business benefits, the hardware and software processes need to be integrated into a unified process.

This general, ideal process illustrated in Figure 2 provides a kind of map for software and systems development teams to address the needs of a standard such as IEC 62304. Some of this process may be part of your current methods; some portions may be clearly missing; and some may be unclear. The next step is to go about your own gap analysis to determine where you need to improve to meet the standard.

Verification and validation

Time

Concept ofoperations

Operation andmaintenance

Requirements and architecture

System verificationand validation

Detaileddesign

Integration, test and verification

Proje

ct tes

t and

integ

ration

Project definition

Implementation

FIGURE 2

The typical stages both software and hardware teams use for analysis, design, implementation, and testing.

Untitled-13 1 3/31/11 4:26:15 PM

www.logicsupply.com/itx


technology deployed

Performing a Gap Analysis IEC 62304 compliance does not need to slow down your med-

ical device software development. But we DO recommend that you perform a gap analysis to see how closely your own process maps to the specifications of IEC 62304. You may eventually hire a third party to help you come into compliance with the new standard, but you should do the gap analysis first, just to take an inventory of your process and its typical artifacts. You may find that your docu-mented process isn’t the one you actually follow in practice.

Get started by examining your process on paper. Is this pro-cess truly the one you are following? Be honest with yourself, and determine if your departures from the stated process oc-cur across all products, or only some. Try to determine where your software tools are most helpful—where the integrations are strong and consistent across the entire organization; and identify the areas for improvement.

For example, do you have the traceability between the phases as required by the new spec? Some organizations conduct trace-ability only on paper. Requirements are linked to specific loca-tions in the code, but requirements described early in a project can become out of synch with the actual code because, as discussed earlier, requirements evolve as development goes on. Hence, you need a requirements management method that maintains a link to the actual code that addresses each requirement, not simply a line number or some other meta reference.

Of course, it is up to your organization to decide what works best for you, and changes should be carefully considered both in light of the IEC 62304 specification as well as your product delivery culture and history of success. The best tool solutions will be those that allow incremental adoption of new capabilities, allowing you to avoid wholesale process changes and massive new infrastructure investments.

A developer immersed in the details of code she has just written may have a very clear sense of how that code addresses a specific requirement. But even brilliant code that is not well documented won’t meet the specifications of IEC 62304, since a new level of traceability between requirements and code is now demanded. Yet, your brightest developers may detest the need to demonstrate this traceability, since it has little to do with the ingenuity they have brought to bear on their various coding as-signments. That’s why it is vital for your tools themselves to show these connections. You not only alleviate the bother of manual reporting, but the best tools can also dramatically reduce the pos-sibility of human error that invariably is part of a manual pro-cess.

IBMArmonk, NY. (914) 499-1900. [www.ibm.com].

"ALWAYS COMPLETE"

The CSB1724 is manufactured in-house on our IPC-610 Certified, lead-free

capable surface mount line. All products carry a 1-year warranty and are

available in commercial and industrial temperature versions. Cogent offers

standard and custom carrier boards, royalty free licensing options and more.

1.6Ghz 88F6282 Sheeva ARMv5TE Core

16KByte I/D Caches; 256KByte L2 Cache

512MByte DDR2-800 and 512MByte SLC NAND

Two PCIe x1, Two SATA Gen2 and Two USB 2.0

Two 10/100/1000 Twisted Pair Copper Ports

On-Chip Crypto and Security Engines with XOR

Dual SATA Gen 2 and Dual 480Mbit USB 2.0 Ports

4-Bit SD/MMC, 2-wire TTL UART, I2C, SPI and I2S

3W typ., 4W Max, <10mw Power Down

The CSB1724, designed, developed and manufactured by Cogent Computer Systems, Inc., is a high

performance, low-power, ARMADA 300 (Sheeva ARMv5TE) based System on a Module (SOM). The

CSB1724 provides a small, powerful and flexible engine for Embedded Linux based Gigabit networking

and storage applications.

Now available at

www.digikey.com

Marvell Armada300 System On a Module

Untitled-8 1 4/28/11 11:15:23 AM

www.cogcomp.com

46 MONTH 2011 RTC MAGAZINE




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technology deployed


Medical computing is becoming more mobile due to an in-creasingly patient-centric view of health care. Whether in hospi-tals, clinics or at home, equipment must be small and light with network connectivity to provide complete and secure access to patients and their medical histories in real time. Optimized computer-on-module (COM) solutions, such as COM Express and Qseven, can be used with time-saving small form factor ref-erence design carrier boards to deploy next-generation mobile medical devices such as patient monitors, medical cart comput-ers and portable ultrasound devices.

Today’s new instruments can even test blood or separate blood cells into components on the spot. Previous generation de-vices based upon SBCs with cables or motherboards with riser cards can now migrate to cleaner COM solutions to reduce size, weight, power and cost. The module-based architecture is easy to upgrade to the latest processors and chipsets in the future without disturbing the application I/O.

Cart-Based ComputingMedical carts allow the efficient sharing of equipment be-

cause they can be wheeled into a patient’s room or surgery bay as needed, rather than having equipment permanently installed in every single room. A purpose-built cart can even contain a large-capacity 12V or 24V rechargeable battery to indepen-

dently power high-performance processors such as Core i5 / i7 and a monitor, which can then function for a full day without be-ing constantly plugged into a wall outlet like bulkier desktop computer-based carts. Data is stored locally, either on rotating SATA drives or flash-based SSDs, and can also be transmitted over encrypted IEEE 802.11b/g/n Wi-Fi networks. The same wireless connections can alert nurses’ stations in real time. A Gigabit Ethernet connector ensures fast transfer of elec-tronic patient records and other data while plugged in while “off duty.”

Other system requirements include internal USB or SPI buses to interface to mid-range A/D converters that talk to probes with transducers for vital signs, as well as generate ultrasonic waveforms us-ing D/A converters. Practically every sys-tem needs an external USB port for a local printer, and even an external serial port for a barcode scanner. The cart hosts full lap-top-class computer performance, including dual core processor with 2-4 Gbyte RAM

and desktop PC-compatible operating system. The display is usually placed on the top of the cart: either a 10”-15” LCD with an 18-24-bit LVDS interface or a standard DVI-D digital monitor. Occasionally, newer systems can optionally drive large fixed HDMI high-definition TVs and panels. In the next several years, the new DisplayPort monitors could emerge within both hospitals and clinics.

The constant pressure to reduce size and weight means that some OEMs are moving from motherboard-based box computers with vertical I/O cards to small form factor embedded computers with integrated I/O or small form factor expansion I/O modules and even to COM Express with a custom carrier board. Although some non-recurring engineering (NRE) is required up front, the COM-carrier board architecture offers a number of benefits. For example, system lifecycle is extended by upgrading the proces-sor module every 5-10 years. The carrier board is optimized for the exact I/O configuration and connectors and the entire unit can be flat with low-profile wireless modules and analog circuits directly on the carrier board, obviating the need for bulky riser cards that require mechanical support on moving carts.

Intel’s leading-edge second-generation Core i7 “Sandy Bridge” COM Express processor modules are typical of tech-nology that is easily optimized for medical computing. Two ex-amples are shown in Figure 1. Currently, the Type 2 pinout of the PICMG COM.0 R2.0 Specification is the most common in the market (both modules and existing carrier board designs), while the new Type 6 pinout is expected to be the long-term suc-

by Colin McCracken, American Portwell Technology

Compact size, computing power options, reliability, ease of use and function, and expansion are the key considerations for every modular design, especially in the medical computer device industry. Modular computing boards have been defined and developed in order to satisfy these design needs.

Modules Mobilize Medical care

Small Modules in Medical Devices



technology deployed


cessor to Type 2 due to its updated display interfaces and USB 3.0 support. Off-the-shelf building blocks, such as Portwell’s PCOM-B217 product family (Figure 1), feature both types in or-der to support all system requirements, including lower-cost PGA processors with the Type 2 module and ECC memory support with the Type 6 module, along with design-in support for carrier boards that can accept both module types without a redesign for maximum flexibility in the future.

Hand-Carried DevicesPortable ultrasound devices and patient monitors look more

like fixed-function devices than general-purpose application platforms. Since their batteries are much smaller than cart-based batteries due to size and weight limits, Gigahertz single-core Intel Atom processors are sufficient to drive these hand-carried devices. In fact, smaller LCDs can even be integrated into these devices, rather than stand-alone displays with external cables.

Typically, smaller SSDs—including 2.5” form factor, mSATA, CompactFlash and SD/MMC cards—are used in these small systems since their large capacities, weight and reliability advantages render rotating disk drives obsolete for hand-carried devices.

Even Mini-ITX is too large for these systems and certainly not customizable enough. And, while Nano-ITX and ECX / 3.5” SBCs can be used in some cases, they carry the excess baggage of assembly challenges and costs associated with connecting to externally mounted add-on circuit boards and cables. A custom carrier board, however, provides a far more elegant solution. It has the associated benefits of integrating the battery charger cir-cuit and data acquisition interface, and selecting the ideal con-nectors and locations for high-volume applications.

The Qseven form factor standard is an attractive low-power solution to these requirements. Devices like Portwell’s PQ7-M105IT module (Figure 2) come with a choice of “Tunnel Creek” processor from Atom E620 at 600 MHz to Atom E680 at 1.6 GHz along with 512 Mbyte-2 Gbyte soldered RAM for superb shock and vibration resistance, and integrated heatspreader as a low profile thermal solution.

In order to help reduce material cost and save board real estate (its overall package size is 46 percent smaller than its predecessor), the Qseven Atom E6xx series processor utilizes

the open PCIe standard for its processor-to-chipset interface, which delivers much greater I/O flexibility and includes an on-board graphics controller, memory controller and audio inte-grated within the processor. What’s more, the Qseven module takes full advantage of hardware acceleration technologies to facilitate faster web page downloads, multimedia and multi-windowing capabilities, all valuable benefits for hand-carried medical computing devices.

Designing an Optimized CarrierAn optimized carrier board is an essential component for

maximizing the full benefits of the modular solution. In this instance, it is responsible for providing +5 VDC power to the Qseven module and for routing the x86 standard chipset inter-faces to peripheral circuits and connectors. As illustrated in Fig-ure 3, an optimized carrier board provides a range of interfaces through which the Qseven can interface with the outside world of medical computing. A COM Express example would be similar, except that +12 VDC is the main module power source for higher performance computing.

Although only a single PCIe lane is shown in the diagram, four lanes are actually available. This creates additional head-room in the event that the design of a particular medical device needs to use more data or requires a second Ethernet port to attach another high-speed device. Pre-configuring this extra headroom into the carrier at the design and manufacturing stage means that medical OEMs are able to respond to customer requested feature enhancements rapidly and still stay within R&D budgets.

High-speed connection is also assured with the inclusion of

FIGURE 1

Type 2 and Type 6 ‘Sandy Bridge’ Core i7 COM Express modules.

FIGURE 2

This tiny Qseven Atom E620 ‘Tunnel Creek’ module draws less than 5W at 1GHz.


technology deployed


up to 8 x USB 2.0 ports, which are readily available for mid-range analog-to-digital conversion. At the slower end of the spectrum, the SPI bus and 12C bus are the appropriate interfaces for low-cost, low-speed analog-to-digital conversion or other low-power I/O functions.

Gigabit Ethernet is the de facto standard for the high-speed, low-cost transmission and receipt of data across local area networks and is the perfect interface for interchanging and updating the patient information captured by both cart-based and handheld medical devices. The system block diagram is shown in Figure 3.

In order to speed time-to-market for these medical devices, some COM manufacturers have preloaded their carrier boards

with all the necessary interfaces. For example, Portwell has cre-ated the PQ7-C100XL tiny form factor reference design carrier (Figure 4) complete with carrier schematics for system designers to tailor to exact requirements including intellectual property and product differentiation.

The advantage of using carrier boards like the one illustrated in Figure 4 is simple: the medical device designer does not have to re-invent the wheel. The carrier board already includes built-in features such as Mini PCIe, SATA, USB, LVDS and various serial ports. The BIOS firmware and device drivers are already developed and tested. Pre-configuring all of these interfaces onto the carrier board at its own design stage is much more efficient than the full custom design approach because it frees up the med-ical device designer from even having to think about resourcing these components, let alone integrating them and figuring out how to make them work together. Instead of spending valuable time and resources getting to ground zero, medical device de-signers can concentrate on differentiating themselves from their competition by focusing on their value-added circuits that attach to these standard interfaces.

Another benefit of the carrier board illustrated in Figure 4 is application orientation, rather than general-purpose ATX boards as large as 9.6 x 12 inches. While some of the smaller carrier boards on the market can shrink down to Mini-ITX, the 4.1˝ x 5.7˝ carrier board shown in Figure 4 is actually 45 percent smaller and optimized for handheld medical applications.

Mobilizing Designs with ModulesSince the introduction of the latest Atom E6xxx series and

second-generation Sandy Bridge Core i5 / i7 processors, every-thing about embedded systems boards is becoming even smaller and more energy efficient, with benefits such as better perfor-mance, longer battery and product life, and reduced energy costs.

Taking fullest advantage of this modular approach, COM Express and Qseven are well suited for customizing small medi-cal systems as a balance between fully off-the-shelf modules and full custom design. COM Express even scales to high-perfor-mance Core i5 / i7 processors with built-in ECC memory for ul-tra-reliable data that corrects errors on the fly. This new modular product development methodology leverages proven modules to allow device manufacturers to save time and risk by focusing on core competencies—their applications. The resulting systems are much easier to upgrade and re-certify in the future. Small form factor modules and small optimized reference design carrier boards are critical enabling technologies for the rapid develop-ment of next-generation mobile ultrasound devices, patient moni-tors, blood analyzers, instruments and medical cart computers.

American Portwell TechnologyFremont, CA. (510) 403-3399. [www.portwell.com].

Qseven Carrier ~ 4x5’’LCD

SSD

Codec

Transformer

UARTsMini-PCIe

A/D

LVDS

SATA orSD

HDAGigE

LPCPCIe x1

USB HostUSB Host

USB ClientCAN

+5VSB+5V

USB HostSPII2C

Qsev

en M

odul

e

DC-DC

+3 3V

ChargerCircuit

MicrophoneSpeakerLAN

RS-232

USB Host

AC Line Powercell cell

Rechargeable Battery Pack

USB ClientCAN Bus

Probe(Transducer)

FIGURE 3

Block diagram of a standards-based mobile medical device.

FIGURE 4

At only 4.1” x 5.7”, this tiny Qseven carrier features standard interfaces including a Mini PCIe Wi-Fi socket.

Untitled-1 1 4/6/11 8:50:02 AM

www.mentor.com/embedded


proDuctS &TECHNOLOGY


XMC Ethernet Switch Module Delivers 12 Ports of Gigabit Ethernet with No Additional Slot

A managed XMC 12-port Gigabit Eth-ernet Switch for the embedded market can be mounted on virtually any VPX or VME module supporting the XMC mezzanine stan-dard and enables designers of rugged embed-ded systems to integrate high-speed Ethernet switching functionality on a space, weight and power (SWaP) optimized mezzanine mod-ule that requires no additional chassis slot to deploy. The XMC-651 module from Curtiss-Wright Controls Embedded Computing is also available in a PMC mezzanine configuration (PMC-651) that provides up to 8 ports of man-aged GbE switching.

The XMC-651 supports full line-rate non-blocked switching and the in-field man-agement of a broad range of networking fea-tures including VLANs, multicast and Quality of Service. Designed for use in rugged military environments, the module is available in both air-cooled and conduction-cooled variants.

The XMC-651 implements Ethernet switching functions via Broadcom 10th gener-ation switching technology. Eight of the mod-ule’s ports support 10/100/1000Base-T with auto-negotiation. An additional four ports sup-port SerDes (1000Base-BX) Gigabit Ethernet, offering flexibility in connecting in-chassis devices. The XMC-651 implements Layer-2 Ethernet switching with full wire-speed per-formance on all ports and features an 8K entry MAC address table, with automatic learning, advanced flow-control and head of line block-ing prevention.Curtiss-Wright Controls Embedded Computing, Charlotte, NC. (613) 254-5112. [www.cwcembedded.com].

Compact Flash Card Features Lock Switch for Write ProtectionTo assist users in protecting data in such storage devices, Apacer Technology offers a fifth-generation

industrial compact flash (CF) card featuring a write-protection design for data storage safety. The lock switch on the bottom side of the memory card prevents data from being tampered with. By simply locking the lock switch on the bottom side of the card, the industrial CF card can be set to be read only, thus pre-

venting any attempt to write. This way, the data not only can stay safe by avoiding accidental deletion, but also can prevent tampering of confiden-tial information that may result in data leakage. These advantages make the card suitable for embedded devices in such fields as medical, military, gaming and automotive applications.

The industrial CF5 card is compliant with the CFA 4.1 specifications. It uses the standard 50-pin connector and SLC chip featuring industry-level stability for the card. It also boasts resistance to extended tempera-tures (-40° to 85°C), and is available in capacities from 128 Mbyte to 16

Gbyte. The data transfer mode is up to PIO-6, Multi-Word DMA-4 and Ultra DMA-5, with the sequential read/write speed reaching as fast as 40/30 Mbyte/s. This CFC5 memory card also supports 24-bit ECC function, wear-leveling function and Self-Monitoring, Analysis and Reporting Technology (SMART). Apacer Technology, Taipei, Taiwan. [www.apacer.com].

3U OpenVPX PCI Express and Ethernet Hybrid Switch Offers up to Ten Times More Bandwidth

A new 3U OpenVPX PCI Express and Ether-net hybrid switch delivers extremely high transfer rates in centralized VPX and OpenVPX platforms. With up to 4 x 6 Gen1/Gen2 PCIe backplane ports for the data plane, the VX3905 from Kontron provides ten times the I/O band-width found in systems deploying today and paves the way for a new generation of high-performance embedded computing (HPEC) applications. OEMs will benefit from flexible OpenVPX system de-signs, which enable application-specific configurations through centralized COTS backplanes. Owing to the open configurability of the Kontron VX3905, system developers can minimize development time and cost for specific system designs while enabling the reuse of these designs for other applications.

The hybrid switch VX3905 is compliant with the OpenVPX VITA65 switch slot profile SLT3-SWH-6F6U-14.4 for highest compatibility in multi-board designs. It provides up to 24 PCI Express Gen 1/Gen 2 ports for up to 32 lanes, which can be configured ( x8, x4, x2 and x1) depending on the required bandwidth. This offers OEMs a maximum data transfer rate of up to four gigabyte/s per port for serial interboard communication, an extended lifecycle of OpenVPX applications as well as enough headroom for future high-bandwidth designs. The switch can also be partitioned into multiple PCIe subsystems in order for the centralized backplane to host multiple root complexes each being able to control their own peripherals.

Up to nine Gigabit Ethernet ports are available on the VX3905 for the control plane, enabling dedi-cated system management for high availability. An optional SATA disk carrier in accordance with the OpenVPX VITA65 SLT3-STO-2U-14.5.1 profile facilitates central data storage for OpenVPX systems without the need to use valuable payload slots, further simplifying the system design.

For customers to capitalize on the Kontron VX3905’s high bandwidth, Kontron offers the VXFabric software solution for interboard communication. With VXFabric on K 3U and 6U VPX processor boards, OEMs can use common Linux and TCP or UDP sockets. It decouples the application software from the low-level hardware management to simplify and accelerate application development. An additional benefit includes longer application life cycles as the software ensures migration to future standards such as 10G and 40G Ethernet on the backplane.Kontron, Poway, CA. (888) 294-4558. [www.kontron.com].


pRodUctS & technology




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Compact Triaxial Piezoresistive Shock Accelerometer

A piezoresistive triaxial shock accelerom-eter is designed to provide high-reliability measurements in three orthogonal direc-tions within a footprint measuring less than 0.2 square inches (5.08 mm2). The model 73 from Meggitt Sensing Systems is intended for such critical ap-plications as high-shock data recorders, missile fusing and weapon systems.

Design of the model 73 incorporates use of three Endevco model 71 high-g piezoresistive shock accelerometers, housed on a specialty mounting block, with two available mounting options. These are either a surface mount technology (SMT) leadless chip carrier (LCC) package for reflow soldering with structural epoxy underfill; or a flex circuit option, allowing the unit to be adhesively mounted with electrical connec-tions made via solder pads. Units are available in ranges of 2000g; 6000g; 20,000g and 60,000g with frequency response capabilities down to DC (steady state), making them suitable for the support of long duration transient measurements. In addition, Endevco model 73 accelerometers offer minimal zero shift after shock and are undamped for broad frequency content and the prevention of phase shift. Their compact size and unique construction allow for high resonance frequencies and exceptional bandwidth with accurate and repeatable responses to fast rise times and short duration shock motion.

Recommended accessories for the Endevco model 73 include the new model 126 three-channel DC bridge amplifier, the model 136 three-channel signal conditioner, and the model 436 DC differential voltage amplifier. Meggitt Sensing Systems, Fribourg, Switzerland. +41 26 407 11 11. [www.meggittsensingsystems.com].

High-Res Dynamic Signal Acquisition Module for Audio and Acoustic Testing

A dynamic signal acquisition module for USB features high-performance, 24-bit reso-lution and is specifically designed for audio testing, acoustic measurement and vibration analysis applications. The DT9837C from Data Translation is available as a board-level OEM version for embedded test applications, or installed in a metal mini-XLR or BNC connection box for easy sensor connections. All Data Translation devices include comprehensive driver and software support, en-abling developers to get their applications up and running quickly.

Combine the DT9837C with the ready-to-measure VIBpoint Framework to create a powerful FFT Analyzer instrument at a much lower cost. The 24-bit D/A stimulus of the DT9837C precisely matches the input A/D sampling rates for measuring transfer functions up to 96 kHz, a requisite for high-quality acoustic, audio and vibration test and measurement,” according to Fred Molinari, President and CEO.

Key design features include four simultaneous 24-bit Delta-Sigma A/D channels for high-resolution measurements along with support for integrated elec-tronic piezoelectric (IEPE) inputs, including use of a 2 mA current source and AC or DC coupling, to interface with an accelerometer and microphone. The Input range is ±10V with software selectable gains of 1 and 10 for an effective input range of ±10V and ±1V with throughput rates of up to 105.4 kHz per channel. The included drivers and software are compatible with Windows XP/Vista/7. The VIBpoint Framework support software is available in a free 14-day trial version.Data Translation, Marlboro, MA. (508) 481-3700. [www.datatranslation.com].

Virtex-6 Signal Processing Board Family Moves to CompactPCI System DesignsPentek has announced that its popular Cobalt board family is now available for use in CompactPCI (cPCI) systems. The

migration to cPCI gives system designers full access to Pentek’s modular technology, which features high-performance signal acquisition and the processing power of Xilinx Virtex-6 FPGAs.

Cobalt family capabilities now available for cPCI systems include:• 1 GHz A/D & 1 GHz D/A (Model xx630)• 2 Channel 500 MHz A/D, DUC & 2 Channel 800 MHz D/A (Model xx650)• 3 Channel 200 MHz A/D, DUC & 2 Channel 800 MHz D/A (Model xx620)• 3 Channel 200 MHz A/D, DDC, DUC & 2 Channel 800 MHz D/A (Model xx621)• 4 Channel 200 MHz 16-bit A/D (Model xx660)• 4 Channel 200 MHz A/D & Quad DDCs with Beamforming IP (Model xx661)• L-Band RF (925-2175 MHz) Tuner with 2 Channel 200 MHz A/D (Model xx690)All modules feature dedicated DMA channels and memory buffers for each I/O stream, and multi-channel, multi-board synchronization along with a

customizable Virtex-6 FPGA for onboard signal processing. Boards are available as 3U cPCI carriers (73xxx) containing one Cobalt XMC module; 6U cPCI carriers (72xxx) with one XMC installed; and 6U cPCI carriers (74xxx) containing two identical Cobalt XMC modules. Custom configurations mixing XMC module types on a 6U carrier are also possible, yielding single-slot solutions for a wide range of signal acquisition and processing applications.

A bridge chip handles mapping of the Cobalt module’s serial PCIe interface to the parallel PCI bus. Developers can utilize the Virtex-6 FPGAs for on-board signal processing that can help reduce data transfer rates across the backplane. Options are also available for providing LVDS to the cPCI J2 (3U cPCI) or J3 and J5 (6U cPCI) connectors for application-specific custom I/O. All software and FPGA development tools for the Cobalt family are immediately available to support cPCI designs. Pentek’s ReadyFlow Board Support Libraries include drivers for Linux, Windows and VxWorks operating systems, as well as turnkey application software that provides out-of-the-box modules.

Pentek’s GateFlow FPGA Design Kit allows users to incorporate custom algorithms connected to the pre-configured interface functions installed on the Virtex-6 FPGA. GateFlow enables customers to implement high-performance signal processing functions for wideband communications, radar, signal intel-ligence and beamforming. Pricing starts at $11,600. Pentek, Upper Saddle River, NJ. (201) 818-5900. [www.pentek.com].





Compact COM Express Solution for Rugged Mobile I/O ApplicationsA new mobile compact computer baseboard is com-

patible with COM Express compact size standard com-puter modules. The A-Brain from New Embedded Tech-nology is designed specifically for such rugged mobile computer applications such as androids, robots, UAV and wearable computers where extended temperature, shock and vibration are a critical factor of the environment. It is also suitable for fixed outdoor settings requiring small size and in an environment that is not friendly to regular computers such as security monitoring, RFID control, green energy data acquisition, outdoor Kiosk and harsh external research data collection.

The A-Brain features a baseboard 95 mm square and includes on the top I/O side two low-profile RJ45 Gigabit LAN connectors, Mini-PCIe I/O board socket with hard screw/nut mounting and standard Type II CF IDE Flash for diskless boot-ing. Also available are two SATA ports with one standard and one locking connector. Included on multiple locking connectors are eight USB 2.0 ports, four RS-232 ports, VGA, eight digitally buffered GPIO, and RESET/POWER/External LEDs multi-use connection. The fourth serial port can become a RS-422/485 interface as a factory option.

The A-Brain has the capability of utilizing any embedded COM Express CPU module that meets the PICMG standard for its processing while providing additional I/O expansion particular to the mobile and military market. The unit can be used with a passive cooling plate with com-pact size 95 mm by 95 mm SBC modules. Whether the application requires a high-end dual core processor, a low-power Intel Atom processor or an ARM processor, New Embedded Technology can provide a system solution to match a specific requirement. Power is provided to the A-Brain through a small locking 12-pin power connector with a cable adapter available, able to be con-nected to any ATX power supply. New Embedded Technology can also provide internal DC-DC mounted ATX power supplies, the size of a quarter coin, with models available to be powered by 12V regulated, 24-28V and 12V battery power sources and up to 120W of ATX output.

The product life cycle is designed to last longer than most COM Express standard modules with a minimum 5-year life span. By combining the benefits of both the COM Express and Lap-top MINI-PCIe standards, a more cost-effective time-to-market is achieved no matter what the quantity. Prices range from $249 to $569 depending on features and options. Volume pricing is also available.New Embedded Technology, Encinitas, CA. (760) 845-1699. [www.newembedded.com].

ATX Motherboard with Core2 Quad/Duo FSB 1333 MHz Support

A new industrial-grade ATX mother-board is designed with the Intel G41 and the ICH7R chipset for industrial applications that need dual displays for DVI plus VGA and rich strong I/O capability. The AIMB-767 from Advantech supports LGA 775 Intel Core2 Duo, Core2 Quad, Pentium Dual-Core and Celeron 400 sequence processors with FSB up to 1333 MHz and DDR3 800/1066 MHz SDRAM up to 4 Gbytes. AIMB-767 is capable of software SATA RAID 0, 1, 5 & 10 to ensure reliable storage and system protection for network-intensive applications.

With rich I/O interface support, AIMB-767’s four SATAII ports can support software RAID 0, 1, 10 and 5 to serve as an entry-level data security solution with reliability. The four onboard serial ports (COM ports), one PCIe x16, one PCIe x4 and five PCI expansion slots allow AIMB-767 to meet many different in-dustrial control application requirements.

AIMB-767 features excellent graphic processing capability through its embedded Intel Graphics Media Accelerator 4500 with shared memory up to 352 Mbyte. This latest industrial motherboard provides strong 2D/3D graphic processing power without the need for an add-on graphic card, which reduces extra cost, power consumption and thermal design effort caused by an add-on graphic card.Advantech, Irvine, CA. (949) 789-7178. [www.advantech.com].

Forced Air Conduction-Cooled Development Chassis for 3U OpenVPX Modules

A new 12-slot 3U OpenVPX forced air conduction-cooled chassis targets the development of military embedded systems. The RME9CC Chassis from Curtiss-Wright Controls is the newest member of Electronic Systems’ Hybricon family of advanced military COTS electronic packaging solutions. This rackmount-style chassis provides cooling for up to 75W per slot. It’s designed for 3U 1” pitch payload cards and rear transition modules and supports 3U OpenVPX backplanes with high-speed switch fabric support for up to 6.25 Gbaud.

This extreme cooling VITA 65 OpenVPX development chassis is designed for 75W per slot

high-performance conduction-cooled 3U OpenVPX cards. The RME9CC measures 18.96” (Rack Flanges) wide, 15.69” (9U) high and 19.53” deep. The card cage is constructed of conduction-cooled extruded and machined aluminum. 2600W power supply configurations are available for OpenVPX 12V-centric and 5V-centric module sets,Curtiss-Wright Controls, Charlotte, N.C. (978) 952-2017. [www.cwcontrols.com].






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Mini-ITX Platform Provides Multiple Displays for Signage and Gaming

A new low-power Mini-ITX motherboard couples the Via VX900 media system proces-sor with a choice of 1.2 GHz and 1.6 GHz Via Nano Pro-cessors to provide a high-performance and highly scalable solution for advanced digital signage systems.

In addition to providing native support for dual displays, the VB8004 from Via Technologies can also be easily upgraded to support four displays using an additional Via S3 5400E graphics module, providing developers with the widest variety of multi-display configuratons, including HDMI, LVDS and DVI technologies.

Powered by a choice of 1.6 GHz and 1.2 GHz Via Nano proces-sors, the Via VB8004 leverages the advanced multimedia capabilities of the Via VX900 system media processor to deliver awesome DX10.1 graphics and support for rich 1080p video resolutions. In addition to supporting up to 4 Gbyte DDR3, the board features rich I/O capabilities including an HDMI port, one DVI port, a one channel 24-bit LVDS, one GigaLAN port, two USB 2.0 ports, one serial, one PS2 port and two SATA ports.

The Via S3 5400E dedicated graphics module is a daughter card specially designed to provide advanced multimedia capabilities for next-generation embedded applications and is the best-in-class energy efficient DX10.1 GPU on the market today. With support of DX10.1, Shader Model 4.1, OpenGL 3.1 and OpenCL 1.0, the 5400E GPU pro-vides a cost-effective solution for feature-rich graphics processing with high levels of video decoding and 3D rendering performance.

Featuring the ChromotionHD 2.1 video engine, a programmable video architecture supports the latest HD standards including Blu-ray Disk, H.264, VC-1, WMV-9 and MPEG-2/4. The S3 5400E module of-fers HD playback at resolutions of up to 2560 x 1600 pixels. Onboard I/O includes one HDMI port and one DVI port.VIA Technologies, Fremont, CA. (510) 683-3300. [www.via.com.tw].

15W I2C Power Manager Charges Li-Ion Cells at 3.5A

A high-power, I2C controlled, high-efficiency PowerPath manager acts as a diode controller and lithium-ion battery char-ger for single-cell portable devices such as tablet PCs, ultra-mobile PCs (UM-PCs), personal video play-ers, smart phones, digital cameras, PDAs, portable medical and industrial de-vices and personal navigation devices. The LTC4155 from Linear Technol-ogy is designed to efficiently transfer up to 15W from a variety of sources while minimizing power dissipation and easing thermal budgeting con-straints. The LTC4155’s switching PowerPath topology seamlessly man-ages power distribution from two input sources such as a wall adapter and USB port to the device’s rechargeable lithium-ion battery while preferen-tially providing power to the system load when input power is limited.

Because power is conserved, the LTC4155 allows the output load current to exceed the current drawn by the input supply, maximizing use of the available power for battery charging without exceeding the input supply power delivery specifications. For example, when powered from a 5V/2A wall adapter, the IC’s switching regulator efficiently transfers over 90% of the available 10W, enabling up to 2.4A charge current and resulting in faster charge times.

A simple 2-wire I2C port provides broad adjustability for many sys-tem control parameters including charge current, input current (including USB 2.0 and 3.0 compatible settings) and float voltage. The communica-tions bus also allows the LTC4155 to provide status information such as battery temperature, input supply status, charger status and fault status. Linear Technology, Milpitas, CA. (408) 432-1900. [www.linear.com].

SystemPak Makes ATCA Ready for Tough Field DeploymentA high-performance, multiprocessing system platform is designed to address compute-inten-

sive requirements in command and control data center applications. The ATCA7365 SystemPak from Elma Electronic combines the high-performance multiprocessing of an integrated ATCA plat-form with a ruggedized design capable of withstanding the high shock and vibration found in rug-ged mobile transport applications. It has been successfully tested to withstand a 36” drop shock test per MIL-STD-810G.

Featuring three ATCA processor blades, each with two six-core Intel processors as standard, the ATCA7365 SystemPak offers high processing power that makes it an ideal solution for use in rugged “comms on the move” (COTM) applications such as data center virtualization and network-centric en-vironments. Additional attributes of the fully integrated SystemPak include 10 Gigabit Ethernet switching for high-speed data links, 96 Gbytes of DDR memory per blade and 1.2 Tbytes of storage. It is delivered tested and verified with Linux, and the processors are VMware certified.

The new ATCA7365 platform has been successfully tested to meet environmental requirements for operation in a command and control center. It is mounted in a lightweight transit case, can withstand a 36” drop test on two axes, and can endure random vibration up to 25 Gs per MIL-STD-810G. Operat-ing temperature is 3° to 37°C in 5% to 95% non-condensing humidity.

In addition to the three processor blades, the standard configuration includes an Elma Type 11A, 6U six-slot ATCA chassis, a fully replicated mesh backplane and a single system management card with a provision for dual management as well as redundant cooling and power supplies. Four 300 Gbyte SAS (serial-attached SCSI) drives and a 10 Gigabit Ethernet fabric switch blade with RTM (real-time monitoring) are also part of the ready-to-run unit. Elma Electronic, Fremont, CA. (510) 656-3400. [www.elma.com].





M2M Developer Kit Speeds Entry into Rapidly Expanding Smart Services Market

A new machine-to-ma-chine (M2M) Smart Services Developer Kit includes a de-ployable Intel Atom processor-based services-ready system. Developed in collaboration with Intel Corporation, the standards-based Computer-on-Module (COMs)-based kit from Kontron is a develop-ment and deployment solution that provides simple “plug & play” capability enabling designers to develop and test their application’s connectivity and performance, then quickly deploy. The M2M Smart Services Developer Kit is designed to meet customer needs for accelerated M2M connected-computing launch schedules of smart services that utilize cloud-based computing to communicate and aggregate data on edge node and gateway devices.

The kit uses the COM Express-compatible Kontron Computer-on-Module nanoETXexpress-TT powered by the Intel Atom processor and in-cludes an M2M System Carrier Board and an AV board to support headed configuration use. The kit is 802.11a/b/g/n WLAN (wireless local area net-work) and 802.15.4 WPAN (wireless personal area network) capable allowing rapid development of wireless connectivity solutions. 3G WWAN (wire-less wide area network) is either pre-installed or easily enabled by dropping in a pre-certified PCI Express 3G/4G module for further broadband con-nectivity flexibility. Kontron’s COM-based modu-lar architectural approach gives OEMs, smart services developers and independent software vendors (ISVs) multiple benefits including reduced development cost, risk and time-to-market in an optimal, proven production-ready COTS small factor platform that includes mounting hardware for ease of deployment. The M2M solution and kit packaging may be easily customized to include the network operator’s, OEM’s, or ISV’s brand.

The M2M System is preloaded with a 90-day free trial of Wind River Linux 4.1. The kit also includes a Wind River LiveUSB drive that provides the software stacks and drivers to support immediate wireless connectivity testing. The pre-flashed drive containing Wind River software is optimized for developing, running, debugging and prototyping embedded software directly onto the Kontron M2M System using Wind River develop-ment tools. Kontron, Poway, CA. (888) 294-4558. [www.kontron.com].

Data Acquisition with up to 128 Channels of USB Analog I/O and Flexible Signal Conditioning

A highly integrated multifunction data acquisition and control system offers an attractive solution for adding portable, easy-to-install high-speed analog and digital I/O capabilities to any PC or embedded system with a USB port. The DAQ-Pack from Acces I/O Products performs signal conditioning such as RC filtering, current inputs, RTD measurement, bridge completion, thermocouple break detection, voltage dividers, small signal inputs and sensor excitation voltage supply. Sustained sampling speeds up to 500 kHz are available for 32, 64, 96, or 128 single-ended or differential analog inputs. Groups of eight channels at a time can be independently software configured to accept different input ranges. A real-time internal calibration system allows the unit to compensate for offset/gain errors giving more accurate readings. Additional features include two 16-bit analog outputs, 16 high-current digital I/O lines, and a programmable 16-bit counter—all packaged in a small, rugged, gold-zinc plated industrial enclosure with a per channel cost as low as $13.

The small, compact, multifunction I/O DAQ-Pack units provide the user with everything needed to start acquiring, measuring, analyzing and monitoring in a variety of applications. These data acquisition and control devices can be used in many current real-world applications such as precision measurement, analysis, monitoring and control in countless embedded applica-tions. Available accessories include a wide variety of cables and screw terminal boards for quick and easy-to-use, out of the box, connectivity. Also, a DIN rail mounting provision, and a gold-zinc mounting plate, is available for panel mounting.

Advanced calibration models feature a real-time internal autocalibration system that allows the unit to compensate for offset/gain errors. To minimize noise, the board offers oversampling. The channel-by-channel programmable gain feature enables measurement of an assortment of large and small signals in one scan—all under software control at up to 500 kHz. The board’s data buffer and ability to trigger the A/D in real time assures synchronized sampling that is unaf-fected by other computer operations—an essential requirement for signal, vibration and transient analysis where high data rates must be sustained. Pricing starts at $872.ACCES I/O Products, San Diego, CA. (858) 550-9559. [www.accesio.com].

GigE and IEEE 1394b Cameras with 28 Frames/s at 2 MP Resolution

Two new digital camera models deliver 28 frames per second (fps) at 2 megapixel resolution. The scA1600-28 series cameras from Basler Vision Technologies feature the Sony ICX274 CCD sensor in both monochrome and color. They are available with either a GigE or IEEE 1394b interface, as well as in a 90 degree housing version.

The combination of a 2 megapixel sen-sor, a wide range of features, high image

quality and 28 fps speed makes this camera extremely attractive for a variety of markets such as ITS (Intelligent Traffic Systems), medi-cal imaging and several other industrial applications.

These new cameras are a faster version of the popular scA1600-14 models, which de-liver 14 fps. The scA1600-28 now doubles that frame rate to 28 fps while maintaining the same excellent image quality as the older version. Other important camera characteristics such as the noise level, DSNU (Dark Signal Non Uniformity) and PRNU (Photo Response Non Uniformity) are kept at the same low levels typical of Basler cameras.Basler Vision Technologies, Ahrensburg, Germany, +49 4102 463-258. [www. Baslerweb.com].






Ad Index










PMC/XMC Carrier Card for Optimum Performance and Flexibility

A PCI Express PMC/XMC carrier card serves developers wanting to configure PMC and XMC mezzanine cards in high-performance servers and small form factor PCs. The SPR418A hybrid card from GE In-telligent Platforms affords PCI Express compatibility and a combination of per-formance, flexibility, reliability, interoper-ability and cost-effective-ness. It would typically be used in the development of applications such as sonar, radar, communications and signals intelligence (SIGINT).

The SPR418A can be ordered to host either a PMC module sup-porting up to PCI-X transfer speeds, or an XMC module supporting up to 8-lane PCI Express speeds: the Gen2 x8 PCI Express interface to the host allows for unimpeded data transfers at the full rate supported by the mezzanine card. An integrated fan supplies additional cooling to the mezzanine card for optimum reliability, while support for up to 25W of power is well in excess of that required by the PMC and XMC specifications—contributing to both performance and reliability.

Flexibility is delivered by the SPR418A in the form of a number of connectivity options that allow additional I/O and usage modes. J4 connectivity is provided to an optional 80-pin KEL connector (similar to the connector used for FPDP VITA 17). J16 can be connected to two SFF connectors providing for up to four lanes of high-speed serial con-nectivity each via readily available cables. A standard PC power con-nector can be fitted for stand-alone operation for mezzanines that do not require interaction with a host.GE Intelligent Platforms, Charlottesville, VA. (800) 368-2738. [www.ge-ip.com].

COM Express Modules Powered by Freescale QorIQ Processors

A family of COM Express embedded computing modules is powered by Freescale Semiconductor QorIQ processors. Three mod-ules, the COMX-P3041, COMX-P4040 and COMX-P5020, have been announced by Emerson Network Power. These new boards can speed deployment for users of QorIQ processors with diverse I/O requirements by reducing design complexity while providing customizable modular options.

Design engineers are isolated from the complexities of high-speed processor and memory system design, allowing them to focus on a carrier board tailored to the I/O needs of their application and improving their product to gain market share. Targeted applications for the new QorIQ COM Express modules include enterprise and service provider rout-ers, switches, base station controllers (BSCs), radio network controllers (RNCs), long-term evolution (LTE) infrastructure and general-purpose embedded computing systems in the networking, telecom/datacom, wire-less infrastructure, industrial, military and aerospace markets.

The COMX-P3041 module features the Freescale QorIQ P3041 quad-core communications processor operating at 1.5 GHz, for a more power- and cost-efficient solution to modules built on the P4 platform while retaining many of the features and architectural compatibility.

The COMX-P4040 module features the Freescale QorIQ P4040 quad-core communications processor operating at 1.5 GHz, making it ideal for communications applications requiring combined control, data and application layer processing.

The COMX-P5020 module features Freescale’s first offerings with the 64-bit, e500mc core, the Freescale QorIQ P5020 dual-core processor operating at 2.0 GHz to target control plane and compute applications that require high single-threaded performance.

All modules support one or two channels of 2 Gbyte DDR-1333 ECC SO-UDIMM and have 12 configurable SERDES lanes available for max-imum flexibility. Highly flexible I/O includes 10G-XAUI, SRIO, GPIO, USB 2.0, PCI Express, Gigabit Ethernet and real-time debug. Emerson Network Power, Carlsbad, CA. [www.EmersonNetwork Power.com].

Compact and Rugged Fanless Embedded Computer with 100G Shock ResistanceA new fanless embedded computer with rich integrated I/O is equipped with the Intel

Atom D510 1.66 GHz processor. The MXE-3000 from Adlink Technology delivers twice the performance of the previous N270 platform. Featuring maximum operating shock tolerance up to 100G, minimal footprint with a small profile, and innovative thermal design with zero cable management requirements, the MXE-3000 provides reliable performance in mission-critical and harsh environments for a variety of applications.

Leveraging the advantages of enhanced RF function, dedicated I/O features, 9-32 VDC wide range power input, and LVDS & VGA dual display support, the MXE-3000 with ease of mounting capability—VESA or DIN rail, is a suitable match for diverse applications such as intelligent transportation, medication management, digital signage, factory automation and logistic applications, and especially in automated guided vehicle systems.

With changes in market trend toward smaller fanless configurations, the MXE-3000’s compact 210 mm (W) x 170 mm (D) x 53 mm (H) size suits it ideally for applications requiring limited storage space and demanding zero-noise, dustproof performance. A unique cable-free structure and extended temperature functionality enable the MXE-3000 series to greatly benefit customers with high-performance computing, lowered total cost of ownership, and long-term durability. The MXE-3000 is priced at $672. ADLINK Technology, San Jose, CA. (408) 360-0200. [adlinktech.com].





High-Speed Data Acquisition Module with Multi-Board Synchronization

A high-speed data acquisition module is ca-pable of digitizing one 12-bit channel at 3.6 GHz, or two channels at 1.8 GHz. The Model 71640 from Pentek has provisions for the synchronization of multiple boards for cap-ture and analysis of even wider bandwidths. Leverag-ing the National Semiconductor ADC12D1800 12-bit A/D converter, the 71640 provides two transformer-cou-pled RF input ports that can operate in single- or dual-channel mode. The 71640 also includes an on-board Xilinx Virtex-6 FPGA for customer-specific data processing. The module includes four banks of 256 Mbyte DDR3 SDRAM and built-in triggered data capture functions for acquiring precise data blocks. An optimized multi-channel DMA engine provides efficient data movement over the Gen2 x8 PCIe interface to host processors. An optional 8x, or dual 4x, gigabit serial I/O interface allows users to support application-specific protocols and create high-bandwidth paths between modules or to addi-tional signal processing engines. Pentek offers cPCI, PCIe, VPX and ruggedized, extended-temperature versions of the 71640.

Radar and broadband communications signal acquisition are prime applications for the 71640. To capture wideband signals with previous-generation A/D modules, developers needed to split those signals into smaller overlapping bands and use multiple A/Ds to digitize those bands. This cre-ated challenges whenever the target signal fell in the overlap band. The 71640’s wide bandwidth now allows system designers to eliminate the pitfalls of such overlap processing while also saving system costs of the band-splitting filters and multiple data acquisition boards. For even wider bandwidths or for multi-channel systems, the 71640 offers a syn-chronization bus that works with a companion tim-ing module for sample-accurate synchronization of multiple Cobalt modules.

Pentek’s ReadyFlow board support package for the 71640 allows quick configuration of the board’s features including a linked-list DMA en-gine and automatic appending of metadata and time stamps to support storage and post-capture analysis of acquired signals. In addition, Pentek’s GateFlow tool provides developers with libraries and design support for implementing their own real-time analysis using the onboard Virtex-6 FPGA. Pricing starts at $17,445.Pentek, Upper Saddle River, NJ. (201) 818-5900. [www.pentek.com].

VPX Cards Employ Spartan-6 FPGA for Higher Performance/Price Requirements

A new series of 3U VPX FPGA boards provides powerful, but economical solutions for high-speed pro-cessing of algorithms in em-bedded computing applica-tions. The VPX-SLX boards from Acromag employ a con-figurable, logic-optimized Spartan-6 FPGA with 150k logic cells to meet demand for higher performance in cost-sensitive applications. A high-throughput PCI Ex-press interface, generous dual-ported memory for efficient data handling, and 64 I/O lines direct to the FPGA en-able rapid data processing and great versatility. Ideal for defense, aerospace, or scientific research; typical applications involve signal intelligence, image processing and hardware simulation.

All VPX-SLX models use the XC6SLX150 Spartan-6 FPGA chip with 147,433 logic cells and 180 DSP48A1 slices. There are 64 I/O or 32 LVDS lines connected to the FPGA via the rear P2 connector. A series of AXM extension modules are available to provide ad-ditional front-end 16-bit A/D, differential RS-485, CMOS, or LVDS I/O processing chan-nels through a mezzanine connector on the front of the card. FPGA code loads from the PCIe bus or from onboard flash memory. A JTAG and Xilinx ChipScope Pro interface are also supported to simplify development tasks.

For extended temperature range operation, models can be ordered with a frame for use in a conduction-cooled chassis. The standard model operates reliably over a 0 to 70°C range in an air-cooled or forced convection system. The conduction-cooled version sup-ports a range of -40° to 85°C. And for system compatibility, Acromag’s 3U VPX cards support a number of VITA 65 slot profiles and conform to VPX VITA 46.0, 46.4 and 46.9 specifications.

Acromag’s Engineering Design Kit provides utilities to help users develop custom programs, load VHDL into the FPGA, and establish DMA transfers between the FPGA and the CPU. The kit includes a compiled FPGA file and example VHDL code provided as selectable blocks with examples for the local bus interface, read/writes and change-of-state interrupts to the PCI bus. A JTAG interface allows users to perform onboard VHDL simu-lation. Further analysis is supported with a ChipScope Pro interface.

For easy integration of the boards with embedded Windows applications, Acromag developed a DLL driver software package for compatibility with Microsoft Visual C++ and Visual Basic. Sample files with “C” source demonstration programs provide easy-to-use tools to test operation of the module.

For real-time and open source applications, Acromag offers C libraries for VxWorks, Linux and other operating systems. The libraries provide generic routines (source code included) to handle reads, writes, interrupts and other functions. Pricing starts at $5,200 for an air-cooled version and slightly higher in a conduction-cooled format.Acromag, Wixom, MI. (248) 295-0310. [www.acromag.com].

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Ad Index









Company Page WebsiteAccES I/o products .......................................................................................................2, 40 ..........................................................................................................www.accesio.com

AMD ................................................................................................................................60 ............................................................................................... www.amd.com/embedded

Avalue technology .............................................................................................................7.........................................................................................................www.avalue-usa.com

cogent .............................................................................................................................45 ......................................................................................................... www.cogcomp.com

congatec ..........................................................................................................................11 ............................................................................................................. www.congatec.us

Extreme Engineering Solutions, Inc. ..................................................................................59 ............................................................................................................ www.xes-inc.com

Innovative Integration ........................................................................................................35 ................................................................................................. www.innovative-dsp.com

ISI Nallatech Inc. ..............................................................................................................20 ..........................................................................................................www.nallatech.com

Jayco ...............................................................................................................................27................................................................ www.jaycopanels.com; www.ultra-displays.com

JumpGen .........................................................................................................................37..........................................................................................................www.JumpGen.com

Lippert Embedded computers ...........................................................................................26 ......................................................................................................... www.lippert-at.com

Logic Supply, Inc. .............................................................................................................44 .......................................................................................................www.logicsupply.com

Measurement computing ..................................................................................................25............................................................................................................ www.mccdaq.com

Mentor Graphics ...............................................................................................................49 .................................................................................................. www.edatechforum.com

Netrino .............................................................................................................................21..................................................................................... www.netrino.com/boot-camp-box

one Stop Systems ............................................................................................................23 ...............................................................................................www.onestopsystems.com

phoenix International .........................................................................................................4............................................................................................................ www.phenxint.com

real-time & Embedded computing conference .................................................................57................................................................................................................ www.rtecc.com

themis computer .............................................................................................................39 ............................................................................................................. www.themis.com

uSB Module & Data Acquisition Showcase .......................................................................41 ........................................................................................................................................

VersaLogic corporation ....................................................................................................31......................................................................................................... www.versalogic.com

WDL Systems ....................................................................................................................5........................................................................................................www.wdlsystems.com

WinSystems .....................................................................................................................13 .......................................................................................................www.winsystems.com

Xtech ..............................................................................................................................10 ....................................................................................................www.xtech-outside.com

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X-ES 2nd Generation Intel® Core™ i7 Processor Solutions: Delivering Innovation

In 2010, Extreme Engineering Solutions, Inc. (X-ES) developed more Intel® Core™ i7processor products based on VPX, CompactPCI, VME, CompactPCI Express, and XMC formfactors than anyone in the industry. This year, X-ES has added solutions based on the 2ndgeneration Intel Core i7 processor. Providing products customers want, when they wantthem – that truly is innovation that performs.

X-ES offers an extensive product portfolio that includes commercial and ruggedized singleboard computers, high-performance processor modules, multipurpose I/O modules, storage, backplanes, enclosures, and fully integrated systems.

2nd generation Intel Core i7 processor solutions available in a variety of form factors.Call or visit our website today.

Untitled-7 1 6/29/11 10:28:32 AM

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