RTAX-S Qualification and Reliability Data September 7-9, 2005 2005 MAPLD International Conference...
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Transcript of RTAX-S Qualification and Reliability Data September 7-9, 2005 2005 MAPLD International Conference...
RTAX-S Qualification and Reliability Data
September 7-9, 2005
2005 MAPLD International Conference
Minal Sawant
Ravi Pragasam
Solomon Wolday
Ken O’Neill
2Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Outline Design Overview
MIL-STD-883B Enhanced Antifuse Qualification (EAQ)
Sample Size and Test Sequence
Results MIL-STD-883B Enhanced Antifuse Qualification (EAQ)
Enhanced Lot Acceptance (ELA) Plan Results
Terminology:
EAQ = ELA (both processes use the same design)
Group C = High Temperature Operating Life (HTOL) = Dynamic Programmed Burn In (DPBI)
3Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Design Overview
MIL-STD-883B Uses the QBI (Qualification
Burn In) design Goal: Device Feature
Maximum Utilization of logic cells
Test all IO standards Test all macro offering
(Carry chain, buffys etc) Test RAM feature Test for propagation delay
Note: QBI = QCMON
EAQ Uses the EAQ design Goal: Antifuse Reliability
Tests all possible antifuse type
Based on NASA style design Test for delay perceptibility
4Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Top Level QBI Design EAQ Design
FIFO Test OK
CombinatorialBlock
FIFO Block
RAM Block
I/O Block
MonitorCircuit
Global Test
Monitor
Combo Test OK
I/O Test OK
RAM Test OK
ALU Block
ALU Test OK
Reset_n
Set_n
ShiftFreq[1:0]
A_Pattern_length[2:0]
A_Pattern_type
2
3
Array Test Block(1458 bit SR)
Tile 1-3 (Row 1)
Array Test Block(1458 bit SR)
Tile 4-6 (Row 2)
Array Test Block(1458 bit SR)
Tile 7-9 (Row 3)
Array Clock
IO Test Block375 I/Os
(1125 I/O Regs)IO_Pattern_length[2:0]
IO_Pattern_type3
IO Clock
RAM Test Block(nine 1x16384 ram)
IO_ResetSyncD
Delay Chain(8 X 1300 NAND)
IO_pin[0]
IO_pin[374]
Delay_sel [1:0]
Delay_in2
8 Delay_out [7:0]
Array_out [0]
Array_out [1]
Array_out [2]
Ram out [8:0]
Ram Monitor
IO_Monitor
3
13
Array Monitor
Global Monitor
Array Monitor
Global Monitor
TOG_n
Clk Spine
Clk Spine
Clk Spine
Error Flags [2:0]
Error Flag
Error Flag [8:0] 9
5Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Delay Paths QBI includes one small
delay chain EAQ includes 8 delay chains
Q
QSET
CLR
D
Q
QSET
CLR
D
Q
QSET
CLR
D
Q
QSET
CLR
D
Delay_in Delay_out
22 Stages: ~ 36 ns
0123
Delay_out [3]
delay_sel_n[1]delay_sel_n[0]
Delay_in
IO_ResetSyncD
Sliding Decoder
Q
CLR
D
EIO_clk
Q
CLR
D
E
Q
CLR
D
E
Q
CLR
D
E
3264 128
1,300 NAND4 gateDelay Line
Delay_out [2]
Delay_out [1]
Delay_out [0]
Delay_out [4]
Delay_out [5]
Delay_out [6]
Delay_out [7]
6Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Design Summary QBI
I/O’s are configured with all the different combinations of I/O standards, slew and pull-up resistor (I/O standards LVTTL, PCI, and PCIX, LVPECL, and Vref are used)
EAQ (RTAX1000S-CG624)
SEQUENTIAL (R-cells) Used: 5768 / 6048 95.37% 9965 / 10752 92.68%COMB (C-cells) Used: 12091 / 12096 99.95% 21437 / 21504 99.69%LOGIC (R+C cells) Used: 17859 / 18144 98.43% 31402 / 32256 97.35%
RAM/FIFO Used: 36 / 36 100% 64 / 64 100%IO w/Clocks Used: 196 / 198 99% 196 / 198 99%
HCLOCK (Hardwired) Used: 4 / 4 100% 4 / 4 100%CLOCK (Routed) Used: 4 / 4 100% 4 / 4 100%
RTAX1000S-CQ352 RTAX2000S-CQ352
SEQUENTIAL (R-cells) Used: 6010 / 6048 99.37%
COMB (C-cells) Used: 12029 / 12096 99.45%
LOGIC (R+C cells) Used: 18039 / 18144 99.42%
RAM/FIFO Used: 36 / 36 100%
IO w/Clocks Used: 418 / 418 100%
HCLOCK (Hardwired) Used: 4 / 4 100%
CLOCK (Routed) Used: 2 / 4
(2 of the unused RCLK's resources are divided into
spine networks and utilized as global Set/Reset signals)
7Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Antifuse Utilization
EAQ
F 14458 24752 16998 Between module output segment & short vertical segment
H 6306 10900 5608 Antifuse between two horizontal tracks
I 238718 414683 240638 Between short horizontal segments & module input segment
SD 13869 24894 15737 Semi-direct antifuse
V 3214 4784 1640 Antifuse between two vertical tracks
X 92569 161448 92300 Antifuse Between short horizontal & vertical segments
C 984 1728 0 Between short vertical segments & hclockmux modules input segment
CSR 6256 8272 6256 Antifuse for I/O configuration options
SSR1 12 9 8 Silicon Signature antifuse in silicon signature words
LDH 48 226 54 Horizontal inter-tile antifuse
LDV 66 135 70 Vertical inter-tile antifuse
DB 3873 6831 85 Between local segment (DB inverter output) & input segment
LL 15338 26474 15550 Between RX/TX input/output module segment & long horizontal/vertical segment
QBI
Total 394,944
RTAX1000SAntifuse Type RTAX1000S RTAX2000S Description
395,711 685,136
8Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Sample Size QBI :
129 equivalent RTAX2000S-CQ352B devices used at 125°C
Additional 78 devices of RTAX1000S-CQ352B used for LTOL (Low Temperature Operating Life) experiment at -55°C
EAQ : 300 devices of RTAX1000S-CG624 used
Equivalent 129 Devices (LTPD =3)
RTAX2000S-CQ352
84 Units
Equivalent RTAX2000S-CQ352
45 Units
RTAX1000S-CQ352
90 units
2 Units (RTAX1000S) = 1 unit (RTAX2000S)
RTAX1000S-CG624 300 UNITS
AXS1150 Units
AXS2150 Units
AXS1A94 units
AXS1B56 units
9Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Test Sequence QBI : HTOL
QBI : LTOL
EAQ : AXS1
EAQ : ASX2
Program with QBI design
Pre Burn In ATE test (25°C,-55°C,
125°C)
Burn In (1000 hr)at -55°C (with
various pullpoints)
ATE Test at 25°C (at various
pullpoints)
Final Post Burn In ATE (after 1000 hr) test (25°C,-55°C,
125°C)
Program with QBI design
Pre Burn In ATE test (25°C,-55°C,
125°C)
Burn In (1000 hr)at 125°C (with
various pullpoints)
ATE Test at 25°C (at various
pullpoints)
Final Post Burn In ATE (after 1000 hr) test (25°C,-55°C,
125°C)
Program with EAQ design
Pre Burn In ATE test (25°C)
Burn In (1000 hr)at 125°C (with
various pullpoints)
ATE Test at 25°C (at various
pullpoints)
Post Burn In ATE (after 1000 hr) test (25°C)
Burn In (250 hr)at -55°C
Final Post Burn In ATE test
(25°C)
Program with EAQ design
Pre Burn In ATE test (25°C)
ATE Test at 25°C (at various
pullpoints) Final Post Burn In ATE (after 1000 hr) test
(25°C)
Burn In (250 hr)at -55°C
Post Burn In ATE test (25°C)
Burn In (1000 hr)at 125°C (with
various pullpoints)
10Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
QBI Summary
QBI For RTAX2000S (87 units) = 84 + 3 spares For RTAX1000S (98 units) = 90 + 8 spares 7 failures were observed during the HTOL and LTOL tests
Product Package Wafer lot# Group Design UnitsBI
(hours)AF
failuresOther
FailuresTotal
(hours)TA
(C)
VCCA
(V)
VCCI
(V)Comments
RTAX2000S CQ352 D1L9R1 Qual(M026) QBI 87 1000 0 2 85000 125 1.6 3.6 ESDRTAX1000S CQ352 D1GAH1 Qual(M026) QBI 98 1000 0 4 94000 125 1.6 3.6 ESDRTAX1000S CQ352 D1GAH1 Qual(M026) QBI 78 1000 0 1 77000 -55 1.6 3.6 ESD
RTAXS
11Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
QBI FA Investigation & Conclusions All the 7 failures* observed from the (QBI) devices indicated
identical failure signature due to equipment induced ESD
Physical Failure analysis indicated damage to the ESD circuit
Duplication of failure mode with MM testing indicated identical failure signature
ESD zap is due to the charge buildup on the CQ352 socket lid This charge does not exist on the CG624 package Thus no failures observed in the EAQ experiment
No additional failures due to ESD have been observed since the use of ESD friendly and staticide treated socket lids
De-processing of a second failed device showed the same failure signature
RTAXS Passed ESD at 2000 V HBM
RTAXS Passed ESD at 250 V MM
*Failure analysis report available upon request
12Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
EAQ Summary
EAQ 9 failures were observed during the HTOL and LTOL tests
8 Failures had identical failure signature 1* (HTOL after 1000 hrs) unit has a different failure signature
Failure Analysis under progress Antifuse has been eliminated as a potential cause
No Antifuse failures observed
EAQ experiment will be continued for an extra 1000 hours of HTOL on a sample size of 120 units from above lot Results expected by Mid October 2005
Product Package Wafer lot# Group Design UnitsBI
(hours)AF
failuresOther
FailuresTotal
(hours)TA
(C)
VCCA
(V)
VCCI
(V)Comments
RTAX1000S CG624 D1GAH1 AXS1 EAQ 150 1000 0 6 144000 125 1.6 3.6 Cont failure due to BIB
RTAX1000S CG624 D1GAH1 AXS2 EAQ 148 1000 0 1* 147000 125 1.6 3.6Device at FA, suspect
CMOSRTAX1000S CG624 D1GAH1 AXS1 EAQ 144 250 0 0 36000 -55 1.6 3.6RTAX1000S CG624 D1GAH1 AXS2 EAQ 150 250 0 2 37000 -55 1.6 3.6 Cont failure due to BIB
RTAXS
13Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
EAQ FA Investigation Conclusions Analysis and testing showed that all 8 failures* were on the
same output pin “AE16” All 8 devices came from burn-in board locations D1 and D2
Failure analysis indicated that the damage was on the output buffer pull-down transistor
Damage was due to contention problem on the burn-in boards The -1V on the output, with over 300 mA current, exceeded the
absolute worst case condition for extended periods
No additional failures have been observed since the contention was eliminated AXS1 completed 250 hrs of LTOL and AXS2 completed 1000 hrs of
HTOL with no failures
De-processing of a second failed device showed the same failure signature
*Failure analysis report available upon request
14Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
ELA Plan Uses the same high perceptive design as EAQ
ELA is the EAQ design used in the production flow of RTAX-S devices
A sample of units will be tested per each wafer lot before shipment This will qualify the lot for shipment
Units will be programmed to the ELA design Units will be sent for 168 hours of Burn in at 125°C 100% yield is required to qualify lot for shipment
Product # of UnitsRTAX2000S 14RTAX1000S 24RTAX250S 100
15Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
ELA ResultsResults to date – No Antifuse failures
Shipping RTAX-S to Space Flight Applications today
Product Package Wafer lot# Group Design UnitsBI
(hours)AF
failuresOther
FailuresTotal
(hours)TA
(C)
VCCA
(V)
VCCI
(V)RTAX2000S CQ352 D1GAG1 ELA EAQ 14 168 0 0 2352 125 1.6 3.6RTAX2000S CQ352 D1N9H1 ELA EAQ 14 168 0 0 2352 125 1.6 3.6RTAX2000S CQ352 D1L9R1 ELA EAQ 14 168 0 0 2352 125 1.6 3.6RTAX250S CQ352 D1H381 ELA EAQ 100 168 0 0 16800 125 1.6 3.6
RTAX2000S CQ352 Eng HiSS 8 1000 0 0 8000 125 1.6 3.6
RTAXS
16Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
DSCC SMD Application Status SMD#
Pre-assigned SMD# for RTAX-S are 5962-04219 for RTAX250S 5962-04220 for RTAX1000S 5962-04221 for RTAX2000S
SMD Application SMDs in draft
Derived from Actel datasheet Qualification Package in preparation
Qual results, FA reports, with TRB approval minutes Qual lots attribute sheets, copies of assembly/test/burn-in travelers Silicon technology summary
with XSEM showing planarized process
Support documents Submission to DSCC being planned for the end of October 2005 Certification expected by the end of 2005
17Sawant, Wolday, Pragasam, O’Neill RTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032
Conclusion
NO ANTIFUSE FAILURES
More than 650,000 hours of test data available now
MIL-STD-883B Qualification completed successfully
EAQ experiment completed successfully 150 units with 1000 hours of HTOL and 250 hours of LTOL 150 units with 250 hours of LTOL and 1000 hours of HTOL
Shipping RTAX-S to Space Flight Applications today Both “B” & “E” flows shipping