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Robust Design for E-Mobility

Industry Session 28: Reliability

Thursday, March 19, 2020

Autor: Alexander Gerfer

Presented By – Lorandt FölkelWürth Elektronik eiSos GmbH

Sep 2018 TS/AG/TL/sku 2

Can you imagine hiking on a

steep mountain trail in the black

of night not knowing how close

to the edge of the cliff you are?

Would you feel safe?

Quote from ZVEI Handbook

for Robustness Validation



Reliability is the probability that an electronic component

will perform in accordance with expectations for a

predetermined period of time in a given environment.

Quote from ZVEI Handbook

for Robustness Validation


today tomorrowprivate use

tomorrowshared use

Passenger Car Usage 121.500h( 22,5h per day, 15 years)


8.000h(1,5h per day, 15 years)



Having a closer look on the high voltage applications

On-Board Charger InverterBattery



Tomorrow Shared Use Tomorrow Private Use

No use (DC charging will

be preferred)

up to 22,5h/ day

100.000+ hours

On-Board-Charger

DC-ChargeAC-Charge

DC-DischargeAC-Discharge

Vehicle-2-Grid

Standard Charging

…every time the car is parked

and charging cable plugged in



Tomorrow Shared Use Tomorrow Private Use

up to 24h/ day

100.000+ hours

up to 24h/ day

100.000+ hours

Battery-Management-System

DC-SupplyDC-Charge

DC-ChargeDC-Discharge

Vehicle-2-Grid /

Regenerative braking

Standard

Charge / Discharge

…whenever car is driving or put

to charge



What about component

lifetimes?



approx. 10.000h

Lifetime in average

usage conditions

Lifetime Margin:

-90.000 hours

Aluminium Electrolytic Capacitor



High Voltage MLCC‘s

How do these components handle the high requirements

concerning vibration, voltage and temperature?

Power Inductors Transformers



Active comp.

And what about these?

Is AEC-Q100 / 200 the answer??

Electro mechanics PCB’s Assemblies



ZVEI* Robustness Validation Working Group

Mission Profile

ECU Level

Are AEC-Q

criterias enough?

Determine failure

mechanisms, etc.

Mission Profile

Component Level

Very Critical

Consideration!

Setup Robustness

Validation Plan

If not

ZVEI

Robustness

Validation Group

Source: ZVEI – Handbook for

Robustness Validation* German Electrical and Electronic Manufacturers' Association



Mission Profile as basis for Robustness Validation

Source: ZVEI – Handbook for

Robustness Validation

Environmental Loads

Interaction

Functional Loads

• Thermal

• Mechanical (e.g. Vibration)

• Radiation

• Dust

• Humidity / Water

• Chemical

• Electromagnetical

• High Speed

• Overtaking / Freuquent Speed

Changes

• Stop & Go

• Mountain Pass

• Trailer Pulling

Assembly Requirements Shipping and Service



Source of Stress for Electronic Components

The percentages variate for different

applications and packaging locations; Source: ZVEI – Handbook for Robustness Validation

Temperature -Steady State & Cyclical; 55%

Humidity / Moisture; 19%

Contaminants / Dust; 6%

Vibration / Shock; 20%


Robust Design at WE – Pulse Peak

Destructed part by current peaks over the specified value

Example: Input Line Filter

High peak current until capacitor is fully charged SMD

ferrite damage due to peak pulse current possible



Withstand Pulse Peak

WE-MPSB, Pulse definition:

Single Pulse 0,5ms – 8ms, 100A max.

Multiple Pulse 8ms 100.000 Pulse max.

Time

Cu

rre

nt

Rated Current

Peak Current

WE-MPSB specification

Size 0805



Layer Design:

Special inner silver layer to reach high pulse capability



Process of releasing a product

Our process is based on 6 fundamental and

properly defined pillars, following the framework of

the APQP principles:

1. Planning: Idea evaluation and project definition

2. Product design and development: Design

phase and prototype elaboration

3. Process design and development: Design

and implementation of the manufacturing line

4. Product and process validation: Pre-launch

phase, process analysis and product

qualification

5. Production: Documentation for production and

release to the market

6. Feedback assessment and correction action:

Continuous improvement to ensure customer

satisfaction

International Standards for Automotive

Certifications

IATF 16949 : 2016

Automotive PPAP (Level 3)

Automation Commitments

Process Capability (Cpk)

Measurement System Analysis (MSA)

Data Tracking (In process and EOL

systems)

IPQC (Control Inspection)

Process Optimization

Product Qualification

Early Validations

AEC-Q200

Stable Automotive Processes

at Würth Elektronik eiSos

Sep 2018 TS/AG/TL/sku


Total Quality Management

at Würth Elektronik

Measurement Lab

Network/Spectrum/Impedance Analyzers

RF Impedance/Material Analyzer

LCR Bridges with High Current Capability

Precision LCRs

Modular Impulse Generators

Varistor Testers

Winding Testers

ESD Testers

Dielectric and Insulation Resistance

Testers

1000 W Power Supply

300 W Electronic Loads

Environmental Lab

Shock and Vibration

Temperature Cycling

Thermal Shock

Combined Shock and Vibration with

Temperature Cycling Steam Aging

Four Quality Centers

Germany (Waldenburg)

France (Lyon)

China (Longgang)

USA (Watertown)

Analysis Lab

Microscopic Analysis

Cross Sectioning and Polishing

Terminal Strength

Packaging MSL Level Testing

Wetting Balance

RoHS Reflow Profile

Computer Tomography

Hot Air Reflow

Vapor Phase

Wave Soldering

XRF X-Ray

Automatic Pick & Place

Certified according to:

DIN EN ISO 9001, DIN EN ISO 14001, DIN EN ISO

50001, ISO 17025, ISO 17043



• Factor 10~15 higher requirements concerning component

lifetime coming up

• Significantly higher requirements concerning temperature,

voltage, vibration and EMC

• Some initiatives already started, e.g. ResCar 2.0 Project

Time to Accelerate!

Thank you

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