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RISHO PCB Materials

Confidential

RISHO Company Profile- Foundation : October, 1921 (100 years old in 2 years!!!) - Annual Revenue : 170M USD- Number of Employee : 740

Business Outline1. Electronics

Copper Clad Laminates, Epoxy Glass Tape, Rubber Clad Laminates2. Industrial Material, Electrical Insulating Material

Laminated Board, Backup/Entry Board, Laminated Tube3. Epoxy Molded Electrical Products

Potential Transformers, Current Transformers, Capacitors, Reactor, Insulator

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RISHO CCL Epoxy Glass Tape

Solder Pallet

RICOCEL Phenolic Paper Laminates

Phenolic /Rubber Clad Laminates

Laminated Tube

Transformer2

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Branches and Affiliated Companies

- Head Quarters : Osaka in Japan - Sales Office： Osaka, Tokyo, Nagoya and other 9 domestic branches. - Overseas Sales Office : Taipei, Seoul, Singapore, Frankfurt, Wuxi- Factory ： Amagasaki, Shiga, Konan （ISO9001 & 14001 Certified）- R&D : Amagasaki Factory - Affiliated Companies: Risho Singapore Pte., Ltd.

Risho Enterprises （Car Driving School）Risho Kogyo (Wuxi） Electric Co.,Ltd. （ISO9001 & 14001 Certified）Risho Kogyo (Wuxi） Chemical Co.,Ltd. (ISO9001 & 14001 Certified）

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High-Speed Low-Loss Materialsfor Telecom Application and

Antenna

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【Characteristics of PPE Resin】

・Excellent Dielectric Property(Stable for frequency and temperature)(Low Dk, Low Df)

・Superior Tolerance of Thickness(Good Impedance Control)

・High Thermal Resistance, High Tg

・Low Water Absorption

・Excellent Processability

High-Speed PCB Materials

based on PPE Resin

Dk

Df

RISHO CCL Materials for Antenna PCB

Thermoplastic Resin

Epoxy Resin

PTFE

0.1

0.01

0.001

0.0001

2 3 4 5

0.1

0.01

0.001

0.0001

2 3 4 5

Bismaleimid(BMI)

BismaleimideTriazineResin

PPEPPE Resin

Polyarylate

Polycarbonate

PolysulfonCyanateester Poly Ethel Sulfone(PES)

Thermoset Resin

Phenol Resin

Polyethylene

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IPC SPECThickness Weight Density

(count/25mm)（mm） （g/m2) Warp Fill

106 0.035 25 56 561078 0.043 48 54 541080 0.055 47 60 463313 0.075 83 60 622116 0.095 104 60 587628 0.180 209 44 32

Glass Cloth

Cross Section of PCB

E-glass Low Dk glass

Density ｇ/cm3 2.6 2.3

CTE ppm/℃ 5.6 3.3

Dk （1GHz） 6.8 4.8

Df （1GHz） 0.0035 0.0015

Dk is determined by the ratio ofresin and glass cloth.

𝜀𝜀𝑙𝑙𝑙𝑙𝑙𝑙 =𝑉𝑉1 � 𝜀𝜀1 � ⁄2 3 + ⁄𝜀𝜀2 3𝜀𝜀1 + 𝑉𝑉2 � 𝜀𝜀2

𝑉𝑉1 � ⁄2 3 + ⁄𝜀𝜀2 3𝜀𝜀1 + 𝜀𝜀2

εlam ： Dk of laminateε1 ： Dk of resin（include filler）ε2 ： Dk of glass fabricV1 ： Volume% of resinV2 ： Volume% of glass fabric

Copper

Resin

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Standard Foil Low Profile Foil （LP） RTF

Optical（S-side）

SEM（S-side）

SEM（M-side）

M-sideRoughness

Rz（μｍ）9 2 4

Note Standard Low Transmission Loss Low Transmission LossLow Cost

Copper Foil

※RTF： Reverse Treated Foil

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Advantages of RISHO PPE CCL

・Low (High) Dk and Df・Low Water Absorption・High Tg・Excellent to thickness accuracy(Range of thickness accuracy is only half of FR-4)⇒ Easy to control impedance

・Good Processability (Equivalent to FR-4)（Drilling, TH-plating, etc.）

・Multi-Layer process available with other materials

Hi-Speed Materials Lineup

Base Resin PPE Resin EpoxyResin

Products AD-3379

AD-3379M

CS-3379M

CS-3379

CS-3376G/GV

CS-3376C

CS-3396M CS-3396 AD-3396

CS-3387S

Glass Fabric BondingSheet (Non) E glass

BondingSheet(Non)

E glass

Dk（10GHz） 3.1 3.0 3.16

2.9(Low DkE glass)

3.09 3.27 7.27(@8GHz)

11.3(@1GHz)

16.5(@1GHz)

3.92

Df（10GHz） 0.0018 0.0015 0.0015

0.0033(Low DkE glass)

0.0046 0.006 0.006(@8GHz)

0.003(@1GHz)

0.003(@1GHz)

0.012

Low ProfileCopper Foil ✔ A✔ ✔ ✔ ✔ ✔ ✔

Prepreg n Now Developing ✔ ✔ ✔ ✔ ✔

Halogen Free ✔ ✔ ✔ ✔

Flammability V-0 eqv. V-0eqv. V-0eqv. V-0 V-0 V-0 V-0 Equiv. V-1 V-0

Equiv. V-0

TypicalApplication

Servers, Routers,mm-Wave Antenna

Antennas, Amplifiers, Wi-Fi, DSRC

Antennas, Military, Aerospace, GPS

Device Embedded

Antennas, RFID

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AD-3379, CD-3379

Product code UnitUnder DevelopmentAD-3379

Dk (1GHz) － 2.9

Df (1GHz) － 0.002

Tg(DMA) ℃ 240

CTE Z （α1 /α2) ppm/℃ 38／41

Water absorption % 0.08

Flammability － V-0 Equiv.

Multi layer process － ○

Halogen free － ×

【Product Type】

Bonding Sheet, RCC

【Application】

・Bonding Sheet, Build-up Film

【Features】

・Isotropy of Dk and Df due to no glass cloth

⇒ Skew Reduction

・Dk＝2.9 / Df＝0.002 （1GHz）

・High Tg: 240℃

AD-3379Line-up

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Low Dk CCL（Dk＝3.2）

◆Application

FR-4（Dk＝4.2）

High-Speed Multi-Layer Board

・・・

AD-3379（Dk＝2.9）

AD-3379 ◆Laminate Press Condition

◆Heat Resistance Test（Humidity Reflow）

・・・

Temperature （℃） Pressure （kgf/cm2）

180℃ / 210min 10kg / 30min ⇒ 30kg / until cooled

CS-3376C（Dk＝3.3）

Core Material ： CS-3376C（0.4t, Cu18）Inner Layer Copper Foil Treat： BO treatOuter Material： AD-3379（0.1t）

【Test Condition】Humidify： 40℃/90%/24HrReflow ： 255℃ peak×6times

【Test Result】1 time 2 times 3 times 4 times 5 times 6 times

appearance OK OK OK OK OK OK

No abnormal issue on appearance after reflow

AD-3379（Dk＝2.9）

0

10

20

30

40

50

60

0

20

40

60

80

100

120

140

160

180

200

0 40 80 120 160 200 240 280

Pres

sure

(kgf

/cm

2 )

Tem

pera

ture

(℃)

Time (min)

Line-up

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CS-3379MCS-3379M

Line-up

Product Code UnitUnder DevelopmentCS-3379M

Dk1GHz

－3.2

10GHz 3.2

Df1GHz

－0.0010

10GHz 0.0015Tg（DMA） ℃ 205

CTE Z （α1 /α2) ppm/℃ 30／150

Water Absorption % 0.03

Flammability － V-0 Equiv.

【Product Type】

Double-Sided CCL

【Application】

・mmWave Radar, 5G Antennas, Satellite,Wi-Fi and GPS Antennas

【Characteristics】

・Low Dk and Low Df

Dk＝3.2／Df＝0.0015 at 10GHz

・Low Transmission Loss at mmWave Band

・High Thermal Conductivity: 0.6W/mK

・High Cost Performance

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Transmission Loss of CS-3379M

-10

-8

-6

-4

-2

00 20 40 60

Tran

smis

sion

loss

(dB/

100m

m)

Frequency（GHz）

CS-3379M

PTFE CCL

Transmission loss of CS-3379M is comparable to PTFE.

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Dk/Df Frequency Dependence CS-3379 M

3.0

3.2

3.4

3.6

3.8

10 20 30 40 50 60 70 80 90 100

Dk

Frequency(GHz)

0.000

0.005

0.010

10 20 30 40 50 60 70 80 90 100

Df

Frequency(GHz)

Test Method :

Balanced-type Circular Disk Resonator Method measured by FUJITSU

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Dk Temperature Dependence of CS-3379M

0.95

0.97

0.99

1.01

-100 0 100 200

Cha

nge

from

Dk

at 2

0℃

Temperature(℃）

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confidentialRoadmap of Risho Materials for 5G Antennas

2016 2018 2021

MaterialProperty

CopperFoil

RTF

Profile-free

CS-3379MDk：3.0Df：0.002≧

Dk：2.8Df：0.001≧

CS-3376G, GVDk：3.1Df：0.0029

H-VLP

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Thermal Solution Materials

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High Thermal Conductive Material Lineup

Low Resin FlowBonding Sheet

AD-70060.3W/mK

Glass Epoxy Laminate, Prepreg

CS-39451.3W/mK

CS-3295, ES-32453W/mK

CCL CCL, Prepreg

AC-73033W/mK

AC-7200TY5W/mK

Bonding Sheet, RCC, Copper-base CCL without Glass Fabric

AC-79001W/mKAl-base CCL

Liquid Molding Compound

(One-Pack Type)(1 - 4W/mK)

Liquid Molding Compound

(Two-Pack Type)(1 - 7W/mK)

Al-base CCL

AC-72088W/mK

CC-7303AD-7303CD-7303

3W/mK

Al-base CCL Al-base CCL

CC-7200TYAD-7200TYCD-7200TY

5W/mK

Dielectric Layer(Woven Glass Cloth)

Copper Foil

Copper Foil

CCL (CS-XXXX)

Dielectric Layer(B-stage)

(Woven Glass Cloth)

Prepreg (ES-XXXX)

Aluminum / Copper Plate

Dielectric LayerCopper Foil

Bonding Layer (B-stage)

Release Film

Release Film

Bonding Sheet (AD-XXXX)

Bonding Layer (B-stage)Release Film

Copper Foil

New

NewAD-7210CD-7210CC-7210

10W/mK

AC-721010W/mK

AD-7208CD-7208

8W/mK

Metal base CCL (AC-XXXX) RCC (CD-XXXX)

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RISHO Hi Thermal materials Road map

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2

4

6

8

10

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2002 2004 2006 2008 2010 2012 2014 2016 2018 2020

Ther

mal

Con

duct

ivity

(W/m

K)

AD-7004

AD-7200TY

AD-7208

AD-7210

AD-7303

CS-3945

Thank you for your kind attention!!!

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