RF Interconnection Technologies for 40G Serial
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IEEE 802.3ba Task Force September 15 – 19 Seoul, Korea RF Interconnection Technologies for 40G Serial IEEE 802.3ba Interim Session Seoul, September 15-19, 2008 Kazuyuki Mori, Fujitsu Labs Youich Akasaka, Fujitsu Labs Hideki Isono, Fujitsu Song Shang, SMI
Transcript of RF Interconnection Technologies for 40G Serial
IEEE 802.3ba Task Force September 15 – 19 Seoul, Korea
RF Interconnection Technologies for 40G Serial
IEEE 802.3ba Interim SessionSeoul, September 15-19, 2008
Kazuyuki Mori, Fujitsu LabsYouich Akasaka, Fujitsu Labs
Hideki Isono, FujitsuSong Shang, SMI
2IEEE 802.3ba Task Force September 15 – 19 Seoul, Korea
SupportersNetwork Carrier• Osamu Ishida, NTT• Shoukei Kobayashi, NTT• Hidenori Takahashi, KDDI Labs
System Supplier• Hiroshi Onaka, Fujitsu • Satoshi Obara, Fujitsu• Shinji Nishimura, Hitachi Ltd• Hidehiro Toyoda, Hitachi Ltd• Satomi Shioiri, NEC
Transceiver Supplier• Tomas Aherne, JDSU • Beck Mason, JDSU• Mike Dudek, JDSU • Atsushi Takai, Opnext• Kiyohisa Hiramoto, Opnext• Matt Traverso, Opnext• Ed Cornejo, Opnext• Tadashi Ikeuchi, Fujitsu Labs• Honghuey Lin, eGtran Corporation
Device Supplier• Farzin Firoozmand, SMI• Craig Hornbuckle, SMI• Hideaki Horikawa, OKI• Hitoshi Watanabe, Mitsubishi Electric• Sosaku Sawada, Eudyna• Keiji Sato, Eudyna• Hao Feng, Eudyna• Tetsuya Kinoshita, Kyocera • Keith Nellis, Inphi Corp• David McCormick, Picometrix• Janis Valdmanis, Picometrix• Padraig O’Mathuna, Gigoptix
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Outline• Purpose of this presentation
• RF interconnection technology to reduce 40GE Serial cost is proposed.• These technologies are available now and also enable to reduce optical
module size in near future
• Effective cost reduction method for 40G Serial• Integration EML and EA Driver into one PKG• Removing GPPO from Serdes ICs and optical devices
• Two-types of RF interconnection method to remove GPPO • Edge mount GPPO method• FPC interconnection method
• Optical module size estimation by using proposed RF interconnection method• Comparison between Serial vs CWDM
RF Interconnection Methods
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FPC interconnection
Ser TOSAw/ Drv
FPC
MSL
GPPO edge mount connectors
Edge mount GPPO
XLMD Tx w/ DrvSer
MSL
Current OC768
Ser
EA Drv
EML
EML(GPPO PKG)
SerializerOC768
16:1/1:16(GPPO PKG)EA Drv
(GPPO PKG)
Serializer40GE
4:1/1:4(LGA PKG)
TOSA w/ EA Drv(Feed-through)
XLMD w/ EA Drv(GPPO PKG)
85 % cost reduction50% cost
reduction(*1)
60% cost reduction(*1)
(*1) TOSA(w/ driver)+ROSA cost, not include volume effectFrom traverso_01_0909
Cost reduction of SerDes for 40GE Serial
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Cost Comparison: OC768 and 40GE SerDes, YR2008 technology
OC768 16:1/1:16(GPPO PKG)
40GE 4:1/1:4(LGA PKG)
85%
Edge Mount GPPO Method
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Frequency (GHz)
SDD
21 (d
B)
Transmission loss = 1.0dB@40GHzf-3dB bandwidth = 60GHz
GPPO Edge MountMulti-layer PCB(FR-4)
Probe Probe
Available Today
FPC Interconnection Method
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X-point 50.3 %Ext. ratio 10.8 dBJitter p-p 7.56 psJitter rms 1.09 ps
X-point 50.1 %Jitter p-p 4.01 psJitter rms 0.64 psEye amp. 1.2 VTr 7.11 psTf 7.44 ps
X-point 50.0 %Ext. ratio 10.5 dBJitter p-p 7.56 psJitter rms 1.13 ps
1. Alumina board connection(Reference)
2. FPC film connection
Input waveformBit rate ： 39.8Gb/sData pattern：PRBS31
Driver IC integratedEML module
GPPOconnector
Alumina board(7mm)
Solder Joint
FPC film
FPC film(10mm, R=0.75, 90deg bend)
Driver IC integrated EML module
GPPO connector
Ceramic feed-through
Ceramic feed-through
Ceramic feed-through
(*OECC 2008, WeC-1)
Available in 2009
Optical output
Optical output
FPC Measurement Conditions
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FPC Material: Polyimide (t=50um)Signal Line: Micro strip line/ Grounded coplanar line (L=10mm)Measurement Conditions
FPC Temperature: 25, 50, 85oC(a) Bent (90o, 120o, 180o, R=0.75mm) (b) Twisted(c) Folded
(a)
(b)
(c)
Micro Strip Line Type Grounded Coplanar Line Type
MSL Type FPC Performance
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Frequency (GHz)
S11
(dB
)
S21
(dB
)Frequency (GHz)
S11
(dB
)
S21
(dB
)
25oC50oC85oC
StraightBent 90o
Bent 120o
Bent 180o
TwistedFolded
Micro Strip Line Type
No degradation
Grounded CPL Type FPC Performance
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No degradation
Frequency (GHz)
S11
(dB
)
S21
(dB
)Frequency (GHz)
S11
(dB
)
S21
(dB
)
25oC50oC85oC
StraightBent 90o
Bent 120o
Bent 180o
TwistedFolded
Grounded Coplanar Line Type
40G Signal Transmission on FR4
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S21 (measured)
Frequency (GHz)
MSL, 10mmMSL, 20mm
Input waveform (40Gb/s) After 10mm transmission After 20mm transmission
Material ：CCL-EL230 type TDielectric Constant：3.8 (@1GHz)Dielectric Tangent：0.005 (@1GHz)Thickness ：200um
MSL 10mm
Optical Module Size
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91 mm
36 m
m
70 m
m120 mm
Y2009-2010 Y2011-2012 Y20??18
mm
62 mm
Serial
CWDM
Double XENPAK
X2
QSFPFPC CMOS
???
Double XENPAK
70 m
m
120 mm
4xROSA
4xTOSAO-Mux
O-DeMux
18m
m
62 mm
QSFP
O-Mux
O-DeMux4xROSA
4xTOSA
???
Which is the right technology?
13IEEE 802.3ba Task Force September 15 – 19 Seoul, Korea
Summary• Recommend the 802.3ba task force to adopt 40GbE
Serial PMD for 10Km SMF:• Two-types of RF interconnection method are proposed and
confirmed that RF characteristics are acceptable for 40G Serial• GPPO edge mount method – Available today• FPC interconnect method – Available in 2009
• These technologies enable to reduce optical module cost and size for 40G Serial
• Optical module size• X2 by adopting FPC interconnection method• QSFP by adopting low power CMOS
• Serial is the right technology for 40GbE 10km SMF application
