review · 2018-05-23 · Condensation soldering becomes more flexible with CondensoXC P. 22...

PROGRAMMING

MOBILE DEVICES

VICON

ViCON APP

06“Turn Vision into Reality”Welcome to productronica 2017 in Munich

10ViCONManufacture simply and efficiently using smart software

18“Supplier of the Year 2016”Rehm was awarded a prize by the Continental Automotive Group

reviewCustomer Magazine, Issue 02 | 2017

®

www.rehm-group.com

Now also as an

App!

MOBILE DEVICES

P3778

P4135

Everything in sight with ViCON!

terms such as big data and Industry 4.0 are cur-rently present in both the media and companies in equal measures. But what is behind this and how can electronics manufacturers meet the high expectations of production in the digital age?

Even today, considerably more data is available within a process chain than that which has already been analysed. Therefore, it is important for modern manufacturing companies to deal with this data and use it effectively within the limits of available resources. The pivotal point here is the acquisition of operating data. Extracting such information simply and easily from its production

process to analyse it reliably can now be carried out with the new ViCON software. In addition to the basic software, Rehm is developing addition-al features to increase efficiency, including the ViCON Analytics monitoring tools, the ViCON Connect remote manager and the ViCON App, which lets the operator keep an eye on production using the smartphone at all times.

Would you like to find out more about the new software and the Rehm system highlights? Then visit us at productronica in Munich from 14 to 17 November 2017 in hall A4, booth 335. We look forward to seeing you!

Dear reader,

Johannes RehmCEO

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FUTURETECHNOLOGY

review 02 | 2017 Editorial

Imprint

review is a publication of

Rehm Thermal Systems GmbH

Leinenstraße 7

89143 Blaubeuren, Germany

T +49 7344 9606-0 | F +49 7344 9606-525

[email protected] | www.rehm-group.com

Picture credits© Asetronics/Page 14 (image of OP light), Page 15 (images of the installation of the reflow

convection soldering system), Page 16 (image of product range of surgery lights) and Page

17 (image of street lighting); © Continental AG/Page 18; © Shutterstock/Page 19 (image of

Taoyuan City); © Werner Fink, ELMERIC, We Link Electrical Engineering to print Technologies,

EE-Kolleg Sant Jordi, March 2016/Page 30 (image 4); © Silas Ristl/Page 31 (shot putter im-

age); © IStock/Page 31 (children's football image); © EM ASIA/Page 35 (image of the award

ceremony); © Günter Dieckmann/Page 36 – 37 (images of nativity scenes); © IHK Ulm/Page 37

(employees in front of the system); © Rehm Thermal Systems/all other images used

Content review 02 | 2017

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Expansion of sales & service in Asia: Successful inauguration of the new branch in Taiwan

Condensation soldering becomes more flexible: Portfolio expanded by CondensoXC system

14

Seamless lighting management: Asetronics manu-factures efficient LEDs with equipment by Rehm

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26 32 36

More than “just” coating: New application possibili-ties with ProtectoXP

Putting the assemblies through their paces: Innova-tive test equipment in the Rehm Technology Center

Interview: It’s Christmas – Quality Manager Günter Dieckmann builds handcrafted nativity scenes

Editorial P. 3

“Turn Vision into Reality” – productronica 2017 P. 6

ViCON: Manufacture efficiently using smarter software P. 10

Seamless lighting management thanks to modern LED technology P. 14

Excellence: Continental honours Rehm as “Supplier of the Year 2016” P. 18

New branch office opened in Taiwan P. 19

Rehm sales team reorganised P. 20

Condensation soldering becomes more flexible with CondensoXC P. 22

Extended application possibilities with ProtectoXP P. 26

From the roll – Dryer Part 3 P. 28

An all-round success: Rehm supports school and sports projects P. 31

Innovative test equipment in the Rehm Technology Center P. 32

International presence: 2017 trade fair review P. 34

Interview: Günter Dieckmann builds nativity scenes P. 36

Rehm at the starting line: AOK Company Run and Einstein Marathon P. 38

Save the Date: shows and events 2017/18 P. 39

review 02 | 2017 Content

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Rehm presents itself with a new trade fair stand and showcases innovative systems technology

“TURN VISION INTO REALITY”PRODUCTRONICA 2017

In 2017, we will once again be one of the exhibitors in Munich and will be presenting clever thermal system solutions at the productronica from 14 to 17 November.

This year, particular emphasis will be placed on smart data. In addition to the systems, we, among others, will be demonstrating the new ViCON

software with touch control and will be presenting initial solutions for the “The Hermes Standard” interface. A new stand design will also breathe new life into events over the

course of the trade fair. See for yourself – in hall A4, booth 335!

Hall A4,Booth335

Premiere: Presentation of the new booth and colour concept at SMT Hybrid Packaging 2017 in Nuremberg

Fast and efficent for the perfect result.

Show Highlights review 02 | 2017

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VisionXP+ Vac and VisionXC ViCON EditionThe VisionXP+ Vac for reflow convection soldering with or without a vacuum is even more efficient! The system is available with new, digital EC fan motors, which are not only quieter and more sustainable, but also enable extensive process performance thanks to real-time recording of all relevant operational data. The focus continues to be also on energy management – the system consumes less than 10 kWh of electricity when in operation. Here, the optimum distribution of the gas flow in the segmented cool area substantially contributes to saving energy.

The VisionXC will also be presented at the trade fair in the form of the ViCON Edition. With this system, Rehm has responded to the needs of the market. This new complete solution offers a high-quality system technology combined with high-quality equipment, as well as the new, modern ViCON software including the ViCON App for mobile system monitoring. The ideal package – whether you are starting out or a seasoned pro!

VisionXC ViCON Edition and VisionXP+ Vac

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CondensoXCThe new CondensoXC reflow condensation soldering system is best suited for laboratory applications, small pro-duction lines or prototyping. The system is a top performer, therefore it plays a huge part in the process despite having a space-saving design. The patented injection principle, supplies the process chamber with exactly the right quan-tity of Galden® for optimal profiling. Thanks to the closed-loop filter system, virtually 100 percent of the medium can be recovered. The system is fully suitable for vacuum and has an integrated process recorder for optimum traceability.

Strong performance withlarge components.

NexusThe new Nexus contact soldering system is suitable for pore-free and flux-free soldering in a vacuum at up to 450 °C with a variety of process gases. The wet-chemical activation with formic acid is available as an option. It is possible to use lead-free or lead-containing preforms and pastes. Nexus is used in advanced packaging and power electronics.

Securo MinusRehm presents suitable equipment also to analyse the reliability of sensitive electronics under extreme tempera-tures. Securo Minus is used for reliable cold function tests and checks the suitability of electronic components at winter temperatures among other things. The electronic components are exposed to cold air or nitrogen at low temperatures of up to –55 °C in the system. Securo Minus can be combined with other measuring equipment.

Optimal contact forspectacular results.

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ProtectoRehm is also continually refining our systems engineering for selective conformal coatings. The Protecto coating system protects sensitive electronic modules from damage caused by aggressive environmental influences. At the trade fair, Rehm will be presenting two equipment variants for different manufacturing environments, including the ProtectoXC for flexible coating processes, even at low throughput, as well as the ProtectoXP Longboard for pro-cessing large circuit boards up to 1.5 m in size.

System technology does not only focus on technological progress, but also relates to their control and networking. With ViCON, Rehm is creating clever software for intuitive touch operability of the VisionX series. This lets you, for example, log all values, or collect and analyse alarms etc., to avoid errors, improve soldering processes and document for optimum traceability. In addition to the basic software, Rehm is developing additional features, to increase effi-ciency, including the ViCON Analytics monitoring tools, the ViCON Connect remote manager for monitoring the entire Rehm machinery and the ViCON App, which lets the operator keep an eye on production in a mobile way.

The entire production process must be networked before setting up a “smart factory”. Rehm and various other sup-pliers have worked together and introduced a manufactur-er-independent interface for communications between all machines of a production. “The Hermes Standard” enables circuit boards to be logged through all stations of the pro-duction process (printers, transport, placement machines, AOI systems, soldering systems, etc.), with complete trace-ability and without any loss of data. It is intended that the tool will replace the usual SMEMA standard. At the trade fair, we will be very happy to provide visitors with more detailed information about these new software options.

Towards the “Smart Factory” with ViCON and Hermes

Meticulous protective coating.

review 02 | 2017 Show Highlights

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The challenges of the future are growing all the time with increasing data volumes from modern industrial systems, and with them, the challenges for the system software used: Huge data volumes have to be managed and archived for the long term. At the same time, demands on performance are increasing. Analysis tools ensure optimum system availability and proactive manufacturing.

Digitisation, networking and big data are megatrends in the electronics industry, to which electronics manufacturers today must react quickly and flexibly

KEEP THE LINE RUNNINGEASY PRODUCTION WITH VICON

Products review 02 | 2017

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The new ViCON software for the operation of the VisionX- Series supports you optimally in the daily production routine. In addition to the basic software, Rehm is developing addi-tional features to ramp up efficiency, including the ViCON Analytics monitoring tools for optimum profiling, the ViCON Connect remote manager for monitoring the entire Rehm machinery and the ViCON app, which enables mobile access to all relevant system information from a smartphone.

ViCON VisionX – a good basis counts

The ViCON software stands out with a clearly structured interface design and intuitive touch operation. The objective is to depict the system’s current operating status clearly so that the operator can react quickly to status and alarm messages. All messages, commands and parameters are visible at a glance in the main screen with machine view. With numerous features, for example, a favourites bar that can be freely added, the unique grouping of parameters or

the individual process monitoring and documentation, ViCON offers you optimum support for your manufacturing process-es. Access rights, views and favourites are tailored exactly to each user. Only the relevant information is displayed, and a cluttered software interface is a thing of the past. Within an SMT production line, every single system delivers a variety of information about the status of systems and current production – regardless of whether this is a trans-port conveyor, printer, placement machine, soldering system or AOI. This data then needs to be recorded, pooled and analysed. Rehm offers you numerous tools for acquiring operational data of the soldering system.

Tried and tested Rehm software add-ons, such as the convenient product management and process locking, the Profile Creator and the possibility of MES connection, are optimally combined with new functions in the area of mobile applications and traceability.

ViCONVisionX

Top: Alarm messages with a display of the action buttons and the favourites bar

Right: Main menu, adapted to the respective user level

Keeping an eye on production at all times while on the move

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ViCON AnalyticsGreater transparency in the manufacture of electronics

What goes on in the reflow soldering system? What points can be improved on further? Where are the hidden poten-tial savings? The Rehm monitoring tools provide you with answers to these questions. They capture the plant’s data relevant to quality, costs and performance and summarise the results in clearly laid-out reports and logs. An appropriate analysis is possible as a result, and optimisation processes can be initiated on the basis of these findings.

Flexible system operation with ViCON ConnectOffline, online or on the system

Being able to access the machine from anywhere and at any time is essential these days. Rehm offers a variety of concepts for this. With remote access via ViCON Connect, you are able to retrieve data at any time, switch directly to the system and monitor and control it from your production conveniently at your workstation. In conjunction with a cross-divisional system, you can maintain an overview of your entire production – worldwide!

Information available at any timeMobile retrieval of system data with the ViCON App

The App – developed especially for ViCON – allows you mo-bile access to all the relevant system information from your smartphone. You can see the operating status and alarms at first glance. The responsive design ensures optimum display on varied devices, thus offering a convenient overview and simple operation – cross-system for IOS, Android and Win-dows. The ViCON App is not restricted to a special system, but rather allows all Rehm systems that are installed in your production and which have been connected to the App to be represented.

Production management A clear view of all products

Process lockingThe focus is on process security

TraceabilityTraceability of all manufactured goods

MES connectionSuperordinate production control

Profile creatorThe perfect profile made easy

ViCON Extensions

Remote managerTool for monitoring all Rehm machinery

ViCON Connect

ProCap – professional capability systemControlled process stability

Remote maintenance – Remote Administration Tool (RAT)Software support without time loss

KIC RPI – Reflow Process IndexTemperature profiling of KIC

RecorderAll data points recorded

ViCON Analytics

Always mobileKeep an eye on production from the comfort of your smartphone

ViCON AppViCON Software Service Support:

T: +49 (0) 7344 - 9606 [email protected]

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INTERVIEWIn discussion with Michael Hannusch

Our customers are thrilled! In 2015, Hannusch Industrie- elektronik from Laichingen changed their reflow convec-tion soldering system software from Visu II to ViCON. The evaluation phase has now been completed, and ViCON is successfully in use, as Michael Hannusch, Head of Pro-cesses and Technology, explains in an interview. Hannusch produces modules in the area of flat components and switch cabinets and has been on the market for almost 30 years.

What are the advantages of the new ViCON software for your daily production routine?

Michael Hannusch: The conversion from the old software to the new one was possible in a very short time, and so far we only have positive experiences. ViCON is very well-structured and easy to use. Even our new employees can find their way around quickly. The intuitive control via the touchscreen interface makes it easy for the operator to find their way around the menu. We have four assembly lines connected to one soldering system. Since we often have product chang-es, the new Favourites bar is also very practical for storing custom entries in a user-specific way. I also appreciate the structured data analysis. With ViCON, relevant machine parameters can be selected and documented in a targeted manner, so that errors can be detected quickly without hav-ing to compare large amounts of data sets.

You also use the Remote Manager ViCON Connect. What are your experiences here?

M.H.: ViCON Connect makes our routine production much easier. It is very practical if you can keep an eye on the ma-chine from the office. If an alarm lights up, ViCON Connect immediately indicates this on the PC. This way, I don't have to go to the system every time, but can access the it directly from the offline workstation, see where it is jammed and control the process. This is a great advantage!

How do you rate Rehm Software Service Support?

M.H.: As the software has been running very well in our company so far, we didn't have to make frequent use of the service. For minor problems, the software experts at Rehm were always able to provide us with competent assistance immediately via remote maintenance. This worked well and is significantly faster than telephone support.

The interview was conducted by Anna-Katharina Peuker and Manuela SebabiMichael Hannusch explains in an interview with Anna-Katharina Peuker how the use of ViCON software eases routine production

Process control directly at the system or from the workstation via ViCON Connect

review 02 | 2017 Products

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Asetronics manufactures efficient light emitting diodes for the automotive industry, medical technology and power electronics

PERFECT LIGHTING MANAGEMENT THANKS TO MODERN LED TECHNOLOGY

LEDs are changing the world of light: they consume considerably less energy than conventional light bulbs and at the same time have a longer service life, are more economical and do not contain any highly toxic substances such as mercury. In the field of high-perfor-mance lamps, the automotive industry was one of the first sectors to get involved with this trend and was already installing headlight systems equipped with LEDs (light emitting diodes) into cars at the end of the 1990s. In or-der to assure that this new lighting technology functions flawlessly, in particular heat generated by the LEDs must be reliably dissipated. This is where Asetronics comes in. The company located in Bern, Switzerland, produces and develops modern electronics for LEDs and is continuously researching strategies targeted at improving temperature management. Asetronics has been successful in manu-facturing light modules for the automotive industry, but the company’s product range also includes street lamps and railway illumination, work lamps for industry, lab-oratories and offices, as well as lamps for surgery and examinations in the field of medical technology – all on the basis of LEDs.

Up through 2004, Asetronics belonged to the production division of telecommunications manufacturer Ascom. In 2006, the company successfully launched independent operations with its first LED applications involving chip-on-board technology. These applications are used in the brake lights, blinkers, fog lights and daytime running lamps of

vehicles produced by renowned automobile manufacturers. Asetronics has since experienced strong growth and in the meantime employs 190 persons. Roughly 60% of Asetronics’ annual turnover is generated alone with LED light modules for automotive headlights. The Swiss enterprise cooperates with suppliers to well-known brand names such as Audi, BMW, Daimler and Porsche.

Whereas only premium automobiles were equipped with LED light a number of years ago, cars without this modern lighting technology are rare in the meantime. Pressure is rising along with the unbelievable growth of the industry sector. Asetronics produces roughly 250 million SMD com-ponents each year. It’s continuously expanding its product range and production capacity, it maintains high levels of quality and it conducts research targeted at optimizing its technology. The company relies upon diversified know-how in order to make successful progress in this respect. And this means that Asetronics not only assembles and processes the light modules, it also manufactures the metal-core PCBs for the LEDs itself. This makes it possible to optimize heat management, and to continuously improve it by means of in-house R&D. “In extreme cases, inadequate temperature management can result in irreversible damage to, or destruction of the LED and the PCB. Light emitting diodes radiate light to the front and heat to the back, which has to be dissipated from the chip as quickly as possible. At temperatures of greater than 150 °C, the sensitive diode degenerates”, explains Georg Schafer, head of Turnkey Electronics at Asetronics. There’s a small thermal resistor

Customer Portrait review 02 | 2017

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PERFECT LIGHTING MANAGEMENT THANKS TO MODERN LED TECHNOLOGY

between the component and the PCB, as well as between the PCB and the heat sink, in order to ensure ideal temper-ature management. Heat at the bottom can be removed and dissipated via the heat sink with the help of microvias. The heat sink functions in turn via the metal-core PCB with its extremely thin layer made of insulation material which ideally spreads and dissipates the heat. This is important in particular with regard to ever increasing levels of miniatur-ization.

Where the production of sensitive electronic components is concerned, Asetronics relies upon top quality systems engineering from Germany. In order to reduce maintenance costs and manufacture more efficiently, the company has switched over entirely to reflow soldering systems from Rehm Thermal Systems over the last three years. Three VisionXP+ convection soldering systems are currently being used in production.

The newest system is equipped with a vacuum module for reducing voids in the solder joint and has been running since October 2016. Heavy equipment was necessary in order to get the 4600 kilogram titan into the upper floor at Asetronics. And the effort has paid off, because vacuum soldering has become a central issue in electronics manu-facturing and is a standard process at the Swiss company as well, in order to be able to assure best possible quality. “Vacuum technology is an important issue in particular where the production of sensitive electronics is concerned. In the meantime, LED manufacturers are demanding void

Dizzying heights – installing the new VisionXP+ Vac reflow convection system at Asetronics in October 2016

VisionXP+ Vac from Rehm Thermal Systems

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content of less than 15%. In some cases the tolerance limit is even lower for certain products. We’re now able to fulfill these requirements reliably, and above all lastingly, with the new VisionXP+ Vac”, stresses Sven Schwalbach, depart-ment head for SMT Production at Asetronics.

The VisionXP+ Vac delivers reliable soldering results, even at high throughput levels. With a partial vacuum of down to 2 mbar, void content of less than 2% is feasible – a great advantage, above all for future manufacturing requirements. With the help of the optional vacuum module, the user can decide whether or not vacuum technology will be activat-ed depending on the respective product. Manufacturing flexibility is enormously increased as a result. “The option for systems networking represents a further advantage. The machines access a common database. And thus it’s possible to run identical profiles on our systems – a point which mustn’t be overlooked with regard to time and cost savings in production”, says Philip Längsfeld, Head of Sales Europe at Rehm Thermal Systems.

Perfect illumination at doctor’s offices and in hospitals

The favorable characteristics of LEDs become plainly apparent in the field of medical technology – an additional, important mainstay for Asetronics. Outstanding light quality and natural color rendering, full illumination without shad-ows, intensive and clear light without glare, high levels of luminance with minimal heat radiation – medical lighting is subject to demanding requirements. Due to the fact that old-er light sources radiate a great deal of heat to the front, thus causing operating rooms to heat up very quickly for example, Asetronics developed a lighting concept which is highly advantageous above all for surgeons. “Our new generation of surgical lighting consists of LEDs which can be individually regulated with regard to brightness, color temperature and light focus. With the LED, heat is dissipated to the back. And thus in the active state, the lamp is no warmer than 35 to 40° C. Light is focused in a bundled fashion – shadow-free and with natural color rendering. Beyond this, the lamp is equipped with an integrated HD camera. These conditions make work much more pleasant for attending physicians and surgery personnel”, says Georg Schafer.

“Light On Demand”: Clever concept for street lamps with a promising future

In 2014, Asetronics participated in an invitation to tender for the reconceptualization of street lighting in the canton of Bern – with great success. The manufacturer’s “Light On Demand” project was highly convincing. Asetronics devel-oped a new type of LED light module system to this end for rugged outdoor lamps. Each street lamp is equipped with a motion detector which is capable of controlling light in an event-oriented manner. “When there’s no traffic, lighting power is reduced to 10 to 20%. If a person or a car approach-es, the closest lamp and the next three are pushed up to full

Broad range of products for optimized illumination for medical examinations and operations

(left to right): Sven Schwalbach, Department Head of SMT Production and Georg Schafer, Head of Turnkey Electronics (Asetronics)

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power. This results in energy savings amounting to 80 to 90% as compared with inefficient older systems”, says Georg Schafer, Head of Turnkey Electronics at Asetronics. A lamp consists of roughly 50 individual LEDs. Not only can they be switched on and off, they’re also individually dimmable. After being placed into service, the LED street lamps provide light for up to 20 years without being replaced. In the case of con-ventional street lamps, the light source has to be replaced every two to three years. In the meantime, Bern and its sur-rounding districts have already been equipped with roughly 3500 of the new street lamps. Additional communities with extensive road systems will follow.

Challenge: Miniaturization and networking

What does the future hold for LED technology? As is the case in all fields of electronics manufacturing, the trend towards miniaturization is plainly apparent in lighting technology as well. LEDs are becoming smaller, more efficient and combina-ble into entire LED networks or arrays. LED chips are expected to evolve in the future, onto which it will be possible to place as many as 64 individual light emitting diodes. Processing these LEDs so that they will later be specifically controllable is a great challenge. Asetronics is not only continuously con-ducting research on the LED itself, the company is also devel-oping core expertise in the optimization of processing options. Within this context, attention is focused again and again on the issue of heat management. This pursuit of continuous im-provement, inquisitiveness directed at technological progress and the enthusiasm to be an active player at the head of the market unite Rehm and Asetronics and are clearing the path for further successful collaboration. “In the final analysis, we were convinced by Rehm’s great innovative spirit. We’re on the same wavelength in this regard, because Rehm also steadily continues to develop its products and offers its customers top quality and outstanding service as a global player. Thus far we’re very satisfied with Rehm’s products and we’re looking forward to new developments, above all in the area of vacuum technology”, says Georg Schafer in conclusion.

Anna-Katharina Peuker

The team standing in front of the new VisionXP+ Vac at Asetronics’ production facility (left to right): Sven Schwalbach, Department Head of SMT Production (Asetronics), Philip Längsfeld, Head of Sales Europe (Rehm) and Georg Schafer, Head of Turnkey Electronics (Asetronics)

“Light On Demand”: Clever concept for street lamps with a promising future

review 02 | 2017 Customer Portrait

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Rehm is one of the best suppliers in Continental’s Automotive Group

PRIZE-GIVING CEREMONY FOR “SUPPLIER OF THE YEAR 2016”

From among 911 strategic suppliers, the Continental Automotive Group has identified its best partners around the world on the basis of a comprehen-sive, systematic evaluation. Rehm Thermal Systems impressed as the only supplier of manufacturing equip-ment in the area of “Investment and Engineering (Soldering Machines)” and was one of 15 companies recent-ly awarded a prize for outstanding performance at “Supplier Day” in Re-gensburg. Looking back at 2016, the focus was placed specifically on the increased requirements with regard to quality and reliability.

“Both developments within the automo-tive industry, and the increasingly com-plex worldwide platform concepts and the increasing demands of our custom-ers with regard to quality, present new challenges for the entire supply chain“, said Dr. Elmar Degenhart, Chairman of the Executive Board of Continental AG, in his speech. “Quality is now no longer an objective in the sense of an

indicator of customer satisfaction, but an essential requirement. One goal of our work is to pursue a consistent zero defect strategy in all areas. All compa-nies in the supply chain must therefore firmly anchor this quality standard in their DNA, so that it is embodied by all employees and shapes each individual process step.”

The individual customer care provided by Rehm Thermal Systems was high-lighted as being particularly praisewor-thy. The Swabian mechanical engineer uses direct contact persons and always bases its product portfolio on the needs of its customers. In cooperation with Continental, many specific spe-cial solutions in the reflow area have already been implemented in this way in the past. An international presence continues to play a central role for both companies.

“It makes us very proud to be among Continental’s top partners worldwide and it shows that we are meeting the

increasing quality and technology re-quirements in a dynamic industry like electronics production. The award is a special honour for us. We very much appreciate the confidence shown in us, the exchange of experiences and the mutual inspiration in numerous joint projects in the course of our now almost 25-year partnership”, said Johannes Rehm, Managing Director of Rehm Thermal Systems.

Every year since 2008, Continental has awarded prizes for “Supplier of the Year” to outstanding suppliers in the automotive business, in the six areas of Electronics, Electromechanics, Metal, Plastic and Rubber, Investment and Engineering Services as well as Divi-sion-Specific Solutions. The selected companies are rated in the categories Quality, Technology, Logistics, Costs and Purchasing Terms.

News review 02 | 2017

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With around 23 million inhabitants spread across an area roughly the size of the German state of Baden-Württem-berg, Taiwan is one of the smaller countries in Asia. In the electronics industry, however, the island is a major global player, with leading manufacturers such as Asus, Acer and HTC becoming global brands in recent years. In order to meet the needs of Asian electronics manufacturers and strengthen partnerships with them, Rehm Thermal Systems has recently set up a new branch in Taiwan.

Together with long-term clients and business partners, the Rehm team celebrated the opening of the branch and the inauguration of the new premises, led by Regional Sales Director Titan Huang.

”A clear trend in the Asian electronics market is, in particular, massive growth in the semiconductor industry. With the new branch, we are offering customers in Taiwan and the region even more reliable sales services and faster support, with particular focus on semiconductors. But the team is also on hand to offer help and advice on any other queries

regarding Rehm’s product range”, says Michael Hanke, Rehm’s Chief Customer Officer.

In the Technology Center on site, thermal processes can be optimized together with customers and partners and numerous applications can be tested and compared.

Rehm opens new branch in Taiwan – Expansion of the Sales and Service department in Asia

GRAND OPENING TAOYUAN CITY, TAIWAN

Contact:

Titan Huang | Regional Sales DirectorRehm Thermal Systems Limited Taiwan Office 1F, 75#, Qingpu 4th Street, Zhongli Dist.,Taoyuan City, Taiwan

T: +886 919358442 | F: +886 (03) 287 [email protected]

review 02 | 2017 News

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Martin Meyer, Business Development Key Account

With the expansion of the Key Account Management division, Martin Meyer is now working with Stefanie Stier, to manage Rehm's global headquarters and major custom-ers, based in Europe, Asia, North and South America. “In this way, we’re further developing our ability to address the needs and interests of our key accounts, expanding long-term business relationships, and opening up new markets”, he says. Martin Meyer started out at Rehm in 1991 as a design engineer. In 1996, he took over sales tasks and busi-ness development with a focus on Asia. Most recently, he was responsible for customers and distributors in Europe and for establishing and expanding sales structures in this region.

Philip Längsfeld, Head of Sales Europe

Since 1 May 2017, Philip Längsfeld has overseen sales for Western Europe. In this role, he supports cooperation and sales partners in customer acquisition, advises them on product portfolios, and strengthens Rehm’s presence in Europe. “Especially for our branches and distributors, a con-crete contact person is an important part of representing our common interests externally. I see myself not merely as an advisor, but as a companion”, he says. With the suc-cessful completion of his dual studies in business manage-ment, which he undertook in cooperation with Rehm, Philip Längsfeld is well acquainted with corporate structures. He previously worked as an internal sales manager. He passes these tasks on to Anna Grünauer.

Expansion of national and international contact

REHM SALES TEAM NEWLY REORGANISED

Which system is appropriate for my production requirements? Where can I find quick advice when I need a spare part or a new feature? Or, who is the person to contact when my company is based in Europe, America, or Asia? Rehm Thermal Systems has reorganised its sales team and can now offer faster customised answers to these and other questions.

Contact:[email protected] +49 7344 9606 515 | M +49 172 9140051

Contact:[email protected]+49 7344 9606 759 | M +49 171 2420080


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Anna Grünauer, Head of Back Office

Rehm welcomes a new member of the team, Anna Grünau-er, who took over the sales office on 1 April 2017. She thus acts an interface between the sales office and the sales field team, taking care of sales control, and managing customer contacts. “Rehm is active as an up-and-coming company with innovative products and ideas in a wide range of industries, and offers many development oppor-tunities. I’m especially pleased with the cooperation with renowned national and international customers”, emphasis-es Anna Grünauer. Her many years of experience in product marketing at a medical technology company will provide an excellent foundation from which to begin her new success-es at Rehm.

Peter Schiele, Sales Manager CondensoX/Special Systems

Since 1 June 2017, Peter Schiele has been the new contact person for worldwide sales of the reflow condensation soldering systems CondensoX and for special systems. He worked successfully for many years as a sales manager and key account manager for renowned customers in the automotive industry, having gained extensive experience in technical sales, as well as in system component devel-opment and reflow vapor phase soldering. In addition, he founded his own solar technology company in 2005. “For me personal contact with the customer is very important if we want to configure a system that meets expectations optimally. I’m looking forward to the projects that I’ll be able to achieve at Rehm in the future”, says Peter Schiele.

“We’ve given the sales team a new structure, allowing us to support our customers and part-ners better now. I’m also looking forward to welcoming two new faces to the team. We’re strengthening our international partnerships and are now better able to make optimum use of new market potentials.”

Michael Hanke, Chief Customer Officer

Contact:[email protected] +49 7344 9606 513

Contact:[email protected] +49 171 2462440


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CondensoX-Series expanded to include CondensoXC compact system

MORE FLEXIBLE VAPOR PHASE SOLDERING

Electronic PCB manufacturing has made tremendous pro-gress thanks to further development of convection reflow soldering systems. But due to the increasing complexity of the PCBs, the melting point of the solder and maximum permissible process temperatures for the components, convection systems are not always first choice. The developers never stand still. The manufacturers’ R&D departments are consistently working on the optimization of existing systems and the development of new ones – improved quality, process optimization and user-friend-liness are their goals. Vapor phase soldering (also known as condensation soldering) is a process which has estab-lished itself within the industry and is being used to an ever greater extent. This type of soldering process clearly demonstrates its advantages where the quality of the soldering results is concerned.

Rehm Thermal Systems has many years of experience in the development and production of vapor phase reflow soldering systems, and has expanded upon this experience more and more during the course of the years. In addition to convection soldering, Rehm got involved in vapor phase

soldering already at the end of the 1990s, and was able to introduce its first system with vapor phase technology to the market in 2002, namely the KLS 400 Batch. This system was already additionally equipped with a vacuum option for void-free soldering. Vapor phase soldering was further developed by Rehm on the basis of the success of this technology, and is being used all over the world in today’s CondensoX-Series.

Vapor phase or convection?Vapor phase soldering systems have various advantages as opposed to convection systems. For many users, the fact that the maximum possible temperature of the PCB is limited by the boiling point of the medium used to generate the vapor is seen as a decisive benefit. As a rule, a medium with a boiling point of 240° C is used for lead-free solders. Vapor condenses onto the PCB until it reaches a temper-ature of 240° C – a further increase of even just 1° is not possible. This assures that the components, some of which are highly sensitive, cannot be overheated and significantly minimizes the failure rate as compared with other process-es. A further advantage is the fact that the vapor creates an inert atmosphere, which means that no additional nitrogen is required in order to avoid oxidation of the PCBs.

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Using Galden® as a mediumPerfluoropolyether (PFPE) – Galden® – is used as a heat transfer medium. The vapor phase of a PFPE is six times heavier than air, which means that the vapor remains at the bottom as a layer above the liquid PFPE and displaces resid-ual air in the upward direction. When a PCB is immersed into the vapor phase, it’s heated up in an inert atmosphere which prevents oxidation of the metallic components. Outstand-ing heat transfer coefficients and dielectric characteristics make PFPE an ideal medium for vapor phase soldering. A further significant advantage of this process results from the homogenous transfer of heat to the entire PCB.The boiling point of Galden® is adapted to the utilized solder paste. Various types of Galden® ranging from Galden® 200 to Galden® 260 can be used in Rehm systems. Galden® 240 is usually used, which reaches a maximum temperature of 240° C during condensation under normal pressure.

The CondensoX-Series and its advantages

Horizontal conveyorThe advantages of using a medium are common to all vapor phase soldering systems. But the CondensoX-Series has two essential benefits as opposed to other system available on the market. On the one hand, in the case of conventional systems, PCBs are vertically immersed into the vapor in a boiling chamber which is open at the top, and subsequently removed from the top in the molten state. This may lead to shifting of the components due to the vertical motion. With Rehm systems, the PCBs are no longer moved in the molten state.

Injection concept and pressure controlOn the other hand, Rehm uses patented injection technolo-gy. The PCB is advanced into a hermetically sealed process chamber and the Galden® is injected against a heated floor plate in precisely the right quantity at precisely the right moment in order to generate the required vapor. This makes it possible to accurately control the process and the tem-perature profile by influencing the amount utilized Galden® and ambient pressure. Due to the fact that the medium is injected against the vacuum chamber’s heated floor plate, the vapor can spread freely throughout the process cham-ber. The vacuum chamber makes it possible to generate a vacuum before actual soldering takes place. This further im-proves the formation of vapor. After the soldering profile has been run in its entirety – without having to move the PCB – a vacuum is generated directly in the process chamber. The option of making use of pressure not only after the soldering process, but rather during soldering as well in a targeted fashion as a process parameter, is a distinguish-ing feature as opposed to the usual vapor phase soldering systems. Conventional systems are “open”, i.e. the process chamber is not sealed and is exposed to external ambient pressure. In contrast to this, the CondensoX makes use of a vacuum-tight process chamber. The boiling point of a liquid depends inevitably on ambient pressure. CondensoX systems make it possible to take advantage of this phe-nomenon: the boiling point of the Galden® can be varied by adjusting pressure in the process chamber.

This option is a great advantage in particular for service pro-viders who cannot rule out the need to process various sol-ders with different melting points. If a conventional, lead-con-taining solder with a low melting point has to be used, it’s only necessary to adjust pressure correspondingly in the solder profile. The system is filled with the Galden® variant which is suitable for the solder with the highest melting point and process pressure is specified via the corresponding The new CondensoXC: Compact built, great in process

Reliable and repeatable: optimum profiling

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soldering profile in order to reduce the boiling point. As a result, there’s no need to change the medium. This option not only eliminates the necessity of keeping two media in stock – tedious and careful cleaning of the system which is required when the medium is changed over in order to prevent contamination of both media is avoided as well.

Galden® filteringWith the Rehm process in a single chamber, the Galden® is kept in a closed circuit: It’s injected, vaporized, exhausted, condensed, purified and returned to the production process. Systems included in the CondensoX-Series are in fact the only vapor phase systems with which 100% of the utilized medium is filtered and reused after every soldering cycle. Contamination is fully and effectively trapped in a targeted fashion by a filter during complete filtration of the Galden®.

WPS 2.4 continuous temperature recording In addition to the concept of always being able to precisely reproduce the same temperature profile for a production line, a further goal for modern manufacturing of electronic PCBs is detailed traceability of a PCB’s history. The R&D engineers at Rehm Thermal Systems have always focused attention on this aspect as well. Of course it has to be possible to record and document the temperature and pressure profiles of the individual manufacturing lots to this end. For a long time, this could not be done for the (vacuum) vapor phase sol-dering process. In most systems, temperature curves have been regulated by means of preheating zones, and immer-sion into the vapor phase has been controlled more or less mechanically. Thanks to Rehm’s patented injection process,

the temperature profile can be precisely controlled. It’s only necessary for to make consistent data available for profiling. Recording of this data has been very tedious and difficult in the past. Production had to be interrupted again and again during a test run in order to read out the data. The WPS 2.4 is a globally unique measuring system for va-por phase soldering, which can be used to continuously con-trol the temperature profile. The measuring system is based on SAW technology (surface acoustic waves). Connection between the sensor and the evaluation unit is wireless. The WPS 2.4 consists of a sensor with antennas, as well as a radio receiver and an evaluation unit.

The temperature sensor is mounted directly to the workpiece carrier of Rehm’s CondensoX soldering systems. It functions passively and doesn’t require any external power supply for the performance of measurements. A complete soldering profile can be ascertained without a bothersome cable or any batteries, and can be transmitted to the system software in real-time – without interrupting or influencing production. The tool has been specially adapted to the CondensoX-Se-ries with optimized antennas for the process chamber and the cooling tract. Rehm’s software-aided documentation and evaluation functions (Rehm Recorder) permit new levels of traceability.

A comprehensive soldering profile has to be created for each new product before the actual soldering process, in which all process-relevant parameters such as temperature, Galden® quantity, time and pressure have to be specified. With the WPS 2.4, the temperature curve created by means of profiling

View into the hermetically sealed process chamber: Innovative through patented injection principle

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can be continuously and accurately monitored and docu-mented during production. The tool accompanies the entire soldering process – from preheating and the peak zone, right on up to the end of the cool-down phase. The sensor of the WPS 2.4 is mounted directly to the workpiece carrier at the same height as the PCB to be soldered. One of the antennas of the WPS 2.4 is located inside the process chamber of the CondensoX system, and there’s another outside in the cool-ing zone. During soldering, the sensor measures temperature continuously and, as an innovative tool, generates traceable data. One of the advantages of this system is the fact that the measuring sensors are not attached at fixed locations within the system, but rather travel with the PCBs through the entire process and transmit data to the control software in real-time.

Integrated process recorderFrom a process engineering standpoint, CondensoX systems are rounded out by the integrated process recorder which replaces external temperature recorders and detects pres-sure, as well as temperature. Because one thing’s for sure: if vacuum is used in the process either before, during or after the soldering process in order to reduce voids, pressure is also a process parameter which must be documented.Data logging and traceability reach previously unattained levels– without having to interrupt production. Soldering profiles (temperature and pressure) are thus accurately ac-quired and can be retrieved and precisely reproduced at any time for series production.

The product portfolioThe CondensoX-Series has successfully established within the market since 2006 – naturally with integrated vacuum technology. Configuration of the individual models of the CondensoX-Series varies above all with regard to imple-mentable cycle times, but from a process engineering stand-point they’re all on the same level – from the small system with manual loading right on up to the large, inline system with fully automated control for mass production.Introduction of the CondensoXC has now added a compact system to the portfolio with a footprint of just 2.3 square meters. This system has been designed especially for short production runs and is also extremely well suited for the production of prototypes.

The CondensoX-Line is the series’ largest model – a va-por phase soldering system in which components can be processed in a continuous inline sequence with automatic loading thanks to the 3-chamber process. The PCBs are rinsed with nitrogen in the first sealed chamber, after which they’re advanced into the actual process chamber. After-wards, the PCBs are transferred to the cooling chamber and cooled down gently in a controlled manner in an inert atmos-phere with less than 100 ppm residual oxygen. The entire processing sequence takes place in a hermetically sealed, low-oxygen environment. Oxidation of metallic materials is thus consistently avoided. This system is especially well suited for large volume production. During further develop-ment, the advantage of short cycle times which distinguishes convection soldering systems and the advantage of high quality results offered by convection soldering systems have been combined to the greatest possible extent. All in all, the process engineering concept of the CondensoX-Series, with its technical advantages and significant potential for cost savings, is not only convincing because the systems are con-siderably smaller and space-saving with just a single process chamber. More than 50% less Galden® (!) is required as well thanks to the closed circuit used for the medium. With prices beginning at €450 for a 5 kg container, this quickly adds up to a considerable sum.

The R&D department at Rehm Thermal Systems is driven by practical innovation and sustainability, as well as continuous further development of the product portfolio. The industry’s requirements are becoming more and more demanding all the time, and a reciprocal process will remain in the future by means of which all involved parties will motivate and inspire each other mutually in the name of progress.

Rehm Thermal Systems and Apros ConsultingThe temperature sensor of WPS 2.4: Parameter monitoring on highest level

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Application options with ProtectoXP

MORE THAN “JUST” COATING NEW APPLICATION POSSIBILITIES

With the ProtectoXP, completely new application fields are emerging – even outside of the conformal coating sector. Thanks to the highly flexible system construction, you can use ProtectoXP to combine several processes within one machine. In addition to sealing the entire circuit board, par-tial areas or individual components can also be coated on the support. From the “Globe Top” to “Dam & Fill” to the

“Flip Chip Underfill”; different procedures have been devel-oped here. With the ProtectoXP, a large number of applica-tions – all in one system – can be realized. With innovative nozzle technology, the user can apply a wide variety of materials to the module – so each product will be optimally protected later according to the requirements.

1.

3. 5.

7.

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1. Dam & FillDam & Fill allows individual areas to be selectively coated on the circuit board, thereby efficiently protecting them. Two materials with different viscosities are used for this purpose. First, a dam is placed around the component to be protect-ed with a highly viscous material. Subsequently, the region within the dam is filled with a low-viscosity material.

2. SealingIn this process, a 1K or 2K material is applied to a compo-nent such that a continuous and uniform sealing loop is produced. Volumetric applicators are particularly suitable for this purpose.

3. Globe TopA Globe Top is used to protect a selective area on the circuit board. For this purpose, a material is used which, on the one hand, is fluid enough to securely encapsulate all the components involved, but on the other hand, is not so low in viscosity that it flows onto adjacent components.

4. Flip Chip UnderfillUnderfills increase the mechanical stability between the chip and the circuit board and distribute locally occurring voltages over a larger area, which significantly increases the service life. For this purpose, a low-viscosity material is applied along the edge region of the chip, which then independently fills the gap between the chip and the circuit board using the capillary effect.

5. 1K and 2K encapsulationEncapsulation is always used when a particularly high level of protection is needed. Thanks to the volumetric applica-tors, it is ensured that exactly the same amount of material is always supplied in the correct mixing ratio, independent of temperature and pressure fluctuations.

6. Heat dissipationDue to the constant miniaturisation in electronics, less and less surface is available for heat dissipation. This makes it all the more important to have an optimal passage between the heat sink and the component. Liquid heat-transfer media can be adapted to the individual contours better than fixed pads or foils and ensure a safe heat dissipation, which significantly increases the service life of the components.

7. Individual requirementsAre you looking for a partner who can offer you a complete solution for your coating and dispensing process? Then you‘ve come to the right place! Thanks to versatile appli-cators and conveyor units, we are standing ready to meet many requirements with our standard applications. We are also prepared to tackle new challenges and to implement them for you in a series-production process.

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Award-winning Reel-to-Reel system with moving process chamber

FROM THE ROLE RELIABLE DRYING Dryer

Part 3

Horizontal dryers, vertical dryers, infrared dryers, ultraviolet dryers, nitrogen dryers, reel-to-reel dryers – these are just a few of the designations which describe the great variety of thermal systems used in the electronics industry. And this diversity makes it difficult to set up a clear-cut system which is capable of classifying all of the variants. However, all variants have their own existence, since it is ultimately a reliable functioning electronic assembly.

Reel-to-Reel DryerReel-to-reel (R2R) manufacturing is a continuous process by means of which production steps (e.g. coating, printing, insertion) are carried out on a continuous carrier tape or a flexible substrate (e.g. polyimide foil). The continuous tape is frequently coiled up onto a reel which, after it has been emptied, is either replaced with a full reel or a new tape is spliced onto the end of the old one – similar to placement systems.

Figure 2: Battery Dryer


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Systems for R2R manufacturing are seldom used for surface mount technology. The problem lies in linking the drying process to other upstream production steps, for example paste printing. The fact that these processes are run sequen-tially (discontinuously), i.e. the tape is at a standstill during the paste printing process, causes problems for the reflow process which requires continuous thermal conditions. But technical solutions are available for this problem.

Continuous drying tasks are used where active materials are coated onto carrier foils. The production of cathode and an-ode materials for lithium battery manufacturing is mentioned here as an example. Rehm developed the TID 2400 R2R foil dryer for applications of this sort (see figure 2).

Assuring an absolutely dry process atmosphere was a spe-cial challenge for the development of this system. This was accomplished through the use of a nitrogen atmosphere with a residual oxygen value of less than 100 ppm. The system is laid out for tape throughput speeds of up to 4 meters per minute and carrier tape widths of 100 to 250 mm. Four heat zones, which transfer heat by means of convection and infra-red radiation (IR), reach a maximum tape temperature of 150 °C (see figure 1).

Figure 3 shows a drying profile for a tape temperature of 130 °C, by means of which very good drying results were ob-tained with residual water content of less than 200 ppm. So-called glove boxes are flange mounted to the thermal system, thus making it possible to change over the foil reels within a dry atmosphere without touching them with the hands. A sensor roller and web edge control assure that the foil always runs through the process chamber with the same amount of tensioning along precisely the same path. Quartz glass guides prevent the foil from sagging in the process chamber. The coiling and uncoiling units are laid out for a reel diameter of 750 mm and a maximum coil weight of 25 kg.

Figure 1: View into the open Foil Dryer

Foil dimensions: 100 to 250 mm

Maximum temperature: 300 °C

Inert process atmosphere with less than 100 ppm O2

Maximum throughput speed: 4 meters per minute

Figure 3: Temperature-time profile for Foil Drying

low maintenance expenses

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(°C)

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Reel-to-Reel Dryer with moveable process chamber

In the future, R2R dryers will also conquer the continuously growing market for printed electronics. In his presentation entitled “We Link Electrical Engineering to Print Technologies” (Werner Fink, ELMERIC, We Link Electrical Engineering to Print Technologies, EE-Kolleg Sant Jordi, March 2016), W. Fink introduced numerous examples of printed electronics on flexible polymer substrate materials (e.g. PET foil as a flexible PCB) (see figure 4).

As already mentioned above, printing is usually sequential (discontinuous), whereas the drying process has to be con-tinuous, e.g. for drying printed silver conductors. Continuous substrates with printed electronics are usually subdivided into images, i.e. uniform sections arranged in series (similar to PCB panels). There’s only a few millimeters of blank space between the individual images. This makes it more difficult to obtain reproducible reflow soldering profiles for each image. If the tape comes to a standstill during the drying process, this may be problematic for temperature increases and cool-ing. Unfortunately this is not restricted locally to the image to be processed, but rather usually has an undesired influence on neighboring images as well. In order to solve this problem, Rehm has developed a dryer with a mobile process chamber (see figure 6).

Temperature profiles are generated for each image by mov-ing the heat source in the direction opposite the direction in which the tape is advancing. A continuous flow concept can be simulated in this way which permits synchronized drying as well. The temperature profile can then be implemented during the transport cycle. This also permits defined profiles for non-adapted cycles resulting from upstream and down-stream processes. Figure 5 is a schematic diagram which shows how the position of the process chamber is matched to the cycle.

Dr. Hans Bell, Paul Wild

R2R Dryer with moveable process chamber

Contact heat in the preheating zone at the bottom

Four IR processing zones at top/bottom

Maximum tape width: 300 mm

Figure 5: Schematic diagram of the moveable process chamber

Figure 4: Printed PET foil as flexible PCB

Figure 6: R2R Dryer with mobile process chamber


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Young emerging talent

Silas Ristl gets off to a flying start as a shot putter and qualifies for the European Championships

Rehm Thermal Systems is involved in various social projects to get children and young people more enthusiastic about sports and exercise. Promoting young talent is part of the company's philosophy.

Sit back and relax? Not with Silas Ristl! The 22-year-old shot putter from Langenau is currently hitting the ground running in sport – thanks to Rehm's sponsorship among other things. He is in 4th place on the German U23's leader board and 9th place in the overall ranking. The trained orthopaedic techni-cian began his sporting career at the age of six in track and field. At the age of twelve, Silas Ristl threw the 3 kg ball for the first time at the triathlon and pentathlon. Even then he was fascinated by this Olympic sport. At the age of 13, he made it into the Württemberg throwing squad. He is currently active at the SSV Ulm. This year, Silas Ristl has already qualified for the European U23 shot put championships. Rehm wishes him good luck for the coming season!

Train like professionals

Rehm supported the Children’s Football Day at the Blautopf School in Blaubeuren

The 5th Children's Football Day at the Blautopf School in Blaubeuren, a cooperation project with Rehm, the Stuttgart football school “GOAL” and FutureSport, was a complete success! “The advancement of young people is a matter close to our hearts. We have been supporting FutureSport's projects for several years with financial and non-monetary donations. In this way, we can actively make a difference,” says CEO Johannes Rehm.

The 47 children from year three had the opportunity to spend a whole day with professional coaches to improve their football skills and strengthen their team spirit. The timeta-ble consisted of warm-up games, coordination and football technique training, instead of mathematics and German. A further highlight this year was celebrity support. “Thanks to the great help of our sponsors, it was possible to invite former professional footballer and coach André Trulsen, who was already under contract with VFB Stuttgart, FC St. Pauli or the FC Cologne, to participate in the Children's Football Day. This day was a great experience for our pupils,” sums up Thomas Hilsenbeck, Headmaster of the Blautopf School.

Rehm Thermal Systems supports school and sports projects in and around Ulm

PERFECT ALL ROUND SOCIAL ENGAGEMENT


Anyone who assumes that CT X-ray examinations are only used in the medical field is mistaken. These X-ray inspection systems have long since found their way into the electronics and semiconductor industry to analyse the quality of soldering with regard to pores and voids. In the Rehm Technology Center, customers can now take a close look at their boards with the new Y. Cheetah µHD CT X-ray inspection system from YXLON. And as if that were not enough: In order to be able to check the quality of the printing or coating process even better, two new additional inspection systems from Pemtron's TROI series are also used. The systems of the Korean manufacturer are sold by ANS answer elektronik.

Rehm focuses on innovative test equipment for component analysis at the Technology Center

PUTTING THE ELECTRONIC ASSEMBLIES THROUGH THEIR PACES

(from left) Sebastian Glitsch (ANS answer elektronik) and Helmut Öttl (Rehm) during solder paste inspecti-on with the TROI-7700H


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CT X-ray examination with Y. Cheetah µHD by YXLON

Voids have a great influence on the quality of the solder joint, and so automotive manufacturers are increasingly setting acceptance limits for the assemblies. Not everyone has the necessary technical equipment for extensive tests. With the new X-ray inspection system YXLON Cheetah µHD, solder joints in the Rehm Technology Center can be examined in detail and professionally. The system enables the high-reso-lution, non-destructive real-time microfocus X-ray inspection of components and assemblies, printed circuit boards, elec-tronic and mechanical modules, sensors, MEMS and MOEMS as well as electromechanical components and connectors. It combines innovative developments such as fine-focus tube technology, the high-power-target, a finely calibrated flat panel detector of the latest generation with a long service life and a manipulator with vibration damping, eHDR inspection, micro-CT and microlaminography. By using laminography, it is possible to generate precise layer images of larger or double-sided printed circuit boards as well as multilayer sem-iconductor components. But above all, industrial computed tomography offers three-dimensional insights into test parts and thus facilitates the analysis of internal structures, dimen-sional measurements or target/actual comparisons to CAD data. As well as this, computer tomography also provides valuable information for the production process and allows detailed insights into the finest structures and smallest components.

Solder paste and coating inspection with TROI from Pemtron

Flawless paste printing during soldering and precise appli-cation of lacquer in conformal coating are the basis for all further process steps, especially with regard to the increasing miniaturisation of components. The new paste and coating inspection systems of the TROI series optimally complement the Rehm machinery and ensure the best analysis results. The 3D-SPI system for solder paste inspection has a patent for the joint and/or separate use of 2D and 3D images. The system works with high precision. An ordinary 3D solder paste inspec-tion system generates a wireframe model to represent the paste application. Pemtron, on the other hand, has developed a patented, enhanced “Colour Mapping Algorithm”, which gen-erates a graphical “live colour image” of the paste application. The 3D projection, based on Moiré technology, takes place from two sides and determines the entire height of the paste without shadowing.

The conformal coating inspection system is equipped with both RGB and UV illumination. The coating is assessed by means of a good/bad comparison. Areas that are not to be in-spected can easily be excluded. The automatic coating thick-ness measurement is unique. The paint application is checked at different positions on the printed circuit board by means of a height sensor. The user can simultaneously use the system as a “microscope” and recognise whether too much, too little or no material has been applied and whether there are bridges, a distorted application or a material misplacement. Pseudo errors are reduced to an absolute minimum, and only faultless assemblies are further processed.

Helmut Öttl, Head of Process Development/Application (Rehm) and Thorsten Rother, Market Manager (YXLON) in front of the X-ray inspection system

The TROI-8800CIL conformal coating inspection system


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ЗдравствуйтеHello

New equipment for Russian customers

From 25 to 27 April, customers had the opportunity to visit Rehm at the ElectrontechEXPO in Moscow to find out about the latest developments in the field of thermal system solu-tions. The machine manufacturing company thus tied up the success of the past year. The Rehm team of the branch founded in 2015 was on site and was able to advise the visitors extensively on the innovations. There was particular interest in the subject of protective coatings for sensitive electronic components. Correspondingly, Rehm presented the Protecto coating unit at its stand, with which highly se-lective conformal coating processes can be accomplished. Customers were able to see the versatility and flexibility of the system for themselves in a live demonstration at the booth. Another highlight was the new application possibili-ties with Protecto, which go beyond painting – such as the application of two-component materials, densities, encap-sulation or heat dissipation. In addition, the new CondensoXC was exhibited at the stand of Rehm distributor Global Engineering. The Rehm team also succeeded in attracting new prospective customers and partners on site as well as in maintaining existing customer contacts.

Present on site – Rehm at the AMPER 2017

AMPER is one of the largest trade events for the electronics industry in Europe. Rehm was also present in Brno, Czech Republic, this year with its own booth. The VisionXC reflow convection soldering system was presented with a new ViCON user interface – a system specially designed for electronics manufacturers who process small and medium batches. “We now have a large forum in Eastern Europe. It is therefore important for us to be present on site for our customers and not only through a distributor. Renowned trade fairs such as AMPER offer a great platform for cultivating customer contacts and spotting new trends,” summarises Karl Spitzer, Head of Sales CEE. During the talks, it became clear that the visitors were particularly interested in vacuum technologies for void-free reflow soldering and reliable coating processes for optimum protection of sensitive electronics. Software is just as central a topic. “Today, Rehm already offers innova-tive solutions in system technology and software operation to meet the challenges of industry 4.0 and modern produc-tion of the future,” adds Milan Hurban, Managing Director of Rehm Czech Republic.

Rehm Thermal Systems presented innovations and new equipment during numerous trade fairs and events both domestically and internationally

The Rehm team on site in Moscow Milan Hurban explains the new ViCON user interface for the VisionX-Series

Ahoj

SUCCESSFUL WORLDWIDE2017 TRADE FAIR REVIEW

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Outstanding trade fairs in Shanghai

In April 2017, Rehm was represented at two renowned trade fairs in Shanghai and showcased the latest system tech-nology for modern and efficient electronics production. At NEPCON China, the machine manufacturer presented the tried and tested VisionXP+ Vac for reliable reflow convection soldering and the CondensoXC, a new, compact system for optimal condensation soldering. Outstanding quality “made in Germany” scored points among the trade visitors – in two respects! At this year's “EM ASIA Innovation Award”, Rehm took away "Best Supplier of the Year". The award, which has been presented at NEPCON China since 2006, recognises

new products, software, services and equipment that have recently been released, and supports the development and launch of innovations in Asian electronics manufacturing.

Rehm was also presented in the solar sector! At the SNEC, Rehm exhibited the VOC Thermal Oxidizer for clean and sustainable solar cell production, which was met with great interest among the visitors. With more than 1500 exhibiting companies from 90 countries, the trade fair is one of the largest international trade events for the solar industry.

“Turn Vision into Reality”

Fit for the production of the future – Rehm Thermal Systems presented itself at the SMT in Nuremberg on more than 280 m2 at a newly developed and redesigned exhibition booth. The fresh colours, the clearly structured design and play with contrasts mainly intrigued the visitors. Modern ele-ments with a wooden and concrete look symbolised Rehm's awareness of tradition as well as the innovative mission statement of the company and its technological leadership. But the new stand was not the only highlight. Of course, the focus this year was once again on thermal systems – Rehm presented a number of innovations, including a new series. Visitors were able to find out about the further developments of the VisionXP+ Vac, VisionXC, CondensoXC, Nexus, Securo, ProtectoXC and ProtectoXP Longboard. Another interesting aspect was the ViCON software with new features that make routine production easier and more efficient, such as ViCON Connect and the VICON App.

NEPCON China 2017 Rehm was awarded the “EM ASIA Innovation Award”

Missed it? Then take a look at all the highlights in our trade fair video!

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How did you come up with the idea of building nativity scenes?

Günter Dieckmann: The idea was born over drinks! At the time, I wanted to meet up with friends in the evenings during the cold season to have a nice beer and chat. Our wives, how-ever, were less enthusiastic about it, so an excuse had to be made. We told them we were building a nativity scene. And it worked! However, we were caught in a fix when one day the ladies asked whether the nativity scene would be ready in time for Christmas Eve. We really didn't want to stand there as frauds, so we really did get to work. In their own hobby cel-lar, we sawed, glued, plastered and painted. In the end, it was really fun, and the nativity scene was there for Christmas.

Out of necessity came virtue!

G.D.: Actually, we thought it was just a one-time thing. But then we heard more and more often from acquaintances how beautiful our “prototype” was and that we had talent. Even-tually, it became a real hobby. Hermann Wöhrle exhibited our first nativity scenes in his bank branch as a festive Christmas decoration. When it quickly attracted interested buyers, I thought for the first time about building more nativity scenes and going deeper into the topic. I would never have expected this success. Now the nativity season begins for us every year in mid-August. We forget the beer more and more often (laughs).

INTERVIEW

Bethlehem in miniature Günter Dieckmann painstakingly builds

hand-crafted nativity scenes

In discussion with Günter Dieckmann

A fountain made of pebbles with a pulley made of rope and wire, a fence made of bark and moss,

small pieces of woodpile up in front of a little window, from which warm light shines outwards;

in the middle of it the Child Jesus, Mary, Joseph, ox, donkey and sheep. If you take a closer look at Günter

Dieckmann's works of art, you feel like in a world of your own and know: it's Christmas! For 11 years,

the Quality Manager of Rehm and his friend Hermann Wöhrle have been building nativity scenes and selling

them at Advent markets in the region.

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How long does it take from the first draft to the finished nativity scene? Where do you get your inspiration from?

G.D.: It all depends on the size of the nativity scene. For the smaller ones, we need about 25 work hours. For the larger ones, it can already go from 50 to 60. In the beginning, we used everything we could find in the forest, like roots, stones, tree bark and moss. Today we get our building material from friends and acquaintances, joineries or we find it our-selves at the recycling yard. First, we build a foundation of wooden beams. These are precisely sawn with laborious manual work, sanded and stained in such a way so that the nativity scene looks more rustic later on. The roof truss is then placed on top of this basic framework, and everything is plastered and painted. I mainly build nativity scenes in alpine-region style. I don't get ideas from books. I prefer to go out with my camera and take pictures of houses or farms in Allgäu that I like. I then reproduce them and piece them to-gether in our own little world. For me, this is a great balance to everyday life.

Where are the nativity scenes sold?

G.D.: In the past, we went to Advent markets in Bad Hindelang, Zainingen and Langenau. It was especially nice to see that we were really successful with our nativity scene sales in a “nativity scene stronghold” like Bad Hindelang. This year, you will find our stand in Langenau-Albeck at the Advent Exhibition

of the Scheerer arboretum (Baumschule Scheerer) on 18th and 19th November as well as the Christmas Market in Langenau. Visitors can of course also indulge themselves in our “second mainstay”, the mulled wine sale. We offer very special creations like “Löffelbrunnenwasser”, a white, orange mulled wine or our legendary “Hot Hessen”, an apple wine with a dash of Calvados, spiced with cinnamon and cloves. The recipe – as expected – is from a friend from Frankfurt am Main, who supports us every year in selling it.

What was your most memorable experience?

G.D.: At the Christmas markets, we experience funny things time and again. A few years ago I met an elderly lady at an Advent exhibition and wanted to chat with her about our na-tivity scenes – sociable as I am. She ignored me completely, but took a close look at our constructions and then remarked briefly and bluntly with a strong Swabian dialect that her husband can also build nativity scenes. I put up with it. A few weeks later I met her again, together with her granddaugh-ter. She came back to our stand and considered the nativity scenes. Suddenly she said unexpectedly: if the granddaugh-ter wants a nativity scene, then she can ONLY get one from us! I was totally perplexed, and I was very happy when she actually took one. Another highlight was making an entire nativity village. A major project that I was able to complete some time ago. I have not only built a nativity scene but also integrated it into a complete themed landscape with much attention to detail. There were small houses and farms with stables and animals, a village square and even a church.

Which project would you still like to make happen?

G.D.: Everyone knows the Christmas carol “Silent Night”, but only few know the story of its origins. It was first performed by organist Franz Xaver Gruber and pastor Joseph Mohr at the Schifferkirche St. Nikola in Oberndorf near Salzburg. The fact that this song later became so famous is attributed to the Strasser siblings among others, a group of singers from the Tyrolean Zillertal. They included it in their repertoire and spread it beyond their own national borders. In the Austrian Laimach, today a district of the municipality of Hippach in Tyrol, stands the former residence of the Strasser family. I would like to reproduce this beautiful cottage. And the repro-duction of the nativity scene of the Ulm Christmas market is also still on my “to do” list. Now, however, the focus is on preparations for the Christmas market in Langenau on 2 December. We are looking forward to many visitors!

Anna-Katharina Peuker conducted the interview

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It's all happening at Rehm – even aside from Vision, Protecto & Co! At the end of June, the team took part in the 3rd DEE-AOK company run for the first time! The 7 km long route led cross Neu-Ulm. The start and finish line were in the ratio-pharm arena. At just under 30 °C, the weather was almost too good, and the run was strenuous. Top performance and great praise to the 19 participants of Rehm! The team held out very well and could use the company run to prepare for the next highlight.

The Einstein Marathon is THE running event in Ulm and Neu-Ulm. On 17 September 2017, more than 10,600 runners were on their feet again. The 15-man (and woman) strong Rehm team competed this year in the Beurer Half Marathon (21 km), Liqui Moly City Run (10 km), WMF BKK Health Run (5 km) and the Daimler TSS Inline Half Marathon (21 km). The routes led to the Ulm surroundings, but also crossed the

alleys and shopping streets of the cathedral city. But there was no time for sightseeing. It was a matter of perseverance and happiness when you reach the finish line together with your colleagues. The Rehm team made it and shone at the end with a top result! It wasn’t just the performance, but the atmosphere along the track was superb, too. The runners were accompanied by around 1200 volunteers, around 20,000 spectators and 24 bands who added an extra dose of motivation. After the successful runs, the Rehm team met at the Barfüßer Brauhaus Neu-Ulm and ended the evening pleasantly with a cool drink and Swabian delicacies.

“Regional running events like these naturally offer a great framework for company sports and health promotion. We are looking forward to seeing many Rehm employees take part for Rehm at the starting line of next year's event,” says Tanja Staudte, organiser and Rehm HR Manager.

After the successful debut at the Einstein Marathon 2016, some motivated employees of the Rehm Group took part in the running events in the region this year again.

AT THE STARTING LINE “NEVER STOP A RUNNING SYSTEM”

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Whether at a trade fair, technology event, seminar, training event or workshop, take the opportunity tolearn about our systems engineering and receive advice from Rehm experts. Further information onevents can be found at www.rehm-group.com.

Rehm will be present at the most important electronics industry events

SAVE THE DATE SHOWS & EVENTS 2017/2018

DATE EVENT

Nov. 14 – 17, 2017 productronica, Munich, Germany

Nov. 17, 2017 SinoJobs Career Days, Munich, Germany

Dec. 6, 2017 Seminar Temperature profiling*, Blaubeuren, Germany

Feb. 20 – 22, 2018 Automation Electronics, Minsk, Russia

Feb. 22 – 24, 2018 9. Ulmer Bildungsmesse, Ulm, Germany

Feb. 27 – March 1, 2018 APEX, San Diego, USA

March 7, 2018 EPP-Innovationsforum, Böblingen, Germany

March 14 – 16, 2018 productronica, Shanghai, China

March 20 – 23, 2018 AMPER, Brno, Czech Republic

March 21 – 25, 2018 21. EE-Kolleg, Colonia de Sant Jordi, Mallorca/Spain

Apr. 17 – 19, 2018 ExpoElectronica, Moscow, Russia

Apr. 24 – 26, 2018 NEPCON, Shanghai, China

June 5 – 7, 2018 SMT, Nuremberg, Germany

June 20 – 23, 2018 NEPCON Thailand, Bangkok, Thailand

Aug. 28 – 30, 2018 NEPCON South China, Shenzhen, China

Oct. 10 – 11, 2018 Rehm Technology Days, Blaubeuren, Germany

* Presentation in German language

We look forward to welcoming you at one of our upcoming events!


www.rehm-group.com

Rehm Thermal Systems GmbH Leinenstrasse 7 89143 Blaubeuren, Germany

T +49 73 44 - 96 06 0 | F +49 73 44 - 96 06 525 [email protected] | www.rehm-group.com

Rehm WorldwideAs a leading manufacturer of innovative thermal system solutions we have customers on every continent. With our own locations in Europe, America and Asia as well as 27 agencies in 24 countries we are able to serve the international markets quickly and to offer outstanding on-site service – worldwide and round the clock!

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