REVERSE COSTING ® – STRUCTURAL, PROCESS & COST …

©2021 by System Plus Consulting | SPR21576 - STMicroelectronics Proximity Sensor and Flood Illuminator | Sample 1+33 2 40 18 09 16 [email protected] www.systemplus.fr

STMicroelectronics Proximity Sensor and Flood Illuminator

New time-of-flight and illumination device from the Apple iPhone 12SPR21576 - Imaging report by Sylvain HallereauLaboratory analysis by Leo VatantJune 2021 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

22 bd Benoni Goullin44200 NANTES - FRANCE

©2021 by System Plus Consulting | SPR21576 - STMicroelectronics Proximity Sensor and Flood Illuminator | Sample 2

Versions of the Report

Version Date Updates

V1 29/05/2021 o Initial release


Table of Contents

Overview / Introduction 4o Executive Summaryo Reverse Costing Methodology

Company Profile 8o STMicroelectronicso STMicroelectronics Portfolioo FligthSense Technologyo Supply Chaino Apple iPhone 12 Teardown

Physical Analysis 23

o Summary of the Physical Analysis 24

o Package 26 Package View & Dimensions Package Opening:

Overview, Wire Bonding, Flood Illuminator

Package Cross-Section:Adhesives, Ceramic Substrate, PCB Substrate, Diffuser, Filters, FOV, Heat Sink

o VCSEL #1 & #2 Die 59 Die View & Dimensions Die Overview & Cavity Die Cross-Section Die Process Characteristic

o VCSEL Driver Die 88 Die View & Dimensions Die Overview & Marking Die Delayering & main ID Block Die Cross-Section Die Process Characteristic

o SPAD Detector Die 100 Die View & Dimensions

Die Overview & Marking: Active Area, SPADs Die Delayering & main ID Block Die Cross-Section Die Process Characteristic

Comparison iPhone X and iPhone 12 Proximity Sensor 125o Package, Function, FOV, Optical Blocking Package, SPAD Detector &

VCSELs, SPADs

Manufacturing Process 132o SPAD Detector Die Front-End Process & Fabrication Unit.o VCSEL Drive Die Front-End Process & Fabrication Unito VCSELs Die Front-End Process & Fabrication Unito OLGA Packaging Process & Fabrication unit

Cost Analysis 147o Summary of the cost analysis 148o Yields Explanation & Hypotheses 149

o SPADs Detector & VCSEL Driver die 152 Die Front-End Cost Die Wafer & Die Cost

o VCSEL Dies 156 Die Front-End Cost Die Front-End Cost per process steps Die Wafer & Die Cost

o Component 162 Packaging Cost Component Cost

Estimated Selling Price 166

Feedbacks 170

Related Analysis 172

Company services 174


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

Related Analyses

About System Plus Consulting

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theSTMicroelectronics Proximity Sensor & Flood Illuminator in Apple iPhone 12.

• Located in the front above the main speaker, the proximity sensor & flood illuminator is packaged using optical LGA. The device is a custom version for Apple. In the past, STMicroelectronics has already released a custom proximity sensor for the iPhone X, 15% smaller than the previous version, the new version came along with a flood illuminator two time larger. The sensor is still based on FlighSenseTM technology.

• The larger VCSEL die and VCSEL driver die are not the only differences for the flood illuminator. The diffuser is more sophisticate with a complexity close to a diffractive optical element.

• To reduce the package size with larger components, STMicroelectronics has developed a 3D package with two PCBs stacked. The 3D package manages the heat dissipation of the flood VCSEL thank ceramic substrate, solder balls and PCB design.

• In this report, the complete microsystem is analyzed from the Vertical-Cavity Surface-Emitting Laser (VCSEL) illuminator of the proximity sensor manufactured by Trumpf, the VCSEL of the flood illuminator manufactured by Lumentum. Also the 2 integrated circuit with a VCSEL driver from Texas Instruments and the Single Photon Avalanche Diode (SPAD) developed by STMicroelectronics. The package, the diffuser and the filters are also analyzed with optical pictures, SEM pictures and EDX analysis like the main semiconductor components. The report includes a complete cost analysis and price estimation of the device based on a detaileddescription of the package, the ToF detector, the VCSEL and the second VCSEL for the flood illumination.

• It also features a complete technology comparison with the proximity sensor from the Apple iPhone X.

Executive Summary


Overview / Introduction


Physical Analysis o Summaryo Packageo VCSEL #1o VCSEL #2o VCSEL Drivero SPAD Detector

Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Package Views & Dimensions

4.34 mm

2.8m

m1.

65 m

m

• Package:OLGA 19-pin

• Dimensions: 4.35 x 2.8 x 1.65 mm

• Pin Pitch: 0.65 mm

Package Top View – Optical View©2021 by System Plus Consulting

Package Bottom View – Optical View©2021 by System Plus Consulting

Package Side View – Optical View©2021 by System Plus Consulting Package Side View – Schematics

STMicroelectronics





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Package Opening





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Package Lateral View





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Package Opening – Diffuser

Package opening – Optical View©2021 by System Plus Consulting

Diffuser Top View – Optical View©2021 by System Plus Consulting

Diffuser Top View – Optical View©2021 by System Plus Consulting





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Package Cross-Section #2

Package Cross-Section Plan©2021 by System Plus Consulting

Package Cross-Section – Optical View©2021 by System Plus Consulting





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


VCSEL #1 Die View & Dimensions

VCSEL Die – Optical View©2021 by System Plus Consulting





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


VCSEL #2 Die View and Dimensions

VCSEL Die – Optical View© 2021 by System Plus Consulting





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


VCSEL Driver Die View & Dimensions

VCSEL Driver Die Overview – Optical View©2021 by System Plus Consulting





Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


SPAD Detector Die View & Dimensions

SPAD Detector Die Overview – Optical View©2021 by System Plus Consulting




Physical Analysis

Physical Comparison

Manufacturing Process Flowo SPAD Detector Processo SPAD Detector Fab Unito VCSEL Driver Processo VCSEL Driver Fab Unito VCSEL #1 Processo VCSEL #1 Fab Unito VCSEL #2 Process Flowo VCSEL #2 Fab Unito Assembly Unito Packaging Process Flow

Cost Analysis


Feedbacks

Related Analyses


VCSEL #2 Wafer Process Flow (2/3)

drawing not to scale




Physical Analysis

Physical Comparison


Cost Analysiso Summaryo Supply Chain o Yield Summaryo SPAD Detector FE Costo SPAD Detector Wafer & Die

Costo VCSEL Driver FE Costo VCSEL Driver Wafer & Die

Costo VCSEL #1 FE Costo VCSEL #1 Wafer & Die Costo VCSEL #2 FE Costo VCSEL #2 Wafer & Die Costo Packaging Costo Component Cost


Feedbacks

Related Analyses


SPAD Detector Front-End Cost




Physical Analysis

Physical Comparison


Cost Analysiso Summaryo Supply Chain o Yield Summaryo SPAD Detector FE Costo SPAD Detector Wafer & Die

Costo VCSEL Driver FE Costo VCSEL Driver Wafer & Die

Costo VCSEL #1 FE Costo VCSEL #1 Wafer & Die Costo VCSEL #2 FE Costo VCSEL #2 Wafer & Die Costo Packaging Costo Component Cost


Feedbacks

Related Analyses


Packaging Cost


R E L A T E DA N A L Y S E S




Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses


Related Analyses

RELATED MONITORS

RELATED TEARDOWN TRACKSRELATED REPORTS

By System Plus Consulting:• 3D Time of Flight module in Meizu

17 pro

• Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module

• iPad Pro Lidar Module

• STMicroelectronics Proximity & Flood Illuminator iPhone X

By Yole Développement:• 3D Imaging & Sensing 2020

• VCSELs – Market and Technology Trends 2020

• 6’’ and Below: Small-Dimension Wafer Market Trends 2020

• Glass Substrate for Semiconductor Applications 2020

By System Plus Consulting:• OPPO Reno3 5G 12GB RAM

• APPLE iPhone 12 5G US A2172 64GB 4GB RAM Dual SIM

• APPLE iPhone 12 Pro 5G US A2341 128GB 6GB RAM Dual SIM

• APPLE iPhone 12 mini US A2176 64GB 4GB RAM Dual SIM

• APPLE iPhone 12 Pro Max 5G US A2342 128GB 6GB RAM Dual SIM

By System Plus Consulting:• Smartphone Design Win

Quarterly Monitor

http://www.systemplus.fr/

https://www.systemplus.fr/reverse-costing-reports/3d-time-of-flight-module-in-meizu-17-pro/

https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-depth-sensing-camera-module/

https://www.systemplus.fr/reverse-costing-reports/apple-ipad-pro-11s-lidar-module/

https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-flood-illuminator-in-the-apple-iphone-x/

https://www.i-micronews.com/products/3d-imaging-sensing-2020/

https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2020/

https://www.i-micronews.com/products/6-and-below-small-dimension-wafer-market-trends-2020/

https://www.i-micronews.com/products/glass-substrate-for-semiconductor-applications-2020/

https://www.reverse-costing.com/teardowns/oppo_reno_3/#features

https://www.reverse-costing.com/teardowns/apple_iphone_12/

https://www.reverse-costing.com/teardowns/apple_iphone_12_pro/#features

https://www.reverse-costing.com/teardowns/apple_iphone_12_mini/#features

https://www.reverse-costing.com/teardowns/apple_iphone_12_pro_max_a2342_128gb/#features

https://www.systemplus.fr/monitors/smartphone-design-win-quaterly-monitor/


COMPANYSERVICES




Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Analyses

About System Plus Consultingo Company serviceso Contact

Our Core Activity : Reverse Costing®

A Structure, Process and Cost Analysis

Reverse Costing® consists of disassembling a device or a system in order to identify itstechnology and discern its manufacturing processes and then using in-house models andtools to determine its cost.




Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Fields Of Expertise




Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Business Model

Teardown Track

205+ teardowns per year

Monitor1 per year quarterly updated

Custom Analysis150 custom analyses per

year

Report60+ per year

Costing Tools

5 process-based and 3 parametric

costing tools

Cost MethodsTrainingOn demand




Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Worldwide Presence

100+ collaborators in 8 different countries

Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement

Boise

CorneliusRaleighPhoenix

Austin

Singapore

Hsinchu

TokyoShenzhen

Seoul

Frankfurt

Nantes

Lyon




Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Analyses


Contacts

HEADQUARTER & CUSTOM PROJECT SERVICES

22 Bd Benoni Goullin44200 Nantes, France

[email protected] - +33 2 40 18 09 16

REPORTS & MONITORS WEBSITEwww.systemplus.fr

TRACKS WEBSITEwww.reverse-costing.com

MARKETING, COMMUNICATION & PR

Jean-Christophe Eloy, Marketing & Communication

[email protected] - +33 686 68 19 31Sandrine Leroy, Public Relations

[email protected] - +33 4 72 83 01 89

Western US & Canada Steve Laferriere - [email protected]

+ 1 310 600 8267

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[email protected]+49 69 96 21 76 78

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+81 80 4371 4887

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REVERSE COSTING ® – STRUCTURAL, PROCESS & COST …

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