Ready For The Future 2015. 2 Streamline Circuit Corp’s Facility Manufacturing all levels of...

Ready For The Future

2015

2

Streamline Circuit Corp’s Facility

• Manufacturing all levels of technology– Time sensitive prototyping through production

• The facility was established in 1982 – New management team installed September 2003

• 70,000 sq. ft. PCB manufacturing facility– Complete manufacturing process under one roof

• 1 mile from the San Jose Airport – Delivery convenience for out of state customers

• Located in Silicon Valley– Short car ride away for pick up & deliveries

• Financially secure in current market conditions– Low cost infrastructure

Located in Silicon Valley

3

The Team & Their Experience• Chuck Dimick- CEO | Founder

– Over 33 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991)

• Greg Halvorson- President | Founder– Over 31 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic

Circuits Inc.

• Tom Doslak-Vice President of Sales & Marketing | Founder– Over 23 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager

for Dynamic Details Inc.

• Ed Pitney- Operations Manager– Over with 32 years of PCB manufacturing experience. Ed spent his early career with NTI Inc. as a Director

of Manufacturing Operations later purchased by DDI Global Inc.

• Steve Morris – Director of Engineering – Over 27 years of PWB Design & Engineering experiencing. Former VP of Advanced Technology for Multek (a

division of Flextronics) and a key member of the HP PWB Corporate commodity team.

• JR Ramirez- Production Manager | Founder – Over 32 years of experience in the industry. Former Production Manager for both Dynamic Details Inc. and Dynamic

Circuits Inc.

• Lorraine Hook - Director of Quality – Over 43 years of industry experience. Former Director of Quality for many successful companies including DCI and

DDI. She has held dual positions as Corp. Quality Systems Manager.

4

Customer Service Support

• Customer Service (24 hours - 7 days a week)– Sales, Engineering, Manufacturing and Quality

• Dedicated customer service readily available-our support group’s located onsite in the facility

• Quick response to all requests such as: – Job status– Delivery pull-in– Quantity Increases– Engineering design modification Inside Sales Customer

Support

5

Proactive Engineering Services

• Manufacturing Capabilities– Prototype though volume– All time sensitive builds

• DFM (Design for Manufacturability)– DFM Software (reviews in 10 minutes)– Net list compare to customer data– Custom Verification programs– Looking for customer design error– In plan Smart data Collection System

• Controlled Impedance Verification– Stack up assistance– Copper distribution– Material verification

Cam Valor Stations

4 Laser Direct Imaging units

• DFM Scan & Report

• Stack up assistance

• Copper distribution

• Material verification

• Sub Panel /Array Support

Controlled Impedance VerificationControlled Impedance Verification

Go to slide 50

7

Quality Reassurance • Net list compare prior to MFG

– Matching Net list to Gerber data• Front End DRC (design rule check)

– Searching for customer design mistakes• AOI Automated Optical Inspection

– Verifying inner & outer layers• X-Ray Verification

– After Lam (Inspecta), After Drilling• Cross Section Verification

– Hole Integrity • Controlled Impedance Testing

– TDR test of panel coupons • 100% Net List Test On All Product

– Eliminator Tester & flying probe• Coordinate Measurement Machine

– First articles, 100% measurement verification

In house Mil & deliverable Lab

Automated Optical Inspection

8

On Time Delivery Reassurance

• 100% In-house manufacturing from start to finish

– Control delivery & customer flexibility– In-process quality verification system– No out sourcing delivery delays

• Employee Training program– Performance evaluation every 6 months

• In-house Chemical Laboratory– Cross Sections– Chemical analysis – Mil spec verification

Vacuum Lamination press

8 flying Probe Testers

9

Continuous Improvement Programs

• Working daily on: – Research and Development– Pre-Engineering Programs – Improvement Process Program– Department Performance Reviews– Preventative maintenance program– Employee Training Program– Planned Capital expense program

Management meetings

7 Laser drills

10

A Full PCB Solution• Multilayer Rigid / Rigid- Flex / Flex

• 1 to 70 Layers Plus

• 28:1 High Aspect Ratio

• 3.23 Mils Hole to Copper

• Buried / Blind Vias

• 9 Sequential Laminations

• 13+ Stacked Vias

• 1 Mil Trace & Space

• Cavity Constructions

• 6 oz. + Copper Thickness

• Copper Filled Micro Vias

• +/- 5% Controlled Impedance Tol.

• AS9100 Rev. C / ISO 9001

• Mil-Spec 55110 / ITAR

• RoHS & Halogen Free Materials

• IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency

• 3 Mil Mechanical Drills

• 24” x 30” Oversize Panel

• 2 Mil Laser Drill Vias

• Up to 345 Mils Board Thickness

• Via Under Pad (Conductive & Non-Conductive Filled)

• 45+ Materials (Hybrid Constructions)

ISO 9001:2000

Mil-Spec 31032 in process

ITAR

AS9100 Rev C

Mil-Spec 55110

IPC 6012,13,15,16,18 Class 3

Nadcap

12

Q-Pulse Total Quality Management

• Quality Assurance Systems • Q-Pulse Quality System

• NCMR’s and Corrective Actions• Audits• Training• Equipment Calibrations

BACK

13

• Use advanced equipment technologies to manufacture today's printed circuit board requirements

• The future in PCB manufacturing is about technology and automation

• Hire and Train equipment operators

• High percentage engineering personnel and staff

Streamline’s Capital Expenditures

Cuposit & Electroless Line

Laser Direct Imaging

DES Inner Layer Stripline

Design Strategies

Resin Fill off set Vias

Resin fill/stacked Vias

Epoxy fill with copper Vias

All Copper Fill process

15

A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create

MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing,

this MicroVia technology is a cost effective route for advanced technology.

V-Stacks: Patented MicroVia technology that will change everythingV-Stacks: Patented MicroVia technology that will change everything

RIGID-FLEX EXAMPLES6 Layer Rigid Flex

8 Layer Rigid Flex Micro via

6 Layer Rigid Flex with Cavity

10 Layer Micro via BGA

PCB Equipment Needed for the Future

Pre Production Engineering

LDI Image Processing

ElectrolessTechnology

TestProduct Integrity

QualityVerification

Develop Etch Strip

Laser DrillingRegistration

and Micro Via’s

Solder MaskSilkscreen

Test Cases Flex / Rigid-FlexOff-Shore Solution

Flex / Rigid-Flex

RIGID-FLEX EXAMPLES6 Layer Rigid Flex

8 Layer Rigid Flex Micro via

6 Layer Rigid Flex with Cavity

10 Layer Micro via BGA

Standard Advanced

Layer Count 1L to 6L 8L to 10L

Maximum Panel Size 10”x16” (250x406mm) 10”x35” (250x889mm)

Min. Line/Space (H & ⅓ oz) 0.004" (0.10mm) 0.003" (0.076mm)

Outline Tolerance +/-.004” (0.10mm) +/-.002” (0.05mm) by laser

Stiffener Types PI, FR4+PSA PI, FR4, Steel, Alum

Polyimide Thickness 0.5, 1 mil (12.5, 25um) 2, 3, 4 mils (50, 75, 100um)

Base Copper Thickness 0.5, 1 oz (17.5, 35um) ¼ to 2 oz (9 to 70um)

HDI Microvias Yes Yes

Adhesiveless Materials Yes Yes

Flexible Soldermask Yes Yes

White Coverlay Yes Yes

RA Copper Yes Yes

Flex Capabilities

20

Base Material Flex and Rigid Flex

•IPC- Manufacturer Material Name•4202/1 DuPont Pyralux FR•4203/1 DuPont Pyralux FR•4203/18 DuPont Pyralux FR, Pyralux •4204/1 DuPont Pyralux FR, Pyralux •4204/11 DuPont Pyralux AP•4101/21 Isola FR406, FR408, 370•4101/24 Isola FR406, FR408, 370• Arlon PrePreg 49N•4101B/124 Arlon PrePreg 51N•4101/26 Isola FR406, FR408, 370• Isola Prepreg FR406N• Grace GA-170LL•4101/41 Arlon 35N• Isola Prepreg P26•4101/42 Arlon PrePreg 38N•4101/99 Isola 370HR

• Other Material Flex and Flex-Rigid

• Name Manufacture Material Name• Conductive Silver Ink DuPont CB028• Flex LPI Solder Mask Taiyo PSR-9000FXT, PSR-900• Rogers RFLEX 8080 Liquid Coverlay• Kapton/Polyimide Stiffener DuPont Pyralux, FR, Pyralux • FR4 Stiffener Isola FR406, FR408, 370• Grace GA-170LL• Polyimide Stiffener Arlon 35N• Aluminum Stiffener• Pressure Sensitive Adhesive 3M 467MP, F9469PC, F9460PC• Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black

Note: Other materials javailable and have been manufactured, but non standard on per customer

request.

2015

Off-Shore Solution

One Stop PCB Solution

23

•3 million square feet manufacturing Space

•QTA 15-20 days ( based on technology)

•Local Team Support ( US and China)

•24 hours 7 days a week technical support

•Focused Facilities based on Technology & Quantities

24

Complete Tooling Package

“Build Exact”

25

Integration-Domestic/Offshore

“Build Exact”

Time To Market

“Build Exact”

Intellectual Property The implementation of strict protection for intellectual property of customers, other than the traditional encryption and decryption.

We provide rigorous authorization and detailed access logs to our employees, in order to control the exchange information.

Move Customers' Logo off and destroy the unusable boards completely.

……

N. AMERICA

S. AMERICA

ASIAEUROPE

AFRICA

OCEANIA

ShanghaiChongqing

Zhuhai

KaiserstraBe, Germany

Plants

Offices

Hangzhou

Headquarter

Page28

Beijing

Texas

California

Oregon Utah

Florida

Shenzhen, Guangdong

Go to Slide 1 BACK

Standard Advanced

Maximum Layer Count 36L 40L

Maximum Panel Size 21”x24” (533x610mm) 24”x42” (610x1067mm)

Maximum Finished Thickness 0.126" (3.2mm) 0.256" (6.5mm)

Minimum Finished Thickness 0.006" (0.15mm) 0.004" (0.10mm)

Minimum Core Thickness 0.002” (50um) .0015” (38um)

Trace/Space (H oz) 0.003” .0025”

Maximum Aspect Ratio 14:1 25:1

Minimum Mechanical Drill 0.008" (0.20mm) 0.006" (0.15mm)

Minimum Laser Drill 0.004" (0.10mm) 0.003" (0.076mm)

Min. Soldermask Dam 0.003" (76um) 0.0025" (64um)

Max. Base Copper Thickness 5 oz (75um) 6 oz (210um)

Impedance Control +/- 8% +/- 5%

PCB Capabilities

29

Continual development of new Technologies, Processes, and Materials

•Low Dk/Df, Low CTE, CAF resistant, and Halogen Free FR-4

•High Aspect Ratio Plating (25:1 and 30:1)

•Advanced plating and photo lithography processes

•Advanced tooling systems for registration

•High Technology Radio Frequency (RF) PCB’s

•Metal Backed and Thermal Management PCB’s

•Solid Copper Plating for Through Vias

•Deep Blind Vias and Deep Stacked Microvias

•Embedded Capacitance & Resistance (2015)

•Embedded Heater Circuits (2015)

30

Technology Development

Stacked Microvias

Filled Buried Vias

Manufacturing CapabilitiesSTANDARD ADVANCED

Single-Side Flexible Panel Size 12"x18" 18"x24"

20"x26" 24"x36"

Double-Side Flexible Panel Size 12"x18"

18"x24" and Up

Mulilayer Flexible Panel Size 12"x18"18"x24" and

UpLayer Count 3 to 12 13+

RIGID FLEX PANEL SIZE 12"x18" 18"x24" and

UpLayer Count 2 to 28 28+

Multiple Lamination Copper Foil Weights Internal/External 1/4 to 2 ounce Up to 3 ounce

Kapton Polyimide Stiffener .001" to .007" .008" and Up

FR4 Stiffener .003" to .062" .063" and Up

Polyimide Rigid Stiffener .003" to .062" .063" and Up

Lines, spaces & pad diameters Internal Line Width .0035" .001"Internal Spacing .0035" .001"

External Line Width .0035" .001"External Spacing .0035" .001"SMT Pitch .010" .010"

Controlled Impedance 10% 5%

Via hole Finish STANDARD ADVANCEDLaser Micro Vias .004" .002"Blind/buried Vias .004" .002"Laser Pads .004" .002"Minimum Drilled Hole Size .012" .0079"Drilled Hole to Copper .008" .007"Castellation Yes Yes Finish surface Tin Lead Plating Thickness .0003" to .0005" Less .0005"

Tin Nickel Plating Thickness150 Micro

Inches 250 Micro Inches

Low Stress Nickel100 Micro

Inches 250 Micro InchesGold Plating Thickness 30 Micro Inches As SpecifiedElectroless Nickel/Immersion Gold Yes YesImmersion Gold Yes YesImmersion Silver Yes YesEntek 106A HT Yes YesHASL Yes YesTOLERANCES Plated Hole Tolerances (+/-) .002" .001"Non-Plated Hole Tolerances (+/-) .001" .001"Fabrication Tolerance (+/-) .005" .003"Vision Rout (+/-) .003" .002"Laser Rout (+/-) .002" .001"

CommunicationInfrastructure

IT

CommunicationTerminal Industrial

Equipment

Other Products:Consumer/ Office Facilities/Military/Vehicle/Our products are used inOur products are used in

于

Automobile electronic

Complete PCB

Solutions

Product Mix

33

Plant ISO9001 TS16949 ISO14001 QC080000 OHSAS18001 GJB9001 TL9000 AS9100 ISO27001

F1 Certified Certified Certified Certified Certified Certified Certified Certified

F2 Certified Certified Certified Certified Certified

F3 Certified Certified Certified Certified Certified Certified

F4 Certified Certified Certified

F5 Certified Certified Certified Certified On-going Certified Certified Certified

F6 Certified Certified Certified Certified Certified Certified Certified

Certifications

Material Type Supplier Product Tg (°C)

High-Tg FR-4

ShengYi S1000-2 175

ITEQ IT180A 175

ISOLA 370HR 175

Mid-Tg FR-4 ShengYi S1000 150

Low-Tg FR-4

ShengYi S1141 140

ITEQ IT-140TC 140

NanYa NY1140 140

Halogen-Free FR-4ShengYi S1155 130

ShengYi S1165 170

High Speed Low Loss Materials

ISOLA FR408, FR408HR, IS420, IS620, GETEK

Nelco N4000-13, -13EP/SI, N4000-29

Panasonic Megtron4, Megtron6

Rogers RO3003, RO3006, RO3010, RO4003C, RO4350B

Arlon / Taconic PTFE (RF35, TLX, TLY)

Aluminum Yugu YGA Series

Flex Polyimide SY/Taiflex/Panasonic ½, 1 mil, 2 mil PI

Rigid Polyimide Ventec VT901 250

Additional Materials are available.

Materials

35

Revolutionary ZETA® Material•Sunshine is a ZETA® Certified Fabricator

•Glass-free Polyimide Film, 13/25 um [0.5/1 mil]

•Low Dk (3.0-3.4) and low Df (.005-.010)

•Ideal for HDI and High Speed Applications

•High peel strength after multiple lam cycles

•Lead-free compatible and Halogen free

•High dielectric strength

•Eliminates Pad Cratering

36

Copper

B-Stage Epoxy

C-Stage PolyimideCopper

C-Stage Polyimide B-Stage Epoxy

Zeta® Cap Zeta® Bond SE

Zeta® Lam

Graphics provided by Integral Technology

Zeta Certified

37

High Speed Board•10 Layer HDI

•N4000-13EP

•119x112mm [4.7”x4.4”]

•Thickness 1.6mm [.062”]

•Construction 1+8+1

•Aspect Ratio 10:1

•Via-in-Pad (VIPPO)

•Min L/S .10 mm [.004”]

•Drill/Pad .006”/.016”

•ENIG Finish

•Application: GPS Receiver, Satellite Positioning System

Product Showcase

38

Telecom Linecard•16 Layer HDI

•370HR

•376x272mm [14.8”x10.7”]

•Thickness 2.21mm [.087”]

•Construction 1+14+1

•Aspect Ratio 11:1

•Via-in-Pad (VIPPO)

•Min L/S .10mm [.004”]

•Drill/Pad .008”/.018”

•Controlled impedance

•ENIG Finish

•Application: Data Server, Communications

Product Showcase

High Layer Count Board•30 Layers•S1000-2 (Hi-Tg FR4)•7.0” x 7.0”•Thickness 3.81mm [.150”]•25:1 Aspect Ratio with 25 um [1.0 mils] plating required in vias•Smallest drill .006” on .012” pads•Via-in-Pad (VIPPO) with maximum dimple 12.5 um [0.5 mils] •Full body nickel/gold•Minimum line/space .10 mm [4 mils]•BGA mounting device positional accuracy requirement•Fabrication rout tolerance of +/- 0.20 mm [.008”]

39

Product Showcase

ATE Board•34 Layers•S1000-2 (Hi-Tg FR4)•368x368mm (14.5”x14.5”)•Thickness 4.6mm (.180”)•18:1 Aspect Ratio•Blind vias from L32-34•Via-in-Pad (VIPPO) •Internal Cu: 1 & 2 oz•Minimum L/S 4 mils•Drill/Pad .010”/.016” •Over 20 impedance controlled lines (SE/Diff)•Countersink holes•For semiconductor testing

40

Product Showcase

41

Product Showcase

Rigid-Flex

•14 Layer HDI Rigid-Flex•Construction: 14R – 2F – 14R•Min L/S:.10 mm [4 mils]•Thickness: 1.6 mm [.062”]•Application: Medical

•8 Layer Rigid-Flex•Construction: 3R – 2F – 3R•Min L/S:.13 mm [5 mils]•Thickness: 1.0 mm [.040”]•Application: Industrial

Rigid-Flex

•14 Layer HDI Rigid-Flex•Construction: 14R – 2F – 14R•Min L/S:.10 mm [4 mils]•Thickness: 1.6 mm [.062”]•Application: Medical

•8 Layer Rigid-Flex•Construction: 3R – 2F – 3R•Min L/S:.13 mm [5 mils]•Thickness: 1.0 mm [.040”]•Application: Industrial

42

Product Showcase•RF (Radio Frequency)

•Layer Count: 2L to 10L boards•Mat’l Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX,

TLY)•Hybrid Option: RO4350B + FR4•Finishes:ENIG, Thick Wire Bondable Gold, Flash Gold•Special Process: Selective plating and etching•Applications: Radio Trans-receivers, Antennas, Power Amplifiers

•RF (Radio Frequency)

•Layer Count: 2L to 10L boards•Mat’l Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX,

TLY)•Hybrid Option: RO4350B + FR4•Finishes:ENIG, Thick Wire Bondable Gold, Flash Gold•Special Process: Selective plating and etching•Applications: Radio Trans-receivers, Antennas, Power Amplifiers

Regular ReliabilityTest

In ProcessQuality Control

TQM Activities(Continuous Improvement)

OutgoingQuality Control

Incoming Quality Control

Panel Control (Traceability)

Quality Assurance

Comprehensive Quality System Structure

Implemented Routine Reliability Tests(1)

No Description Test Parameter Method Reference Frequency

1 Cross Section Microscope inspection IPC-TM-650 2.1.1 per Lot

2 Solderability Preconditioning with 2X IR Reflow; Solder Pot Temp.:232±6 oC, 2-3 sec (Solder Dip)

IPC-TM-650 2.4.12 per Lot

3 Thermal Stress, PTH Temp 288±5 oC, Cycle Time: 10+1/-0 sec, Solder Float X5 Cycles;


4 Peel Strength 1oz copper foil, 25mm sample width, vertical pulling @ 50 mm/min for min. 30 mm distance

IPC-TM-650 2.4.8.4 weekly

5Dielectric Withstanding Voltage

Finished PCB, 500 +15/-0V, 150V/s, for 30+3/-0 sec

IPC-TM-650 2.5.7 weekly

6Liquid to Liquid Thermal Cycling

-55 to 125oC, 15 min. dwell and ramp time, 200 cycles

IPC-TM-650 2.5.32 monthly

7Tensile Strength & Elongation

Plated thickness of 0.05 mm to 0.1 mm; gage length 50 mm; cross head speed 1.2 mm/min; chart speed 500 mm/min

IPC-TM-650 2.4.18.1

monthly

Implemented Routine Reliability Tests(2)No Description Test Parameter Method Reference Frequency

8 CAF Testing 65±2 , 87+3/-2 %RH, 100V bias, ℃500 hrs


9Surface Finish

Thickness Metal thickness on the pad at four corners and center of the board


10Solvent Extracted Contamination (SEC)

75% v/v 2-propanol/water; run time: 30 minutes

IPC-TM-650 2.3.25 per day

11 IR Reflow Simulation Lead: 230±5 @ 20-30 sec; ℃Lead free: 260±5 @ 20-30 sec℃

J-STD-020 per Lot

12 Soldermask Adhesion 3M Brand 600 ½” wide; min. 50 mm in length; perpendicular pulling

Per IPC-TM-650 2.4.1

per Lot

13Interconnect Stress Test (IST))

Ambient temperature to 150 oC, min. 300 cycles


14 Material Stability

Tg/∆Tg, CTE, T260. Sample is heated at a rate of 5oC/min until all desired transitions have been completed

IPC-TM-650 2.4.24 per day

State of the Art Facilities

Facilities Summary

48

•25 years of PCB fabrication experience in China

•Strong financial backing

•Market/Product focused factories

•State of the art equipment and processes

•QTA/NPI to volume production capabilities

•No constraints on expansion

•Dedicated research and development institute

•Commitment to be the technology leader

Technology Process

50

Pre-Production Engineering Services

• “In Plan” planning software• Customer Specific Rules Based Automation

• Valor front end CAM (Unlimited Seats)• Industry Standard for front end engineering

• Stack up consultations, Service Offered No Charge $

• Insight Frontline DFM’s, Service Offered No Charge $

• Tech Seminars /Webinars

• Material Science, Latest in Laminates and Pre Preg’s

• R&D, Building the Toughest to Gain the KnowledgeWhen you need it, we will be ready!

Go to slide 7

High Speed Materials Website Page

Hybrid Construction for low cost

(Meg 6 combined with low cost material for power layer)

53

DFM Report

54

Graphical DFM report

BACK Go to slide 7

55

Imaging System

LDI (Laser Direct Imaging)Orbotech Paragon SM20

57

LDI Imaging Systems

• 100% Laser Direct Imaging (LDI)• Repeatable process, computer controlled• 24/7 consistent imaging regardless of shift• No film means lower tooling costs• No repeating defects

• Consistent trace width• Tighter impedance control (+/- 5 %)• ¼ Mil Accuracy .0008 Min Line/.0005 Space• Layer to layer registration within .0004”• No film growth due to heat expansion

BACK

SCHMID Precision DES Line(Develop – Etch – Strip)

59

Inner Layer Develop Etch Strip

• January 2012 State of the art Schmid DES line Installed• Computer controlled for consistent product• Full automation removes human element • 2 Micron variation over panel• 1 mil core capability for substrate, HDI, and Rigid flex• 4,000 Cores per day capacity based on current copper mix• Tripled capacity upon installation• Positions Streamline for future technologies

BACK

Precision Laser Drilling6 High Speed Laser Drills

61

Laser Drilling

• 6 Laser drills in house (7th has been purchased)• Daily processing 4-N-4 of means experience

• Higher stacks available • .0014” Hole, .004” Pad advances technology window• Aspect Ratio: 3:1• Positional Accuracy for Hole Location +/- .0005”

62

Via formation, Aspect Ratios and Stacked Vias for Increased Densities

BACK

63

Electroless Processing

BACK

• Completely Automated Line installed January 2012• Industry leading 28:1 Aspect Ratio: allows for higher density

designs• Bar coded processing removes operator errors• Dwell times established in planning for speed & efficiency,

translating to consistent product • Ultrasonic, knife edge agitation, vibration & thumper• 36 stations, Oversized tanks (24”x 30” Panels)• High volume throughput capability

IPS Automatic Electroless Plating Line

65

Test Capabilities:

• 100% Flying probe testing (8 Systems)• Flexibility, no fixtures, less cost• Allows for testing sub chapters before final book• Everett Charles Eliminator for faster testing• Every board 100% Net List Tested

BACK

Everret Charles Flying Probe Testing With the Eliminator

Pluritec Inspecta X-ray Registration System

68

Internal Registration

• In unison with “Xact Software” for scaling

• Internal Registration is one of the key attributes in being successful

• X-Ray allows verification in real time• X-Sections Verify X-Ray

Xact Scaling Report

Non Conductive Filled Via Wrap Per IPC 6012 Class III

Dendrites(Teeth)

SmoothCopper

ElectrolessWrap

71

Copper Fill Laser Vias & Through Hole Solid Copper Vias

Thermal Via Farms for Thermal Management

BACK

72

• Chip Scale Packaging Requires Streamlines Equipment Sets for Success-

100% LDI

Chip Scale Packaging

LSMDP Laser Solder Mask Defined Pad

Using the LDI’s

• Precise Imaging to .0005” clearance– Allows reduced solder mask clearance sizes

– May reduce layer count

– Maximize geometry

– Using laser solder mask defined pad (LSMDP)

• You can define a “Pad” on top of a pad

LSMDP (Laser Solder Mask Defined Pad)

Ink Jet SilkscreenOrbotech Sprint-8TM

Ink Jet Silkscreen

“Now Engineers can actually read to debug!”– Ultra Fine Crisp Lines, Down to 3 mil– Serialization on the fly, BAR Code & QR codes– Applied over partially cured mask providing for the

mask and legend to be cure simultaneously to reduce cycle time

– Combination inkjet and laser technology – Dry's the ink as it’s applied

BACK

77

Quality Verification

•Verify Expected Results• 2 X-Section labs on site

• 200 plus sections per day• Wet processing lab onsite• CMM For critical measurement reporting• Two TDR’s for impedance verification• Single ended & diff pairs (Separate testing for

accuracy)• Ionic contamination testing• In process lamination X-ray verification• XRF Gold thickness verification X-Ray

78

Q-Pulse Total Quality Management

• Quality Assurance Systems • Q-Pulse Quality System

• NCMR’s and Corrective Actions• Audits• Training• Equipment Calibrations

• Quality Certifications• IPC Certified Trainers 6012, 13,15,18 • ISO 9001 AS9100C ITAR MIL-P-55110• Mil-P-31032 In Process

BACK

79

Future Investments

• New Schmid outer layer etcher• 2 Orbotech AOI systems with .0005” (1/2 mil) capability• New Electroless Gold line (Enepig)• 2 Additional LDI systems• New Photo plotter for button and silkscreen film• Additional OEM Press•Facility Growth Expansion.

BACK

80

Sample Case #1

Highlights:1/1 Trace Space4 N 4 Stacked Micro Vias.225 mm 1300 Pin BGA1.6 Mil Via – 4 Mil Pad.020 ThickSub Panel Test

Equipment Set:LDI, DESLaser, Inspecta, LDILDI, Inspecta, LDI S/MLDI, Laser, ElectrolessLDI, DES, InspectaFlying Probe

81

Sample Case #2

Speed Test:• 800ea 10 layers• 2 Lamination cycles• Buried vias, 2-9• Laser Micro Blind 2-3, 8-9• Laser Micro Blind 1-2, 9-

10 with via in pad• 3/3 trace and space• 6.5 PTH to Copper Delivered in 4 Days

82

Sample Case #3 Extremely Thin• 4 Layer Buried vias 2 -3• 2 Lamination cycles• Laser Micro Blind 1-2, 3-4• Finished thickness .0054• Equipment set

BACK

Ready For The Future 2015. 2 Streamline Circuit Corp’s Facility Manufacturing all levels of...

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