Qualcomm VIVE® QCA9500 - Home - System Plus …©2018 by System Plus Consulting | NXP SCM-i.MX6Q...

©2018 by System Plus Consulting | NXP SCM-i.MX6Q RCP SiP 1

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Qualcomm VIVE® QCA9500First WiGig Chipset in 60 GHz BandRF report by Stéphane ELISABETHJanuary 2018


SOMMAIRE

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Qualcomm

o WiFi History, Evolution & Challenges

o Qualcomm 60 GHz PortFolio

o Toward 5G Implementation

o TP-LINK Talon AD7200 Teardown

Market Analysis 24

o WiGig First mmWave Certificated protocol

o mmWave communication penetration rate

o Doubled sided technology

o RF SiP packaging market revenue

Physical Analysis 29

o Synthesis of the Physical Analysis

o Module Package 31

Package Views: Dimensions, marking, Block Diagram

Physical Analysis of the Baseband Board 29

o Baseband Board 34

Board disassembly: Overview, Bill of materials

Board Cross-Section : PCB substrate

o Baseband SiP 40

Package Views: Dimensions, marking

Package Opening: Top, Botttom, Bill of Materials

Package Cross-Section : PCB Substrate, Copper Pillars, Dies

Summary of Physical Data

Summary of main Dies

o Baseband Processor & SiP active dies 60

Die View & Dimensions

Delayering & main Blocs

Die Process

Die Cross-Section

Die Process Characteristic

Physical Comparison 77

Discrete packaging Solution

Physical Analysis of the Antenna Board 79

o Antenna Board 80

Board disassembly: Overview, Bill of materials

Board Overview : Patch Antenna, Quasi yagi Type Antenna

Ceramic Substrate deprocessing

Board Cross-Section: Ceramic substrate, Patch & Quasi yagi Type antenna

o RFIC 96

Die View & Dimensions

Delayering & main Blocs

Die Process

Die Cross-Section

Die Process Characteristic

Manufacturing Process 111

o Synthesis of the main parts

o Baseband Processor, RFIC Die Front-End Process & Fabrication Unit

o SiP Fabrication Unit

o SiP Packaging Process Flow

Cost Analysis 119

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses 122

o Baseband Processor, RFIC 124

Die Front-End Cost

Die Wafer Cost

Die Cost

o SiP Packaging 126

Reconstituted Wafer on Glass Carrier Cost

SiP Packaging Cost

SiP Packaging Cost per steps

SiP Component Cost

o Module 131

Module Assembly Cost

QCA9500 Component Cost

Estimated Selling Price 135

Company services 139


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theQualcomm VIVE® QCA9500.

• The QCA9500 is a complete solution for WiGig application dedicated to mobile devices (Computer) and access point (router). The module comes with two boards linked by a coaxial connection. The first board features an RFIC and innovative antennas, and the second features an advanced System in Package (SiP) using Double Side Molding configuration. The SiP integrates a baseband (BB) processor along with a switch, a regulator, a crystal, a memory and more than 60 SMD components, all in a single package smallerthan 40 mm². This is the first double side molding device than we have found in the market, and it could be a key milestone for 5G SiP technology.

• Developed by Wilocity, a subsidiary company of Qualcomm since 2014, the RFIC features up to four transceivers controlling up to 32 antennas (patch and Quasi-Yagi-Type) for the beamforming at 60 GHz. The SiP uses non-conventional molded packaging developed by Amkor. It has innovative interconnections, enabling the redistribution of the BB processor signal to the PCB. Copper pillars inside the molding and a very thin confined PCB substrate complete the signal distribution structure.

• This report includes a full analysis of the module, featuring a detailed analysis of the SiP and the antenna board including die analyses, processes and board cross-section. Finally, it contains a complete cost analysis and a selling price estimation of the system.


Overview / Introduction

Company Profile & Supply Chain o Qualcommo WiFi technologyo Qualcomm PortFolioo AD7200 Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

TP-LINK Talon AD7200 Teardown




Market Analysiso Communication protocolo mmWave penetration rateo Double sided technologyo RF SiP Market revenue

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

RF SiP packaging Market Revenue




Market Analysis

Physical Analysis o Synthesiso Moduleo Baseband Board

Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies

o Antenna Board Board Board Cross-Section RFIC Die

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Synthesis of the Physical analysis




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Module View & Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband Board – Board Cross-Section




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Package View & Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Package Opening




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Package Cross-Section




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Baseband Processor Die Dimensions

PGDW: Potential Good Dies per Wafer




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna Board – Board Overview




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna Board – Antenna Patch




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna Board – Board Cross-Section – Ceramic Substrate




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna Board – RFIC – Die View & Dimensions




Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Synthesiso Front-End Process &

Fabrication Unito SiP Process Flow

Cost Analysis


Feedbacks

About System Plus

Packaging Process Flow (1/2)




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Front-End Cost &

Wafer/Die Costo SiP Packaging Costo Component Cost


Feedbacks

About System Plus

Baseband Processor Front-End Cost




Market Analysis

Physical Analysis

Physical Comparison





Feedbacks

About System Plus

SiP Packaging Cost




Market Analysis

Physical Analysis

Physical Comparison





Feedbacks

About System Plus

SiP Component Cost




Market Analysis

Physical Analysis

Physical Comparison





Feedbacks

About System Plus

Component Cost




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financial o Manufacturer Price

Feedbacks

About System Plus

Estimated Manufacturer Price




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

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Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks


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Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks


Contact

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Qualcomm VIVE® QCA9500 - Home - System Plus …©2018 by System Plus Consulting | NXP SCM-i.MX6Q...

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Transcript of Qualcomm VIVE® QCA9500 - Home - System Plus …©2018 by System Plus Consulting | NXP SCM-i.MX6Q...