PV MODULES FOR GROUND TESTING

LMSC-D973480

10 September 1986

PV MODULES FOR GROUND TESTING

CR 179_76

NAS3-24(; 57

FINAL RE]_:ORT

Prepared for

NASA-Lewis Re,,_earch Center

Cleveland, OH 44135

by

Lockheed Missiles & Space Company, Inc.

Sunnyvale, CA 94088

LOCKHEED MISSILES & SF_ACE COMPANY. INC.

-- LMSC-D973480

FOREWORD

This report documents the work performed by Lockheed Missiles & Space Co.,

Inc., Sunnyvale, California, for the Lewis Research Center of the National

Aeronautics and Space Administration un_ier contract no. NAS3-24657 on the

PV Modules for Ground Testing.

The term of this contract was 4.5 month'+_ beginning on 8 August 1985 and

concluding on 20 January 1986. This report summarizes the full term effort

performed on the subject contract over this entire period. The outcome of

this contract was four solar cell test modules which will be tested in a plasma

chamber to investigate current loss mechanisms. Henry Curtis of the Power

Systems Branch of NASA/LeRC provided technical direction for this work.

PRECEDING PAGE BI,ANK NOT FILMED

LOCKHEED

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MISSILES & _;PACE COMPANY. INC.

-- LMSC-D973480

Section

1.0

2.0

3.0

4.0

2.1

2.2

2.3

2.4

3.1

3.2

3.3

3.4

3.5

3.6

CONTI:NTS

Foreword

List of Figures

List of Tables

Appendix A Drawing Li:_t

IN TROD UC TION

OBJEC TIVE

SCOPE

pa e

iii

vii

ix

x

TECHNICAL PROGRESS SUMMARY

TASK 1 - DESIGN AND ANALYSIS

TASK 2 - MODULE FABRICATION

TASK 3 - QUALIFICA_I ION TESTING

TASK 4 - DELIVERY

3

3

3

8

26

FACILITIES AND EQU:FPMENT 27

DESIGN AND ANALYSIS EQUIPMENT 28

THERMAL CYCLING FQUIPMENT 34

FLEXIBLE SOLAR ARRAY FABRICATION 35

FACILITIES AND EQUIPMENT

FLASH/FUNC TIONAL TESTING 50

SOLAR ARRAY BLANKET ZERO-GRAVITY TESTING 50

FULL-SCALE MAST AND WING EXTENSION 56

TESTING

FULL-SCALE WING ENVIRONMENTAL TESTING 56

SAE ASSEMBLY AND 'rESTING SEQUENCE 60

SUMMARY 7O

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SPACE COMPANY. INC.

_ LMSC-D973480

Figure

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LIST OF }qGURES

PV Modules Master Schedule

Flat-wise Tensile Test Set-up

One Cell Electrical Model

One Cell Electrical Samples

Circuit Assembly (X8512605-501)

Circuit Assembly (X8517161-501)

Aluminum Plate Assembly (X_512607-501)

Module/Plate Assembly (X8512604-501)




I-V Curve (X8517162-501)

I-V Curve (X8517162-002)

I-V Curve (X8517163-001)

I-V Curve (X8512604-501)

I-V Curve (X8512604-503)

I-V Curve (X8517165-501)

I-V Curve (X8517166-501)

CADAM System Terminals

Electrical Power Systems H-P 1000 Terminals

Cray 1R Computer

Electrical Power Systems Computer Network

Star Lab VAX II/780 Computer and Terminals

Solar Array Laboratory Solar Cell Testing

Solar Array Laboratory Thermal Cycling Chambers

Solar Array Laboratory Layout

New "Quick Look Box Ill"Coavective Thermal Cycling

Chamber

Quick Look Box-III - Specimen Mounted for Test

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LOCKHEED MISSILES & _PACE COMPANY. INC.

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Figure

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LIST OF FIGURES (cont.)

Solar Array Fabrication Facility in Building 153

Flexible Circuit N/C Drill Station

Flexible Circuit Roll Laminator

Flexible Circuit Photo Resist Exposer

Flexible Circuit Photo Resist Developer

Flexible Circuit Copper Etcher

Flexible Circuit Photo Resist Stripper

Copper Anti Tarnish Coating

Flexible Circuit Production Welder

Flexible Circuit Development Welder

Flash Testing of SAE Flight Panel

SEP Solar Array Zero-Gravity Experimental Setup

SEP Solar Array Zero-Gravity Aircraft Testing

General Test Setup

SAE Being Deployed in Building 153

SAE Fully Deployed in Building 153

SAE Acoustic Noise Test - Mounted on Simulated SupportStructure

SAE Acoustic Noise Test - No Support Structure

SAE Vibration Test - Two Large Shaker Tables

Full-Scale Wing Thermal-Vacuum Test Setup

Fabrication, Assembly, and Test of SAE Wing

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LOCKHEED MISSILES & SPACE COMPANY. INC.

Table

1

2

3

LIST OF T%BLES

Flat-wise Tensile Test Results

Capacitance/Resistance Test Results

Electrical Summary

6

9

18

LOCKHEED

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MISSILES & _!;PACE COMPANY. INC.

LMSC-D973480

APPENDIX A DRAWING LIST

Drawing

Solar Cell Envelope Drawing

Solar Cell Envelope Drawing

Coverslide Envelope Drawing

Superstrate Envelope Drawing

Solar Cell Assembly Envelope Drawing

Epoxy Board

Aluminum Plate

Aluminum Plate Assembly

Printed Wiring Master

Circuit Assembly

Printed Wiring Master (8 x 8 Cells)

Circuit Assembly (8 x 8 Cells)

Module Assembly (5.9 Cells)

Module Assembly (8 x 8 Cells)

Module Assembly (5.9 N Strip)

Module/Plate Assembly

Module/Plate Assembly (Conventional)

Module/Plate Assembly (8 x 8 Cells)

(X8512603)

(X8519617)

(X8512606)

(X8519619)

(X8512610)

(X8512608)

(X8512609)

(X8512607)

(X8512611)

(X8512605)

(X8512612)

(X8517161)

(X8517162)

(X8517163)

(X8517164)

(X8512604)

(X8517165)

(X8517166)

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LOCKHEED MISSILES & SPACE COMPANY, INC.

LMSC-D973480

1.0 INTRODUCTION

Increased power requirements for missions in the 1990's will provide the impetus

for higher solar array operating voltages. Weight reductions for both cable harnessing

and converters will be realized at these higher voltages. However, operation in

regions of high plasma density at high voltage could significantly offset any weight

savings. In order to realistically assess the performance potential of high voltage

solar arrays, the question of the magnitude of the power loss associated with plasma

interaction must be answered.

A solar array in space will be surrounded by a plasma sheath. This sheath is the

region in which the potential changes from that of the exposed conductors or charged

dielectrics on the array to that of the plasma. In general, the current collected by

the array will depend upon the voltage, plasma particle density and energy, and

the array geometry. Additional factors cor, tributing to current collection include

(a) motion of the spacecraft relative to the plasma for heavy ion collection, (b) the

earth's magnetic field, (c) potential distribution upon the array, and (d) material

properties of the array.

1.1 OBJECTIVE

The main objective of this contract was to c!esign and build a minimum of three

photovoltaic test panels for plasma interaction experiments. These experiments

are intended to provide data on the interact:ions between high-voltage solar arrays

and the space plasma environment. Data gathered will significantly contribute to

the development of design criteria for the space station solar arrays. Electrical

isolation between the solar cell strings and the module mounting plate is required

for high-voltage bias.

i.2 SCOPE

LMSC is contractually obligated to supply three different solar cell module types

utilizing 0.020-0.030 cm (8-12 mils) thick, 2 ohm-era, silicon solar cells. Inter-

connected cell series strings must demonsl:rate an electrical conversion efficiency

1


LMSC,D973480

of at least 11.0% at 1 AM0 and 28 degrees Celsius. Further electrical requirements

include a capacitance range of 2000-2500 pf and a resistance greater than 1011 ohms

between the cells and the module plate. Three 0.91 m (3 ft. ) 22 guage Kapton coated

copper wire leads exiting from one of the short sides of the plate are required.

In addition to the three different solar cell module types which LMSC was under

contract to deliver, a fourth module, utilizing 8 x 8 cm silicon solar cell technology

was furnished. A brief description of each of the different module types delivered is

given below:

Module P/N De set iption

1 x8512604-501

2 x8512604-503

3 x8517165-501

4 x8517166-501

0.020 cm (0.008 in.) thick, 5.9 x 5.9 cm

Si cells, gridded back, wrap-around

contacts, 0.013 cm (0.005 in.) thick

individual CMX covers, welded Cu/Kapton

flexible interconnects, cells are bonded to

module plate face up, 28 cells in series

Same as module type #1 except cells are

bonded to module plate face down

Same as module #1 except BSR cell and

conventional n-bar contact with soldered

Ag plated/Mo interconnect

0.020 cm (0.008 in.) thick, 8 x 8 cm Si

cells, gridded back, wrap-through

contacts, 0.053 cm (0.021 in.) CMX

superstrate, welded Cu/Kapton flexible

interconnect, cells are bonded to module

plate face up, 15 cells in series

i

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LMSC-D973480

2.0 TECHNICAL PROGRESS SUMMARY

The contract was initiated within LMSC during mid August 1985 and completed with

the delivery of four solar cell module plate:_ to LeRC in January 1986. A complete

contract master schedule is shown in Figure 1.

2.1 TASK 1 - DESIGN AND ANALYSIS

During this task, preliminary engineering crawings were released for procurement

of all long lead time items. In addition, adhesive bond evaluation tests were conducted

at this time to determine bond strength bet_veen FM?3M adhesive and a non-acid

etched, MIL-C-5541 coated aluminum alloy surface. The flat-wise tensile test

set-up employed to evaluate bond strength is shown in Figure 2.

Test results, summarized in Table 1, show that FM73M forms a strong bond to

MIL-C-5541 coated aluminum alloy. All bond failures occurred at the unprimed

interface. The failure mechanism was primarily cohesive. The use of BR 127

primer gave additional bond strength to the chemically coated aluminum/FM73M

bond. The average tensile strength of the ,:;amples tested (35.4 MPa/5146 psi)

compares favorably to an acid etched aluminum surface/FM73M bond (41.4 MPa/

6000 psi}. Results from this test were inccwporated in the fabrication of the aluminum

plate assembly (x8512607) as seen on the engineering drawing attached in Appendix A.

2.2 TASK 2 - MODULE FABRICATI(_N

Electrical evaluation tests were performed on "one cell" models (shown in Figure 3)

of the three solar cell modules. The purlxse of these tests were to verify compliance

with the design requirements for resistancq_ greater than 1011 ohms and capacitance

within the 2000-2500 pf range between sola:_: cells and the module plate. A linear

scale-up factor was assumed to predict full scale module capacitance. Fringing

field effects at the solar cell edges was ne_!:lected since intercell spacing was small

compared to capacitor plate spacing.

3


TASK DIESCRIPTION AUG SEP OCT NOV DEC JANPV MODULES

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1.0

2.0

2.1

2.2

2.3

2.4

2.5

DESIGN & ANALYSIS

1.1 Documentation

1.2 Eng. Dwg. Release Review

1.3 Bond Evaluation Tests

MODULE FABRICATION

Electrical Eval. Tests

Aluminum Plate Assembly

Interconnect Assembly

Cell Delivery

Cell Module Assembly

Cell Module/Plate Assembly

3.0 QUALIFICATION TESTING

3.1 Capacitance Test

3.2 Resistance Test

3.3 I-V Test - 1 AM0, 28°C

4.0 DELIVERY

4.1 Inspection, DD250

5.0 REPORTING

5.1 Monthly Report

5.2 Final Report

Figure 1 PV Modules for Ground Testing - Master Schedule

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NL 6061 NIMIL-C-5541 CLIII

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NL BLOCK.

FPL ETCH &

BR 127 PRIMER

Figure 2 Flat-wise Tensile Specimen

DLNSSIEPOXY LNMINRTE

BR 127 PRIMER

NO PRIMER SIDE

DLRSSIEPOXY LAMINRTE

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FLATWISE TENSILE RESULTS

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TENSILE, PSI

6073

5094

4767

4310

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at AI without primer interface.

(2)Specimen loaded to 3600 psi and released due to load pin deflection.

Specimen was tested to failure using a new pin.

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MODE OF FAILURE (1)

80% COItESIVE, 20% GLASS DELAM

75% COHESIVE, 15% GLASS DELAM,

10% ADHESIVE TO A1 (NON PRIMED SIDE)

90% COHESIVE, 10% ADHESIVE TO Al

95% COHESIVE, 5% ADHESIVE TO AI

80% COHESIVE, 10% ADHESIVE TO A1,10% GLASS DELAM

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LMSC-D973480

Preliminary calculations (see Appendix B) had suggested a dielectric stack of:

0.013 cm (0.005 in.) thick epoxy adhesive, 0.132 cm (0.052 in.) thick glass epoxy

laminate, 0.005 cm (0.002 in.) thick silicone adhesive and a 0.002 cm (0.001 in.)

thick Kapton film to meet the electrical design requirements. Test results,

summarized in Table 2, show that an additional 0. 038 cm (0. 015 in.) thick layer

of epoxy dielectric is needed to approach the electrical design requirements

(sample #5). The inaccuracy of the dielectric thickness calculations can be

attributed to the approximate and directional nature of the constants used in the

preliminary calculations. The added dielectric thickness was incorporated into

the design by the addition of FM73M adhesive layers onto the face of the glass/

epoxy laminate. A photograph of the "one cell test" samples is shown in Figure 4.

vl

Upon completion of all testing, hardware fabrication was initiated. Photographic

documentation of all completed hardware is shown in Figures 5 through 11.

2.3 TASK 3 - QUALIFICATION TESTING

Results of capacitance and resistance testing of the full scale solar cell modules is

summarized in Table 3. Module Type 4 (x8517166-501) was shown to exhibit a

comparatively low capacitance of 1100 pf and a low resistance between cell and

mounting plate of 8 x 1011 ohms. In addition, module type 2 (x8512604-503).

exhibits a capacitance below the required range, probably as a result of the extra

thickness of dielectric (coverglass) in the stack. These results do not comply with

the contract requirements, however, approval for hardware delivery was given bythe contract monitor.

All modules were shown to exhibit an electrical conversion efficiency greater than

11%. Electrical [-V curves are provided in Figures 12 through 18 at 28 degrees

Celcius and 1 AM0. It should be noted that Figures 12 through 14 show the I-V

characteristics of the solar cell modules before being bonded to the mounting plate.

Particular attention should be brought to Figure 13 which is taken as baseline for

module type 2 (x8512604-503) rather than Figure 16 which shows the solar cell

I-V characteristics when illuminated from the backside only. Thus the electrical

conversion efficiencies listed in Table 3 are from Figures 15, 13, 17, and 18


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TABLE 2

CAPAC ITANC E/RESISTANCE TEST RESULTS

Description

Module Type #1

(Cells Bonded Face Up)X = 0 Y = .005

Module Type #2

(Cells Bonded Face Down)X = 0 Y = .005

Module Type #3

Conventional N-Bar

Cells Bonded Face Up

X = 0 Y = .005

Module Type #I

(Cells Bonded Face Up)X = .010 Y = .005

Module Type #I


Module Type #1


Capac itance (pf}Measured for

"One Cell" Model*

102.2

98.5

94.6

89.6

84.7

73.4

Capacitance (PD

Extrapolated toFull Scale Model

2786

2758

2649

2508

2400

2054

Resistance (ohm)at 500V**

1,2 x 1011

1.2 x 1011

3.1 x 1010

4.5 x 1011

1.8 x 1011

2.6 x 1011

Measured by: *HP4274A Multi Frequency LCR Meter (LMSC #121867)

**1620C Megohmeter, Freed Xfmr Co. (MSL #60668)

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(Front Side)

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Figure 7 Aluminum Plate Asse:_nbly (X8512607-501)

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LOCKHEED MISSILES & :SPACE COMPANY, INC.

LMSC-D973480

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LMSC-D973480

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TABLE 3

ELECTRICAL SUMMARY

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X8512604-501

X8512604-503

X8517165-501

X8517166-501

*CAPACITANCE (pf)

(at I00 Hz)

2010

1880

2O70

1100

**RESISTANCE (_)

(at 500V)

1.2 x 1011

2.0 x 1011

1.6 x 1011

8.0 x 1010

ELECTRICAL CONVERSION

EFFICIENCY (%)

(at T = 28°C)

11.72

11.22

12.06

11.31

MEASURED BY: *HP4274A MULTI-FREQUENCY LCR METER (LMSC #121867)

*'1620C MEGOHMETER, FREED XFMR CO. (MSL #60668)

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LMSC-D973480

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Isc = 1.33A

iI

I(at V=13.72V) = i. 14A

..... Pmp = 15.86WEFF = 15.86 = 11.96%

1353"28".0035TEMP = 28°C

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2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0

VOLTAGE (V)

Figure 12 I-V Curve @_(8517162-001)

LOCKHEED

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MISSILES & S;PACE COMPANY. INC.

LMS C-D973480 _"

1.4

1.2

1.0

0.8

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..... t I(at V= 13.72V) = 1.07Ar Pm,_ = 14.88W

I E'_ = 14.88 = 11.22%i 1353 *28*. 0035

....... : TEM-P = 28°C

J t

2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0

VOLTAGE _)

Figure 13 [-V Curve (X8517162-002)

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-- LMSC-D973480

2.5

2.0

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Z 1.5

1.0

0.5

%° =8.6v _/%o=2.22A _1I(atV =7.35V) = 1.80A

Pmp = 13.8W IEFF = 13.8 = 11.33% f

1353"15".006(,TEMP = 28°C

0 2.0 4.0

i iii............6.0 8.0 10.0

VOLTAGE (V)

Figure 14 I-V Curve (X8517163-001)

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LOCKHEED MISSILES & _!;PACE COMPANY. INC.

LMSC-D973480

1.4

1.2

1.0

0.8A

<

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Voc = 16.5V[sc = 1.33AI(at V=12.5V) = 1.24APm = 15.54WE F_ = 15.54

1353"28". 0035TEMP= 28°C

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0 5.0 10.0 15.0 20.0

VOLTAGE (V)


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LMSC-D973480

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140

120

100

< 8O

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........................ ...............

........ v = 1 ,8v ...........................

[_t V=10V)= 117.1 mA \

__ Prop = 1.24W __ \

............ EFF = 1.24 = 0.c,4% \

1

:1-13-86 i

0 2.0 4.0 6.0 8.o 10.0 12.0 14.0

VOI,TAGE (V)

i

i" " I .....

I

16.0

Figure 16 I-V C,Lrve (X8512604-503)

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LOCKHEED MISSILES & S;PACE COMPANY. INC.

LMSC-D973480

ORIGINAL PAGE IS

OF _POOR OtJALITY

I , ' ! : \' t I

i'i ......................Z Isc = 1.29A ' _ i

I(at V=12:5V)= 1.25A _ i [0.6 Pm _-- 15.99W I r '

o ...... EPi_= z_._9 =z2.06_ T - - _--,......... ii'353"28".0035 ..... '_ _ ! ;

TEMP = 28°C _ -

o 4 ............. i-!3;86..................... 1.........

=2 ....

0 2.0 4.0 6,0 8.0 10,012.0 14.0 18,0

i

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18.0

VOLTAGE (V)


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-- LMSC-D973480

2.5

2.0

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a:

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........... L----...... . . i

L _+_

....... I , . ,

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Voc = 8.6V

[sc = 2.19AT(at V--7.0V) = 1.88A

..... Pmp = 13.43W

EFF = 13.43

- _ iiii

= 11.31% ......... t •1353"15".0058 ..........

...... TEMP = 2823 .........

.................... i i

.... 1-13-86 .........

• + " " • t ; ..................

0 2.0 4.0 6.0 8.0 10.0

VOLTAGE (V)

Figure 18 I-\ Curve (X8517166-501)

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LOCKHEED MISSILES & !!_PACE COMPANY. INC.

LMSC -D973480

respectively. No damage was incurred to the solar cells during adhesive bonding

to the module plate.

2.4 TASK 4 - DELIVERY

The four solar cell module plates were delivered to NASA LeRC, attention

Henry Curtis, on 20 January 1986. Subsequent conversation with Mr. Curtis

has assured LMSC that the plates arrived safely at their destination.

26


LMSC-D973480

3.0 FACILITIES AND EQUIPMENT

This section contains a detailed description of the facilities that would be used to

support the design effort and fabrication work on Space Station flex arrays. These

include areas for solar array engineering design and analysis, development, fabri-

cation, assembly, and testing. The facilities most pertinent to the performance of

this project are described in this section, which includes the following:

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

DESIGN AND ANALYSIS EQUIPMENT

THERMAL CYCLING EQUIPMENT

FLEXIBLE SOLAR AI'_RAY FABRICATION FACILITIESAND EQUIPMENT

FLASH/FUNC TIONAI, TESTING

SOLAR ARRAY BLANKET ZERO-GRAVITY TESTING

FULL-SCALE MAST AND WING EXTENSION TESTING

FULL-SCALE WING FNVIRONMENTAL TESTING

SAE ASSEMBLY AND TESTING SEQUENCE

Engineering, development, and fabrication operations for LMSC spacecraft programs,

for the most part, are performed at three primary sites located on the San Francisco

Peninsula. The main LMSC plant is located in Sunnyvale and contains the Corporate

Offices (Building 101). The Astronautics Division (AD) has offices at the main

Sunnyvale plant. The Research and Development Division has offices and facilities

on the second site, located near Stanford Umversity in Palo Alto. Lockheed

Research and Development Laboratory facilities have broad scientific capabilities

for investigation of physical sciences. If LI_SC were to perform Space Station design

and fabrication work, these capabilities are available. The third major LMSC facility

is the Santa Cruz Test Base (SCTB). SCTB is located in the Santa Cruz mountains

west of Sunnyvale and is the location of a large antenna test range and hazardous test

support facilities. It would not be utilized for Space Station work. LMSC-owned/

leased facilities provide over 8 million square feet of board and desk, manufacturing,

and test facilities.

27


LMSC-D973480

LMSC has considered all of the facilities needed to support Space Station, and all

facilities described herein are available for this design effort and fabrication work.

3.1 DESIGN AND ANALYSIS EQUIPMENT

The Electrical Power Systems (EPS) organization at LMSC, which will be directly

responsible for solar array design, is located in Building 151. All necessary space,

facilities, and support services such as the data center, reproduction, and document

control are available in the immediate area to support this project. In addition, EPS

has extensive computer support equipment which is listed below.

Electrical and Mechanical Design

• IBM 4361 CAD/CAM System using CADAM software

• 10 terminals within EPS area (Figure 19)

395 terminals available throughout LMSC

• 9 electrostatic plotters linked to the CADAM system

Engineerir_ Analys is

• EPS has 3 HP 1000 computers (Figure 20), 1 HP 9000 computer

• 20 HP 150 work stations

• Using a networking hookup, the CRAY 1R computer (Figure 21) and

VAX 11/780 computer are available for EPS use (Figure 22)

• 1 VAX 11/780 computer is available for Dynamic Modeling Analysis

in the LMSC Star Lab (Figure 23) in Building 104

With the CAD/CAM system, computer analysis equipment and data management

support services, the EPS organization minimizes labor inducive tasks and maxi-

mizes the design and analysis efforts of its engineers. LMSC educates its employees

through company training courses on how to get the most out of available equipment

and software.

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3.2 THERMAL CYCLING EQUIPMENT

The test facilities for thermal cycling are a part of the EPS Laboratory. This lab

consists of approximately 5,000 square feet dedicated to power systems test and

evaluation. The solar array capabilities in the lab are approximately 2,000 square

feet and consist of the necessary facilities and capabilities for completing thermal

cycle testing.

Solar Array Laboratory

• 5 Convective Thermal Cycle Chambers

These chambers are used to perform thermal life cycle testing on solar

array panel and substrate assemblies to assess failure modes and deter-

mine thermal/electrical performance for a given number of thermal

cycles. The EPS lab has over 100 square feet of available chamber

space to perform these types of tests.

3 Thermal Vacuum Cycling Chambers

The solar array lab has three chambers capable of performing electrical

and thermal performance tests in a 10 (-8) tort environment which can be

cycled thermally from -300°F to +200°F. Additionally, each chamber has

two fused quartz windows so a light source can be directed at the test

samples and electrical measurements can be made at the test conditions.

3 Calibrated Light Sources

The solar array testing facility has three calibrated light sources available

for use on test samples. Two Spectrosun X-25 solar simulators capable

of >1 sun and a portable XT-10 simulator for special applications and field

use.

Portable Solar Test Facility

To accommodate special test requirements the solar array lab has a

portable solar cell/array test set which includes a 1 sun solar simulator

and a data acquisition and control system to take and manage acquired test

data.

34


- LMSC-D973480

Test Data and Control System

To manage test operations, acquire data, and perform test data analysis;

the solar array lab utilizes an I4P 1000/A600 minicomputer in a real time

mode. This facility is capable of monitoring and controlling eight simul-

taneous tests with a total data acquisition capability of 500 channels. There

is graphics display and hard-copy capability available in the test area.

Laboratory Layout

The lab is arranged to provide testing to six test stations from a rotating

X-25 solar simulator. This is illustrated in Figures 24 and 25. The

floor plan is shown in Figure 26.

Because of its availability and accelerated cycle time, Quick Look Box III would be

used to perform thermal cycle testing. This new chamber, shown in Figures 27

and 28, has multi-mode capabilities with th:_'ee individually controlled sub-chambers.

Each sub-chamber can take solar array specimens up to 36" x 36" or a single panel

of 36" x 96" if the inside chamber walls are removed. This facility is presently in

use to thermally cycle gallium arsenide solar cell strings and a panel segment of

5.9 x 5.9 cm solar cells for one of our pro_:ram applications. This facility/chamber

was designed and fabricated for LMSC, bas,_;d on our successful thermal cycling in

Quick Look Box I of the SAE 2 x 4 cm and 5.9 x 5.9 cm panel seg-ments in support

of the panel verification.

3.3 FLEXIBLE SOLAR ARRAY FABRICATION FACILITIES AND EQUIPMENT

The facilities required for the fabrication o: the flexible solar array panels are in

place in LMSC's new solar array fabricatio, l facility in Building 153 (Figure 29)

of the Sunnyvale plant. This area was the home of the SAE assembly and deployment

testing for four years. After a $3.2 millio1_ upgrade, Building 153 consists of a

30,000 square foot processing area for fabricating polyimide/copper solar cell

interconnect circuits, and a final assembly clean room for circuit to substrate

bonding, wiring, and testing. The circuit processing area consists of a series of

conveyorized equipment for drilling, laminating, photo processing, copper etching,

and final cleaning operations.

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In addition to the Building 153 solar array fabrication facility, Building 151 has a

solar array fabrication facility which supports existing DoD contracts that utilize

conventional assembly technology consisting of discrete silver plated molybdenum

interconnects soldered to 2 x 4 cm solar cells. The new Building 153A facility is

scaled to handle high production assembly requirements for new DoD contracts

including the MILSTAR program. The circuit process incorporates the use of a

custom design N/C drill (Figure 30) for providing solar cell contact weld access

holes in a one rail adhesive coated polyimide (kapton) dielectric film. This machine

is capable of drilling a 20" x 80" circuit in a continuous roll set-up. Following the

drilling of a quantity of circuits (up to 500 linear feet) the polyimide film is laminated

to a roll of copper foil using a continuous roll lamination process. This laminator

(Figure 31) is also used for laminating a dry film photo resist which is used for

controlling the copper circuit configuration during etching.

Following the resist application, the circuits are processed through the photo etch

processes consisting of a UV exposer (Figure 32) to establish circuit configuration,

a conveyorized semi-aqueous photo resist developing station (Figure 33) and a

copper etcher (Figure 34) to remove unnecessary copper from the circuit. The

final circuit processes include a photo resist stripping process (Figure 35) and a

final cleaning and anti-tarnish coating process (Figure 36). The completed circuit

is then ready for net trim and is stored in nitrogen cabinets until ready for welding

of large area wraparound contact solar cells.

The panel assembly area of this facility consists of a 18,000 square foot clean room.

In this area the solar cell welding, circuit electrical checks, circuit bonding and

final wiring and panel electrical checkout are performed.

The solar cell welding system is a state-of-the-art design using a Hughes parallel

gap electrode tip and power supply with several process control and monitoring systems

incorporated into the electronics. The primary control for the weld pulse is a Vanzetti

I-R sensor that performs an in-process reading of the weld temperature and terminates

weld energy when a pre-set temperature is achieved. Other monitors take readings

on tip force, weld voltage, current, weld energy, tip contamination and weld duration.

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All of this data is stored on a hard disk for later verification of weld quality. This

welder incorporates a 20" x 80" N/C controlled table movement. Two camera systems

are used for controlling and monitoring the welding in process. A precision locating

camera performs final alignment of the weld area under the weld tips prior to each

weld. The second camera is a CCTV monitor of the welding process which is dis-

played on a remote screen. This can be video taped for later correlation with the

hard disk data to get complete history of each weld for each circuit. Two welding

systems are in place. One welder is used for production work (Figure 37) and the

other welder is used for development work (Figure 38). In 1987, the development

welder will be moved to the advanced manufacturing area in Building 588, and a

second production welder will be installed in Building 153 to accommodate the larger

scale production needs of the MILSTAR program.

All flexible solar array fabrication equipment is available in Building 153 except

for autoclaves which would be needed _f autoclaving of superstrates to welded sub-

modules is required. This capability exists in the main manufacturing shops. If

production needs require it, an autoclave would be dedicated to this project to

accommodate schedule constraints.

3.4 FLASH/FUNCTIONAL TESTING

LMSC currently has three pulse light test systems available in our manufacturing

area to provide full illumination testing of the modules and panels. The 2 x 4 cm

and 5.9 x 5.9 cm SAE panel segments were successfully tested prior to and after

the flight and ground testing. Figure 39 shows a SAE panel mounted to a pegboard

for electrical testing. The new facility will have a Spectrosun pulse light source

available for testing small modules and panel wing segments.

3.5 SOLAR ARRAY BLANKET ZERO-GRAVITY TESTING

After developing an advanced solar array, a test will be required to demonstrate

the retraction capability of the solar array panel segments in a zero-gravity

environment. The Solar Electric Propulsion (SEP) solar array was tested bv constructing

a test fixture (Figure 40) and flying the experiment in a KC-135 airplane (Figure 41).

By performing a parabolic flight maneuver, a simulated zero-gravity environment was

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Space Station arrays.

A similar test could be done with the

With LMSC's experience performing this test, no problems can be foreseen in

repeating it in the future. LMSC would use a KC-135 airplane from NASA-JSC

(Ellington AFB) because of our successful teaming arrangement with them in the

past. No aircraft availability problem can be foreseen.

3.6 FULL-SCALE MAST AND WING EXTENSION TESTING

In addition to solar array fabrication, the Building 153 facility would also be the

location for a series of functional and acceptance tests on the mast and solar array

wing. The mast would be tested first as a component, and then the whole solar array

wing would be tested.

The mast tests would most likely include functional extension and retraction (both

loaded and unloaded), linear and angular alignment measurements at intermediate

and fully extended positions, torsional and bending stiffness measurements, flight

loading, and lock-up loading tests. To simulate a zero-gravity environment, a

water table (Figure 42) would be set up. Because LMSC has done this testing

once before, no problems are anticipated.

The solar array wing would need to be functionally tested to demonstrate its capability

to properly perform "hands-off" extension/retraction operations. To demonstrate

this capability, a simulated zero-gravity test setup would be required. This test

was performed once before in the Building 153 facility, see Figures 43 and 44.

The monorail which was used to support the wing while being extended and retracted

is still in place in the facility. Additional test support equipment would be required,

but no problems in completing this task are foreseen.

3.7 FULL-SCALE WING ENVIRONMENTAL TESTING

Three environmental tests would be performed to test a full-scale wing. These tests

would include vibration, acoustic noise, and thermal vacuum cycling. The test

facilities required for these three tests are located in the Sunnyvale facility. These

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facilities are the same as those used on the Solar Array Experiment (SAE). Figures

45 through 48 show the acoustic, vibration, and thermal vacuum cycling setup of the

SAE and SEPS hardware. The experience gained on these previous tests would provide

the basis of accurate cost and performance estimates if these same facilities were

used for this project.

3.8 SAE ASSEMBLY AND TESTING SEQUENCE

The overall SAE fabrication and assembly capabilities and methods are shown in the

flow sequence shown in Figure 49. Many of these same methods would be used on

Space Station solar arrays if LMSC became involved in fabrication work.

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4.0 SUMMARY

Two modules consisting of 28 large area 5.9 cm x 5.9 cm wraparound contact solar

cells welded to a flexible Kapton circuit werc_ fabricated. In addition, a soldered

conventional n-bar contact 5.9 cm x 5.9 cm-28 cell module was fabricated along

with a 15 cell module utilizing 8 cm x 8 cm vrrap-through contact solar cells

welded to a flexible Kapton circuit. These modules contain features to allow

experimental evaluation of the effects of instlation, pin-holes and other factors

on several design options to gain a basic understanding of plasma interaction with

solar arrays. Pretest I-V measurements were made on each module string. The

module plates were delivered to NASA LewL,_ Research Center where they are

currently undergoing plasma testing.

7O


LMSC-D973480

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NO CRACKED SOLAR CELLS WHEN EXAMINED WITH NORMAL OR CORRECTED TO NORMAL VISION,

003 PRIOR TO ELECTRICAL TEST CLEAN SUPERSTRATE {ITEM 3) PER ITEM 50! AS REQUIRED,

I 004 LOCAL NOTE: TEST CELL _ODULE ASSY IN A SUN CALIBRATED ARTIFICAL LIGHT SOURCE, THE LIGHT SOURCE

SHALL MEET REQUIRE!MENTS OF ITEM 401, RECORD CURRENT OUTPUT AT 7-35 VOLTS _AND 25 DEGREES C

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HOLES TO ELECTRICAL BONDING AREAS OF

I DATE I A_='ROVAL I DATE

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00! LOCAL _OTE: FILLET WIRES (ITEM 204) TO DIELECTRIC SURFACE OF ITEM 001 PER ITEM 502 AS FOLLOWS:

I, SOLVEINT CLEAN SURFACES TO BE FILLETED WITH ITEM 203 {2-PROPANOL) USING

PRE-CLEANED Q-TIPS AND AIR DRY lO MINUTES MINIMUM.

2. APPLY: ITEiM 200 IN A CONTROLLED MANNER.

3. CURE {8 HRS MINIMUM AT 75 ÷/- 10 DEGREES F. PRIOR TO HANDLING & 7 DAYS MINIMUM

AT 75 ÷/-- I0 DEGREES F. PRIOR TO TESTING.

002 LOCAL NOTE: BOND ITEM 002 i TO ITEM 001 (AL PLATE ASSY) PER ITEM 501. APPLY ADHESIVE TO PRIMED

DIELFCIRIC SURFACE OF ITEM OOl (AL PLATE ASSY) IN A CONIROLLEO PATTERN AND THICHNESS SUCHTHAT THE FOLLOWING qf _UIREMENTS ARE MET:

(NOT,._ CONTINUE() NEXT PAGE)

_ ,,. ]

i _/L_ DATE APPROVAL

CHECKEO BY _" DATE A_ROVAL

OR_ I"_'_L _T t_ _ _lrf CC_,LIE " _,EQ NC} * SEQUENCE NUMBER ORGN = ORfiANIZATION

I DATE l AP_R'OVAL [ DATE

7 I I

STD

NOTE


I I t 1 I I I I i I 1 I t I l i I I

I' I I 1 I l I I I I: I ! I I ( I II

TRACT NUMBER _RITY

| LOCATION f

NOTE

NO. NOTE TEXT

( C_INT I NUED )

1.

003 LOCAL NOTE:

004 LOCAL NOTE:


D_E SCRIPTIONE REFERENCE DESIGNATION/ N_O

MATERIAL/NOTES

GTL)

NOTE

EACH OF THE 2_ SOLAR CELLS SHALL BE BONDED TO THE SUBSTRATE THROUGH 3 BONDING

SLOTS-

2. THE MINIMUM BONDING AREA SHALL _E _0_ UF THE SLOT AREA FOR ALL SLOTS.

3. 9ONDLINE THICHNESS SHALL I_E .005 IN THICK.

4. THE CURED ADHESIVE SHALL NOT _IDGE [N MORE THAN ONE PLACE _ETwEEN ANY 2

ADJACENT SLOTS.

SOLDER CIRCUIT WIRES ITEM 20_ Tr] ITEM 2 PER ITEM 500 uSING ITEM 205.

MA_K PAqT NO. PE_ ITEM 505 APPRDX AS SHOWN.

SPLICE TERM|NAL LEAOS TOGETHER USING ITEM 206.00_ LOCAL NO_E:

3 FT. LONG.

006 EACH SnLAR CELL AS SEP_Ly SHALL BE CHECKED FO_ THE FOLLOWING DEFECTS BEFORE TESTING:

|. DELAMINATION SHALL NOT' EXCEED AN A_EA GREATE_ THAN .0|5 INCH PER CELL ASSEMBLY,

2. EXPOSED SILICON AS A RESULT OF CRACKED OR CHIPPED COVERSLIOES*i

3. C_ACKED SOLAR iCELLS.

o ALL ASSEM_LIES HAVING ANY OF THE ABOVE DEFECTS SHALL BE RECORDED. REE APPROVAL SHALL 5E REQUIRED

FOR ALL _EWDRK OF SOLAiR CELL ASSEPBLIES-

007 CLEAN SOLAR PANEL PER 'I TEM %03 P_IOR TO F [RST FUNCTIONAL TEST AND AS REQUIRED AFTER ALL TESTS

SPECIFIED BY THE R_E. ,

008 FUNCTIONAL T ES!T THE ELECTRICAL PERFORMANCE OF EACH CELL CIRCU[T UNDER REE DIRECTION.

OOg CONDUCTOR COATI EXP'OSEDI WIRES OF ITEM 002 (CELL _ODULE ASSEMBLY} PER ITEM 504. AREAS TO BE

COATED NEE_ NOT B_I CLEANED PRIOR TO APPLICATION tJNLE_S VISUALLY CONTAMINATED.

O0"11;:o

SINGLE LEADS SH_N SHOULD BE APPROX _

E_

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C[ATE 1APP_owL

D&TE AI_PBOVAL

FORM LM,_C 2_42 F-10 ABBREVIATIONS LC " L I_'E CODE SEQ NO = SEQUENCE NUMBER ORG TM = ORGANIZATION

J AFM_ROVAL _ DATE

I APPI_OVAL I DATE


! A,qT ;_%_,, _ TI,T_'_I r_A(,$ .% TIII'_, I [%T '

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500 :<

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LAC3041-020000

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LAC3154-010000

LAC3211-020501

LAC3575-019993

I CF£

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DESCRIPTION

AL PLATE ASSY

MODULE ASSY

ADHESIVE,EPOXY

2 PROPANOL

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SOLDER

STD PRACTICES

GEN ELEC SOLDER

BOND FLEX MOD

FIL & ADH BOND

SOLAR PANEL

COATING SPEC

MARKING METHOD

I i REFERENCE DESIGNATION/ 1 NOTE

ITEMLC MATERIAL/NOTES NO

N STRIP

SN63 WRMAP 2 OR 3

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SOLDER PER

COAT PER

MARK PER

N03

NO2

NOI

NO4

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NOTE !

NO. NOTE TEXT

QK NOTE LINE INDICATORS (A; B; C, ETC.) ARE NO LONGER REQUIRED AND HAVE BEEN REMOVED

OOI LOCAL NOTE: FILLET W I:RES i(ITEM 204) TO DIELECTRIC SURFACE OF ITEM 001 PER ITEM 502 AS FOLLOWS:

I, SOLVE!NT CLEAN SURFACES TO BE FILLETED WITH ITEM 203 (2-PROPANOL) USING

PRE-CLEA_D Q-TIPS AND AIR DRY I0 MINUTES MINIMUM,

2. APPLY ITEM 200 IN A CONTROLLED MANNER.

3. CURE 4B HRS MINIMU._ AT 75 +/-- I0 DEGREES F. PRIOR TO HANDLING G 7 DAYS MINIMUM

AT 75 +/- I0 DEGREES F. PRIOR TO TESTING.

002 LOCAL NOTE: BOND ITEM. 002 TO ITEM OOI (AL PLATE ASSY) PER ITEM 501 • APPLY ADHESIVE TO PRIMED

DIELECTRIC SURFACE OF ITEM 001 (AL PLATE ASSY) IN A CONTROLLED PATTERN AND THICHNESS SUCH

THAT THE FOLLOWING REQUIREMENTS AR[ MET:

I • EACH OF THE 2_ SOLAR CELLS SHALL BE BONDED TO THE SUBSTRATE THROUGH 3 dONDING

SLOTS•

(NOTF CONTINUED NEXT PAGE)

l J

STD

NOTE

"''°-r-_,-_-_T,,,TI_---_-':Z - ABBREVI_,IC)-NS i . !,r_ :{_DE SE3 NO = 5EOUENCE NUMBER ORGN = ORGANIZATION

DA'rE

DATE

APPROVAL

AR:M_OVAL

I DATE

I OATE

LOCKHEED MISSILES & SPACE COMPANY. INC

I I I I I _ (' l I l I I I I I I I, I I

I I I ! I I I I ! I I I ! I I I II

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NO SH ZO E

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NO, NOTE TEXT

(CONT INUEL)}

2.,

3,

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rES'ONORONIO'TE.... IOAOEI°' pL

_o.,_ J--_MN--T_NG PARTS LIST

CCA/CI NO. DESCRtPTION MATERIAL/NOTES ITEM

F IDENT

STD

NOTE

THE MINIMUM BONDING AF_EA SHALL RE 90X OF THE SLOT AREA FOR ALL SLOTS,

BONDLINF-- THICHNESS SHALL [3E ,005 IN THICK,

THE CURED ADHESIVE SHALL NOT F]RIDGE IN MORE THAN ONE PLACE BETWEEN ANY 2

ADJACENT SLtlTS •

SOLDER CIRCUIT WIRES ITEM 204 TO ITFM 2 PER ITEM %00 USING ITEM 205.

MA_K PART NO0 PER ITEM 50% APPROX AS SHOWN,

SINGLE LEADS SHOWN SHOULD BE APPROX 3 FT, LONG,

003 LOCAL NOTE:

004 LOCAL NOTE:

00% LOCAL NOTE:

006 EACH 5QLAR CELL ASSEMBLY SHALL BE CHECKED FO_ THE FOLLOWING DEFECTS BEFORE TESTING:

[. DELAMINATION SHALLI NOT EXCEED AN AREA GREATE_ THAN ,0[5 INCH PER CELL ASSEMBLY,

2, EXPOSED SILICON A_ A _ESULT OF C_AC_E_ _ C_TDppD COVFRSLIDES,

3, CRACKED SOLAR CELLS,ALL ASSEMBLIES HAVING ANY !OF THE ABOVE DEFECTS SHALL DE RECORDED, BEE APPROVAL SHALL _E REQUIRED

FOR ALL REWORK oF SOLAR CELL ASSFM[_LIES,

007 CLEAN SOLAR PANEL !PER ITEM 503 PRIOR TO FIRST FUNCTIONAL TEST AND AS REQUIRED AFTER ALL TESTS

SPECIFIED 9Y THE BEE,

00_ FUNCTIONAL TEST THE ELECTRIICAL pERFORMANCE OF EACH CELL CIRCUIT UNDER REE DIRECTION-

OOg CONDUCTOR CUAT EXPiOSEDi WIRES OF ITEM 002 (CELL MODULE ASSEMBLY) PER ITEM 504 AREAS TO BE

COATED NEED NOT BE ! CLEIANED _ PRIOR TO APPLICATION UNLESS VISUALLY CO NTAMINATED" --

C_

F-_Ti

--!

DATIE

EATE ___J AF_c'_:_O¥ AL

DATE APPROVAL

CHI_CKEO BY

FORM LMSC 2q4R ABBREVIATIONS LC - LtFE CODE SEQ NO - SEQUENCE NUk;L;:[R ORGN = ORGANIZATION

LAST [_AC,; -- Tf_TAt DAG{_ [HI';, LIgT 2

APt:_tOVAL I.D ATE

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204 AR

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400 X

500 X

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I I "EFERENCEDES'ONAT'ON'I _O'EITEM

DESCRIPTION LC MATE RIAL/NOTES NO

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81348 Q_$571

1421331

LAC3851-010100

LAC30_I-02000O

LAC3210-OIO000

LAC3154-OlO000

LAC3211-020501

LAC357G-OIg993

AL PLATE ASSY

MOOUL_ ASSY

AOHESIVE:EPOXY

2 PROPANOL

WIPE ELEC

SOLtJER

STD PRACTICES

GEN ELEC SOLDER

BOND FLEX MOD

FIL _ ADH _OND

SOLAR PANEL

COATING SPEC

MARKING METHOD

8X8 CM CELL

SN63 WRMAP 2 OR 3

DWG PRACSSTD DEF

SOLDER PER

COAT PER

MARK PER

N03

N02

N01

N07

N09

NO 4

NOTE

NO, NOTE TEXT

QK NOTE LINE INDICATORS (A; Bl C; ETC,) ARE NO LONGER REQUIRED AND HAVE BEEN REMOVED

001 LOCAL NOTE: FILLET WIRES _( ITEM 204) TO DIELECTRIC SURFACE OF ITEM 001 PER ITEM 502 AS FOLLOWS:

I, SOLVENT CLEAN SURFACES TO OE FILLETED WITH ITEM 203 (2-PROPANOL) USING

pRE-CLEANFD Q-TIPS AND AIR DRY I0 MINUTES MINIMUM,

2, APPLY ITEM 200 IN A CONTROLLED MANNER,

3, CURE 48 HRS MINIMUM AT 75 ÷/- I0 DEGREES F, PRIOR TO HANDLING 6 7 DAYS MINIMUM

AT 75 +/- I0 DEGREES F, PRIOR TO TESTING,

002 LOCAL NOTE: BOND IITEM 002 TO ITEM 001 {AL PLATE ASSY) PER ITEM 501, APPLY ADHESIVE TO PRIMED

DIFLECTRIC SURFACE OF ITEM 001 (AL PLATE ASSY) IN A CONTR9LLED PATTERN AND THICHNESS SUCH

THAT THE FOLLOWING REQUIREMENTS ARE MET:

I, EACH OF THE 15 SOLAP CELLS SHALL qE BONDED TO THE SUBSTRATE THROUGH ] BONDING

SLOTS,

(NOTE CONTINUED NEXT PAGE)

I J

Z' E 1

b_u

NOTE

O0

C_ _.

r- {_1

................ AB_/_VIATIONS LC .... E CODE SEO NO : SEQUENCE NUMBE" ORGN - ORGANIZATION

I DATE

I DATE

LOCKHEED MISSILES & SPACE COMPANY, tNC I

RACT NUMBER

/

ITEM I LOCATION I

NoiS'IZONEI_JOT _:

QUANTI_ I_ER ASSEMBL_

NOTE Tf-XT

( COr_ T I NUE[) )

2.

4•

ESIGN ORGN DATE rAGE oF

T FSCM NUMBER. CCA/Cl NO.

I MEAS J NO. IDENT {:}_ESCRIPTION LC

I

IPL 1 ]XRr_1716_F_


REFERENCE DESIGNATION/

MATERIAL/NOTES

THE MINIMUM BONDING AREA 3HALL {_E 90% OF THE SLOT AREA FOR ALL SLOTS•

HONDLINE THICHNESS SHALL ._E .00% IN THICK,

THE CURED ADHESIVE SHALL NOT {}RIDGE IN MORE TF_AN ONE PLACE BETWEEN ANY 2ADJACENT SLOTS.

i NOTEITEM

NO

STO

NOTE

O0 _ LOCAL NOTE :

004 LOCAL _.iOTE:

005 LPJCAL _OTE:

SOLDER CIRCUIT WIRES ITE_ 204 TO ITEM 2 PER ITEM 500 USING ITEM 205,

MARK PART NO, PER ITEM 505 APPROX AS SHOWN.

SINGLE LEADS SHOWN SHOULD _E APPROx 3 FT. LONG,

005 EACH S(}LA_ CELL ASSEmbLy SHALL BE CHECKED FOP THE FOLLOWING DEFECTS BEFOPE TESTING:

i. DELA_INATION SHALL NOT EXCEED AN AkEA GREATER THAN .015 INCH PER CELL ASSEMBLY•

2• EXPOSED SILICON AS A RESULT OF CRACKED OR CHIPPED COVERSLIDES,3. CRACKED SOLAR CELLS

Oz

;or-

ALL ASSEMBLIES HAVING ANY IOF THE ABOVE DEFECTS SHALL BE RECORDED• REE APPROVAL SHALL BE REQUIREDFOP ALL REWORK OF SOLAIR CELL ASSEMBLIES.

I !

007 CLEAN S]LAR PANEL !pER ITEM 503 PRIOR TO FIRST FUNCTIONAL TEST AND AS REQUIRED AFTER ALL TESTSSPECIFIED BY THE RiEE, "

i

00_ FUNCTIONAL' TEsT TFffE ELECTRICAL PERFORMANCE OF EACH CELL CIRCUIT UNDER REE DIRECTION,

O0 <) CONDUCTOR COAT EXP;OSED I WIRES OF ITEM 002 (CELL MODULE ASSEMBLY) PER ITEM 504. AREAS TO BE

C_ATED NEFD NOT BE CLEANED PRIOR TO APPLICATION UNLESS VISUALLY CONTAMINATED,

L fPREPARED BY

! I

ro_M I._Sc ?s4_ F lu ABBF_EVIATIONS L( _ L:_F C-()C_E SEQ NO = SEQUENCE NUMBER ORGN : OR_ANI_ATION


I I I I I I I I I I ! ! I l I I i I

OF P_I_O_- QUAL!'TY'

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118

LMSC-D973480

APPE_rDIX B

119


LMSC-D973480

MODULE CAPACITANCE

AND RESISTANCE

I. Normal Orientation, 28 cells

Use 55 mils silica/epoxy on aluminum

Approx 2250 pf ,Approx 1.4 x I0II ohms

II. Upside Dowr_Orientation, 28 cells, 6 mil covers

Use 50 mils silica/epoxy on aluminum

Approx 225[_pf IApprox 1.5 x 10'I ohms

120


LMSC-D973480

NORMALCELL ORIENTATION

I ,

Silicone

Kapton

Epoxy

Silica

Materials Properties

MATERIAL DIELECTRIC CONSTANTiin Eo

4.3 to 3.4

3.9 to 3.5

5.2 to 2.8

3.8

VOLUMERESIVITYQ - cm

1014 to 1016

1015 to 1016

1014 to 1016

6.3 x 1014

DIELECTRIC STRENGTFvolts/mi]

400 to 700

310 to 560

4OO

II. Capacitance (~DC)

Find capacitance on a per cell basis (34.8 cm2)

Area 1

Copper interconnect}

2 mils Silicone

X mils Silica/Epoxy

Area 2 • Cell

I mil Kapton

CI _ _o Area _dl

2 mils Silicone

"///L/////-/_///// X mils Silica/Epoxy

Assume all _ average to 3.8_ o ]

3.8 * 8.85 x 10-14 Farads/cm * 34.8 cm2

(2 + X)mil * 0.00254 cm/mil

C2 _ _Eo Aread2

3.8 * 8.85 x 10-14 Farads/cm * 34.8 cm2

(3 + x)mil * 0.00254 cm/mil

Let _, be 25%of area, C2 ,: 75% of area

Capacitance = CI

Capacitance = C2

4607

(2 + X)mil pico farads

4607

(3 + x)mil pico farads

121

LOCKHEED MISSILES & SPACE COMPANY, INC,

LMSC-D973480

MODULE, UPSIDE 1]OWNORIENTATION

I .Material - same as "Normal Cell Orientation"

Assume all Es = 3.8E(, for silica/epoxy, silicones

II.

C =

Capacitance (-DC)

On a per cell basis

Cell

__ 3 mils silicone

........ 6 mils microscheet or quartz _ = 4.6

1015 Q-cmZlll/ll/l,"lll/l'IZ X mi I S Si Gi ca/Epoxy

3.9 x 3.85 x I0 -14 farads/cm * 34.8 cm2

- (3 + 6 + X) * 0.00254 cm/mil_Eo Area

4729 pf per cellC = (9 + X)

Module capacitance = 28 * cell capacitance

47292000 to 2500 pf = 28 * _) Pf

472971 to 89 = 9 + X

4729 9X = 71 to 89

I_ooo_o_oop_;x; _ _ _o. m_ _a_e_ox_IIII Resistance

1015 Q-cm (X + 9)mils * 0.00254 cm/milResistance = 28 cells * 34.8 cm_/cell

Resistance = 2.607 x 109 * (X + 9)mils

for X = 58

X = 44

R = 1.75 x 1011 _s

R = 1.38 x 1011 _s

122


LMSC-D973480

Cper cell = -25CI + .75C2 or = 1151-_+ X)mil s

Module capacitance = 28 * cell capacitance

So 2000 to 2500 pico farads = 28 *(._ 1151+ X)mils

or(1) (2) 3453 + 1151x + 6906 + 3453x71 to 89 =

6+5x+x 2

(I) X2 - 59.8 x -140.0 = 0 ÷ x = 62, -4.5 mils

X2 - 46.7X - 110.4 = 0 + x = 49, -4.5 mils

X = 62 mils at 2000 pfX = silica/epoxy X = 49 mils at 2500 pf

+3453 )(3 + X)mils

pico faradsper cell

3453I pico farads+ i3 + X)mils /

10359 + 4604x6+5x+x 2

III. Resistance

Assume average of >1015 Q-cm restivity for silica/epoxy

then,

Resistance = 1015 Q-cm * (X mils) * 0.00254 cm/mil28 cells * 34.8 cm2/cell

Resistance = 2.607 x 109 * (X mils)

for X = 62 mils R = 1.62 x 1011QsX = 49 mils R = 1.28 x 1011 _s

123


u

inat

PV MODULES FOR GROUND TESTING

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