PulseForge® Soldering on Low Temperature Substrates in ......standard lead-free solder pastes on...
Transcript of PulseForge® Soldering on Low Temperature Substrates in ......standard lead-free solder pastes on...
NovaCentrix400 Parker DriveSuite 1110Austin, Texas 78728T: 512-491-9500F: [email protected]
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PulseForge® Soldering on Low Temperature Substrates in Milliseconds PulseForge® Soldering: A collaboration between NovaCentrix and the Holst Centre. PulseForge® Soldering enables the soldering of standard lead-free solder pastes on low-cost, temperature sensitive substrates such as paper and PEN in milliseconds.
HOW IT WORKS
• Pulses of high intensity light are used in place of a reflow oven to heat the solder to its liquidus temperature in milliseconds without damaging the underlying substrate.
• Solder paste is heated indirectly through a light-absorbing layer and components.
• High contrast ratio absorption between layers allows for selective heating.
• High energy doses can be applied without damaging conductive tracks by protecting them with light-reflecting layers.
HOW IT IS BETTER
• Multiple types of components requiring different levels of heat can be soldered simultaneously.
• Processing is much faster than reflow soldering and is roll-to-roll compatible.
• Enables the use of standard lead-free solder pastes on temperature sensitive substrates – not possible with any other processing method.
LED Ball Grid Array
PulseForge Beam
Utilizing PulseForge® soldering technology, we were able to solder LEDs, resistors and capacitors onto conductive ink traces in a matter of milliseconds. These were soldered using traditional solder paste SAC 305.