Pulsed laser ablation opens up new borders for the manufacturing of solid PCD tools

Aerospace Innovation Forum, Bordeaux, 15.10.2015

Maximilian Warhanek, ETH ZurichPaul Butler-Smith, University of NottinghamClaus Dold, EWAG AGJean-Francois Bucourt, Diamoutils

Agenda

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Pulsed Laser Ablation (PLA)

DIPLAT project

Tangential laser processing

PLA-produced solid PCD tools

Tool performance benchmarking

PLA drill production

Ultrashort Pulsed Laser Ablation

Extremely high laser peak power

Short laser-material interaction time

Negligible thermal impact on workpiece

EWAG Laser Line 5-axes machine centre 50 Watt ps laser source Fully automated

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EWAG Laser Line ULTRA

Source: Semrock.com

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Ultrashort Pulsed Laser Ablation

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DIPLAT - Enabling advanced functionalities of Diamond and other ultra-hard materials by Integrated Pulsed Laser Ablation Technologies

EU 7 Framework Project, 8 partners, 6 countries Development and industrialization of diamond tool

processing technologies by PLA

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Polishing Grinding/Dressing Drilling/Milling15 October 2015 © DIPLAT

Laser Processing Kinematics on Rotary Tools

Radial Efficiency Geometrical flexibility

Tangential Precision / Repeatability Surface quality

Axial Influence of beam caustic

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Radial Laser Processing: 2.5D Volume Ablation

Material removal in layers Orthogonal beam incidence

+ Geometrical flexibility+ Laser power efficiency

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Source: CAM service

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Tangential Laser Processing

Material removal orthogonalto beam directionDefined geometrical limits

Final contour is defined only by the relative motion between laser and workpiecePrecisionRepeatability

[Timmer 2001]: True profiling

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Focus

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Tangential Laser Processing: Advantages

Surface quality No discretization errorLess trade-off between surface

quality and process time

Polishing effect[Tokarev et al. 1994]Composite materialsRoughing

Ra < 35nm on carbide

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Tangential Laser Processing Kinematics

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5 CNC axesX’,Y,Z’,B’,C’PrecisionFlexibility

3 Laser axesU,V,WDynamics

EWAG Laser Line machine kinematics

Tangential Laser Processing before DIPLAT

PCD Cutting inserts

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Source: EWAG AG Source: Claus Dold, 2013, Dissertation

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Tangential Laser Processing - DIPLAT

Solid PCD tools with complex geometries

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2mm drill M2.2 thread mill 2mm mill 2mm mill15 October 2015 © DIPLAT

Tool Benchmarking

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Comparison: Drilling tools by Pulsed Laser Ablation Electro Discharge Grinding CVD-D coating

Criteria Roughness Edge radii Wear behavior

EDG

CVD

PLA

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Tool Benchmarking: Surface Roughness

Roughness: Ra (λc=80 µm)) PLA EDG CVD Clearance face: 146 nm 219nm 217 nm Helix: 152 nm 242nm 249 nm Chisel edge: 166 nm - 280 nm Secondary edge: 138 nm - 208 nm

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500µm

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Tool Benchmarking: Edge Radii

Cutting edges Primary PLA: 9.1 µm (3.5 µm) EDG: 4.7 µm CVD: 18.7 µm

Primary at chisel edge PLA: 5.9 µm EDG: 4.4 µm CVD: 19.1 µm

Secondary PLA: 5.7 µm EDG: 4.6 µm CVD: 16.8 µm

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PLA

CVD

EDG

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Tool Benchmarking: Drilling Test

Material: Zirconium Oxide (1200HV) Feed: 4 mm/min, 3 mm/bore Spindle: 3500 rpm

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Tool Benchmarking: Drilling Chips

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Left:Coated toolBrittle chips

Right:PLA-toolDuctile chips

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Tool Benchmarking : Wear

Tool wear after 15 bores in Zirconia Oxide (1200HV)

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PLA-processed PCD tool CVD-D coated carbide tool15 October 2015 © DIPLAT

Tool Benchmarking: Drilling Test

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Material: CFRP Feed: 480 mm/min, 4 mm/bore Spindle: 8000 rpm

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Tool Benchmarking: Wear

Tool wear after 1000 bores in CFRP

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PLA-processed PCD tool EDG-processed PCD tool

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Tool Benchmarking: Drilling Test

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Material: CMC Feed: 480 mm/min, 3.2 mm/bore Spindle: 8000 rpm

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Tool Benchmarking: Wear

Tool wear after 300 bores in CMC

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PLA-processed PCD tool EDG-processed PCD tool

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Thank you for your kind attention!

Maximilian WarhanekInstitute of Machine Tools and ManufacturingETH Zurich, PFA H43Technoparkstrasse 1CH – 8005 ZürichPhone: +41 44 633 78 40warhanek@iwf.mavt.ethz.chwww.iwf.mavt.ethz.ch

Jean-Francois BucourtDiamoutils SAS

Parc Altaïs -32, rue AdrastéeF 74650 Chavanod

Phone: :+33 4 50 67 41 33jf.bucourt@diamoutils.comhttp://www.diamoutils.com