PROGRESS IN SPECTROSCOPIC ELLIPSOMETRY FOR THE IN … · Faculty of Electrical and Computer...
Transcript of PROGRESS IN SPECTROSCOPIC ELLIPSOMETRY FOR THE IN … · Faculty of Electrical and Computer...
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
Dresden – March 10, 2014
PROGRESS IN SPECTROSCOPIC ELLIPSOMETRY
FOR THE IN-SITU REAL-TIME INVESTIGATION
OF ATOMIC LAYER DEPOSITIONS
8th Workshop Ellipsometry by the Arbeitskreis Ellipsometrie (AKE) - Paul Drude e. V.
Marcel Junige, V. Sharma, D. Schmidt, M. Albert, M. Schubert, J. W. Bartha
phone: +49 351 463-37967 | - 34382
mobile: +49 163 5809233
fax: +49 351 436-37172
e-mail: [email protected]
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
4. Conclusion
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
4. Conclusion
Metrology issues
film thickness & quality
ALD growth behavior
reaction mechanisms
ALD benefits for nanoscale
film manufacturing
atomic-level thickness control
conformality in 3D structures
uniformity on large substrates
MOTIVATION
1
20
µm
M. Knaut et al.: JVST A 30, 01A151 (2012).
M. Knaut et al.: Microelectron. Eng. 107, 80 (2013).
D. Schmidt, E. Schubert, and M. Schubert:
Appl. Phys. Lett 100, 11912 (2012).
Ch. Wenger et al.:
18th WoDiM (Kinsale Co Cork, 2014).
– submitted
precursor A
reactant B
reaction byproducts
precursor A adsorbate
functional surface group
functionalized film surface
ATOMIC LAYER DEPOSITION
M. Leskelä , M. Ritala , and O. Nilsen: MRS Bulletin 36, 877 (2011).
G. N. Parsons, S. M. George, and M. Knez: MRS Bulletin 36, 865 (2011).
M. Ritala, and M. Leskelä; in: “Deposition and processing of thin films” 1, 103 (Academic Press, 2002).
half-reaction A
half-reaction B
purge or evacuation
purge or evacuation
2
material amount
time
ATOMIC LAYER DEPOSITION
V. Miikkulainen et al.: J. Appl. Phys. 113, 21301 (2013).
S. Elliott, and M. Shirazi: AVS 59th International Symposium & Exhibition (AVS, Tampa, 2012). 3
adsorbed
precursor
~ 1 − 𝑒−𝒌𝑨∙𝑡
~𝑒−𝒌𝑩∙𝑡
eliminated
ligands
condensed /
deposited
film
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
4. Conclusion
Industry-oriented ALD
class 10 cleanroom
capability for 300 mm wafers
rapid thermal annealing (RTA)
up to 1000 °C in vacuo
current processes:
Al2O3; Ta2O5;
TaNx(O,C); Ru(C); RuO2
4
transfer
chamber
ALD
metals
SE, QMS
PES SPM
handler
ALD
dielectrics
load-lock
Ar
QMS
SESE
MFC Ar
O2
MFC
MFC
ArMFC
ECPR
ArMFC
TBTDET
TMA
NH3
MFC
O3
QCM
Industry-oriented ALD
class 10 cleanroom
capability for 300 mm wafers
rapid thermal annealing (RTA)
up to 1000 °C in vacuo
current processes:
Al2O3; Ta2O5;
TaNx(O,C); Ru(C); RuO2
In-situ, on-site &
In-vacuo metrology
Spectroscopic Ellipsometry
Quadrupole Mass Spectrometry
Photoelectron Spectroscopy (X-ray, Ultra Violet)
Scanning Probe Microscopy (Atomic Force Microscopy,
Scanning Tunneling Microscopy)
Quartz Crystal Microbalancing
4
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
a) in-situ real-time SE algorithm
b) ALD growth behavior of Al2O3
c) ALD growth behavior of TaNx
4. Conclusion
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
a) in-situ real-time SE algorithm
b) ALD growth behavior of Al2O3
c) ALD growth behavior of TaNx
4. Conclusion
120
130
140
150
160
170
180
10
15
20
25
30
35
0 500 1000 1500 2000Δ
(°)
Ψ (
°)
wavelength (nm)
Ψ, Δ spectrum after 100 Al2O3 ALD cycles at 350 °C
5
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
spectroscopic
Ψ, Δ = ƒ(wavelength)
in situ
at the place
real-time
Ψ, Δ = ƒ(time)
6
in-situ real-time Spectroscopic Ellipsometry (irtSE) algorithm
acquire ellipsometric spectra
with the fastest possible sampling rate
calibrate ex-situ and in-situ elements
in the ellipsometer’s light path
evaluate the acquired ellipsometric spectra
time slice by time slice
post-process
the evaluated time-resolved result
⑦ reveal process parameter (inter)dependencies
of characteristic ALD growth values
⑤ fit modeled to experimental data
time slice by time slice
④ construct an optical model
③ acquire ellipsometric spectra
in situ and in real-time
with the fastest possible sampling rate
calibrate additional in-situ elements in the
ellipsometer’s light path at the vacuum reactor
calibrate the rotating compensator ellipsometer’s
basic components on the ex-situ stage
MSE ok? no
yes
uncalibrated or suspicious hardware
① fine correct experiment-specific deviations
② correct inaccuracies
due to the fastest possible data acquisition
⑥ extract the ALD characteristic curve
for the linear growth region
start of ALD processing sequence
end of ALD processing sequence
new sample of interest
6
Δ
Ψ
𝜽
offset in the
angle of incidence
SE FOR THE IN-SITU REAL-TIME INVESTIGATION OF ALD
7
in-plane & out-of-plane
window effects
various
temperature effects
additional in-situ elements in the ellipsometer’s light path at the vacuum reactor
timewise mean absolute deviation of Ψ, Δ at 450 nm
in dependence on effective acquisition time
comparing fast acquisition and high accuracy mode
8
155.2
155.3
155.4
155.5
155.6
155.7
155.8
0.1 10000Δ
at
450 n
m (
°)
time (s)
19.8
19.9
20.0
20.1
20.2
20.3
0.1 10000
Ψ a
t 450 n
m (°)
time (s)
24.0
24.1
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0 10 20 30 40 50 60
mea
n a
bso
lute
dev
iati
on
of Ψ
, Δ
(°)
effective acquisition time per ellipsometric spectrum (s)
fast acquisition Psi fast acquisition Delta
high accuracy Psi high accuracy Delta
Ψ, Δ at 450 nm over time
comparing fast acquisition
and high accuracy mode
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
timewise mean absolute deviation of optical layer thickness
in dependence on effective acquisition time
comparing fast acquisition and high accuracy mode, respectively
9
0.00
0.01
0.02
0 10 20 30 40 50 60
mea
n a
bso
lute
dev
iati
on
of
op
tica
l la
yer
th
ick
nes
s (n
m)
effective acquisition time per ellipsometric spectrum (s)
fast acquisition
high accuracy
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
MSE vs. effective acquisition time
comparing fast and high accuracy mode
10
0
5
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60
mea
n-s
qu
are
d e
rro
r
effective acquisition time per spectrum (s)
fast acquisition
high accuracy
J. A. Woollam et al., in Optical metrology, G. A. Al-Jumaily, Ed.
(SPIE Optical Engineering Press, Bellingham, 1999), pp. 3–28.
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
timewise mean Ψ, Δ error vs. effective acq. time
comparing fast and high accuracy mode
MSE vs. effective acquisition time
comparing fast and high accuracy mode
10
0
5
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60
mea
n-s
qu
are
d e
rro
r
effective acquisition time per spectrum (s)
fast acquisition
high accuracy
0.00
0.01
0.02
0.03
0.04
0.05
0 10 20 30 40 50 60
mea
n Ψ
, Δ
err
or
(°)
effective acquisition time per spectrum (s)
fast acquisition Psi fast acquisition Delta
high accuracy Psi high accuracy Delta
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
11
-1.0
-0.5
0.0
0.5
1.0
0 500 1000 1500 2000
Ψ, Δ
dif
fere
nce
(°)
wavelength (nm)
fast acquisition Psi fast acquisition Delta
-1.0
-0.5
0.0
0.5
1.0
0 500 1000 1500 2000
Ψ, Δ
dif
fere
nce
(°)
wavelength (nm)
high accuracy Psi high accuracy Delta
spectral Ψ, Δ difference (experiment – model)
in fast acquisition mode
spectral Ψ, Δ difference (experiment – model)
in high accuracy mode
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
spectral mean absolute deviation of Ψ, Δ difference (experiment – model)
vs. effective acquisition time comparing fast and high accuracy mode
12
0.00
0.05
0.10
0.15
0.20
0.25
0 10 20 30 40 50 60
mea
n a
bso
lute
dev
iati
on
of
Ψ, Δ
dif
fere
nce
(°)
effective acquisition time per ellipsometric spectrum (s)
fast acquisition Psi fast acquisition Delta
high accuracy Psi high accuracy Delta
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
0
5
10
275 285 295 305AL
D c
ycl
e in
dex
ALD process time (min)
8.5
9.0
9.5
10.0o
pti
cal
lay
er
thic
kn
ess
(nm
)
1st derivative
increment by 1
whenever
a threshold value
is exceeded
13
-5
0
5
gro
wth
ra
te
(nm
/ s)
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
TM
A
O3
TM
A
O3
14
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
Al2O3 optical layer thickness
after averaging over 10 cycles
Al2O3 optical layer thickness
in the course of one ALD cycle before averaging
0
1
2
3
0 60 120 180
op
tica
l la
yer
th
ick
nes
s (Å
)
time (s)
0
1
2
3
0 60 120 180
op
tica
l la
yer
th
ick
nes
s (Å
)
time (s)
timewise mean absolute deviation of averaged optical layer thickness
in dependence on the number of ALD cycles involved into averaging
15
IN-SITU REAL-TIME SPECTROSCOPIC ELLIPSOMETRY
0.0
0.1
0.2
0 1 2 3 4 5 6 7 8 9 10
mea
n a
bso
lute
dev
iati
on
of
av
era
ged
op
tica
l la
yer
th
ick
nes
s (Å
)
number of ALD cycles involved into averaging
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
a) in-situ real-time SE algorithm
b) ALD growth behavior of Al2O3
c) ALD growth behavior of TaNx
4. Conclusion
TM
A
O3
averaged optical layer thickness in the course of one Al2O3 ALD cycle
at varied deposition temperatures
16
ALD GROWTH BEHAVIOR OF AL2O3
0
1
2
3
0 60 120 180
op
tica
l la
yer
th
ick
nes
s (Å
)
time (s)
500 °C
400 °C
300 °C
200 °C
100 °C
V. Sharma: Student Research Project (Technische Universität Dresden, Dresden, 2014). – manuscript
extracted ALD characteristic values
in dependence on the actual deposition temperature
17 V. Sharma: Student Research Project (Technische Universität Dresden, Dresden, 2014). – manuscript
0
1
2
3
0 100 200 300 400 500
(a. u
.)
actual Si surface temperature (°C)
growth per cycle (Å)
adsorbed precursor
removed ligands
loss during purge 2
ALD GROWTH BEHAVIOR OF AL2O3
TB
TD
ET
NH
3
averaged optical layer thickness in the course of one TaNx ALD cycle
at varied deposition temperatures
18
0.0
0.1
0.2
0.3
0.4
0 50 100 150
op
tica
l la
yer
th
ick
nes
s (n
m)
time (s)
400 °C
250 °C
200 °C
150 °C
ALD GROWTH BEHAVIOR OF TANX
T. F. Walther: Diplomarbeit (Technische Universität Dresden, Dresden, 2014). – manuscript
Faculty of Electrical and Computer Engineering Institute of Semiconductors and Microsystems
OUTLINE
1. Introduction
2. Experimental setup
3. Results
4. Conclusion
in-situ real-time Spectroscopic Ellipsometry
with a sampling rate of 0.8 s per spectrum
and a thickness MAD below 0.01 nm
ALD characteristic curve
in the homogeneous growth region
containing both saturation curves
detailed insight into the
ALD growth behavior of Al2O3 and TaNx
in dependence on deposition temperature
CONCLUSION
assistance at scientific work, especially
Marion Geidel, Martin Knaut, Christoph Hossbach, Christoph Kubasch,
Tino Hoffmann, Keith B. Rodenhausen, Stefan Schöche,
Daniela Seiffert (geb. Schmidt), Steffen Strehle,
Thomas Wagner, Greg Pribil,
Eugene Irene, Maria Losurdo, Kurt Hingerl, Thomas Hingst,
Tillmann F. Walther, Ralf Tanner
financial support
The PhD project of Marcel Junige is funded by the European Social Fund (ESF) and the
Free State of Saxony of the Federal Republic of Germany 2011-2014 (contract number: 100077335).
ACKNOWLEDGMENT