Profile of IoT Promotion Department (FY2019)IoT primarily consists of five major elements:...

July 2019（1st Edition）

Profile of IoT Promotion Department (FY2019)Realizing Connected Society for an Open Future

MUZA Kawasaki Central Tower, 1310 Omiya-cho, Saiwai-kuKawasaki City, Kanagawa 212-8554 JapanTel: +81-44-520-5100 Fax: +81-44-520-5103URL: https://www.nedo.go.jp/english/index.html

National Research and Development Agency New Energy and Industrial Technology Development Organization

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About NEDO’s IoT Promotion Department The NEDO IoT Promotion Department promotes R&D projects in the fields of electronics, information and telecommunications, and manufacturing. In addition, it advances the development of cross-sectoral technologies required for an IoT society and contributes to the realization of an IoT society by specifying social problems, formulating necessary solutions, and providing these solutions to society.

※ For each of its projects, NEDO assigns a project manager (PM) who is responsible for planning and managing the overall progress of the project, including establishing the basic plan, constructing an implementation system, and implementing the project. In some cases, NEDO also assigns a sub-project manager (SPM) to assist the PM.

Project Management Policies of the IoT Promotion DepartmentUtilizing real data

Create an enabling environment for utilizing real data to realize a society where the real world and cyber space are deeply connected

Constructing cross-sectoral partnerships

Break through barriers between fields, organizations, and sectors to solve multi-faceted social problems

Maximizing network effectsControl the data collection and analysis cycle to increase its value

Strengthening multi-faceted security measures

Realize a robust society that is secure against cyberattacks

Shifting from centralized to distributed networks

Overcome the major problem of increases in energy consumption caused by explosive increases in the amount of data

Supporting commercialization and industrialization

Provide support to start-up companies in areas such as standardization and systemic reforms

Creating services based on cutting-edge devices

Accelerate social change by utilizing Japan’s strengths

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IoT primarily consists of five major elements: collection, storage, analysis, control, and security.The IoT Promotion Department promotes R&D projects addressing all five of these elements in an effort to realize an IoT society.

IoT’s Five Major Elements

Three Pillars of the IoT Promotion Department

AnalysisAI computing technologies for processing large amounts of dataMachine learning technologies for converting stored data into valuable information→ Enables the acquisition of necessary

knowledge within a practical time period

ControlTechnologies for controlling both hardware and software→ Enables the creation of value-added

services

StorageTechnologies for high-speed data storage with ultra-high capacity→ Enables writing, saving, and reading

large amounts of data at high speeds

SecurityHigh-speed/energy-efficient cryptography technologiesTechnologies for detecting and predicting cyberattacks→ Enables a safe and secure society

CollectionEdge computing technologiesTechnologies for miniaturized/energy-efficient devices→ Enables the acquisition of various

data types from real world contexts by installing sensors in a variety of locations

Devices/Computers

Manufacturing Systems

Numerical analysis Data

analysis

ServicesNumericalanalysis

Dataanalysis

Control Security

StorageCollection

Numericalanalysis ControlControl

Data analysis

Storage

Please refer to pages 23 to 24 for the definitions of terms denoted with an asterisk in this pamphlet.

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01 About NEDO’s IoT Promotion Department

04 IoT Promotion Department Projects

05 NEDO Projects 　Devices/Computers 　　Project for Innovative AI Chips and Next-Generation Computing Technology Development 　　Project for Accelerating Innovative AI Chip Development 　　�Development of Technologies for Super Energy-Efficient Optical Electronics Implementation

Systems 　　Novel Semiconductor Power Electronics Project for a Low Carbon Emission Society 　Systems 　　�Development Project on Data Sharing in Collaborative Areas and AI System to Achieve the

“Connected Industries” 　Manufacturing 　　�Development of Advanced Laser Processing with Intelligence Based on High-Brightness and

High-Efficiency Next-Generation Laser Technologies (TACMI Project) 　　Basic Technology Development Project for Metal Additive Manufacturing Parts

15 Cross-Ministerial Strategic Innovation Promotion Program (SIP) 　　Introduction to Cross-Ministerial Strategic Innovation Promotion Program 　　Cybersecurity for Critical Infrastructure 　　Cyber Physical Security for an IoT Society 　　Intelligent Knowledge Processing Infrastructure Integrating Physical and Virtual Domains

18 International Research and Development/Co-Funded Projects

19 Examples of Results

22 Public Relations Activities and Introduction to Project Results

23 DefinitionsofTerms

25 NEDO Background Information

Table of Contents

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IoT Promotion Department Projects

Project for Accelerating Innovative AI Chip Development

Development Project on Data Sharing in Collaborative Areas and AI System to Achieve the “Connected Industries”

Development of advanced laser processing with Intelligence based on high-brightness andhigh-efficiencynext-generationlasertechnologies(TACMIproject)

Cross-Ministerial Strategic Innovation Promotion Program (SIP) Second Phase/Cyber Physical Security for IoT Society

Cross-Ministerial Strategic Innovation Promotion Program (SIP) Second Phase/Intelligent Knowledge Processing Infrastructure Integrating Physical and Virtual Domains

Cross-Ministerial Strategic Innovation Promotion Program (SIP) First Phase/Cybersecurity for Critical Infrastructure

Novel Semiconductor Power Electronics Project for a Low Carbon Emission Society

(started in 2013)

Basic Technology Development Project for Metal Additive Manufacturing Parts

(until FY2023)

DevelopmentofTechnologiesforSuperEnergy-EfficientOpticalElectronicsImplementationSystems

(started in 2013)

2015 2016 2017 2018 2019 2020 2021 2022

Project for Innovative AI Chips and Next-Generation Computing Technology Development

(until FY2027)

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Devices/C

omputers


Using IoT and AI to strengthen competitiveness in Japan’s information technology industry

(1) Early practical application utilizing small and medium-sized venture businesses in addition to large enterprises

(2) Human resources development of young researchers through ambitious research and development(3) Short, medium, and long-term development periods and management according to the state of

technology

KeyPoints

PM:ShinyaOsugi,ChiefOfficerSPM:TakenoriEndo,ChiefOfficer

Background and objectivesIn order to create an IoT society for a post-Moore era* that is sure to arrive in the future, NEDO has been advancing basic research and development for enabling the efficient and sophisticated utilization of massive amounts of data since fiscal year (FY) 2016. As the arrival of an IoT society approaches, Japan is also confronting the new problem of increased energy consumption due to explosive increases in the volume of data. With the objectives of solving these social problems and reviving Japan’s information technology industry, NEDO is tackling research and development involving collaboration between industry, academia, and government entities as well as small and medium-sized ventures.

Research and development activitiesThis project tackles the development of the following technologies: “AI edge computing* technologies” which implement principal AI processing on the edge of network devices in order to reduce the volume of data; “next-generation computing technologies” which are disruptive computing technologies for dramatically reducing energy consumption; and “common basic technologies” that serve as the foundation for such technologies.

(1) Development of innovative AI edge computing technologies

(2) Development of next- generation computing technologies

Social implementation

(3) Development of cross-sectoral technologies for realizing advanced IoT society

SecurityCollaboration, application

Data collection

Data storage

Data analysis

Real world contexts

Overview of entire project

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Devices/Com

puters

●Project period: FY2016–FY2027 ●FY2019 project budget: 8.49 billion yen ●Project participants: 112 entities, including Renesas Electronics Corporation, The University of Tokyo, KDDI Corporation, Socionext Inc., Oki Electric Industry Co., Ltd., NEC Corporation, eSol Co., Ltd., Kumamoto University, Tokyo University of Science, Device & System Platform Development Center Co., Ltd., Fixstars Corporation, NSITEXE, Inc., National Institute of Advanced Industrial Science and Technology, Preferred Networks, Inc., Hitachi, Ltd., Nara Institute of Science and Technology, Photonics Electronics Technology Research Association, Waseda University, Osaka University, RIKEN (Institute of Physical and Chemical Research), Chuo University, IBM Japan, Toshiba Corporation, NMEMS Technology Research Organization, Tokyo Institute of Technology, Yokohama National University, Ritsumeikan University, ALAXALA Networks Corporation

(1) Development of innovative AI edge computing technologiesEnergy-saving technologies required in edge devices are an area of strength for Japan which possesses globally advanced technologies. By integrating this strength with ideas and mobility provided by small and medium-sized ventures, research and development is being conducted with regards to AI edge computing technologies while focusing on their early practical application in collaboration with industry, academia, and government entities.

(2) Development of next-generation computing technologies With a focus on a future post-Moore era, research and development is being conducted with regards to novel next-generation computing technologies, such as those modeled after the human brain. At a time when novel developments in new computing technologies are taking place, ambitious research and development over the medium- and long-term is being tackled which proactively involves highly motivated young researchers.

(3) Development of cross-sectoral technologies for realizing advanced IoT societyIn order to establish common basic technologies for an advanced IoT society, research and development is being conducted on technologies with respect to major IoT elements which support IoT flows such as collection, storage, analysis, and security. Sensors are installed in a variety of locations, and a variety of real-world data is collected and utilized in order to promote improvements in productivity and efficiency in areas such as production, distribution, and infrastructure.

Future prospectsThe results of the research and development of basic technologies for an advanced IoT society developed through this project will advance development for successive practical applications. In addition, advanced edge computing technologies using AI and other technologies and the novel, next-generation computing technologies for the post-Moore era will be used to work toward the establishment of technologies through collaboration between industry, academia, and government. NEDO’s objective is to revive Japan’s information technology industry and strengthen its competitiveness and achieve the early implementation of technologies developed for solving social challenges facing Japan.

Example of successful early practical applications of research and development results:real-time high-speed image processing system for high-speed moving objects

Example of latest R&D results:Development of superconductive quantum annealing machines*(Prototype quantum annealing chip)

Industrial robots

Captures images

in 1,000 frames per second

Deploying user applications

User applications

PC

Provision of camera unit and software development kit

High-speed moving objects

ControlEnables immediate execution of control function in response to image (e.g. by capturing specific colors)

HSV SDK

Camera unit

Software development kit

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Devices/C

omputers

Project for Accelerating Innovative AI Chip Development

Turning ideas for innovative AI chips into reality(1) Realizing ideas for AI chips(2) Developing an environment for accelerating AI chip development

In order to accelerate the advanced utilization and application of rapidly increased information flows resulting from the advent of an IoT society, it is essential to perform core information processing at the edges of the network. However, advanced skills and expensive design tools are required in order to develop AI chips that efficiently analyze data using limited resources, especially at the edges of the network.

Despite having innovative ideas, these requirements are particularly high hurdles for small and medium-sized businesses and venture companies newly seeking entry into the marketplace. For this reason, the IoT Promotion Department is implementing a project which supports design and development efforts aimed at the practical application of ideas formulated by small and medium-sized businesses and ventures.

KeyPoints

PM: Akinori Haza, Director

Specification design＊

Physical design＊Circuit design＊

Prototyping

Evaluation/verification

Ideas

AI chip

AI-equipped devices and services

AI chip design

Practical application

AI chip design base

Matching with businesses

Conceptual image depicting practical application of AI chip ideas

Background and objectives

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Devices/Com

puters

(1) Development toward practical application of ideas concerning AI chipsFor practical application of ideas concerning the AI chips possessed by private businesses and the like, circuit design such as logic design and the like, is performed using dedicated design tools, and its effectiveness is evaluated and verified by simulations and the like.Furthermore, in order to commercialize the verified results, the route toward commercialization is established by finding the business with which will cooperate.

(2) Development of common basic technology for accelerating AI chip developmentA base with a development environment for design, evaluation verification and the like of AI chips is provided as a common basic technology to accelerate the development of advanced AI chips. Also, we develop common technology to advance chip development. Furthermore, an environment is provided for developing human resources with the knowledge and knowhow for the utilization of IoT and AI technologies, in order to accelerate the realization of innovative ideas.

For (1), in addition to the five themes adopted in FY2018, new small and medium-sized businesses and venture companies possessing innovative ideas will be selected, and development for practical application will be advanced.With regards to (2), in addition to establishing a base in FY2018, research and development of common basic technologies for designing AI chips will be advanced. In addition, the base for developed basic technologies will be used by external entities to advance confirmation of their effectiveness. Moreover, human resources development will also start.

(1) Development toward the practical application of ideas for AI chips (assistance)

(2) Development of common basic technology for accelerating AI chip development (consignment)

Provision of design tools, knowledge, knowhow, and the like

Private businesses and other entities concerned with AI chip development- Chip design - Evaluation and verification of designed chips - Establishment of route toward commercialization for developed chips

Universities, research institutes, and other entities (creation of research base)- Provision and management of design tools, verification equipment, IPs necessary for circuit design, and other aspects- Provision of common basic technology

Universities, research institutes, etc. (development of basic technologies, human resources development)- Provision and management of design tools, verification equipment, IPs necessary for circuit design, and the like- Provision of common basic technology

Image of application of results

●Project period: FY2018–FY2022 ●FY2019 project budget: 1.68 billion yen ●Entrusted parties: National Institute of Advanced Industrial Science and Technology, The University of Tokyo ●Project participants: Tech Idea Co., Ltd.Synkom Co., Ltd., RayTron, INC., Trigence Semiconductor, Inc., Tohoku–MicroTec. Co., Ltd. (as of June 2019)

Research and development activities

Future prospects

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Devices/C

omputers

Development of Integrated Photonics-Electronics Convergence System Technology for Super low power consumuption

Faster speeds and reduced power consumption of IT equipment by implementing optoelectronics technology

(1) Development of key technologies to realize integrated optoelectronic circuits(2) Using key technologies to develop photonics electronics convergence technology

● Project period: FY2012–FY2021 ●FY2019 project budget: 1.74 billion yen ●Entrusted party: Photonics Electronics Technology Research Association

Due to the spread of cloud computing and AI, the volume of traffic at data centers is significantly increasing, and power requirements keep increasing rapidly as well. For this reason, it is desirable to realize technologies for IT equipment that can achieve both high-speed data processing and low power consumption. In this project, for the purpose of realizing energy-saving, high-speed, and miniaturized IT equipment, both fundamental technologies for a photonics-electronics convergence system and implementation technologies to realize the integration of optical and electronic circuits will be developed.

By using optical instead of electronic wiring to connect servers and by applying optoelectronic technologies, server power consumption will be reduced by 30%. Technologies in this field, in which Japanese industries lead global development, are expected to be widely applied all over the world to high-performance computers, network equipment, high-definition TV, and devices other than data center equipment.Based on the project’s technical development results, a commercial company was established in 2017.

(1) Development of fundamental implementation technologies

Basic technologies will be developed to make compact, high-speed, power-saving devices such as light sources, photodetectors, modulators, and waveguides, which are necessary for integrated conversions between electronic and optical signals

(2) Development of 　 systemization technologies

Chip-size optical I/O core devices and integrated optoelectronic interposers will be developed by applying the basic technologies described above, which can be used in IT equipment. To promote practical applications, this project will also promote international standardization efforts.

PM: Hiroaki Kurihara, Chief Officer

Optical wiring between servers Data center

KeyPoints



Future prospects

5mm Optical I/O core

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Devices/Com

puters

Novel Semiconductor Power Electronics Project for a Low Carbon Emission Society

Realizingfurtherimprovementsinenergyefficiencyandincreasesin performance of electrical equipment without wasting electricity

(1) Development of applied systems using next-generation devices(2) Development of new Si devices far different from the conventional technologies(3) Human resources development project with a view to the future

In the majority of electronic devices, power is controlled using power semiconductors, and improving performance and effectiveness of power conversion is extremely important for realizing a low-carbon-emission and energy-efficient society.The objective of this project is to improve the performance of the currently mainstream Si power semiconductors and to guide, to the level of practical application, technologies such as next-general material SiC* that are expected to realize significant reductions in power loss.

(1) Development of applied systems using next-generation devicesThe development of next-generation power devices using new materials such as SiC and the development and practical application of applied systems will be further advanced in applications such as industrial equipment, automobiles, and consumer goods.Examples: turbocharger system that is integrated generator and motor using inverter module with SiC power devices, development of large-diameter wafers for new material devices, development of devices with high-heat dissipation structures using diamonds, and development of high-frequency devices for high-performance, high-capacity wireless communication

(2) Development of new Si devices far different from the conventional technologiesNew structures that is not on conventional extension are being developed with regard toSi, which is currently a mainstream material that has started to exhibit performance limitations, with the goal of achieving higher performance.

(3) Human resources development project with a view to the futureHuman resources development capable of promoting applied technology of next-generation power electronics will be conducted with seminars involving hands-on not only lectures but also practice, for researchers and other persons at companies that have not received specialist education concerning power electronics.

PM:ShigeoNomura,ChiefOfficer

●Project period: FY2014–FY2019 ●FY2019 project: 600 million yen ●Entrusted parties: The University of Tokyo, Tokyo Institute of Technology, Mitsubishi Electric Corporation, National Institute of Advanced Industrial Science and Technology, Sumitomo Electric Industries, Ltd., Nagoya University, TAIYO NIPPON SANSO CORPORATION,, Nagoya Institute of Technology, University of Tsukuba, Osaka University, Yokohama National University ●Project participants: ACR Co., Ltd., Mitsubishi Chemical Corporation,The Japan Steel Works, LTD.

The objective is to achieve unprecedented energy-saving effects by FY2020 using ultra-high-efficient energy realized by the application of power electronics technologies.Furthermore, establishing differentiating technologies and creating new application technologies in next generation power devices and new "Winning formulae" within international competition will maintain and expand global market share of Japanese businesses in relevant markets.

Conceptual image of advancements in practical applications of next-generation power devicesPower devices using new materials

Industrial equipment Consumer

productsAutomobiles

KeyPoints



Future prospects

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Systems

Development Project on Data Sharing in Collaborative Areas and AI System to Achieve the “Connected Industries”

Support for ventures active globally through a beneficial cycle of data sharing and utilization

(1) Development of AI systems having global market competitiveness(2) Development of a data infrastructure for expanding collaborative areas(3) Establishment of business environments that promote data sharing and utilization

To realize a virtuous cycle for sharing and utilizing data to expand collaborative areas, this project is designed to provide support for the development of new AI services and a data infrastructure and to establish business environments so that development activities will continue to be further promoted. The targets of this project are acquiring a market gain of 300 billion yen and producing unicorn companies that are globally active. At least five new listed companies are expected to experience the same type of growth.

PM: Chief Officer, Yoshihiro Kudo

Cross-industrial AI systems and industry-shared data platforms mainly for the five primary fields of Connected Industries* that can be rolled out domestically and internationally will be developed to facilitate data ecosystems friendly to startups and other new players. Moreover, cooperative development of AI systems and a data infrastructure will be conducted in the project. Furthermore, several survey projects will be conducted to improve business environments for a virtuous cycle of sharing and utilizing data.

(1) Development of cross-industrial AI systemsCross-industrial AI Software as a Service (SaaS) systems that can be used by multiple companies will be developed to provide new value to the world through cutting-edge technology and business models. The AI SaaS aims to provide solutions that can be expected to grow rapidly over a short period of time.

(2) Development of industry-shared data infrastructureIndustry-shared data infrastructure with sophisticated approaches, such as real-time data processing and blockchain* technology, will be developed for domestic and international platform development and also for linking between several existing and newly developed platforms. By considering data standardization and interoperability, platforms will be developed to collect various types of data from multiple industries and effectively utilize such data.

(3) Establishing business environments for a virtuous cycle of data sharing and utilizationTo ensure all companies are able to utilize and share data effectively, several survey projects will be conducted. For example: - Designing architecture as the fundamental infrastructure of society- Methods for fostering human resources that can utilize AI technology to solve problems- New governance models for a digital society

KeyPoints



12

Systems

●Project period: FY2019–FY2021 ●FY2019 project budget: 3.04 billion yen ●Entrusted parties and project participants: Under investigation (as of July 2019)

Comprehensive initiatives through research and development projects and support projects for establishing project environments will create best practices in the virtuous cycle of sharing and utilizing data, in which AI systems and data platforms are unified. This will promote the creation of value through the linkage of a broad array of data for both domestic and international companies.

Research, development, and establishment of related environments will be conducted integrally in order to advance and maximize the social implementation of project results

Research and development

Improving business environments

Enhancement of data utilizationin collaborative areas

AI

Data

Cross-industrial globalAI SaaS utilizing

cutting-edge technologiesVirtuous cycle of data sharing and utilization

Cross-industrial AI systems

Industry-shared data infrastructure

Real data(Company A)

Real data(Company B)

Overseas data PF

Other industry data PF

Architecture Create sketches to realize Society 5.0 (digitization and datatization + connection + processing of data without human intermediaries), etc.

Fostering ofhuman resources

Program for fostering human resources that can utilize AI to solve problems: AI QUEST - Developing curricula for gaining practical abilities in data science, operation of (PBL), and evaluating the effect of the curricula

Governance Investigate new forms of governance that do not impede innovation and new forms of societies based on trust, convey new concepts at G20, etc.

DX promotion in private sector

Establish visualized indicators that induce the promotion of DX and IT system innovations, and investigate diagnostic methods

DX promotion in government

Establish a cloud security standard that enables continuous use of safe and secure services

Improvement of domesticbusiness environments

Ensure compatibility between privacy protection technologies and relevant laws in order to improve business environments for data utilization

● �Conceptual Image of Development Project on Data Sharing in Collaborative Areas and AI System to Achieve the “Connected Industries”

Future prospects

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Manufacturing

Development of advanced laser processing with Intelligence based on high-brightness and high-efficiency next-generation laser technologies (TACMI project)

Developing next-generation laser processing technologies suitable for various materials(1) Making the most of Japanese expertise to develop laser light sources(2) Establishment of common base for laser processing technologies satisfying user needs

●Project period: FY2016–FY2020 ●FY2019 project budget: 2.25 billion yen ●Entrusted parties: The University of Tokyo, Mitsubishi Electric Corporation, Osaka University, Spectronix Entrusted ton, Hamamatsu Photonics K.K., Gigaphoton Inc. National Institute of Advanced Industrial Science and Technology, Shimadzu Corporation, Kyoto University, Stanley Electric Co., Ltd., RIKEN (Institute of Physical and Chemical Research), Yamaguchi University, Panasonic Corporation , Panasonic Smart Factory Solutions Co., Ltd., Tokyo Institute of Technology, Fuji Xerox Co., Ltd., Chiba Institute of Technology, Kimmon Koha Co., Ltd., Institute for Laser Technology, High Energy Accelerator Research Organization

At future manufacturing sites, machine tools are expected to become increasingly automated and linked across production facilities by utilizing IoT and AI. Laser processing is expected to be the core technology underpinning future manufacturing lines because lasers are easy to control digitally. However, conventional laser processing has disadvantages with respect to processing speed, finishing quality, and energy efficiency. This project aims to develop novel high-brightness (high-output power and high beam quality) and high-efficiency laser technologies and processing technologies utilizing lasers and spread these technologies to society.

NEDO will continue pioneering the development of high-performance and high-quality next-generation laser processing technologies that are in high demand among manufacturers. In addition to research activities addressing each of the above themes, NEDO will also promote collaborative activities among project participants to contribute to reduced energy consumption and strengthen the competitiveness of the Japanese manufacturing industry.

PM:RyoKakinuma,ChiefOfficer

In order to realize next-generation laser processing for producing high value-added products, the five research themes described below are being addressed by focusing on three key approaches: high energy absorption rates in unexplored wavelength regions, high-quality processing with non-thermal effects using short pulse irradiation, and high-efficiency laser diodes.(1) Making electronic device manufacturing

easier than ever!NEDO aims to develop non-thermal processing technologies using picosecond deep ultraviolet (UV) pulse lasers in order to enable high-quality processing in the order of microns.

(2) Making aircrafts and automobiles more eco-friendly!

NEDO aims to develop world-class high-energy pulse lasers to enable reinforcing the materials used for aircraft and automobiles in order to contribute the weight reduction and energy conservation of them.

(3) Endeavors toward future laser processing!NEDO aims to develop innovative high-efficiency and small-sized laser light sources for laser processing in next-next-generation.

(4) Optimizing laser processing more than ever!NEDO aims to establish laser processing platforms of a data mining system for deriving optimal processing conditions (Recipes).

(5) Advanced short-wavelength lasers open the door of high-efficiency processing!NEDO aims to develop processing technologies using high-brightness lasers in the blue to ultraviolet wavelengths and achieve practical application within a short period of time.

Prediction

Databases

Deep learning

Controlling parameters

Simulation

Laser processing system

Laser

Data acquisition

Analysis

Measurement/evaluation

Processing

CPS

Controlling parameters

CPS

CPS

Cyber system

Physical system

Recipes for processingUser needs

Toward Society 5.0

KeyPoints



Future prospects

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Manufacturing

Basic Technology Development Project for Metal Additive Manufacturing Parts

Promote the development of components and the like using additive manufacturing technologies(1) Development of technologies for predicting defects by elucidating melting and solidifying

phenomena(2) Development of high-performance monitoring and feedback control functions(3) Development of development and evaluation methods for producing additive manufacturing

products

●Project period: FY2019–FY2023 ●FY2019 project budget: 150 million yen ● Entrusted party: Technology Research Association for Future Additive Manufacturing (TRAFAM)

Additive manufacturing technologies, which are gradually becoming more common in the manufacturing of metal components, have problems concerning the costs and time required to maintain the reproducibility of quality and create new developments in high value-added complex shapes, highly functional components, and functional alloy molding. This project aims to maintain the high quality of metal additive manufacturing products and improve development efficiency by elucidating the phenomena of melting and solidifying in metal additive manufacturing.

NEDO aims to reduce the development time of additive manufacturing components to one-fifth of the current time by improving the quality of component molding and the like manufactured using additive manufacturing, ensuring the stability of repeated operations during the molding process, and establishing development and evaluation techniques for creating additive manufacturing components.This project also aims for a 10% introduction of metal 3D printers* equipped with this system to domestic fabrication companies by FY2030.

PM: Shinichiro Kawabata, Chief Research Officer

The following activities will be carried out on powder bed fusion methods using laser beams and electron beams for metal additive manufacturing:(1) Development of technologies for predicting defects by elucidating the phenomena of melting and solidifying

Monitoring and measuring the causes of defects, such as metal vapor, metal scattering (spattering), temperature distribution, and the state of being covered in powder before molding in order to elucidate the relationship between molding conditions and the causes of defects. Moreover, this project aims to achieve molded products that are free of defects and improve the reproducibility of such products by constructing physical models of the processes of melting and solidifying and using simulations of powder-covered states and the processes of melting and solidifying to elucidate the mechanisms of defects.

(2) Development of high-performance monitoring and feedback control functionsNEDO will develop component technologies for incorporating high-performance monitoring and feedback control technologies for in-process use.

(3) Development of development and evaluation methods for producing additive manufacturing productsMolding samples are prototyped and evaluated using defect prediction and monitoring feedback control functions. NEDO will research optimal molding conditions, structural analysis, and material properties to develop development and evaluation techniques for efficient product development of metal components using additive manufacturing technologies.

3D-CAD data

Molding Defect prediction

Improved production efficiency (reduced time and cost)

In-process monitoring/feedback control Finished products

Product quality maintained

Trial and error/experience requiredFinished products Current state

Image after application

X-ray CT examination

Powder-covered state

Solidified surface state

Occurrence of defects

KeyPoints



Future prospects

15

The SIP is a newly established program managed by the Japanese Council for Science, Technology and Innovation. For this program, the Council provides management oversight beyond the frameworks of government ministries and traditional disciplines to realize greater scientific and technological innovation.What makes this program unique is that its program directors (PDs) take the initiative to promote program activities with cross-ministerial involvement.

Transcending barriers between ministries and disciplines　　　to realize a Japan that can compete on a global scale

The project’s objective is to demonstrate its R&D results at the 2020 Olympics and Paralympics through the implementation of the results in critical infrastructure areas such as communications/broadcasting, energy, and transportation. Another objective of this project’s R&D is to help strengthen the competitiveness of the Japanese manufacturing industry.

Future prospects

● Project period: FY2015–FY2019 ● FY2019 project budget: 1.84 billion yen ● Entrusted parties: Nippon Telegraph and Telephone Corporation, Fujitsu Limited, Mitsubishi Electric Corporation, Hitachi, Ltd., ALAXALA Networks Corporation, Control System Security Center, Renesas Electronics Corporation, Electronic Commerce Security Technology Research Association, Panasonic Corporation, National Institute of Advanced Industrial Science and Technology, Keio University, Nagoya Institute of Technology

Cross-Ministerial Strategic Innovation Promotion Program (SIP) First Phase: Cybersecurity for Critical Infrastructure

In recent years, the threat of cyberattacks on critical infrastructure in areas such as communications/broadcasting, energy, and transportation has become a reality, and for Japan in particular, which is hosting the 2020 Olympics and Paralympics, security measures to address such threats are an urgent issue. This project aims to create a secure social infrastructure which ensures the cybersecurity of critical infrastructure and stimulates industry by improving the security technologies of national assets and by developing human resources.


Research and development is being conducted with regards to security confirmation technologies for control/communication devices and operations monitoring/analysis technologies for control/communication devices and control networks, which will also contribute to ensuring security in IoT systems expected to spread and expand in the future. This research and development also strives to: investigate the methods and mechanisms for confirming suitability in support of introducing technology, realize a common platform that transcends different fields, and address human resources development with regards to security.


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Overview of plan

Coretechnologies

Socialimplementationtechnologies

Social implementation(initial)Demonstration usingequipment forOlympics and Paralympics

Social implementation(future)Expansion to criticalinfrastructure insideand outside Japan

Initiatives in SIP

(a1)Securityconfirmationtechnologies

(a2)Operationsmonitoringand analysistechnologies

(a3)Defensetechnologies

(a4)IoT securityconfirmationtechnologies

Verification

(b1) Methods of suitabilityconfirmation

(b2) Information-sharingplatform technologies

Information-sharing toolsand rules

(b3) Evaluation and verificationplatform technologies

Verificationmanual

(b4) Development of humanresources for cybersecurity

Emulationenvironments

Curriculum Practicaltraining

(b5) Social implementationfor IoT

To the IoT age

Control networks

Critical infrastructure companies

Information sharing within fields

Information sharedwithin companies

Control networks

Control networks

Control networks

Operators

Operators

Operators

Operators

Co

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Overview ofStrategic Innovation Promotion Program (SIP)

Aiming to establish the safest and most secure social infrastructure in the worldKeyPoints

(1) Measures against cyberattacks on critical infrastructure(2) Demonstration of the effects of introduction when using new and old systems are used together(3) Strengthening security to have advantages in international competitivenessPD:AtsuhiroGotoPresident,InstituteofInformationSecurityPM:YoshifumiYamagata,ChiefOfficer

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Cross-Ministerial Strategic Innovation Promotion Program (SIP) Second Phase: Cyber Physical Security for IoT Society

With the spread and expansion of IoT, supply chain* risks of illicit programs being added to products and services have manifested, as have risks of modifications to products and services during the manufacturing and transport process. This project aims to enhance an IoT society’s security by establishing cyber-physical security countermeasure infrastructure that protects entire large-scale supply chains including small and medium-sized businesses and IoT systems and services. Incorporated into operating supply chains in a practical manner, this infrastructure protects and strengthens an IoT-based society against cyber threats.

Demonstration tests of developed technologies will be carried out and test results will be fed back into research and development activities. In pursuit of early practical application in society, the cycle of testing and feedback will be repeated. At the same time, the use of developed infrastructure will be promoted across supply chains, including small and medium-sized companies. The aim of promoting the use of developed technology is to disseminate products, services, and systems that have a high level of security ensured by Japanese technology.

Future prospects

●Project period: FY2018–FY2022 ● FY2019 project budget: 2.2 billion yen ● Entrusted parties: Electronic Commerce Security Technology Research Association, National Institute of Advanced Industrial Science and Technology, Nippon Telegraph and Telephone Corporation, NEC Corporation, Hitachi, Ltd., KDDI Research, Inc., Fujitsu Limited, Mitsubishi Electric Corporation


Aiming to establish resilient security infrastructure to support Society 5.0KeyPoints

(1) Creating/confirming trustworthiness(2) Constructing/circulating a trustworthy chain(3) Verifying/maintaining a trustworthy chain

PD: Atsuhiro Goto President, Institute of Information Security

PM:MitsunoriIwamuro,ChiefOfficer

Research and development activities will be carried out to ensure and confirm the security of IoT devices and all component elements in the supply chain. A trustworthy chain will also be constructed and maintained. Ultimately, the security of IoT systems, services, and entire supply chains will be protected.

(1) Research and development of technologies for creating/verifying trustThe security of individual IoT devices and services needs to be improved. Research and development activities will be carried out on technology for creating and confirming trustworthiness to ensure the security of various IoT systems and services and an entire supply chain.

(2) Research and development of technologies for constructing and circulating a trustworthy chainResearch and development activities will be carried out on technology to construct a trustworthy chain for IoT systems, services, and supply chains. It will enable information to be distributed in a secure manner and ensure that security is maintained in various social infrastructures and services as well as wide-ranging supply chains.

(3) Research and development of technologies for verifying and maintaining a trustworthy chainResearch and development will be conducted on technologies that make it possible to verify and maintain the safe operation of a trustworthy chain in IoT systems and services and supply chains.

Service

FREE

A B C

IoT

Service

Creation/confirmationof trustworthiness

Construction/distribution of atrustworthy chain

Verification/maintenanceof a trustworthy chain

Organizations thatperform checks, etc. Trustworthiness

list informationVulnerability, incidentand threat information

Procedures

Software

FreewareAuthenticity

determination

Trustworthy chainconstruction

Datadistribution

Analysis

OEMservice

operators

Dat

a

Co

ntro

l

Trustworthy chainverification

Cyberspace

Maintenanceproviders

MSS

Incidentdetection

Analysis

Countermeasures

Physical spacesIndustries

Electrical power

Systemization

Connected cars

IoT systemsComprised of

multiple IoT devicesworking in conjunction

Products

Distribution

Firmware

Components

Trust base

Production Distribution Construction Operation

Software

IoT systemsComponents


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Cross-Ministerial Strategic Innovation Promotion Program (SIP) Second Phase:Intelligent Knowledge Processing Infrastructure Integrating Physical and Virtual Domains

The high costs of physical space processing and insufficient IT human resources in Japan are extremely severe problems with regard to the implementation of Society 5.0. This research aims to drastically reduce the costs of processing in physical spaces and invigorate industries encompassing small and medium-sized venture businesses. This research aims to do this by developing and socially implementing platforms (Edge computing platforms) with an emphasis on Edge, which make it easy to link between cyber and physical spaces.

(1) Actuation technology with guaranteed real-time operation(2) Edge computing infrastructure, AI processing, construction/operation technologies(3) Digitization and metadata creation technologies for large-volume, non-structured site data(4) Robust wireless communication technologies/security(5) Advanced sensing (flexible, batteryless, super high sensitivity)(6) Construction and social implementation technologies for spreading and establishing the above technologies

Research and development will be conducted regarding the social implementation of technologies, such as robots and other systems that perform real-time processing and other activities that were previously impossible in conventional cloud applications. The aim of this research and development is to link cyber and physical spaces that ensure the safety, reliability and energy efficiency of IoT systems in society. The effectiveness of the developed technologies will then be demonstrated in manufacturing and other industries with the aim of moving into society 5.0. Real-world examples of the application of IoT systems to society will encourage participation from the private sector and help promote the construction of these systems by small and medium-sized venture businesses and user companies. This is necessary because these types of companies have typically experienced difficulties in participating in this area.

Future prospects


● Project period: FY2018–FY2022 ● Entrusted parties: Kyushu University, NEC Corporation, National Institute of Information and Communications Technology, Sanritz Automation Co., Ltd., Mobile Techno Corp., Tohoku University, Keihin Corporation, Keysight Technologies International, Toshiba Corporation, Mitsui Chemicals, Inc., Ritsumeikan University, Yamagata University, Chitose Robotics Inc., Man-Machine Synergy Effectors, Inc., Panasonic Corporation, Suzuki Motor Corporation, National Institute of Advanced Industrial Science and Technology, The University of Tokyo, Dai Nippon Printing Co., Ltd., Ricoh Co., Ltd., CONNECTEC JAPAN Corporation


Contributing to the realization of Society 5.0 with technical development emphasizing Edge computing

(1) Common Edge computing platform technology to develop IoT solutions(2) Technologies for innovative sensors and low-energy IoT chips(3) Technology to disseminate IoT devices for realizing Society 5.0

KeyPoints

PD: Hideyuki Saso, Senior Fellow at Fujitsu Laboratories, Ltd. PM: Yasuhiro Fujino, Chief Researcher

Innovative sensors

I. Common Edge computing platformtechnology to develop IoT solutions

II. Technologies for innovativesensors and low-energy IoT chips

Intelligent Knowledge Processing InfrastructureIntegrating Physical and Virtual Domains

Low-energy IoT chips

Coordination with cyberspace

Large-volume,multi-typesensor control

Learning-type dispersalmulti-modal analysis

Local connectioncontrol

Large-volume,multi-type

actuator control

Large-volume,multi-type collection,

storage, and processing

Linkage

LinkageLinkage Social implementation

Supply

Autonomousgrowth

III. Technology to disseminate IoT devices for realizing Society 5.0

Production Foodstuffs TransportationOther services

Cyberspace

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● Project period: (1) FY2017–FY2019 (2) FY2017–FY2019 (3) FY2018–FY2019 ● FY2019 project budget: (1) 50 million yen (2) 50 million yen (3) 50 million yen ● Project participants (1) Oxide Corporation (2) Oxide Corporation (3) JRC Nihon Musen

International Joint Research and Development/ Co-funding Projects

In this project, NEDO is implementing cooperative research and development efforts by collaborating with R&D management institutions outside Japan via co-funding schemes and the formation of complementary win-win relationships between Japanese and foreign companies. The project’s objective is to support the expansion of Japanese technologies into foreign markets and quickly strengthen Japan’s industrial competitiveness.

Promot ing ear ly pract i ca l appl i ca t ions through collaborations with entities outside Japan

(1) Promotion of global technology research management (2) Support for international expansion through unified public/

private efforts (3) Building win-win relationships with institutions outside Japan

KeyPoints

PM:KenGomyo,ChiefOfficerMiiko Mizutani



In conjunction with the German company Menlo Systems, this theme is advancing the development of analytical systems by means of ultraviolet and mid-infrared light sources which makes it possible to perform measurements in real-time.Implementing dual-optical frequency comb spectroscopy*, which conventionally had only been implemented with near-infrared light, with ultraviolet and mid-infrared light can be used to enable real-time high-precision analyses such as bio-analysis and gas analysis.

PC

Opticalfrequencycomb 1frep1

Synthesizers

Nearinfrared Frequency

conversiondevice

Opticalfrequencycomb 2frep2

Nearinfrared Frequency

conversiondevice

Mid-infrared

Mid-infrared

Ultraviolet

Sample

Dataprocessor

Aperiodically poledfrequency conversiondevices

Ultraviolet

In conjunction with the Israeli company Neragon, this theme is advancing the development of a portable wireless communication system to ensure security and safety in the public and private sectors by using LTE communication technologies. The transportable base station fulfills the critical needs of highly secure and real-time processing communication networks enabling large volume of data sharing and communication primarily images in the event of disasters.

Connectedsites

Site A

Site B

Site C

(1) Using deep ultraviolet laser light sources to accelerate semiconductor inspections

(2)Usingdual-opticalfrequencycombspectroscopyfortheexplorationofnewanalyticalfields

(3) Using portable LTE communication systems capable of establishing communication environments in the event of a disaster

In conjunction with the French company Lumibird, this theme is advancing the development of deep ultraviolet laser light sources to be used for the high-speed measurement of defects and foreign materials found in wafers during the manufacturing process of semiconductors.By using short-wavelength, high-output deep ultraviolet laser light sources, a laser system for semiconductor inspection equipment is produced that makes it possible to perform high-speed control laser light output without damaging the wafer.

Detection of defects insemiconductor wafers

Wavelength conversioncrystals

266 nmdeepultravioletlaser light

1064 nminfraredlaser light

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Devices/C

omputers

〉〉〉〉〉 Results Example 1

Starting a free information processing service utilizing CMOS annealing machines


With the arrival of the IoT society, demand has increased for services that can search for optimal solutions from countless combinations of information in areas such as transportation, medicine, drug discovery, and finance. Technologies capable of high-speed, energy-efficient informational computation of large and complex data can be called the key technologies of next-generation information processing.

During this project, technology was developed for computational infrastructure using annealing machines. These machines performed computational processing of combinatorial optimization problems faster and more efficiently than conventional computing technologies. Some examples of the technologies developed include the smallest CMOS annealing machines in production by Hitachi, Ltd. The company also started a free-to-use service called “Annealing Cloud Web”, which can perform information processing in a cloud environment using the technology developed.

Results


Providing Annealing Cloud Web free of charge helps promote the use of annealing machines. The project was also successful in creating the world’s smallest annealing machine among those currently released. It is now anticipated that the application of the annealing machine will be expanded in the future to cameras, sensors and other IoT devices used at the edge of networks as well as in cloud environments. The widespread use of this technology can be expected to help establish a highly reliable system of information processing. For example, an automated driving system could be significantly affected by even a few seconds of delay in communication with the cloud, so sophisticated information processing on both sides of clouds and edges would help ensure safety and reliability.

Areas of practical application

● Project period: FY2016–FY2020

Hitachi, Ltd.

World’s smallest CMOS annealing machine

Image of Annealing Cloud Web website

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Systems


Implementing a demonstrative test of supply chain information-sharing using RFID

Groundwork Project for Creating Industrial Models Using IoT

Results


NEDO and teams that had participated in ideathons*/hackathons* discussed the types of services that could be realized in households using products with RFID. As a result, based on the theme of “A Future of Connected People, Things, and

Households,” a variety of concrete ideas about how to utilize RFID were cultivated, for example, a smart trash bin for checking waste segregation and smart recipes to support proper seasoning use. For details, please view the concept video by accessing the URL or by using the QR code on the left.


● Project period: FY2018

Dai Nippon Printing Co., Ltd.

Concept video: https://youtu.be/mR6lMZma9L4

Recording of test: https://youtu.be/aWaXMFGyOps

From February 12 to 28, 2019, the Ministry of Economy, Trade and Industry, Dai Nippon Printing Co., Ltd., and NEDO carried out a demonstrative test on an information-sharing system using RFID. Manufacturers of foodstuffs and daily commodities, wholesalers, convenience stores, drugstores, and ordinary householders who acted as monitors also participated in the test to verify the visualization of stock information and the traceability of product information from manufacturers to wholesalers and retailers. The test also included verification of the optimization of advertisements a n d d y n a m i c p r i c i n g * a t participating stores, where the information-sharing system was connected to external systems such as smartphone messaging apps used by consumers. To see a video of the test, access the

following QR code or URL.

Logs ofcustomer behavior

Electronic receipts In-store behavior data

Information-sharing systemResults of attaching RFID Shipment information Receipt information

Consumption/sell-by-date informationSales information Stock information

Customer behaviordata that does not

identify any specificindividuals

EPCIS*-compliant

data

Customer behavior informationacquired from IoT-related devices

inside the store

Ordinary householderswho acted as monitors

that verify acquisition of product behavior information

*Acquisition ofcustomer behavior

information thatdoes not identify

any specific individuals

Product movementinformation

acquired from RFID

[Manufacturers] Wholesale/[distribution centers] [Retailers] [Consumers]

EPCIS-compliant

data

EPCIS-compliant

data

EPCIS-compliant

data

Image of information-sharing system

Manufacturers, wholesalers, and retailers involved in consumption and distribution inside Japan are confronted with labor shortages and increasing labor costs and face various other challenges such as food loss and product returns. In order to solve these problems, a demonstrative test was conducted because attaching RFID to each product means that various companies in the supply chain can expect to realize a system that can centrally share and visualize distribution information and the like throughout all operators in the supply chain.

RFID

21

Manufacturing

Multifunctional processing machine with high-brightness blue diode laser


Developing the world’s first multifunctional machine with high-brightness blue diode lasers

Development of Advanced Laser Processing with Intelligence Based on High-Brightness and High-EfficiencyNext-GenerationLaserTechnologies(TACMIProject)

A blue diode laser has a high absorption rate on metals and is optimal for processing gold and copper, which are difficult to process with the conventional near-infrared lasers. However, due to the problem of achieving high brightness, there has not been much progress in installing a blue diode laser in multifunctional machines or even in normal laser processing machines. To that end, this NEDO project has advanced research and development into realizing a high-brightness blue diode laser that can be used for metal processing.

Osaka University, Shimadzu Corporation, and Yamazaki Mazak Corporation developed the world’s first multifunctional machine by combining metallic additive manufacturing utilizing a high-brightness blue diode laser with cutting technologies.This hybrid combined processing machine, based on the results of a NEDO project, is equipped with a multi-beam-processing head that is integrating 100 W high-brightness blue diode laser modules that Shimadzu Corporation put on the market in January 2018. By the superposition of three beams from three laser modules with multi-beam-processing head technology, an output of 300 W at the point of concentration has been realized. This provides a power density that is sufficient for melting pure copper powder and has made it possible to perform high-efficiency, high-quality welding and deposition of pure copper.

Results


This multifunctional processing machine makes it possible to perform both 5-axis cutting and laser processing together. It can easily join pure copper with dissimilar metal materials and can integrate processes with cutting. It is expected to have applications such as component processing near the edges of engines required in aircraft, spacecraft, and electric automobiles for forming heat sinks where the heat dissipation is increased by applying a pure copper coating.


● Project period: FY2016–FY2020

Osaka University, Shimadzu Corporation, Yamazaki Mazak Corporation

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Public Relations Activities

CEATEC 2019Event dates: Tuesday, October 15 to Friday, October 18, 2019Event venue: Makuhari Messe

CEATEC JAPAN, Asia’s largest IT and electronics exhibition, welcomed over 150,000 visitors in 2018. In 2018, the NEDO booth carried the theme of “Nedo’s IoT Technologies Implemented in Society” and included many displays illustrating the situations and locations where the technologies tackled by NEDO will be implemented in the future, ultra-smart society (Society 5.0), and the changes that these technologies have made to lifestyles and work styles. The theme of CEATEC 2019 will be “Connecting Society, Co-Creating the Future.” The NEDO booth will display in even greater detail images that show the social implementation of IoT technologies tackled by NEDO. Through the use of hands-on experiences and dynamic displays, NEDO’s booth will allow visitors to clearly see the benefits of these technologies for society.

Introduction to Project Results

The results of past projects implemented by NEDO are widely utilized throughout society, and have produced massive multiplier effects in the economy.By visiting the NEDO website, the public can see examples of practical technology applications, commercialization, and other NEDO project results.

NEDO defines products and processes that use the results of NEDO projects as their core technologies as NEDO Inside Products.Specif ica l ly, NEDO Inside Products are products resulting f r o m N E D O p r o j e c t s t h a t l e a d t o m a r k e t e n t r y a n d commercialization.

NEDO Project Success Stories is a series of reports where technology development sites are visited in order to introduce the products and services that are being realized by applying technologies developed in NEDO projects.

Photos from the 2018 exhibition

SearchNEDO Inside Products SearchNEDO Project Success Stories

23

DefinitionsofTermsThissectionprovidesdefinitionsoftermsusedinthispamphlet.Thetermsdefinedherearethosedenotedinthetextbyanasterisk.

Post-Moore era5pRefers to an era in which Moore’s Law, which states that the number of integrated circuits on a chip doubles every one to two years, will no longer be valid as the performance increases of technology realized through the micronization of semiconductors become limited.

Edge computing5pPerformance of advanced information processing at network terminals near users.

Annealing machine6pA computer applied to information processing for processes in which an optimal state is to be produced by lowering energy from a state in which it has been increased. Examples include quantum annealing machines and CMOS annealing machines.

AI chip7pA semiconductor chip used for realizing a specific function by means of AI technology.

Specificationdesign7pA design process for semiconductor chips in which ideas are shown with specific functions and components and are created as semiconductor chip specifications.

Circuit design7pA design process of semiconductor chips in which circuit data is created to show the components (functional elements) that comprise the semiconductor and their re la t ionships based on the created specifications.

Physical design7pA design process of semiconductor chips in which data is created for adding functional elements, wiring, and the like as semiconductor chips on the semiconductor wafer based on the created circuit data.

Cloud computing9pA computing system which allows users to store data on servers or other devices at data centers connected via the Internet and to use that data via a network according to each user’s needs.

Optical I/O core9pRefers to an ultra-small light transceiver chip, named by the Photonics Electronics Technology Research Association, which uses silicon photonics technology.

Optoelectronic integrated interposer9pAn optoelectronic integrated device with multiple optoelectronic integrated circuits arranged on the same board in order to generate optical signals capable of high-speed/high-volume transmission of large-volume data transmission between large-scale integrators (LSIs).

SiC10pRefers to a new-generation silicon-based material currently used for power semiconductors. SiC is resistant to high voltage and contributes to energy-saving.

Connected Industries11pConnected Industries is a new concept framework in which industries will create new added value and the solutions to various problems in society through connectedness of various facets of modern life, including humans, machines, systems, companies.https://www.meti.go.jp/english/policy/mono_info_service/connected_industries/index.html

Blockchain11pA distributed ledger technology. The ledger is maintained in a distributed manner in order to achieve high availability and resistance against tampering.

24

Metal 3D printer14pA type of 3D printer or additive manufacturing device, which forms objects by melting powders mainly composed of metal by using a directional heat source and laminating one layer at a time.

CSIRT15pAn abbreviation of Computer Security Incident Response Team. It is a security response team for industrial and organizational information systems.

Supply chain16pThe continuous flow of all processes from raw material and processing stages to the acquisition of products and services by consumers.

Society 5.017pA human-centered society that achieves both economic development and solving of social problems by utilizing systems that achieve a sophisticated fusion of cyberspace (virtual spaces) with physical spaces (real spaces).

Optical frequency comb18pA laser source with broadband spectrum which consists of a series of discrete, equally-spaced frequency lines.

Dual optical-frequency comb spectroscopy18pA type of spectroscopy that uses two optical frequency comb light sources. In this method, the characteristics or materials for a sample (e.g. gas or liquid) are specified by passing one of two lights through the sample and then comparing the sample using the other light.

EPCIS20pAn abbreviat ion of Electronic Product Code Information Services. This is a specification in which product movement information and the like are collected and stored on computer servers in order to visualize supply chains.

Dynamic pricing20pThe fluctuation of prices according to supply and demand. In the demonstration, RFID readers installed on shelves automatically read electronic tags to identify products which were approaching their sell-by dates. Ordinary participants were notified by smartphone or the like that the price tag had changed and that they would receive a discount when paying in cash or extra reward points.

Ideathon20pAn event in which multiple teams compete against each other to produce new ideas. It is a hybrid of “idea” and “marathon.”

Hackathon20pAn event in which multiple teams compete against each other to produce new prototypes from ideas. It is a hybrid of “hack” and “marathon.”

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National Research and Development Agency New Energy and Industrial Technology Development Organization (NEDO)

Business name: New Energy and Industrial Technology Development Organization (NEDO)

Originally established on October 1, 1980; reorganized as an incorporated administrative agency on October 1, 2003

Operations relating to technology development management (national projects and practical application promotion activities)

Minister of Economy, Trade and Industry Act on General Rules for Incorporated Administrative Agencies

Act on the New Energy and Industrial Technology Development Organization

1,000 (as of April 1, 2019) Approximately 1.43 billion US dollars (FY2019) (Budget amount is calculated at a rate of 110 yen per US dollar.)

Chairman Mr. Hiroaki Ishizuka

President Mr. Hiroshi Oikawa

Executive Directors Mr. Toshihiro Mitsuhashi, Mr. Shoji Kukita, Dr. Yoshiteru Sato, Mr. Kiyoshi Imai, Mr. Izuru Kobayashi

Auditors Mr. Hideaki Nakano, Ms. Mime Egami

(as of October 1, 2019)

Designation

Foundation

Details of Major Operations

Minister in Charge

Governing Laws

Personnel

Budget

Executives

Organization

Background Information

(as of October 1, 2019)

Chairman

President

Executive Directors

Technology Strategy Center

Project Management Office

Innovation Promotion Department

Moonshot Research and Development Program Office

Robot and Artificial Intelligence Technology Department

AI Promotion Division

Internet of Things Promotion Department

Materials Technology and Nanotechnology Department

Bioeconomy Promotion Division

Energy Conservation Technology Department

New Energy Technology Department

Advanced Battery and Hydrogen Technology Department

Electricity Storage Technology Development Division

International Affairs Department

Global Environment Technology Promotion Division

Smart Community Department

Environment Department

Audit Office

General Affairs Department

Personnel Affairs Department

Accounting Department

Risk Management Department

Asset Management Department

Information and Systems Department

Evaluation Department

Public Relations Department

Kansai Branch Office

Overseas Offices(Washington, D.C., Silicon Valley, Europe, Beijing, Bangkok, New Delhi)

Auditors

26

NEDO homepagehttps://www.nedo.go.jp/english/index.htmlPlease note that messages sent to NEDO via the “inquiry” link on the top of its English homepage use a fillable email template. Although messages may be sent to NEDO at any time, please allow time for NEDO staff to respond. This email inquiry service may also be used to request NEDO documents.

Pamphlets available from other NEDO departments

https://www.nedo.go.jp/library/pamphlets/index.html

Contacting the NEDO IoT Promotion DepartmentContact form

If you have any questions or would like to consult with the NEDO IoT Promotion Department, please contact us via the “inquiry” link at the top of NEDO’s English website.Examples of consultation topics: - Preliminary consultations on research and development activities or practical applications - Consultations on utilization of the NEDO system - Requests for presentations by NEDO staff

Contacting NEDO

July 2019（1st Edition）

Profile of IoT Promotion Department (FY2019)Realizing Connected Society for an Open Future

MUZA Kawasaki Central Tower, 1310 Omiya-cho, Saiwai-kuKawasaki City, Kanagawa 212-8554 JapanTel: +81-44-520-5100 Fax: +81-44-520-5103URL: https://www.nedo.go.jp/english/index.html

National Research and Development Agency New Energy and Industrial Technology Development Organization

● Head OfficeMUZA Kawasaki Central Tower, 16F-20F1310 Omiya-cho, Saiwai-kuKawasaki City, Kanagawa 212-8554 JapanTel: +81-44-520-5100Fax: +81-44-520-5103

● Kansai Branch Office9th Floor, Knowledge Capital Tower C Grand Front Osaka 3-1 Ofuka-cho, Kita-ku, Osaka 530-0011 JapanTel: +81-6-4965-2130Fax: +81-6-4965-2131

● Washington, D.C1717 H Street, NW, Suite 815Washington, D.C. 20006, U.S.A.Tel: +1-202-822-9298Fax: +1-202-733-3533

● Silicon Valley3945 Freedom Circle, Suite 790 Santa Clara, CA 95054 U.S.A.Tel: +1-408-567-8033Fax: +1-408-567-9831

Domestic Offices

Overseas Offices

● Europe10, rue de la Paix 75002Paris, FranceTel: +33-1-4450-1828Fax: +33-1-4450-1829

● New Delhi15th Floor, Hindustan Times House,18-20 Kasturba Gandhi Marg, Connaught Place, New Delhi 110 001, IndiaTel: +91-11-4351-0101Fax: +91-11-4351-0102

● Beijing2001 Chang Fu Gong Office Building Jia-26, Jian Guo Men Wai Street Beijing 100022, P.R. ChinaTel: +86-10-6526-3510Fax: +86-10-6526-3513

● Bangkok8th Floor, Sindhorn Building Tower 2 130-132 Wittayu Road, Lumphini PathumwanBangkok 10330, ThailandTel: +66-2-256-6725Fax: +66-2-256-6727

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