Product End-of-Life Disassembly Instructionsh22235. · HP Z1 Workstation G2 Purpose: The document...

Product End-of-Life Disassembly Instructions Product Category: Workstations

Marketing Name / Model [List multiple models if applicable.] HP Z1 Workstation G2 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm MB

1

Batteries All types including standard alkaline and lithium coin or button style batteries CR 2032

1

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries 0

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps LM270WQ1-SDG1

1

Cathode Ray Tubes (CRT) N/A 0 Capacitors / condensers (Containing PCB/PCT) N/A 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

N/A 0

External electrical cables and cords N/A 0 Gas Discharge Lamps N/A 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

N/A 0

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations. N/A

0

Components and waste containing asbestos N/A 0 Components, parts and materials containing refractory ceramic fibers

adaptor 0

EL-MF877-00 Template Revision B

PSG instructions for this template are available at EL-MF877-01

http://standards.corp.hp.com/elclass/AMF87701.htm

Components, parts and materials containing radioactive substances

N/A 0

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable) Description #1 Screw driver T15 Description #2 Screw driver T8 Description #3 Screw driver T5 Description #4 Screw driver T6 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. [system parts] Remove the stand 2. [system] Remove TOP bezel 3. [System] remove memory FAN 4. [System] Remove the HDD 5. [System] Remove Cpu thermal module 6. [System]Remove ODD 7. [System]Remove site IO board 8. [System] Remove rear IO board 9. [System]Remove EMI CAN 10. [System]Remove speaker 11. [System] Remove MXM power connector 12. [System] Remove PSU 13. [System] Remove hinge& panel IO cable 14. [System]Remover antenna 15. [System] Remove MXM module 16. [System] remove PCIE card 17. [System] Remove MB 18. [System] Remove CPU bracket/CPU 19. [System] Remove memory 20. [System] remove spring 21. [System]Remove front bezel 22. [System]Remove web camera module 23. [System]remove latch 24. [System]remove touch plan 25. System]PSU

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).




[System Parts] 1) Remove the stand

a) Ready for stand remove b)take off stand cover c) Use T15 screw driver to disassemble the stand screw

d) Take the stand leaving from Chassis e) stand disassembly finish

2) Remove TOP bezel

a)push left and right side latch b) Open the top bezel c) disassembly LVDS cable

d) Pull the antenna aux cable out of PCIe short card

e) Pull the antenna main cable out of PCIe short card




h)Pull the connector out of PCA i) Use T15 screw driver to

disassemble the screw j) Use T15 screw driver to disassemble the screw

k) Use T15 screw driver to disassemble the screw

l) remove Front bezel m) disassembly finish

3)remove memory FAN

a)Push memory latch. Then, pull up the memory fan

b) disassembly finish




4) Remove the HDD

a) Ready for HDD disassembly b)push HDD handle pull up the HDD carrier

Pull HDD out of carrier latch Remove connector Disassembly SATA connector from

MB

c) Use T15 screw driver to disassemble the screw

Remove sensor from clip c) Use T8 screw driver to disassemble the screw





5)Remove Cpu thermal module

a) Use T15 screw driver to disassemble the screw

b)remove CPU thermal C)disassembly finish

6)Remove ODD

a)disassembly SATA connector b)push ODD latch c)remove ODD

a) Press ODD carrier latch then pull it out.


7)Remove site IO board


b)remove site io card c) disassembly finish




8)Remove rear IO board


b)remove rear IO c)pull out connector from rear IO board

d) disassembly finish 9)Remove EMI CAN


b)push out connector c) disassembly finish

10)Remove speaker


b)remove left and right speaker d) disassembly finish




11)Remove MXM power connector


Remove MXM power connector

12)Remove PSU

a)push handle latch b) Turn the latch of PSU to downward

C)disassembly connector

d)remove PUS e) disassembly finish 13)Remove hinge& panel IO cable




a) Use T15 screw driver to disassemble the screw b)disassembly panel IO cable 14)Remover antenna


b) remove aux antenna c)remove main antenna

15)Remove MXM module

a)press MXM latch b)remove MXM module c) Use T15 screw driver to disassemble the screw

d)remove MXM heatsink e)remove MXM card 16)remove PCIE card




a) Pull the antenna aux cable out of PCIe short card

b) c) Use T6 screw driver to disassemble the screw

c)remove WLAN card module

d) Use T6 screw driver to disassemble the screw

e) disassembly finish

17)Remove MB

a)ready for MB disassembly b)remove connector from MB

C)remove LVDS cable from MB d)remove backlight cable from MB e)remove panel IO cable from MB

e)remove panel IO cable from MB

f)remove speaker IO cable from MB g) Use T15 screw driver to disassemble the screw




h)remove power cable from MB i) remove MB

18) Remove CPU bracket/CPU

a) Pull the latch lever and open the bracket

b) Take the CPU away from socket c) remove PCIe card

d) remove back plate 19)Remove memory

a) Pull the latch spring and disassemble the Dimm

20)remove spring




a)cut cable clip g) Use T15 screw driver to disassemble the screw

21)Remove front bezel


b)remove touch FPC cable

c)remove BKT d)remove front bezel e) disassembly finish 22)Remove web camera module

a)Ready for web camera remove b) Use T15 screw driver to disassemble the screw

c)remove web camera module




d)remove left & right MIC phone and disassembly connector e) Use T5 screw driver to disassemble the screw

f)disassembly connector g) disassembly finish 23)remove latch


b) Use T15 screw driver to disassemble the screw

c)pull the spring structure to release the latch

d) Use T15 screw driver to disassemble the screw

e) disassembly finish

24)remove Touch plan





b) Use T15 screw driver to disassemble the screw

c)remove glass

[PSU] 1) Remove the stand

a)PSU b)remove case screw c)open the case cover

MAIN BODY SCREW(METAL) CASE

d) cut off cable tie e) f) remove screw for PWB

Internal dis-assemble

g) remove handle from case h) remove PWB from case i) remove screw for FAN

Handle & PWB & Fan dis-assemble




j) Dis- assemble all component

PSU dis-assemble overall




Product End-of-Life Disassembly Instructionsh22235. · HP Z1 Workstation G2 Purpose: The document...

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