Product End-of-Life Disassembly Instructionsh22235. · 2016-04-22 · Product End-of-Life...

EL-MF877-00

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.]

HP Notebook PC 14

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm 2

Batteries All types including standard alkaline and lithium coin or button style batteries

1

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

0

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0

Components, parts and materials containing refractory ceramic fibers

0

http://standards.corp.hp.com/elclass/AMF87701.htm

EL-MF877-00

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Screwdriver #1 Electric cross screwdriver

Description #2 TORX T8 (2.31mm)

Description #3 D73 1 * 3.0 * 20 * 40

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first 3. Use correct screwdriver and torque value before unlock the screw. 4. 5. 6. 7. 8. 9.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

http://standards.corp.hp.com/elclass/AMF87701.htm

MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY

MODEL : Diner

Auditor ： Alicia Chien Tabulator：

A. Current station version list

B. Version Modify list

Revision Date Station Content Ver. Design

0.1 2016/03/08 ALL FIRST VERSION 0.1 Nydia Lee

Sub-assembly name: FA DIS ASS‘Y

Document No.: Diner FA DIS ASS'Y SOP

Written by: Nydia Lee Revision: 0.1

Date: 2016/03/08 Page: 1

Station Ver. Station Ver. Station Ver. Station Ver.

1 0.1 10 0.1 19 0.1 28 0.1

2 0.1 11 0.1 20 0.1 29 0.1

3 0.1 12 0.1 21 0.1

4 0.1 13 0.1 22 0.1

5 0.1 14 0.1 23 0.1

6 0.1 15 0.1 24 0.1

7 0.1 16 0.1 25 0.1

8 0.1 17 0.1 26 0.1

9 0.1 18 0.1 27 0.1

Nydia Lee

Standard Operation Procedure

Document No. Diner FA DIS ASS’Y SOP Station :

Name : Ver. : Date :

Step：

Notes : If finding anything uncommon, notice foreman or assistant at once.

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Tabulator： Issue department： Alicia Chien NPSU-PPE Auditor ： Nydia Lee

1(1/1)

1. Turn the computer over . (Fig.1)

2. Slide the battery latch to the right. (Fig.2)

3. Slide the other battery latch to the left to

remove the battery. (Fig.2)

Disassemble Battery

Fig.1

Fig.2

Fig.3

2016/03/08 0.1

1

2




Step：




2(1/1)

1. Remove the rubbers by stick. (Fig.1)

Remove Rubbers

Fig.1

2016/03/08 0.1




Step：




3(1/1)

1. Loosen screw (6052A0034701) * 5. (Fig.1)

Loosen Screws

Fig.1

1 2 3

4

5

Electric cross screwdriver 1

2016/03/08 0.1




Step：




4(1/1)


Loosen Screws

Fig.1

1 2

3 4

5 6


2016/03/08 0.1




Step：




5(1/1)


Loosen Screws

Fig.1

2

3 1

4

5

6

2016/03/08 0.1





Step：




6(1/1)

1. Disassemble ODD. (Fig.1)

Disassemble ODD

Fig.1

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Step：




7(1/3)

1. Put the machine on desk.

Disassemble Base

Fig.1

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Step：




7(2/3)

2. Insert the stick into the space between TPCB and BTCB to

disassemble hooks. (Fig.2)

3. Insert the stick into the left of battery slot to disassemble

hooks. (Fig.3)

Disassemble Base

Fig.1

Fig.2

Fig.3

2016/03/08 0.1




Step：




7(3/3)

Disassemble Base

4. Disassemble base in order. (Fig.1 / Fig.2)

Fig.2

1

2

3

Fig.1

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Step：




8(1/1)

1. Disassemble the DDRs . (Fig.1)

Disassemble DDRs

Fig.1

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Step：




9(1/1)

For W/ HDD model

1. Disconnect HDD FFC . (Fig.1)

2. Disassemble HDD. (Fig.1)

Disassemble SSD，Only For 6U:

1. Disassemble SSD/B (1310A2745101 )

screw

(6052A0035101) *4. (marked in red/blue

circle)

2. Disassemble SSD/B & SSD BRKT.

Disassemble HDD

Fig.1

Fig.2

组装SSD，Only For MENTOS 6U (圖三)

2016/03/08 0.1




Step：




10(1/1)

1. Disconnect pick button FFC. (Fig.1)

2. Disassemble speaker connector. (Fig.2)

3. Rip acid tape (6054A0076201) * 2. (Fig.2)

4. Disassemble speakers.

拆Speaker

Fig.1

Fig.2

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Step：




11(1/1)

1. Disconnect USB FFC. (Fig.1)

2. Loosen USB/B screw (6052A0019002) *1.

(Fig.2)

3. Disassemble USB/B.

Disassemble USB/B

Fig.1

Fig.2 Fig.3

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Step：




12(1/1)

1. Disconnect antenna cable. (Fig.1)

2. Rip acid tape (6054A0076201 ) *3. (Fig.2)

3. Disassemble antenna cable. (Fig.3)

Disassemble Antenna Cable

Fig.1

Fig.2 Fig.3

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Step：




13(1/1)

1. Disassemble DC IN cable connector. (Fig.1)

2. Disassemble DC IN cable. (Fig.2)

Disassemble DC IN Cable

Fig.1

Fig.2

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Step：




14(1/1)

1. Rip acid tape (6054A0076201) *3. (Fig.1)

2. Disconnect eDP cable. ( Fig.1)

3. Disassemble Touch connector. (For Touch

only)

4. Disassemble eDP cable. (Fig.2)

Disassemble eDP Cable

Fig.1

Fig.2

2016/03/08 0.1




Step：




15(1/1)

1. Loosen fan screw (6052B0081901) *2. (Fig.1)

2. Disassemble fan connector. (Fig.1)

Disassemble FAN

Fig.1

2016/03/08 0.1




Step：




16(1/1)

1. Loosen thermal module screw

(6052B0120001).

For CPU&GPU : screw * 7

For Only CPU : screw * 4

For Braswal : screw * 5

2. Disassemble thermal module.

Disassemble Thermal Module 2016/03/08 0.1




Step：




17(1/1)

1. Disassemble Power/B Connector. (Fig.2)

2. Disassemble K/B Connector. (Fig.3)

Disassemble K/B & Power Connector

Fig.1

Fig.2 Fig.3

2016/03/08 0.1




Step：




18(1/1)

1. Loosen M/B screw (6052A0019002) * 4.

2. Disassemble M/B

Disassemble M/B

Fig.1

Fig.2

2016/03/08 0.1




Step：




19(1/1)

1. Loosen TOP hinge screw * 6.

(6052A0019002)*1

(6052A0034701)*3

(6052B0083501)*2

Loosen TOP Hinge Screws

Fig.1

Fig.2 Fig.3

2016/03/08 0.1




Step：




20(1/1)

1. Disassemble the TOP .

2. Disassemble DC IN cable.

Disassemble TOP

Fig.1

2016/03/08 0.1




Step：




21(1/1)

1. Loosen TOP hinge screw (6052A0019002) * 2.

2. Disassemble the bezel.

Loosen Bezel Screws, Disassemble Bezel

Fig.1

2016/03/08 0.1




Step：




22(1/1)

1. Loosen LCD screw (6052B0156101) * 4.

Loosen LCD Screws

Fig.1

2016/03/08 0.1




Step：




23(1/1)

1. Disassemble LCD connector.

Disassemble LCM

Fig.1

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Step：




24(1/1)

1. Rip acid tape.

2. Loosen screw (6052B0120001) * 2.

3. Remove the bracket.

Disassemble Upper Side Bracket

Fig.1

1 2

2016/03/08 0.1

Fig.2




Step：




25(1/1)

1. Loosen hinge bracket screw * 4 .

(6052B0120001) * 1

(6052A0047401) * 3

2. Rip the gasket, then disassemble hinge

bracket .

Disassemble Hinge Bracket - L

Fig.1

1 2

2016/03/08 0.1




Step：




26(1/1)

1. Loosen hinge bracket screw * 4 .

(6052B0120001) * 1

(6052A0047401) * 3

2. Rip the gasket, then disassemble hinge

bracket .

Disassemble Hinge Bracket - R

Fig.1

1 2

2016/03/08 0.1




Step：




27(1/1)

1. Disassemble eDP cable. (Fig.1)

2. Disassemble camera module. (Fig.2)

3. Rip acid tape, disassemble camera connector.

(Fig.3)

Disassemble eDP Cable

Fig.1

2

Fig.2 Fig.3

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Step：




28(1/1)

1. Disassemble antenna cable. (Fig.1)

2. Disassemble mail antenna and AUX antenna.

( For RCTO) (Fig.2/Fig.3)

Disassemble Antenna Cable

Fig.1

2

Fig.2 Fig.3

Main

AUX For RCTO

2016/03/08 0.1




Step：




29(1/1)

1. Put the LCD cover into kitting box.

Disassemble LCD Cover 2016/03/08 0.1

Fig.1

Product End-of-Life Disassembly Instructionsh22235. · 2016-04-22 · Product End-of-Life...

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Transcript of Product End-of-Life Disassembly Instructionsh22235. · 2016-04-22 · Product End-of-Life...