Process Elements for the Deep and Vertical Etching of ...
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http://tinyurl.com/deep-glass-etching For more information, please email Dr. Khaled Mnaymneh at [email protected] January 6, 2014 1005 EECS Bldg. 12:00 Noon Abstract: Etching deep and vertical structures in fused silica is an important process capability that many fields of micro fabrication require. Some examples include the vertical walled trenches of a micro-fluidic system and the interdigitated comb structures of a resonator for sensors or inertial navigation devices. The challenge with these structures is that the natural chemical inertness of fused silica make deep and/or vertical etches difficult. The Ulvac NLD 570 glass etcher is capable of generating very low density, high temperature plasmas to help tackle this fabrication challenge. With tailored etch chemistries, nearly vertical etches over 100 microns deep are possible. Process development and etch results from the Ulvac will be presented here. Bio: Christopher Raum’s research interests include semiconductor fabrication process development and experimentation for micro and nanosystems devices that include MEMS based photonics and inertial navigation devices. He is also interested in microsystems performance enhancement through the cross-coupling of MEMS structures to the functionality of the device itself. He has completed postdocs at UC Irvine and NASA’s Jet Propulsion Laboratory where he conducted process development and research on fused silica based structures for inertial navigation devices. Much of this research was conducted at UCLA’s Nanoelectronics Research Facility using their Ulvac NLD 570 glass etcher. Currently he is a research collaborator at Caltech conducting opto-mechanical characterization of 3D photonic crystals. Process Elements for the Deep and Vertical Etching of Fused Silica in an NLD Plasma Dr. Christopher Raum Research Collaborator Caltech Pizza will be served.
Transcript of Process Elements for the Deep and Vertical Etching of ...
http://tinyurl.com/deep-glass-etchingFor more information, please email Dr. Khaled Mnaymneh at [email protected]
January 6, 2014 1005 EECS Bldg. 12:00 Noon
Abstract: Etching deep and vertical structures in fused silica is an important process capability that many fields of micro fabrication require. Some examples include the vertical walled trenches of a micro-fluidic system and the interdigitated comb structures of a resonator for sensors or inertial navigation devices. The challenge with these structures is that the natural chemical inertness of fused silica make deep and/or vertical etches difficult. The Ulvac NLD 570 glass etcher is capable of generating very low density, high temperature plasmas to help tackle this fabrication challenge. With tailored etch chemistries, nearly vertical etches over 100 microns deep are possible. Process development and etch results from the Ulvac will be presented here.
Bio: Christopher Raum’s research interests include semiconductor fabrication process development and experimentation for micro and nanosystems devices that include MEMS based photonics and inertial navigation devices. He is also interested in microsystems performance enhancement through the cross-coupling of MEMS structures to the functionality of the device itself. He has completed postdocs at UC Irvine and NASA’s Jet Propulsion Laboratory where he conducted process development and research on fused silica based structures for inertial navigation devices. Much of this research was conducted at UCLA’s Nanoelectronics Research Facility using their Ulvac NLD 570 glass etcher. Currently he is a research collaborator at Caltech conducting opto-mechanical characterization of 3D photonic crystals.
Process Elements for the Deep and Vertical Etching of Fused Silica in an NLD Plasma
Dr. Christopher RaumResearch Collaborator Caltech
Pizza will be served.
