Proceedings2009

International Symposium on

Microelectronics

November 1 - 5, 2009

San Jose McEnery Convention Center

San Jose, California - USA

Sponsored by

[MAPS

International Microelectronics And Packaging Society

Table of Contents

TAl

Biomedical, Portable, and Consumer ApplicationsChairs;

John Mazurowski, Pennsylvania State University;Aicha Elshabini, University of Idaho

1 Design and Process of 3D MEMS PackagingJohn H. Lau, Hong Kong University of Science & Technology

10 LCP Properties Ideal for Miniaturization Trend

in Electronic IndustryEdson Ito, Ticona EngineeringPolymers

18 High Density Hearing Aid Chip PackagingJohn Dzarnoski, Doug Link, Starkey Laboratories

26 Physiological Monitoring by "Credit Card"

Harry K. Charles, Jr., Russell P. Cain, TheJohns Hopkins

University / APL

33 Multiple Gas Sensing Device Based On Nano-Porous

Structure of Zeolite Coated -with Nile Red DyeSon Nguyen,Joan Delalic, David Kargbo, Zameer Hasan,

Temple University

TA2

Electromagnetic Interference (EMI)Chairs:

Terry Baum, L-3 Communications Cincinnati Electronics;

Joan Delalic, Temple University

38 Characterization of Extent of Cure of Form-in-Place

CompoundsHuiYe, Claudine Lumibao, Douglas S. McBain,

Laird Technologies

46 Modeling and Analysis of a New Packaging Structure

for Noise Isolation in Mixed-Signal SystemsIvan Ndip, Stephan Guttowski, Herbert ReicbL Fraunhofer

Institute for Reliability and Microintegration (TZM)

54 A Practical Shielding Effectiveness Evaluation of EcE

Gaskets Incorporating Accelerated Aging

Douglas S. McBain, Tarn Chau, Shelby Ball, Robert Antonio,

Laird Technologies

60 The Hidden Component to High Speed Filter Design:

The Footprint Influence

A. Rahman, M. Broman, M. Howieson, Thin Film Technology

Corporation

64

72

Compression Force of a Form-In-Place (FIP) Conductive

Elastomer EMI Shielding Gaskets: Theory, Measurement

Techniques, and ApplicationHui Ye, Claudine Y. Lumibao, Douglas S. McBain,

Laird Technologies

A Study of the Influence of FIP Bead Shape on

Compression Force in PCB/Shield AssembliesClaudine Y. Lumibao, Hui Ye, Douglas S. McBain,

Laird Technologies

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TA3

Advanced MaterialsChairs:

Jianbiao "John" Pan, California Polytechnic State University;Yan Zhang, Tessera Inc.

79 Evaluation of Electroless Nickel Electroless Palladium

(ENEP) finish as a replacement for Electroless Nickel

Electroless Palladium Immersion Gold (ENEPIG)for Gold Wirebonding and SAC305 SolderabilityJaspreet Gandhi, Shijian Luo, TomJiang, Micron Technology Inc.

87 New PCB Materials for Low Skew Close Phase Matchingin lOGbps Differential System DesignsEdward P. Sayre, North East Systems Associates, Inc.;

Sunichi Maeda, KEI Systems, Inc.; ShinjiYoshikawa, Asahi-Kasei

EMD Corporation

93 High-Performance Optical Silicone for High Power LED

PackagesYeong-HerLin, Jiun Pyng You, Frank G. Shi, University of

California-Irvine

99 Fabrication of 3-D Microstructures with Permanent

Dielectric Dry Film

Tobias Baumgartner, Katin Hauck, Kai Zoschke, Michael

Topper, Fraunhofer IZM Berlin; Hidetaka Uno, Du Pont

Kabushiki Kaisha; Werner Liebsch, DuPont de Nemours s.a.rl;

Hao Yun, MatsJ. Ehlin, Karl H. Dietz, DuPont Electronic

Technologies

104 The Effect of Test Conditions on HAST and THB

Reliability Testing of Thermal Interface Material, and the

Introduction of an Improved Thermal Interface Material

Andy Delano, Natalie Merrill, Richard Xu, Honeywell Electronic

Materials

V

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TA4

Pb-Free Soldet Materials and RoHS, Processes and

Reliability 1

Chairs:

Wennkig Liu, Pacific Northwest National Laboratory;Sang Ha Kim, Apple

112 Crystallographic Texture and Whisker Growth

in Electroplated Sn and Sn-AUoy Films

Aaron Pedigo, Pylin Sarobol, John Blendell, Carol Handwerker,Purdue University; Peng Su, Cisco Systems, Inc.

120 Impact of SMT Assembly Process on Tin Whisker Risk

MitigationChieh-Ju Lee, Guhan Subbarayan,Li Li, Jie Xue, Cisco Systems

Inc.; Peter Verbiest, Quyen Chu,Jabil Circuit, Inc.

128 Comparison of Whisker Growth from Pressure Induced

and Environmental Induced Whisker Growth Test

Methods

Michael Osterman, Lyudmyla Panashchenko, Alex Heronime,

University of Maryland - CALCE; Peng Su, Cisco Systems, Inc.

136 Case Study: Bright Tin Whisker Risk in Pb-Free

Connector ApplicationsJames Henzi, C. J. Lee, Damon Northrop, Hongtao Ma,

Tae-kyuLee, Bill Reynolds, Mason Hu, Cisco Systems, Inc.

142 Grain Orientation and Microstructure Evolution in Sn-

Ag-Cu Solder Joints as a Function of Position in Ball Grid

Array PackagesTae-Kyu Lee, Kuo-Chuan Liu, Cisco Systems, Inc.; Bite Zhou,

Lauren Blair, Thomas R. Bieler, Michigan State University

150 Effect of Germanium Addition to Sn3.5Ag Lead Free

Solder System for Overall BGA Package Robustness

ImprovementEu Poh Leng, Wong Tzu Ling, Min Ding, Freescale

Semiconductor, (M) Sdn. Bhd.; Nowshad Amin, Ibrahim Ahmad,

National University of Malaysia; Tay Yee Han, A.S.MA. Haseeb,

University Malaya Malaysia

158 Characterization of SAC Solder Microstructure Evolution

During Thermal Cycling with Statistical and In-situ

Methods

Bite Zhou, Thomas R Bieler, Michigan State University; Guilin

Wu, Stefan Zaefferer, Max-Planck-Institut fur Eisenforschung;

Tae-kyu Lee, Kuo-Chuan Liu, Cisco Systems, Inc.

TA5

MEMS PackagingChairs:

Alissa M. Fitzgerald, A.M. Fitzgerald & Associates, LLC;

David Seeger, Semiconductor Research Corp.

166 Low Cost and Reliable Packaging Technology for Stacked

MCP with MEMS and Control IC ChipsMitsuyoshi Endo, AHhiro Kojima, Yoshiaki Shimooka, Yoshiaki

Sugizaki, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi,

Tatsuya Ohguro, Susumu Obata, Yusaku Asano, Takeshi Miyagi,

Ikuo Mori, YoshiakiToyoshima, Hideki Shibata, Toshiba

Corporation

174 Mechanically Punched Micro Via Fabrication Process

in LCP Substrate for RF-MEMS and Related Electronic

Packaging ApplicationsMohammad K. Chowdhury, Ajay P. Malshe, University of

Arkansas; Li Sun, Shawn Cunningham, WiSpry Inc.

181 Analysis of MEMS Structure Sidewalk for Carbon and

Fluorinated Residue with SEM, EDS and TSA

Lee R. Levine, Process Solutions Consulting; Colin Stevens,

Robert Dean, Auburn University

185 Design of Multiwall Carbon Nanotube Based Embedded

Inductors

Bruce C. Kim, University of Alabama

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TP1

Automotive, Industrial, Harsh Environment

Electronics ApplicationsChairs:

Pradeep Lall, Auburn University;Min Ding, Freescale Semiconductor, Inc.

190 Reliability Evaluation of Lead-Free Solders for

Automotive ApplicationsY. K. Sa,Junghwan Bang, JunM Kim, Sehoon Yoo, ChangwooLee, Korea Institute of Industrial Technology; Yeong K. Kim,

Korea Aerospace University

195 Prognostication for Impending Failure in Leadfree

Electronics Subjected to Shock and Vibration UsingResistance SpectroscopyPradeep Lall, Ryan Lowe,Jeff Suhling, Auburn University; Kai

Goebel, NASAAmes Research Center

203 Component Quality Defects: Identification, Investigation& Remediation

D. Michael Flint, Department of Defense

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Table of Contents

207 A High-Temperature, High-Voltage Linear Regulator in

0.8-imBCD-on-SOI

C. Su, M. A. Huque, B. J. Blalock, S. K. Islam, L. M. Tolbert, R.

L. Greenwell, University of Tennessee

215 Effect of Vibration on Lead-Free SolderJoint ReliabilityUnder Temperature Changes for Automotive Electronics

Sehoon Yoo, Y. K. Sa, Sanghyun Kwon, ChangWoo Lee, Korea

Institute of Industrial Technology; Yeong K. Kim, Korea

Aerospace University

220 A High-Temperature, High-Voltage SOI Gate Driver

IC with High Output Current and On-Chip Low-Power

Temperature Sensor

Mohammad A. Huque, Leon M. Tolbert, Benjamin J. Blalock,

Syed K. Islam, The University of Tennessee

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TP2

Design Elements and ModelingChairs:

Herman Chu, Cisco Systems, Inc.;

Douglas C. Hopkins, University of Buffalo (SUNY)

228 Thermal System Identification Analyses of ChipInterconnects to Facilitate DVFS ImplementationSai Ankireddi, David Copeland, Sun Microsystems, Inc.

233 HotPak: A Tool for Rapid Thermal Mapping & LeakagePower Analysis of Flip-Chip PackagesSaiAnkireddi, David Copeland, Stanley Pecavar, Sun

Microsystems, Inc.

238 Vaporizable Dielectric Fluid Cooling of IGBT Power

Semiconductors

David L. Saums, DS&A LLC

250 Thermal Management of a Planar Magnetic Micro-

Transformer

Yazdan P. Razi, Flextronics International (FlexPower); Bob

Roohparvar, California State University East Bay

256 A Stochastic Coolability Analysis for a Microprocessor

Considering Chip Power Fluctuation

Sai Ankireddi, Sun Microsystems, Inc.

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TP3

Cetamic andLTCC PackagingChairs:

John Menaugh, DuPont Microcitcuit Materials;

Larry Zawicki, Honeywell FM&T

260 Characterization of LTCC Material at G-Band

Nurul Osman, RobertLeigh, Charles Free, University of Sui

268 Thermomechanical Finite Element Techniques in

Multilayer Ceramic Package DesignMarkEblen, Nobuo Takesbita, Franklin Kim, Andy Piloto,

Kyocera America, Inc.

275 DuPont Green Tape 9K7 Low Temperature Co-fired

Ceramic (LTCC) Low Loss Dielectric System for HighFrequency ApplicationsK. E. Soudeis, K. M. Nair, M. F. McCombs, J. M. Parisi,

D. M. Nair, DuPont Microcircuit Materials

283 Effect of Stress on the Densification of a Low-

Temperature Cofired Ceramic (LTCC) System under

Constrained SinteringJau-Ho Jean, Jui-Chuan Chang, National Tsing Hua University;Yao-Yi Hung, AVX Corp.

288 LTCC Ka-Band Switch Matrix Experiment for On-Orbit

Verification

S. Humbla,J. Mueller, R. Stephan, D. Stoepel, J. F. Trabert,

G. Vogt, M. A, Hein, Hmenau University of Technology

296 New Plateable Thick Film Silver Conductors for

DuPont Green Tape Low Temperature Co-firedCeramic (LTCC)Michael A. Skurski, K. M. Nair, DuPont Microcircuit Materials;

David Shields, Component Surfaces, Inc.

304 Development of anA1N HTCC Multilayer System with a

Tungsten Cofiting Metallization

BerndJoedecke, Marco Fritsch, Chastel Kretzschmar, Lars

Rebenklau, Alexander Mtchaelis, Fraunhofer IKTS Institute

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TP4

Pb-Free Solder Materials and RoHS,

Ptocesses and Reliability 2Chairs:

John Lau, Hong Kong University Science & Technology;Li Li, Cisco Systems, Inc.

309 Environmental Conditions Impacts on Pb-Free Solder

Joint ReliabilityBo Liu, Tae-Kyu Lee, Kuo-Chuan Liu, Cisco Systems, Inc.

316 Lead-Free Solder-Joint-Reliability Model Enhancement

Jkn Miremadi, Greg Henshall, Aileen Allen, Elizabeth Benedetto,

Michael Roesch, Hewlett-Packard Company

324 Advanced Lead-Free Server Hardware Reliability Test

Methods: Power Age / Power Cycling and Four Point

Bend Test Data Results

Matthew Kelly, Timothy Younger, David Braun, IBM

Corporation

332 Effect of Temperature CyclingParameters on the

Durability of Pb-Free Solders

Michael Osterman, Preeti Chauhan, University of Maryland -

CALCE

338 Au-Ge Based Candidate Alloys for High-TemperatureLead-Free Solder Alternatives

Vivek Chidambaram, John Hald, Jesper HatteL Technical

University of Denmark

346 Break Down Failure Process of the Flip Chip BumpsCaused by Current StressingShigeaki Suganuma, Toshio Gomyo,Yuya Yamagishi,Kei Imafuji, Masaki Sanada, Yuko Karasawa, Kei Murayama,Takashi Kurihara, Ynkiharu Takeuchi, Shinko Electric Industries

Co., Ltd.

354 Effects of Solder Voids on Thermal and ReliabilityPerformances of PQFN PackagesYonmin Yu, University of Minnesota; Victor A. Chiriac,Freescale Semiconductor Inc.

TP5

Wirebonding and Stud BumpingChairs:

Patrick Story, International Rectifier Corporation;Faina Zaslavsky, Crane Electronics Group

360 Second Bond Stitch Width Model as a Trend Solution

to Lead Width Reduction

Tomer Levinson, Alon Menache, Kulicke & Soffa BondingTools; Shi Fei, Kulicke & Soffa (SuZhou) Limited

367 Accelerated Characterization of Bonding Wire Materials

A. Pequegnat, M. Mayer, Y Zhou, University of Waterloo;JohnPersic, Microbonds Inc.

374 Practical Considerations for PowerRibbon® Bondingof Hybrid PackagesRichard Elliott, Orthodyne Electronics

380 Room Temperature Wedge-Wedge Ultrasonic Bondingusing Aluminum Coated Copper WireMatthias Petzold, Robert KlengeL Fraunhofer Institute for

Mechanics of Materials Halle; Rainer Dohle, Holger Schulze,Micro Systems EngineeringGmbH; Frank Rudolf, Technical

University Dresden

388 Numerical Analysis of Ultra-High Frequency Wire

BondingM. Mayer, Y Huang, University of Watedoo

394 Study of Formation and Change of Intermetallic

Compounds in Cu-Au and Au-Al Systems for Copperon Gold BondingYingweiJiang, Youmin Yu ,Weimin Chen, Sonder Wang,Freescale Semiconductor (China) Limited; Ronglu Sun, Tianjin

Polytechnic University

401 Odd-Form Factor Package Wire Bonding Case Studies

Daniel D. Evans, Palomar Technologies, Inc.

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WA1

OptoelectronicsChairs:

Sang Liu, Huawei Technologies Co., Ltd.;

Virgil Ganescu, ITT

406 Soldet Jetting - A Versatile Packaging and AssemblyTechnology for Hybrid Photonics and OptoelectronicalSystemsErik Beckert, Thomas Oppert, GhassemAzdasht, Elke Zakel,

Thomas Burkhardt, Marcel Hornaff, Ingo Scheidig, Ramona

Eberhardt, Andreas Tuntterrriarin, FrankBuchmann, Ftaunhofer-

Institute for Applied Optics and Precision Engineering

413 The Challenge in Packaging Microelectronics

and OptoelectronicsRick C. Stevens, Fahad M. Siddiqui, Brian L. Uhlhorn,Kevin J. Thorson, Lockheed Martin

420 Micron Level Placement Accuracy for Wafer Scale

Packaging of P-Side Down Lasers in OptoelectronicProducts

DanielD. Evans, Jr., Zeger Bok, Palomar Technologies, Inc.

426 Modeling Residual Stresses in Epoxies during CoolingSalvatoie S. Cimordli, Raymond A. Pearson, Lehigh University

433 Laser Scribing of Copper/Low-k Dielectric

Semiconductor Materials by Nanosecond and Ultrafast

Pulsewidth Lasers

A. Hooper, D. Barsic, H. Zhang, J. O'Brien, Electro-Scientific

Industries

WA2

Thermal Management MaterialsChairs:

David Saums, DS&A LLC;

Eric Huenger, Dow Corporation

440 Indium Thermal Interface Material AssemblyManufacturability and ReliabilitySean S. Too, Mohammad Khan, Edwin Goh, Xiaole Zhao, Kee-Hean Keok, Advanced Micro Devices

446 Evaluation of a Novel Dielectric Material on Aluminum

Substrates

Michael Creamer, Mark Challingsworth, Samson Shahbazi,Heraeus Materials TechnologyLLC, ThickFilm Materials

Division

452 High-Quality C02 Laser Machining of LTCC Structures

for Thermal Management of a Group of Single-Emitter

Laser Diodes

Alberto Campos Zatarain, Aaron McKay, HowardJ. Baker,

Denis R. Hall, Marc Desmulliez, Heriot-Watt University

459 High Temperature Stamping Forging to Fabricate FullyDensified Copper Tungsten and Copper MolybdenumHeat Sink Materials

GuoshengJiang, Zhifa Wang, Yi Gu, Changsha SanewayElectronic Materials, Co Ltd.; Ken Kuang, Torrey Hills

Technologies, LLC

464 Component Level Testing of Application SpecificConditions for Pressure Sensitive Adhesive Thermal

Interface Materials

Herman Chu, Amisha Selvakumar, Cisco Systems, Inc.

470 Process and Reliability Advantages of AuSn Eutectic Die-

Attach

Amanda Hartnett, Indium Corporation; Steve Buerlri, Palomar

Technologies

WA3

Wafer Level/CSP Packaging RequirementsChairs:

Robert Forman, Dow Corporation;Lyndon Larson, Dow Corning Electronics

475 Reliability Study of the Bump on Flexible Lead for Wafer

Level PackagingI. Kolb, O. Ehrmann, H. Reichl, Technical University of

Berlin; M. J. Wolf, Fraunhofer Institute for Reliability and

Microintegiation

482 Development of Wafer Level Embedded SiP (System in

Package) for Mobile ApplicationIn-Soo Kang, Gi-Jo Jung, Byoung-YoolJeon, Nepes Corporation

489 Enhance Solder Ball Shear Value in SiP Embedded

PackagesDyi-Chung Hu, Advanced Chip Engineering Technology, Inc.

492 Microspring Characterization and Flip Chip Assembly

ReliabilityE. M. Chow, B. Cheng, D. DeBruyker, C. Chua,K. Sahasrabuddhe, Palo Alto Research Center (PARC);I. Shubin, J.Cunningham, Y.Luo, A. V. Krishnamoorthy, Sun

Microsystems

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500 AdvancedWafer-Level Integration Technologywith Ultta

Fine Pitch Redistributed Layers between HeterogeneousDevices

Yutaka Onozuka, Hiroshi Yamada, Atsuko Iida,Kazuhiko Itaya, HideyuM Funaki, Toshiba Corporation

508 On the Use of Nanoscale Materials to Toughen Model

EpoxiesR. A. Pearson, P. Dittanet, L. Bacigalupo, Y-L. Liang,R. Oldak, Lehigh University

511 Impact of Thermal History on Gap Filling Capabilityof Die Attach Film

Yeqing Su, Wei Shen, Weimin Chen, Denis Bai, Vitto Huang,

Baoguan Yin, SonderWang, Freescale Semiconductor (China)Inc.

WA4

Package Reliability TestingChairs:

F. Patrick McCluskey, University of Maryland (CALCE);Mudasir Ahmad, Cisco Systems, Inc.

516 Reliability Impact of Defects in Lead-Free BGA Solder

Joints - A Systematic StudyAnuiagBansal, Kuo-Chuan Liu, Jie Xue, Dave Towne, Cisco

Systems, Inc.

524 A Test Platform for the Thermal, Electrical, and

Mechanical Characterization of PackagesJustin Schauer, Nathaniel Pinckney, Nyles Netdeton,

Darko Popovic, Sun Microsystems

532 Use of the Skin Effect for Detection of Interconnect

DegradationMichael H. Azarian, DaeilKwon, Michael Pecht, Universityof Maryland - CALCE

537 Effects of PCB Design Variations on the Reliability of

Lead-Free SolderJointsHongtao Ma, Kuo-Chuan Liu, Dong Hyun Kim, Cherif

Guirguis, Cisco Systems, Inc.

544 Warpage Control of Thermally Enhanced PBGA Packagewith Internal Heat Spreader during Reliability TestMin Ding, BY Low, James Guajardo, Harold Downey,Sheila Chopin, Freescale Semiconductor, Inc.

552 Analysis of Pb-Free BGA Solder Joint Reliability Data

Weidong Xie, Michael Tsai, Kuo-Chuan Liu, Cisco Systems, Inc.

558 A Coupling between Electromigration(EM) and

Kirkendall Effect in Sn-3.5Ag/Cu Solder Joint

Jin Yu, H. W Kang, Y. Jung, KAIST

WA5

3D Packaging ApproachesChairs:

James J.-Q. Lu, Rensselaer Polytechnic Institute;

Peng Su, Cisco Systems, Inc.

563 Lithography and Wafer Bonding Solutions for 3D

IntegrationThorsten Matthias, Eric Pabo, Dustin Warren, Bioh Kim, EV

Group Inc.; Markus Wimplinger, Paul Lindner, EV Group

569 A Cost-Effective PVD Thin Film Deposition Systemfor the 3-D TSV Barrier/Seed ApplicationAlex Wang, Biju Ninan, Pramod Gupta, Ravi Mullapudi, Tango

Systems, Inc.

572 Dispensable 3D Electrical Interconnects - A Near TSV

Back End Packaging Solution

Jeff Leal, Suzette Pangde, Scott McGrath, Grant Villavicencio,

Keith Bame, Simon McElrea, Vertical Circuits Inc.

579 Wafer Level Batch Fabrication of Silicon MicroChannel

Heat Sinks and Electrical Through-Silicon Vias for 3D ICs

Jesal Zaveri, Calvin KingJr., Hyung Suk Yang,Muhannad S. Bakir, Georgia Institute of Technology

585 Critical Issues of 3D High-Performance IC IntegrationsJohn H. Lau, Hong Kong University Science & Technology

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WA6

Emerging TechnologiesChairs:

Rajen Chanchani, Sandia National Laboratory;Linus Jauniskis, Foster-Miller, Inc.

593 Development of Ultra-Thin Microelectronic Multi-ChipAssemblies

H. K. Chades,Jr., A. S. Francomacaro, S. J. Lehtonen,A. C. Keeney, G. V. Clatterbaugh, C. V. Banda, TheJohns

Hopkins University

601 Thermal Characteristics for LSI Embedding Build-upPWBs

Shin-ya Amakai, Tsuyoshi Tsunoda, Kohei Ohta, Shuji Sagara,Dai Nippon Printing Corporation, Ltd.; Yoshitaka Fukuoka,

Wodd Electronic Integrated Substrate Technology Inc.

609 TLS-Dicing - The Key to Higher Yield and Throughputfor Thin Wafers

Hans-UMch Zuehlke, Gabriele Eberhardt, Ronny Ullmann,

JenoptikAutomatisierungstedinik GmbH; Mike Lerner,

JENOPTIK LaserTechnologies

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Table of Contents

615 Active Demonstration of a Passively Self-Aligned,

Multi-Chip Package using Proximity Communication in a

Switching Fabric

John E. Cunningham, Ivan Shubin, Hans Eberle, Robert Drost,

Nils Gura, David Hopkins, Ashok V. Krishnamoorthy, Sun

Microsystems

623 An Overview - Advanced Packaging for Solid State Light

Emitting Diode (SSLED) LightingRajen Chanchard, Sandia National Laboratories

631 Bridging the Manufacturing Gap between Macro and

Micro Devices

Arthur L. Chait,EoPlex Technologies, Inc.

639 A Direct Fanning-Out Packaging Technology using Cu

Base Plate for Embedded Fine-Pad-Pitch LSI

Hideya Murai, Kentaro Mori, Kouji Soejima, Yuji Kayashima,Takehiko Maeda, Takuo Funaya, Katsumi Kikuchi, Katsumi

Maeda, Masaya Kawano, Shintaro Yarnamichi, NEC Corporation

WP1

Packaging fot Extreme Environments

Chairs:

Fred Badow, University of Idaho;

Anwar A. Mohammed, InfineonTechnologies

647 Hermetic Packaging for Highly Space-ConstrainedApplicationsThomas E Marinis, Caroline K. Bjune, JosephW Soucy, Charles

StarkDraper Laboratory

655 CCA Passive Vibration DamperJoe Vecera, Bennion Cannon, Honeywell Aerospace

663 Packaging of High Temperature 50 kW SiC Motor Drive

Modules for Hybrid-Electric Vehicles

J. Hornberger, B. McPheison,J. Bourne, R. Shaw, B. Reese,

A. Lostetter, R. Schubach, Arkansas Power Electronics

International, Inc.; B. Rowden,A. Mantooth, S. Ang,J. Balda,

University of Arkansas; K. Okumura, T. Otsuka, Rohm Co., Ltd.

671 Small Surface Probes for Solar System ExplorationJ. C. Reddick, B. H. Kelsic, C. M. Cottingham, S. Roark,

W Tandy, Ball Aerospace & Technologies Corp.

678 Encapsulation of Power Modules for Extreme

Environment Electronics

Fred Barlow, Gona Rao, Srikanth Kulkarni, Aicha Elshabini,

University of Idaho

686 Investigation of SiC Power Module Requirementsfor Smart Grid ApplicationsYuanbo Guo, PitFee Jao, Douglas C. Hopkins, State Universityof NewYork at Buffalo; Gangyao Wang, Yu Du, Subbashish

Bhattacharya, North Carolina State University

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WP2

Mictowave and RF ApplicationsChairs:

Ron Barnett, National Instruments;

Steve Lehnert, Space Systems Loral

693 Ka-Band High Power Near Hermetic Package using

Liquid Crystal PolymerCheng Chen, Anh-Vu Pham, University of California, Davis

698 Optimizing Low Pass Filter Bandwidth for GeneratingElectrical Duobinary Signal for 40 Gb/s Optical

Duobinary SystemsA. Rahman, M. Broman, M. Howieson, Thin Film TechnologyCorporation

703 Design of Low Phase Noise Cross-Coupled VCO in

90nm CMOS TechnologyLu Wang, Prasanta Ghosh, Syracuse University

706 Column Distribution Analysis and RF Characterization

of High-Density Vertical Interconnections Created by

Magnetically Aligned Anisotropic Conductive Adhesive

Sungwook Moon, William J. Chappell, Purdue University

711 Substrate Integration of Widely Tunable Bandpass Filters

Hjalti H. Sigmarsson, Himanshu Joshi, Sungwook Moon,Dimitrios Peroulis, WilliamJ. Chappell, Purdue University

717 Microwave Characterization and Performance

Assessment of Polymer-Magnetic Nanocomposites usingTransmission-Line Based Microwave Resonators

CesarA. Morales-Silva, Julio Dewdney, Sayan Chandra, Susmita

Pal, Kristen Stojak, Hariharan Srikanth, Thomas Weller, Jing

Wang, University of South Florida

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Table of Contents

WP3

Invited Session on Intelligent Uses of Precious

Metals in MicroelectronicsChair:

Conor Dullaghan, Metalor Technologies USA

723 Precious Metal FinancingPaul M. Angland, HSBC Bank USA, NationalAssociation

726 Cost Effective use of Gold in Thick Film Conductors

Samson Shahbazi, Mark Challingsworth, Heraeus Materials

Technology, LLC - Thick Film Materials Division

731 Optimization of Silver Powder Production throughFactorial ExperimentationKirk McNeilly, Metalor Technologies USA - Advanced Materials

Division; Louis A. Johnson, Minitab, Inc.

739 Gold: The High Reliability Choice in Semiconductor

PackagingLee R. Levine, Process Solutions Consulting; Richard Holliday,Wodd Gold Counril

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WP4

Design for ReliabilityChairs:

Kuo-Ning Chiang, National Tsing Hua University;Hyas Mohammed, Tessera Inc.

744 A Design Rule for 3D TSV Technology to Avoid Radial

Cracking in Silicon InterposerZhen Zhang, Microsoft Corporation

750 Nickel Palladium-Based Pads for Higher Reliabilityin Au Wire Process

Asaf Hashmonai, Alon Menache, Kulicke & Soffa Industries

Inc.; Petra Backus, Atotech Deutschland GmbH

755 Reliability of WLP Structures Fabricated with ALX

Dielectric PolymerAlan Huffman,Jeffrey Pkscik, RTI International; Philip Garrou,

Microelectronic Consultants of NC

760 Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation

on Double Tin and Wicked Thick-Au/Ni Plated Printed

Circuit Boards

Jeffrey M. Jennings, Donna Gerrity, Cadyn Smith, Patricia

Olszewski, Harris Corporation

768 Interconnection Design and Impact Life Prediction

Subjected to Board Level Drop Test

Kuo-Ning Chiang, Chan-Yen Chou, Chao-Jen Huang,Tuan-Yu Hung, National Tsing Hua University

776 Silver Epoxy Filled Via Analysis for High Reliability RFMCM Micioelectronics

Joe Kreuzpaintner, Karen Wooldridge, Donna Gerrity,Bill Clark, Hector Deju, Harris GCSD

782 Monte Carlo Simulation of Void Concentrations in

Surface Mounted Solder JointsJacob Burke,John W Evans, KamiliJackson, NASA Goddard

Space Flight Center

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WP5

3D Packaging Approaches:

Applications, Assembly and DesignChairs:

Charles Banda, Laboratory for Physical Sciences;

Leonard Schaper, University of Arkansas

789 Challenges of Supporting 3D IC and 3D Package

Integration in the Design SpaceWilliamAcito, Cadence Design Systems, Inc.

794 Multi-Components Integration in a SIP

Benoit Haentjens, Alain Leborgne, Gerald Chretien, Yan

Haentjens, Societe Vectrawave ZI les loges en josas - IETR;

Erwan Fourn, M'Hamed Drissi, Universite Europeenne de

Bretagne,

800 Design and Reliability of iPILR Package-on-Package(PoP)Hyas Mohammed, Phil Damberg, Tessera

807 Novel Multi Chip Packaging Method Using Stochastic Self

AssemblyBernd Scholz, Sourin Bhattacharya, North Dakota State

University

813 High Accuracy Placement Enabling High Density and

Fine Pitch in 3D-IC with High Density TSV, with Chip to

Wafer (C2W) Bonding ApproachGilbertLecarpentier, Jean Stephane Mottet, Smart Equipment

Technology (SET); Francois Marion, CEA/LETI

817 Side Mount Package (SMP) for Ultra-High Density

Memory ApplicationsMyung Jin Yim, Jason Brand, Chan Yoo, Numonyx B.V.

822 3D Integration Technologies for Miniaturized Tire

Pressure Monitor System (TPMS)Nicolas Lietaer, Maaike M. V. Taklo, SINTEF; Armin Klumpp,

Josef Weber, Peter Ramm, Fraunhofer Institute for Reliabilityand Microintegration

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WP6

Interactive Fotum (Poster Session)Qiaiis:

Lee Levine, Process Solutions Consulting;Thomas J. Green, TJ Green Associates LLC

830 Deposition of Thick Film Fine Line Patterns by Direct

WritingIvan Szendiuch, Martin Bursik, Jirf Hkdtk, Brno Universityof Technology

834 The Cleaning Effectiveness in Electronics AssemblyProcess

Ivan Szendiuch, Martin Bursik, Bmo University of Technology;Vladimir Sitko, Michal Saffer, Pbt Roznov Ltd.

839 Halogen Free and Thermal Stable Novolac Derivatives

and their Properties in Epoxy CompositesH. H. Wu, W T. Yang, S. F. Liu, C. C. Shieh, MCL, Industrial

Technology Research Institute

846 A New Technique for Testing Copper Stud BumpsStephen Clark, Alan King, Dage Precision Industries

848 What is Halide-Free and What Does it Mean to Me?

John Vivari, EKD, Inc.

852 Intelligent Power Grid Simulation Hardware DesignJohn Browne, Sean Devens, SeanJainarine, Orlando Gotisalves,Son Nguyen, Z. Joan Delalic, Temple University

858 An Investigation of Materials Selection and ManufacturingProcess on Resulted Device Alpha Emissivity Levels

Peng Su, Rick Wong, Shi-Jie Wen, Cisco Systems, Inc.;

AndyTseng,Jimmy Chen, Simon Li, Advanced Semiconductor

Engineering, Inc.

863 A Process to Produce Low Cost Solder Balls in Custom

Sizes

Fred Haring,Jacon Baer, Syed Sajid Ahmad, Aaron Reinhob,

North Dakota State University - CNSE

867 Design and Integration of a Planar EBG for UWB

ApplicationsIvan Ndip, Micha Bierwirth, Stephan Guttowski,

Herbert Reichl, Fraunhofer Institute for Reliabilityand Microintegration (IZM); Ege Engin, San Diego State

University

871 The Design and Integration of a Quasi-DistributedTunable UHF Filter

Eric E. Hoppenjans, William J. Chappell, Purdue University

876 Electromigration and Annealing Kinetics of Cu Pillar

BumpYoung-Bea Park, Myeong-Hyeok Jeong, Jae-Won Kim, Gi-Tae

Lim, Andong National University; Byoung-Joon Kim, Young-ChangJoo, Seoul National University; Kiwook Lee,JaedongKim, Amkor Technology Korea Inc.

882 Evaluation of the Ball Grid Array (BGA) Technology with

a view to the Space-use ApplicationKoichi Shinozaki, Norio Nemoto,JapanAerospace ExplorationAgency; Tsuyoshi Nakagawa, Nippon Avionics Co., Ltd.;

Yoshihiro Tokue, Fukushima Avionics Co., Ltd.

889 A New Type of Reconfigurable Antenna for Multi-Band

Wireless Communications

Chang-Chih Liu, Kuo-Chiang Chin, Wei-Ting Chen, Chang-Sheng Cheng, Li-Chi Chang, Industrial Technology ResearchInstitute

896 Decision Matrix as a Tool for Pb-Free Alloy Selection

Pedro O. Quintero, Ricky Valentin, University of Puerto Rico-

Mayaguez; David Ma, Lockheed Martin Space Systems

905 Modeling and Analysis of Electromagnetic Field

Distribution in Vicinity of Patch Antennas at Millimeter-

Wave FrequenciesFlorian Ohnimus, Herbert Reichl Technische Unrrersitat Berlin;

Ivan Ndip, Stephan Guttowski, Fraunhofer Institute

for Reliability and Microintegration, IZM; Ege Engin, San DiegoState University

912 An Interconnection Verification Method and a New

Substrate Option for Cu Pillar Flip-chip Module

ApplicationsShannon Pan, Scott Morris, Jon Chadwick, Terry Glascock, JohnCzarnowski, Mike Ferrara, Don Leahy, RF Micro Devices

THAI

LED and Photovoltaic Cell PackagingChairs:

Min Ding, Freescale Semiconductor, Inc.;

John Bolger, Department of Defense

916 Near Chip Scale Package for High Power, Big Chip LEDsPaulJ. Panaccione, Jay G. Liu, Luminus Devices, Inc.

923 Mechanical Analysis on Ball Bond Lifting of Wire

Bonding in an LED Package for Backlight UnitJong Woon Kim, Shan Gao, Si]oong Yaag, Seog Moon Choi,

Samsung Electro-Mechanics Co., Ltd.

931 Polarization Recycling LED Module for Pico ProjectorY. Chi, WP. Tang, S.L. Chen, C.J. Tsai, Hong Kong AppliedScience & Technology Research Institute Co. Ltd.

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937 Determination of Optimal Component Spacing in a High

Power Light Emitting Diode Array Assembly for Solid

State LightingS. W Ricky Lee, Y S. Chan, Hong Kong University of Science &

Technology

945 Void-Free Fluxless Solder Bonding of CPV Solar Cells

Wei Shi, Paul Barnes, David Muhs, SST International

%w w 'Ws&mswztm. ««a(^SK=*SK ^&hmKA-%mte^<im*mn~i®^mmt°M"^ i&mi^/i>t2rwns«

THA2

Electrical Modeling, Signal & Power IntegrityGiairs:

Ivan Ndip, Ftaunhofer Institute for Reliabilityand Microintegration (IZM);

Judy Priest, Cisco Systems, Inc.

952 Parallel Algorithms for Power and Signal Integrity Analysisof High-Speed DesignsR. Achat, H. Dhindsa, N. Nakhla, D. Paul, M. Nakhk, Carleton

University

958 Full-Wave Electromagnetic Characterization and

Measurement of Witebond Transitions on High

Temperature Co-fired Ceramics (HTCC) and Low

Temperature Co-fired Ceramic (LTCC) Substrates

for Broadband Package DesignsJetryAgukie, Marcos Vargas, Jason Bast, David O'Neill,Steve Hira, Chen Wang, Kyocera America Inc.

965 Embedding the Footprint into Very High FrequencySurface Mount Components Through De-EmbeddingOptimizationA. Rahman, M. Broman, M. Howieson, Thin Film TechnologyCorporation

969 Comprehensive Multilayer Substrate Models for Co-

Simulation of Power and Signal IntegrityRenato Rimolo-Donadio, Xiaomin Duan, Heinz-Dietrich Bruens,Christian Schuster, TechnicalUniversity of Hambuig-Harburg

977 Reduction of Signal Line to Power Plane Coupling UsingControlled-Return-Current Transmission Lines

A. Ege Engin, SanDiego State University; Ivan Ndip, FraunhoferIZM

THA3

Printed ElectronicsChairs:

C. Mike Newton, nScrypt Inc.;

Andy Tseng, ASE (US) Inc.

991 Improvement of Adhesion and Reliability of Conductive

Inks on Flexible Liquid Crystal Polymer Substrates

Eric MacDonald, D. Muse, S. Pritchard, R. Wicker, University of

Texas at El Paso; X. Chen, M. Newton, K. H. Church, nScrypt,Inc.

995 Polymer Nanocomposites, Printable and Flexible

Technology for Electronic PackagingRabindra N. Das, Frank D. Egitto, BillWilson, Mark D. Poliks,

Voya R Markovich, Endicott Interconnect Technologies, Inc.

1001 Direct Print Technology for Fabricated Mechanical

Sensors

Xudong Chen, Ken Church, nScrypt, Inc.; Dan Muse,

David Roberson, Miguel Alamillo, Eric MacDonald,

Ryan Wicker, The University of Texas at El Paso;

Helena Ronkainen, Skno Varjus, Jukka Paro, VTT Technical

Research Centre of Finland

1008 Low Temperature Sintering Nanoparticle Inks for Printed

Electronic Devices

Zhihao Yang, Zhiyong Xu, NanoMas Technologies, Inc.;

Liwei Huang, HowardWang, Binghamton University

1012 Evaluation of Tool for Processing Metallic Conductive

Inks on Low Temperature Substrates

Stan Farnsworth, I. Rawson, K. Martin, K. A. Schroder,D. Pope, NovaCentrix

1016 Inkjet Printing Approach to Fabricate Non-sintered

Dielectric Film with High Packing Density for 3D PackageIntegration TechnologyJihoon Kim, Hun Woo Jang, Eunhae Koo, Hyo Tae Kim,YoungJoon Yoon,Jong-hee Kim, Korea Institute of Ceramic

Engineering and Technology

983 Impact of Metal Fill on On-Chip Interconnect

Performance

Vikas S. Shilimkar, Steven G. Gaskill, Andreas Weisshaar, OregonState University

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ssrfwaawis^w

THA4

Flip-Chip and Wafet Bumping:Processes and Reliability

Chairs:

Bahateh Banijamali, Tessera Inc.;

Timothy Younger, IBM

1018 Underfill Selection for Flip Chip BGA Wafpage Control

Andy Tseng, BerndAppelt, ASE (US) Inc.; Antony Lin, CY

Li, Meng-Kai Shih,Yi-Shao Lai, Advanced Semiconductor

Engineering, Inc.

1024 Flip Chip Process using the Cu-Sn-Cu Double-Pillar-

Bump BondingTae-Sung Oh, Jung-Yeol Choi, Min-Young Kim, Hongik

University

1028 Improvement in Flip-Chip Bonding by Reduction

of Oxide using Flydrogen Radicals

Tsuyoshi Nakashima, Akira Izumi, Kyushu Institute of

Technology; Koji Miyamoto, Michihko Sato, Nagase & Co., Ltd.;

Kanta Nogita, Kitakyushu Foundation for the Advancement of

Industry

1032 Laser Based Assembly of Ultra Fine Pitch Bumped ICs

for Die-on-Die ApplicationsAndrew Strandjord, Thorsten Teutsch, Ghassem Assdasht,

Pac Tech - Packaging Technologies, Inc.; Matt Giere, Sun

Microsystems

1039 Electrornigration Study of uPILR Platform for Fine-

Pitch Flip Chip Interconnects

Piyush Savalia, Rajesh Katkar, Yoshikuni Nakadaka,

Kyongmo Bang, Bahareh Banijamali, Ilyas Mohammed,Laura Mkkaiimi, Tessera, Inc.

1046 Thermosonic Gold to Gold Interconnect (GGI) Flip Chip

Bonding for 7mm2 Die

Philip Couts, TDK Corporation of America

THA5

High Performance Interconnects and BoardsChairs:

Roger Krabbenhoft, IBM;Ronald Jensen, Honeywell Solid State Electronics Center

1054 New Methods for Mechanical Mating Characterization

of Surface Mount Technology Card to Board

Interconnections

John Torok, William L. Brodsky, Shawn Canfield,Hien P. Dang, David L. Edwards, Mark K. Hoffkneyer,Vijay Khanna, Eric J, McKeever, Arvind K. Sinha,Sri Sri-Jayantlia, IBM Corporation

1062 Production Measurement of Frequency DependentAttenuation and Phase Constant of PCB Traces

John DiTucci, Introbotics Corporation; Roger Krabbenhoft,

IBM Systems and Technology Group

1070 A Case Study of the Impact of Fabrication Processes

on PCB Broadband Electrical Characteristics

Jason Lin, Albert Huang, Ohio Huang, Steven Chen, Compe^

Manufacturing Co., Ltd.

1078 A Comparative Study of Microsttip, Striplineand Coplanar Lines on Different Substrate Technologiesfor High-Performance ApplicationsRobert Erxleben, Ivan Ndip, Lars Brusberg, Henning Schroder,

Michael Topper, Wolfgang Scheel, Stephan Guttowski,Herbert Reichl, Fraunhofer Institute for Reliability and

Mtcrointegration, IZM

1084 Newly Developed Low-Transmission-Loss MultilayerMaterials for PWBs Applied to High GHz Bands

Kenichi Ikeda, Hikari Murai, Yasuyuki Mizuno, Hiroshi Slumizu,

Makoto (Mak) Kato, Hitachi ChemicalCo., Ltd.

1089 A Novel Halogen Free and Low Dk/Df Laminate

Material for High Frequency ApplicationSanny He, Bill Weng, ITEQ (Dongguan) Corporation

1093 A Novel Green Process to Manufacture Ultra High

Density Packaging Substrates

Chih-Kuang Yang, Princo Corporation

m^mmMm^m^mmwmm^i^mm^m^M'

Appendix

1097 Organizational Members

1099 Index of Authors

xv