Probe Transfer M27V 230412 - NXP Semiconductors...1. Objective and Considerations 1.1 Objective...

Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

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23 April 2012, Gunavathi/ Douglas Garrett

Oak Hill Probe to KLM Probe Transfer2M27V CorrelationCAB# 11302371D

0. Introduction – Reason for Probe Site Qualification

� NPI Site to Mass Production Site - Expected(normal) product transfer from NPI (Fab) Probe Site toMass Production Site. This transfer minimizeslogistical complexities and offers flexibility and synergybetween Probe and Final Test.

TMFreescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarksof Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

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1. Objective and Considerations

1.1 Objective

� Objective is to qualify KLM Probe facility as joint probe site for probing

2M27V. Complete list of affected parts is outlined in PCN QSD.

� Scheduled to complete by 30th April 2012 (not including PCN)

� No impact of customer deliveries

1.2 Considerations

� Test Platform Hardware in KLM Probe is identical platform used in OHP

Probe, and verified by tester calibration and dual site Kappa comparative


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Probe, and verified by tester calibration and dual site Kappa comparative

analysis (see slide).

� Identical probe card design used in both sites

� Test Program Revision and test limits are identical in both sites.

� Measurement Systems Analysis (GR&R) performed per 12MRM97179Aproving bin / yield repeatability.

� Visual Inspection including Bond Pads per global specification 12M54564J

2. Correlation Plan2.1 Pre-Correlation items

� Installed and Verified:

� Navigator setup and control map files

� Tester config requirements (hardware/operating system version)

� Probe card documents (PRVX, Schematic, Drawing)

� Prober files (xx e.g. TEL-P8XL probe)

� PROMIS flow (see slide)

� All Bin monitoring systems and limit files

� Zero Defect files (EWM, DPAT, and GDBC Files)


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� Zero Defect files (EWM, DPAT, and GDBC Files)

� Verified installation and lock-down of 2M27V test program

� Probe Card Repair completed incoming inspection on probe card

2. Correlation Plan

2.2 OHP vs. KLM Correlation Plan

Probe Correlation:

� Completed hardware correlation

� 3 wafers(Sort1 and Sort2)

� Confirmed cross-site correlation on all 3 wafers on yield distribution


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3. Correlation Criteria

3.1 Correlation Criteria

(According to Global Probe Transfer Specification 12MQS10020G)

Yield & Bin Correlation

� Fully probe (test) all three wafers in OHP Probe

� Fully probe (test) the same three correlation wafers in KLM Probe

� Bin variation must pass within 6%


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Slide 5

� Yield variation must pass within 3%

Probe Flow4. Probe Flow Comparison (Promis Probe Flow comparison)

Exchanging pre-correlation items (section 2.1)

Sort 1 probe – 25C

Bake – 250C


Sort 1 – Zero defect map updateOHT

KLM

P


Bake – 250C


Sort 1 – Zero defect map update


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Slide 6



FOI

KLM - Assembly

Probe

Probe

Slide 6



FOI

KLM - Assembly

Correlation Results (CHD - TJN)5. Bin to Bin Variation – Overall Sort1 Results

ATX

KLM

7 8 9 14 19 55 101 104 109 121 122 127 128 139 141 144 148 156

7 0.02 0.24

8 0.07 0.05

9

14

19 0.17 0.05

55 1.47 0.05 0.07 0.07 0.02

101 0.59 0.02 0.02

104 0.02

109


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Slide 7

*All data in percentage %

121

122 0.05 0.07 0.02 0.02

127

128 0.02

139 0.21 0.02

141

143 0.02

144 0.09

148 0.02

1 7 9 14 19 20 32 50 59 60 61 62 65 69 72 101 104 109 121 122 139 148 156 185 201 222 230 231 235

1 0.02% 0.21% 0.05% 0.17% 0.21% 0.36% 0.02% 0.19% 0.21%

7 0.12%

9

14

19

20

30 0.52% 0.02%

32

50 0.02% 0.92% 0.07% 0.02%

53 0.02% 0.02%

60 0.14% 0.02% 0.05% 0.02% 0.02%

61 0.05% 0.26% 0.02% 0.07% 0.05%

62 0.07% 0.09% 0.02%

65 0.02% 0.17%

69 0.12%

70 0.02%

72

86

ATX

KLM

Overall LOGIC Results Matrix5. Bin to Bin Variation – Overall Sort 2 Results


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101

104 0.28% 0.02% 0.02% 0.95%

109 0.36% 0.09%

121

139 0.19% 0.02% 0.09%

148

156

185

201

222

230

231 0.19% 0.02% 0.02%

235

Indicates correlating bin

Slide 8

*All data in percentage %

6. Correlation Summary Kappa Assessment

PASSED

Wafer Wafer # 06 Wafer # 16 Wafer # 17 Overall

Probe Yield (KLM) 95.16% 95.66% 95.16%

Probe Yield (ATX) 95.59% 95.02% 95.23%

Bin Correlation Error Mean (<6%) 1.56% 2.77% 2.84% 2.39%

Yield Correlation Error Mean (<3%) 1.69% 2.81% 2.59% 2.37%

Sort1

Wafer Wafer #04 Wafer #05 Wafer #18 Overall

Sort2


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� Kappa wafer analysis showed that the yield from both Probe sites are not statistically different in yield. Bin fallout from both sites were also comparable.

PASSED

Wafer Wafer #04 Wafer #05 Wafer #18 Overall

Probe Yield (KLM) 83.78 % 84.07% 85.56%

Probe Yield (ATX) 81.79% 81.79% 84.42%

Bin Correlation Error Mean (<6%) 5.33% 5.76% 5.69% 5.59%

Yield Correlation Error Mean (<3%) 2.77% 2.92% 2.77% 2.82%

7. Probe Mark Inspection

1 24

5

� Criteria: Probe mark must be > than 5 microns from the passivation opening (Glass Line) per specification 12MTX10001G

Min Distance From Edge (microns)

Point 1 23

Point 2 18

Point 3 21

Point 4 21

Point 5 21


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Slide 10

Probe Mark Inspection Points

1 2

3

4 Point 5 21

1M76G Probe ILD DOE 8. Interlayer Dielectric Study Wafers:

KLM 2M27V

Probe Card:

16 dut x16 (Vertical type)

Card: 75M27V1601

Platform:

Teradyne J750 / TEL P8XL

KLM system KLJ750-28

Inputs:

• 3 overdrives

• 70

• 85- Nominal

• 100


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Slide 11

• 100

• 3 levels of probe events (Touch downs, TD)

• 4 TD

• 6 TD

• 8 TD

• ZPTPA at -5

• measured planarity = 25-30µm

• Single touch probe

• Room temp probe (25C)

Outputs:

• ILD integrity / barrier layer damage assessment

ILD Scrub Examples8.1 Interlayer Dielectric Results

70 OD 6TD 70 OD 8TD 85 OD 4TD70 OD 4TD 85 OD 6TD


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85 OD 8TD 100 OD 4TD 100 OD 6TD 100 OD 8TD

ILD Results8.1 Interlayer Dielectric Results

70 OD 4TD 70 OD 6TD 70 OD 8TD


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Note: With visual Inspection No Dimples or Cracks were seen.

85 OD 4TD 85 OD 6TD 85 OD 8TD

ILD Results8.1 Interlayer Dielectric Results

100 OD 4TD 100 OD 6TD


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Note: With visual Inspection No Dimples or Cracks were seen.

100 OD 8TD

2M27V ILD INSPECTION

Probe site : KLM

10-Oct-11

Inspected by Kong Siow Lian

Test

Platform

Probe Stresses ILD Inspection Results

Overdrive Probe Events Die Inspected (%) % Failed (# Wafer)

704 100% dies 0%

8.1 Interlayer Dielectric Results


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Teradyne

J750

704 100% dies 0%

6 100% dies 0%

85

4 100% dies 0%

6 100% dies 0%

8 100% dies 0%

100

4 100% dies 0%

6 100% dies 0%

8 100% dies 0%

9. Conclusion and Recommendation

9.1 Conclusion

� Based on this report, 2M27V passed all Probe correlation requirements according to

FSL rules without any issues.

9.2 Recommendation

� Test program for 2M27V can be released in KLM Probe

� Track probe and final test yields to check for equivalence on lead production lots.


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� Track probe and final test yields to check for equivalence on lead production lots.

Probe Transfer M27V 230412 - NXP Semiconductors...1. Objective and Considerations 1.1 Objective...

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