Printed Electronics Technologies

8/12/2019 Printed Electronics Technologies

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Printed Electronics:

Technologies, Challenges and Applications

Jurgen Daniel

([email protected])

Palo A lto Research CenterPalo Alto, CA

International Worksho p on Flexible and Prin ted Electronic s (IWFPE 10)

Sept. 8-10, Muju Resort, Korea


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Outline

Motivations for Printed Electronics Printing Technologies

Printing Materials

Challenges Applications

2


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Motivation

3


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Printed Electronics

First integrated circuit: KilbyFirst printed book: Gutenberg

pr int electronics

uniting two worlds

4


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The Vision of Flexible/Printed Electronics

Nokia conceptsAntenna Design concept

Electronic Patch Network (DK)

Displays, sensors, RFID, batteries, solar cells, lighting,

Freshness sensor

(RF, H2S gas)

ITRI/ UCSB

Flexio : Yanko design

e-Drum

Solar-powered radio

5


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Printed Electronics Market

The market for printed electronic devices, compon ents and systems, according to Hannah,(CEO of $300 billion worldwide within the next 20 years.(Printed Electronics Now, Dec 3, 09)

There is a signi f icant market potent ia l for pr inted electronics

but recent ly also:

(~76% printed)

IDTechEx

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Key Motivations for Printing Electronics

Large area or Roll-to-Roll processing Other technologies would be difficult/slow (ex: printed connectors, keypads, PV, lighting,)

Difficulty in processing materials otherwise Materials compatibility (ex: glucose sensor strips, OLEDs)

Substrate topography/fragility (e.g. thin solar cells, MEMS)

Thin product form factor Rollable, conformal

Price: Ultra-low price (ex: battery tester, PV, OLEDs, RFID ?)

->market has to be very large to make money

Print ing may be used only wh ere i t show s a dist inct advantage7


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Printing = Additive Deposition

1 step vs 6+ patterning stepsConvent ional pro cess Pr int ing pro cess

For pr int ing disp lays: ~50% cost savings is predicted

1..

1..

2..

3..4..

5..

6..

Source:Tech-On

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Printing Technologies

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Printing Technologies

after Handbook of print media: technologies and production methods, Helmut Kipphan

Conventional printing(with master)

Non-Impact Printing(masterless)

GravureScreenPrinting

Inkjet

Offset

Letterpress/Flexography

ContinuousDrop onDemand

Thermography

Transfer

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Printing for Electronics: Includes a Variety of Processes

Inkjet, gravure, offset, flexo, (rotary) screen,

Microcontact, (Nano)imprinting

(Laser) transfer printing (of high performance circuits)

Dip-pen nanolithography

Dry printing (Organic vapor deposition)

Hot embossing

Laser processing (cutting sintering, patterning)

Stamping/die cutting

Slot-, dip-, spray-coating R2R etching, photolithography (!)

Lamination,

Consider: The consumer does not care if and how a product is printed11


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Example R2R Printing Process

http://www.thinfilm.se/about-us/manufacturing

12

Gravure, microgravure, rotary screen printing

Ferroelectric polymer memory
http://www.thinfilm.se/about-us/manufacturinghttp://www.thinfilm.se/about-us/manufacturinghttp://www.thinfilm.se/about-us/manufacturinghttp://www.thinfilm.se/about-us/manufacturinghttp://www.thinfilm.se/


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Example of a R2R System with Stationary Step(Bosch Rexroth)

could enable a roll-to-roll (R2R) photolithography step13

ICFPE09


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Screen Printing (I) Properties+ robust

+ simple

(+) thick layers

- large feature size

(~100 m)

- high ink viscosity

(>10,000cP)

- slower speed (5m/min)

Conventional screen printing

on clothing, packaging

screen print ing factors:

- screen parameters- snap-off distance- screen tension (N/cm)- print speed- squeegee pressure- squeegee durometer- angle of contact

Murakami Screen

Screen example:- Mesh count (per inch): 305- Thread dia(mu):34

- Mesh opening (mu): 4714

snap-off


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Flat screen or rotary screen printing

Screen Printing (II)

Kammann - Flat Screen Head on web printing machine

Mark AndyRotary Screen

Speed : up to ~20 m/min (R2R)[up to ~100m/min (~450ft/min)]

15

image courtesy of Storck Screens

kiss printing

(zero off-contact)


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Advanced Screen Printing: 30 m lines/spaces (10-20 m in development)

Screen Printing (III)

(http://www.dknresearch.com/)D. Numakura, DKN Research

Five Star Technologies, ElectroSperseinks50 m lines16

Screen-printed electroluminescent display

130 m pitch


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Gravure PrintingProperties

+ fast printing (50m/min)

up to ~3000 ft/min

+ dot thickness variation

+low dot gain

+ High resolution

+use of organic solvents

possible

~10-500cp ink viscosity

- relatively high plate cost

(metal cylinder)

http://glossary.ippaper.com

Gravure printing for high

quality print e.g.

National GeographicChrome plated cylinder

Rotogravure

source: VTT

- also MicroGravure (Yasui Seki, Daetwyler R&D)

Daetwyler:

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Gravure ExamplesMLCC(Multi-Layer Ceramic Capacitor)

Screen Gravure

Thinner layers (lower ink viscosity)Higher speed (50m/min vs 5m/min)

Samsung (SEMCO)

RFID tags

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Flexographic PrintingProperties

+ inexpensive plate

pattern

+ high throughput

+ thin ink layers / low

viscosity inks

- plate degradation due to

solvents

MarkAndy LP3000: 230m/min

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Flexo printing plate

Source: wikipedia

Printing on packages:

Corrugated cardboard and foil

Y. Dykes, MacDermid, Inc

elastom eric plate m ater ia l


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Inkjet Printing

Piezo

Thermal

Electrostatic

Acoustic

Continuous

Drop on demand

Properties

+ non-contact

+ small ink quantitiesrequired

+ digital printing

+ low viscosity inks

(polymer-free systems)

~5-50cp

- nozzle reliability

- speed

SAMSUNG (SEMCO) Y.Yoo, ICFPE09

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Piezo-inkjet

H. Wijshoff, Oce Technologies

10 s

110 s

20 s


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Inkjet Printing Drop Formation

y ~ s

Feature size:

depends on printed volume and dropinteraction with surface

W. Wong, et al., in Flexible Electronics, W.

Wong, A. Salleo, edt., Springer21

PARC in kjet system

Piezo-inkjet

For high accuracy keep distance low !


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Jet-printing - why ?

Variable digital pattern

On-the-fly error correction (e.g. on flexible substrates)

Non-contact printing (substrates with topography, fragile substrates)

Low operation cost (low ink consumption)

Wide range of inks (hot-melt wax, solder, bio-materials, low-viscosity inks, )

why potentially not ?

limited resolution

limited printing speedjetting reliability issues

sensitivity to substrate variations

Jet-pr int ing is excel lent for prototyp ing !

Piezo-inkjet

22

(PARC)


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Jet-printing for Electronics - components

printheads systems inks

Commercial Printing Components23


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Color Filters LCD Spacers

Polyimide alignment layer

Scratch resistant layers

Back light unit

LCD materials

OLED materials

Electrophoretic media Electrowetting fluids

Electronic circuits

source: Samsung

Applications of Jet-Printing (for electronics)

Ch-LCD

ITRI

EWD

ITRI

Light guide (BLU)

J.Y. Kim, et al, NIP25, 09

(EPFL)

Samsung

Color f i l terLCD spacers

LG Display

Ink jet of fers m any opp ortuni t ies, but manufactur ing can be chal lenging24


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Technology Comparison

Source: H. Kopola, VTT

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Aerosol Jet(R) Printing

M3D (Maskless Mesoscale Materials Deposition) http://www.optomec.com

60m Ag lines written over a 500m trench.

Conformal printing on 3D surfaces: 1-5 mm standoff Viscosity: 1-2500cP Feature size


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Co-extrusion printing (developed at PARC)

MDDW (Micro-Dispensing Deposition Write)

Direct Deposition

Direct-write Extrusion

Bok Yeop Ahn , et a., Advanced Materials

Volume 22, Issue 20,pages 22512254, May 25, 2010

3D substrates Viscosities up to 1mio cP ~50-100 mu lines Up to 200mm/sec

N.S. Kim, K.N. Hahn, ICFPE 20093D antenna printed on helmet:

PARC

Silver ink

Sacrificialmaterial

27

(http://www.nscryptinc.com/)

J. Lewis group, U. Illinois, Urbana-Champaign

(http://www.parc.com/)
http://onlinelibrary.wiley.com/doi/10.1002/adma.v22:20/issuetochttp://onlinelibrary.wiley.com/doi/10.1002/adma.v22:20/issuetoc


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Transfer Printing (I)

Chip Micro-transfer Printing

Laser Transfer

BASF / Schmid Group

Fine line (< 100 mu) High aspect ratio(>0.3) Non-contact

credit: John Rogers, U. Illinois, Urbana

credit: Semprius, Inc.

stamp

source target substrate

Neural sensorarray

Flexible PV

example: solar cell gridlines

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Transfer of nanowires (Javey et al., UC Berkeley)

Thermal transfer of conductive materials

Transfer Printing (II)

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Iimak thermal transfer ribbon:

http://www.iimak.com/


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Printing MaterialsSource: DuPont

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graphic inkselectronic ink s

(PARC)


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The TFT as the Basic Circuit Element

s,d,g contacts+ interconnects:

Thin Fi lm Transisto r

(TFT)

(bottom-gate)

semiconductor:substrate:

g

ds

inter-layer dielectrics:(gate dielectric, top dielectric)

encapsulation

InverterCMOS

InverterPixel

gate linedata line

Cs

The transistor performance d etermin es the extent o f appl icat ions31


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Materials compatible with solution processing

The Printed TFT

s,d,g - contacts:

Thin Fi lm Transisto r

(TFT)

(bottom-gate)

Substrate:polyesterpolyimidePEN (polyethylene naphthalate)...

g

ds

inter-layer dielectrics:(gate dielectric, top dielectric)

-> perform ance of the mater ials has to be opt imized and proc ess

compat ib i l ity ensured

(nanoparticles, polymers,)

PVPPVP, SU-8,

Many new mater ia ls are introduced in to the proc ess

semiconductor:(polymers, oligomers,precursors, nanoparticles)

PQT-12,

(similar materials sets apply for OPV, OLED, )

32

J. Daniel, et al., Mater. Res. Soc. Symp. Proc. Vol. 1114, Fall 2009, 1114-G13-03


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Conductors Carbon, silver, aluminum flakes

Polypyrrole, polyacetylene, thiophenes (PEDOT:PSS) Metal nanoparticles (Ag, Au, Cu, Ni - annealing or photonic curing)

Catalyst printing + plating

Reduced printed metal salts, metal precursors

Carbon nanotubes, metal nanowires Graphene inks

Solder

Elastic Conductors

Photonic cured Cu (~10x bulk)

Cu

Ag nanoparticles

metallic nanowires

Cambrios

Melting point depression in nanoparticles

High condu ct iv i ty , low ro ughness, low proc ess temp erature and w ork func t ion !

surface functional izat ionmay be required for TFT s/d electrodes

Elastic conductor(T. Sekitani, T. Someya, Univ. of Tokyo)

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(PARC)


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Conductors selected new developments

Mechanical sintering (AIST, T. Kamata, Digital Fabrication 09)

- Alloy sintering -> control of work function- Printed oxide semiconductors (NiO, SnO2, In2O3)

Copper deposition

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- in reducing environment (CO, H2, hydrazine)- photonic/laser curing


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Insulators

Oxides, nitrides Al2O3, HfO2 (anodization, atomic layer deposition)

Polymer dielectrics (PVP, PMMA, )

Spin-on-Glass Parylene (evaporated)

Solid electrolytes

Ion gels .

Semico ndu ctor / insulator in ter face is cru cia l for TFTs

surface funct ional izat ion may be required; high-k dielectrics perform poorly with OSCs

- pinhole-free layer- high k or low k- smooth surface- transparent

- barrier property-

potential desirable properties

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Semiconductors

Organic semiconductors (small molecule, polymer)

Oxide Semiconductors (ZnO, InGaZnO)

CNT

Nanowires, nanoribbons (Si, GaAs)

Nanoparticles (Si, CdSe, ZnSe)

high mobility required for current driven displays

(OLED, electrochromic), driver circuit integration

and other circuit applications

mobil iti es of organic SC

pri nted Si

some processes require annealing steps

(e.g. laser or RTP)

CNT

OSCZnOETRI

Organic and inorg anic semicond uctors are pr intable

TIPS-PEN

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Recent developments of printable OSC

Semiconductors organic examples

Works with high-k dielectics (alkylchains keep distance from polar interface)

ActivInkTM N1500 (Small-Molecule)

P-type

N-type

Mobility up to ~4cm2/Vs

- also new amorphous polymer withmobility ~0.5cm2/Vs that is easy toprocess

challenge:

-High mobility and uniformity--> trend towards small molecule precursor/ amorphous polymer blend

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mu lt i -component OS ink

G. Lloyd, OSC09

B. Florez, OSC09


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Recent development

Semiconductors inorganic example

Mobilities up to 5 cm2/Vs(350degC)

- Solution processed (jet-printed) inorganics- Targeting 150degC process temperatures

(H. Thiem, OSC09)

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ZnO


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Challenges in PrintedElectronics (with focus on inkjet)

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Printing process challenges

Registration Chemical compatibility of materials (orthogonal

solvents)

Physical compatibility (step coverage, work function, etc.)

Curing/drying of inks within thermaltolerances/time

Online quality control to optimize process yield

Controlled atmosphere for sensitive materials

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Materials challenges

Ink viscosity Printability

Ink stability (e.g. particle agglomeration, settling,)

Material lifetime(moisture, oxygen, ozone, etc.)

Cost (e.g. Au, Ag vs Cu)

Uniformity (e.g. OSC, nanowires, thickness)

Performance (e.g. OSC mobility)

Process/solvent compatibility

Wetting properties (surface tension, surface energy)

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Challenges from the lab to the fab

Manufacturing challenges: Environmental impact / disposability

e.g. are nanoparticles safe ?, disposable batteries ?

Health & safety

benign solvents

Process time/ TACT time/ print speed

Curing -> UV (photonic curing , laser sintering ?)

Temperature Budget

Low-T curing or photonic curing ?

Process parameters: substrate tension, layer thickness Yield/ uniformity/process monitoring

Packaging

operation in air, elevated temperatures (e.g. in car in summer ?)

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Device challenges

Parasitic capacitance (affecting device speed)

Feature size (affecting device area)

Uniformity (device to device)

Reliability (pinholes, roughness)

Yield

Encapsulation (for longer lifetime)

Process compatibility of device layers Performance tradeoffs (top gate vs bottom gate)

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Challenges from the lab to the fab

K.H. Shin, Konkuk Univ., Seoul, Korea

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Challenges in (Jet)-Printing Circuits Ink formulation (-> adjusted viscosity, surface tension, evaporation rate)

Substrate quality (-> surface energy, roughness control)

Layer to layer registration (-> self-alignment)

Jetting-reliability (-> monitoring, redundancy)

Ejector-to-ejector variations (->monitoring, redundancy)

Print resolution (-> surface energy adjustment or patterning, laser assist, novel print-heads)

Print ing chal lenges of fer opportun i ty for R&D

70 m

10 m

45 m

increasingly hydrophi li c sur face

Inf luence of Subs trate sur face Examples of p rinted si lver l ines

45

A.C. Arias, et al., J. of the SID, 15/7 (2007) 485

J. Daniel, et al., NIP25/ Dig. Fab. 2009, 599-602

(PARC)

Jet printing challenges nanosilver


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Jet-printing challenges - nanosilver

~140 micro n l ines

~65 mic ron l ineson poly imide

(smaller drop size)

100 200 300

0

1000

2000

3000

4000

5000

Height()

Scan distance ( m)

95 m

hydrophobic

hydrophi l ic

ink -surface in terac t ion coffee-r ing effects

optimized process

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J. Daniel, et al., Jpn. J. Appl. Phys., Vol 46, No 3B

(2007) 1363-1369(PARC)


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Typical for inkjet printing: result of the uneven evaporation of a liquidover a droplets liquid-air interface

Coffee Stain Effect

Deegan, R.D., et al, Capillary Flow as the Cause of Ring Stains from Dried Liquid Drops , Nature 389, 1997

Dynamics of the coffee stain effect:

The evaporation rate J is larger at the edge of a droplet due to thecurvature of the droplet leading to a flow of fluid and nanoparticleswith a velocity v.

Source: U Illinois

Pinned contact line

the free surface, constrained by a pinned contact line,squeezes the fluid outwards to compensate for evaporativelosses.

Circulating flows driven by surface-tension gradients (Marangoniflows) can counteract coffee stain: Marangoni flow can beinduced by mixing two solvents with different boiling point anddifferent surface tension.

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Jet-Printed Active-Matrix Backplanes

680 m (37ppi)

48

192 m

Pixel pad

Gate layer

Data layer

Pixel design

Printed pixels (PQT TFT)

PQT-12 jet-pri nted OSC

Jet-pr inted nano-si lver

photol i thography

Commercial backplane(smallest features ~5 m )

pr inted

A.C. Arias, et al., J. of the SID, 15/7 (2007) 485J. Daniel, et al., SID 07 Digest, P-21, 249-251

(PARC)


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Challenge: Higher Resolution

decreasing f i l l factor

improve printing process (line width / spaces)multi-layer pixel design

Higher display resolut ion requires smal ler pixels

increasing pixel count

solut ions

680 m 340 m 170 m

Fill factor: ~72% ~58% ~32%

49 J. Daniel, et al., Proc. NIP25 and Digital Fabrication 2009, 599

(PARC)


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Higher Resolution

T. Tano, Ricoh Co., NIP25, 09

Surface energy patterningof substrate

Sirr ing haus , et al., Scien ce, 290 (2000), 2123

(Fujifilm Dimatix)

Printheads with 1pl drops for

~20 micron features

Sekitani, Proc. Nat. Acad. Sci. 105 4976 (2008)

Superfine inkjet printing

Brow nian mot ion and electrostat ics are crucia l at smal l drop sizes

Droplets smaller than nozzle size possible

Electrohydrodynamic printing

Laser assisted printing

Conductive Inkjet Technology (CIJ)

50

Brownian motion, electrostatics !


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Pixel Fill-Factor

Multi -layer pixel

(MLP)

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J. Daniel, et al., SID 09 Digest, 44.3, p660-663

(PARC)

Requires via

format ion


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Via Formation in Printed Electronics

Gelinck, et al., SID 05 Digest, 3.1

(Polymer Vision / Philips)

Laser ablationPhotol i thography

Solvent Print ing

Kawase, Sirringhaus, et al.,

Adv. Mater. 2001, 13, 1601

(Seiko-Epson/ Univ. Cambr.)

Hole Punch ing

Drury, et al., Appl. Phys. Lett., 73, 1998, 108

(PhilipsRes. Lab)

Vias in dielectrics are essential for multi-layer pixels and for most otherelectronic circuits

Via form at ion proc ess is st i l l chal lenging

Molding process

J. Daniel, et al., SID 09 Digest, 44.3, p660-663

52

(PARC)


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Overlap capacitance in Printed TFTs Larger print tolerances cause greater overlap capacitance

typical bottom-gate TFT

(schematic)

G

S D

( top view)

(cross-sect ion)

e.g. a-Si, organic

(can negatively affectappearance of a display)

Vpixel = Vgate Cp/(Cp+Cst)

Reduce overlap capacitanc e, e.g. with self-al ignm ent techn iqu es

High overlap capacitance -> low sw i tch ing f requency

f = (VgsVt) / 2 L(L+2Loverlap)

High overlap capacitance -> h igh feed th rough vo l tages(unless compensated by large storage capacitor)

Feedth rough vo l tage

Loverlap

Loverlap

53

(PARC)

S d f Di l id t ?


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Speed of Display video rate ?

190x64 m,Cst ~0.2pF,Cp ~0.03pF

680x680 m,

Cst ~pF,Cp ~pF Cst

CpCd

Vft= VsCp

Cst+Cp

high mobility semiconductor is desirable (+ high W/L)

good control over printing process to reduce parasitics

~ 30 fps may be sufficient for many applications

for e-paper, faster display media is under development (E-ink, SID'05)

Conventional LCD display pixels:

Printed pixels:

Fast pixel response requirescareful balancing of feedthrough voltage and pixel capacitances

Pixel capacitances and

feedthroug h vol tage

Pixel capacitance (Cp+Cst)

P

ixelRCtime


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Applications

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Printed Battery Energy Strip

Printed

- conduct or

- i nsu lato r

- th ermoch rom ic d ye

Nice to have, but co nsum er probably wo uld n ot want to pay extra for i t56


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Printed Battery

1.5V/cell carbon-zinc MnO2 chemistry

R2R process

Print ing enables bat tery integrat ion w ith oth er devices on one sub strate

Battery-assisted RFID RF-enabled sensor systems and data loggers RFID smart cards and ID badges Medical care devices Cosmetic patches Interactive consumer goods packaging

potential applications:

printed Li polymer battery

printed Zn/MnO2 ZnCl2 electrolyte

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Printed RFID tags Organic semiconductor on plastic foil

Web speed: ~30m/min

13.56 MHz voltage rectifier ~100Hz ring oscillator, 4 bit Manchester chip (64-bit tags in lab)Antenna is not printed re-writable memory (for toys/games):

PolyIC and Thin Film Electronics ASA

Item-Level TrackingSmart Packaging for Healthcare ApplicationsBrand ProtectionInventory and TrackingTransit Cards and Smart Cards

For ultra-cheap RFID tag applicat io ns

TFT mobilitiies


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Silicon ink semiconductor on metal substrate

Printed RFID tags

Kovios RFID chips are printed on a 16 x 16 in. sheet of metal.

nFET thin-film transistors (TFT) with electronmobilities of 80 cm2/Vs.

(source: Semiconductor International)

IDTechEx: market size for item-level RFID tags by 2015 will growto 163 billion units, valued at $5.3B. By then, the average salesprice will be cents per tag.

For ultra-cheap RFID tag applicat ion s59

P i t d O i PV


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Printed Organic PV

100feet/min; 250-1500mm width 6.39% efficiency (0.8cm2) T80 lifetime ~8000h (>3yrs)

Promising for ul t ra-low cos t , part ial t ransparency and high f lex ib i l ity

(capacity)

8.13% record efficiency (size ?)

J. Hauch, OSC09

Bulk Heterojunction Polymer / Fullerene

Konarka/Lundberg Design

- commercial OPV modules: ~3-5%

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Printed CIGS solar cell

Printed Inorganic PV

CIGS (copper-indium-gallium selenide)

R2R (non-vacuum ) process enables low c ost61

Printed Selective Emitter Process


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Printed Selective Emitter Process

Innovalight

Printed n-type Silicon ink (screen or inkjet)One step added to a conventional cell line (retrofitable)

Efficiency improvement

Si -nanoparticle ink

H. Antoniadis:62

OLED Displays / Li hti


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OLED Displays / Lighting Fully printed OLED

screen printed air-stable printed cathode material

Conventional polymer organic LED (P-OLED)

Add-Vision PrintedP-OLED

evaporated cathode material !

(Superior power efficiency brightness and lifetime)

63

http://www.add-vision.com/

panel wi th ink volume correction

S.Skai, et al., NIP 25, 2009 (Seiko Epson)

inkjet printed displays volume averaging required

for uniformity (Mura reduction)

Seiko Epson, CDT,

Fl ibl Di l i h P i d B k l


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Flexible Displays with Printed Backplane

50x50 pixels(~2 inch diag.)

37ppi

PEN substrate

PVP gate dielectr ic

Pr inted Ag

PQT semico nduc tor

680 m pixels; PQT-12 jet-printedSemiconductor

Display medium: E-inkelectrophoretic imaging film

active-Matr ix pixel circu i ts for electroph oret icmedia (PARC)

Al l -addi t ive solut ion p rocess64


J. Daniel, et al., SID 09, 44.3, 660

Printed Displays further examples


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65

80dpi

50dpi

Dai Nippon Print ing

screen printing+ solution processing

pentacene OSC

QR-power display

roll printed resist for all layers

15 inch display

Printed Displays - further examplesLG

Samsung

Printed Electronics Circuits


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Printed Electronics Circuits

(Chemnitz Univ./Johns Hopkins Univ)K. Reuter, et al., Organic Electronics 11(2010) 95-99

Gravure/Flexo printed inverter

Contact charging of Cytop dielectricfor depletion/accumulation TFTs

(Sunchon National Univ.)M. Jung, G. Cho, et al. ICFPE09

66

Gravure printed 4-bit logic

Jet printed inverter

(PARC)

T. Ng, et al., Appl. Phys. Lett., 94, 233307 (2009)Y. Xia, D.Frisbie, U. Minnesota

Printed D-Flipflop (printed ion gel gated circuit)

O


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Other Printed Electronic Devices

Oncoprobe, Ltd

Biosensors

Printed sensors for glucose meters:~2.2 billion sold each year

Relat ively sim ple prin ted devices are already on th e market

Source: Dupont

Electro lum inescent Lamp s

E lec trochromic D isp lays

GSI technologies GSI technologies + NTera

Source: Dupont

Antennas

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Examples of Printed Sensors


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Examples of Printed Sensors

ITRI/ UCSB ITRI/ UCSB

L. Tymecki, et al, Sensors 2006, 6, 390-396

Screen printed Ion-selective sensor electrodes

VTT

3PLAST project

68

screen printed piezo/pyro sensors screen printed piezoresistive pressuresensor (e-Drum)

detection of H2S gas

Demonstrators


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Demonstrators

Interactive cards (gaming cards)batteries, conductors, push buttons

Interactive package:Conductors, dielectrics, thermochromic ink

69

Printed Electronics demonstrators


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Demonstrator kits by OE-A

Printed Electronics - demonstrators

Game board

Demons trators m ay enable designers to have new appl icat ion ideas70

Alt ti t P i t d Ci it


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Alternatives to Printed Circuits

SAIL (HP)

Lift-off processes (PVI)

Hetero-integration pick and place (Muehlbauer)

Fluidic self-assembly (Alien Technology)

R2R vacuum deposition and patterning Lithography + OSC (Holst Centre, ITRI, )

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Acknowledgment


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Acknowledgment

For work performed at PARC:

A.C. Arias, T. Ng, S.E Ready, R.A. Street, B.Krusor, B. Russo

Xerox Research Center of Canada

DuPont Teijin NIST

DARPA (contr. # W81XWH-08-C-0065)

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Printed Electronics Technologies

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