Printed boards - American National Standards Institute...ISO 8512-2 NOTE Harmonized as EN ISO...

Printed boards

Part 20: Printed circuit boards for high-brightness LEDs

BS EN 62326-20:2016

BSI Standards Publication

WB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06

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National foreword

This British Standard is the UK implementation of EN 62326-20:2016. It isidentical to IEC 62326-20:2016.

The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.

A list of organizations represented on this committee can be obtained onrequest to its secretary.

This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application.

© The British Standards Institution 2016.Published by BSI Standards Limited 2016

ISBN 978 0 580 76702 9ICS 31.180

Compliance with a British Standard cannot confer immunity fromlegal obligations.

This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 May 2016.

Amendments/corrigenda issued since publication

Date Text affected

BRITISH STANDARDBS EN 62326-20:2016



EUROPEAN STANDARD

NORME EUROPÉENNE

EUROPÄISCHE NORM

EN 62326-20

May 2016

ICS 31.180

English Version

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

(IEC 62326-20:2016)

Cartes imprimées - Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité

(IEC 62326-20:2016)

Leiterplatten - Teil 20: Elektronische Leiterplatte für Hochleistungs-LEDs (IEC 62326-20:2016)

This European Standard was approved by CENELEC on 2016-03-09. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique

Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 62326-20:2016 E

BS EN 62326-20:2016



EN 62326-20:2016

2

European foreword

The text of document 91/1311/FDIS, future edition 1 of IEC 62326-20, prepared by IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62326-20:2016. The following dates are fixed:

• latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement

(dop) 2016-12-09

• latest date by which the national standards conflicting with the document have to be withdrawn

(dow) 2019-03-09

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62326-20:2016 was approved by CENELEC as a European Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1 NOTE Harmonized as EN 60068-1.

IEC 60068-2-1 NOTE Harmonized as EN 60068-2-1.














BS EN 62326-20:2016



EN 62326-20:2016

3












ISO 291 NOTE Harmonized as EN ISO 291.







ISO 8512-1 NOTE Harmonized as EN ISO 8512-1.





ISO 9455 (series) NOTE Harmonized as EN ISO 9455 (series).



BS EN 62326-20:2016



EN 62326-20:2016

4

Annex ZA (normative)

Normative references to international publications with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and

assembly - Terms and definitions EN 60194 -

IEC 61189-3 2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

EN 61189-3 2008

IEC 61249-2-6 - Materials for printed boards and other interconnecting structures -- Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN 61249-2-6 -

IEC 61249-2-7 - Materials for printed boards and other interconnecting structures -- Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

EN 61249-2-7 -

IEC 62878-1-1 - Device embedded substrate - Generic specification - Test method

EN 62878-1-1 -

BS EN 62326-20:2016


http://www.cenelec.eu/advsearch.html


– 2 – IEC 62326-20:2016 © IEC 2016

CONTENTS

FOREWORD ......................................................................................................................... 6 1 Scope ............................................................................................................................ 8 2 Normative references..................................................................................................... 8 3 Terms, definitions and abbreviations .............................................................................. 8

3.1 Terms and definitions ............................................................................................ 8 3.2 Abbreviations ........................................................................................................ 8

4 Classification and class of the printed circuit board for high-brightness LEDs .................. 9 5 Design rules and allowance ......................................................................................... 10

5.1 Panel and board sizes ......................................................................................... 10 5.1.1 Board size ................................................................................................... 10 5.1.2 Allowance of dimensions .............................................................................. 11 5.1.3 Perforation and slit ....................................................................................... 11 5.1.4 V-cut ............................................................................................................ 12

5.2 Total board thickness .......................................................................................... 13 5.3 Holes .................................................................................................................. 14

5.3.1 Insertion holes and vias ............................................................................... 14 5.3.2 Datum hole .................................................................................................. 16 5.3.3 Assembly hole (a through-hole without wall plating) ...................................... 16

5.4 Conductor ........................................................................................................... 17 5.4.1 Width of conductor pattern and its allowance ................................................ 17 5.4.2 Distance between conductors and its allowance ............................................ 17 5.4.3 Thickness of the insulating layer ................................................................... 18

5.5 Printed contact .................................................................................................... 18 5.5.1 Allowance of the distance between the centers of two adjacent printed

contacts ....................................................................................................... 18 5.5.2 Allowance of the terminal width of printed contacts ....................................... 19 5.5.3 Shift of the center of printed contacts on front and back sides of a board ....... 19

5.6 Land pattern ....................................................................................................... 20 5.6.1 Allowance of the distance between the centers of two lands .......................... 20 5.6.2 Allowance of the width of a land ................................................................... 20 5.6.3 Land diameter and its allowance for BGA/CSP .............................................. 21

5.7 Fiducial mark and mark for component positioning ............................................... 22 5.7.1 Typical form and size of the fiducial mark ..................................................... 22 5.7.2 Dimensional allowance of fiducial mark and component positioning mark ...... 23 5.7.3 Position allowance of the component positioning mark .................................. 23

5.8 Interlayer connection – Copper plating ................................................................. 23 6 Quality ........................................................................................................................ 24

6.1 Gap between conductor and the wall of a component insertion hole or a via ......... 24 6.2 Positional deviation between conductor layers of a multilayer board ..................... 24 6.3 Minimum land width ............................................................................................. 24 6.4 Surface treatment ............................................................................................... 25

6.4.1 Gold plating for printed contact ..................................................................... 25 6.4.2 Other surface treatment ............................................................................... 26

6.5 Defects of solder resist ........................................................................................ 26 6.6 Symbol mark ....................................................................................................... 28

6.6.1 General ....................................................................................................... 28

BS EN 62326-20:2016



Printed boards - American National Standards Institute...ISO 8512-2 NOTE Harmonized as EN ISO...

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