Primary Secondary · 2020-01-11 · Secondary electron < 50 eV Backscatter electron >80% of primary...
Transcript of Primary Secondary · 2020-01-11 · Secondary electron < 50 eV Backscatter electron >80% of primary...
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e-, hv, ione-, hv, ion tip
Characterization Techniques
Primary Secondary
Characterization Techniques
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The inelastic mean free path (IMFP) of electrons is less than 1 nm for electron
energies with 10~1000 eV.
Interaction of high energy (~kV) electrons with (solid) materials
1 Unscattered
2 Low angle elastically scattered
3 High angle elastically scattered
4 Back scattered
5 Outer shell inelastically scattered
6 Inner shell inelastically scattered
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Secondary electron
< 50 eV
Backscatter electron
>80% of primary electron
energy
X-ray 0.5 – 20 KeV
Inelastic nuclear
scattering.This results in
radiation which is known as
“Bremsstrahlung”, so the
stopping power is the
“RadiativeStopping Power”.
Elastic scattering on
atoms. Incident electron is
scattered without any
change in energy
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Keep in mind…
•A solid sample bombarded with low energy X-rays produces a number of
different types of electrons, all of which need to be understood.
•1,500 eV X-rays will penetrate 1-3 μm into a sample, producing
photoelectrons along the entire depth. Many of these electrons make it out of
the sample and into the analyzer. Most will have lost energy while traveling
through the sample, but some will not. We are primarily interested in the
photoelectrons (or Auger electrons) that have NOT lost energy to some
inelastic loss process before entering the spectrometer.
•Similar processes occur in many analytical techniques.
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X-Ray Photoelectron Spectroscopy (XPS, ESCA)
XPS spectral lines are
identified by the shell
from which the electron
was ejected (1s, 2s, 2p,
etc.).
The ejected
photoelectron has
kinetic energy:
KE=hv-BE-
Following this process,
the atom will release
energy by the emission
of an Auger Electron.
Conduction Band
Valence Band
L2,L3
L1
K
Fermi
Level
Free
Electron
Level
Incident X-rayEjected Photoelectron
1s
2s
2p
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Strengths of XPS
1.Can detect Li-U
2.Surface sensitive (10-100Å sampling depth)
3.Sensitive to differences in chemical environment
4.Quantitative without the use of standards
5. Manageable charging problems with insulators
Weaknesses of XPS
1.Relatively poor lateral resolution (>5μm) when compared with
charged particle surface techniques like Auger, SIMS.
2.Surface sensitive
3.Detection limits 0.01-1.0%
4.Cannot detect hydrogen
No other analytical technique offers these five features in one technique. This
makes XPS the workhorse surface analytical tool. It should be one of the first
things you consider when you have surface chemical issues.
Why surface sensitive ?
An electron with kinetic energy < 1500 eV
will NOT travel very far through a solid
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Main Spectral Features in XPS
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Chemical Shift
Electron Spectroscopy for Chemical Analysis (ESCA)
Peak intensity proportional to amount of
element/species present
• not affected by chemical environment
Peak intensity
Carbon 1s spectrum of ethyltrifluoroacetate
• 4 different carbon environments leads to
4 different carbon peaks
Siegbahn K. et al, ESCA: Atomic, Molecular and Soild
State Structure Studied by Means of Electron
Spectroscopy, Nova Acta Regiae (Uppsala), 1967.
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Advantage: sensitive to local bonding environment
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Large difference in relative amounts of
SiO2 and Si° with only small thickness
differences
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Self assembled monolayers on gold
Methoxy terminated thiol:
C-C and C-O carbon
Methyl ester terminated thiol: C-
C and O=C-O carbon
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Surface functionalization of carbon nanotubes
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050100150200250
102010401060
Na1s
Zn2p1/2
Zn2p3/2
Na2s
Cl2pS2s
C1s
ZnLMM
S2p
Zn3s
Binding Energy (eV)
Zn3d
Zn3p
+ Au4f
Electrochemical Formation of ZnS
Tuba Oznuluer, Ibrahim Erdogan, and Ümit Demir, Electrochemically Induced Atom-by-Atom Growth of ZnS Thin Films: A New Approach for ZnS
Co-deposition, Langmuir 2006, 22, 4415-4419 4415
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C1: C-C, C=C, C-H (285.0 eV)
C2: C-O, C-O-C (286.5-6 eV)
C3: O-C-O, C=O (287.9 eV)
C4: O-C=O, C (=O)OH (289.3 eV)
Grafen Oksit ve İndirgenmiş Grafen Oksit
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Stoichiometry,
Morphology and Size-
Controlled
Electrochemical
Fabrication of CuxO
(x=1,2) by
Underpotential
Deposition Cemile Kartal, Yeşim Hanedar, Tuba
Öznülüer and Ümit Demir*
Prepared for submission
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Electrochemical Synthesis and Photoelectrochemical Properties of Flower-Like and
Grass-Like Nanostructured α-Fe2O3 Photoanodes for Use in Solar Water Oxidation
Yeşim Hanedar, Tuba Öznülüer and Ümit Demir, Submitted for publication
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General methods in assisting peak identification
(1) Check peak positions and relative peak intensities of 2 or more peaks
(photoemission lines and Auger lines) of an element
(2) Check spin orbital splitting and area ratios for p, d, f peaks
A marine sediment sample from Victoria Harbor
The following
elements are found:
O, C, Cl, Si, F, N, S,
Al, Na, Fe, K, Cu,
Mn, Ca, Cr, Ni, Sn,
Zn, Ti, Pb, V
Al 2p
Al 2s
Si 2pSi 2s
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For p, d and f peaks, two peaks are observed.
The separation between the two peaks are named
spin orbital splitting. The values of spin orbital
splitting of a core level of an element in different
compounds are nearly the same.
The peak area ratios of a core level of an
element in different compounds are also nearly
the same.
Electronic Effects Spin-Orbit Coupling
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Peak NotationsPrincipal quantum number
(n) describes the electron shell, Orbital quantum
number, , ℓ
describes the
subshell
The total angular momentum quantum
number: j = |ℓ ± s|Electron spin quantum number (ms or s)
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%100% =
i i
i
A
A
S
I
S
I
Atomic
Quantitative Analysis
Peak Area of element A
Sensitivity factor of
element A
Peak Areas / Sensitivity
factors of all other elements
Peak Area measurement
Need background subtraction
Au 4f
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Factors Affecting Photoelectron Intensities
ADTFNfI ciici = cos,,
For a homogenous sample, the measured photoelectron intensity is given by
d
Detector
Ii,c: Photoelectron intensity for core level c of element i
f: X-ray flux in photons per unit area per unit time
Ni: Number of atoms of element i per unit volume
i,c: Photoelectric cross-section for core level c of element i
: Inelastic mean free path of the photoelectron in the sample
matrix
: Angle between the direction of photoelectron electron and the
sample normal
F: Analyzer solid angle of acceptance
T: Analyzer transmission function
D: Detector efficiency
A: Area of sample from which photoelectrons are detected
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An error of 15% is generally quoted
An error of 1-2% can be achieved if samples with
known concentrations are used as standards
If 20% of Cu is calculated, the Cu concentration should be
in the range of 17-23%.
e. g., determination of the concentrations of Si and N in
SiNx films with a Si3N4 standard.
Quantification Uncertainties
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Auger electron
Incident
electron
KL1L2
KE = EK-EL1-E*L2- j,
3keV incident
electron beam
KLL LMM MNN
Auger Electron Spectroscopy (AES)
Auger process:
First remove an inner shell electron to form a
vacancy. This electron removal is generally
done with an electron beam, although x-rays
and ion beams also may be used. The vacancy
is filled by an electron from a higher shell. The
energy released by this process is transferred
to a 3rd electron, the Auger electron. Auger
electrons can be emitted with energies from
10s of eV, to thousands of eV. The alternative to
Auger emission is x-ray emission
The 3 letters specify the energy levels implied in the process of emission of the Auger electrons
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Strengths of AES
1.Can detect Li-U
2.Surface sensitive (10-100Å sampling depth)
3.Semi-quantitative without the use of standards
4.Excellent lateral resolution (sub-micron is typical)
5.Sensitive to differences in chemical environment for selected
elements (C,Si,Al,Mg,Cu,Zn,Ti,Ga,Cd,Ag).
6.Rapid depth profiling
Weaknesses of AES
1.Bulk insulators generally cannot be analyzed
2.Quantification not as straightforward as XPS
3.Limited chemical state information
4.Detection limits are 0.01-1.0%
5.Sample damage due to focused electron beam
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General fields of study for AES
1.Defect analysis
2.Thin film depth profiling
3.Grain boundary segregation
4.Inter- vs. intra-granular fracture
5.Interdiffusion studies
6.Reverse engineering
7.Surface contamination
Auger is recommended when… the analysis area is too small to be done by
XPS
Typical state-of-the-art XPS system can analyze with ~3-10 μm spatial
resolution.
Specialized XPS systems can obtain sub-micron (to 100nm) spatial resolution
State-of-the-art Auger systems can achieve ~10-15 nm spatial resolution
under ideal conditions
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First derivative used to remove large background and to highlight small Auger peaks
AES spectrum from TiO2 thin film
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AES spectum; S-Au (A) and CdS-Au (B)
Anthony Gichuhi, B. Edward Boone, Umit Demir, and Curtis Shannon J. Phys. Chem. B 1998, 102, 6499
A
B
Electrochemical formation of CdS monolayer
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XPS profile of 200Å SiO2 layer
Ion Beam Depth Profiling in XPS (and AES)
Ions of sufficient energy (0.5-5 kV)
impinge a solid surface; momentum
from bombarding ions is transferred to
the sample, and a portion of that
momentum is re-directed towards the
surface, resulting in some atoms being
removed from the solid. The remaining
surface is analyzed with XPS or AES.
The sputter/analyze cycles are
repeated until a sufficient amount of
material has been etched away.
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DEPTH PROFILE USING Ar ION ETCHING
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Qualitative analysis
1. First, the main Auger peak positions are
identified.
2. These values are correlated with the
listed values in the Auger spectra book
or standard tables. The main chemical
elements are thus identified.
3. The identified element and transition
are labelled in the spectrum (close to
the negative jump in the differential
spectrum).
4. The procedure is repeated for so-far
unidentified peaks. The Auger spectrum of a sample under investigation
E0 = 3keV
Elemental identification procedure
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Example:
From the differential AES spectrum
Ni, Fe and Cr have been identified.
Ni
Fe
Cr
Qualitative analysis
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Information concerning chemical composition
• Peak shape and the energy values,
corresponding to maxima contain
information on the nature of the
environment, due to addition relaxation
effects during the Auger process
• A full theoretical model is difficult to
construct.
• In practice, Auger spectra of standard
samples are used and the results are
drawn from spectra comparison.
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1. Measuring the peak-to-peak height
dEN(E)/dE vs. E
N(E) vs. E
2. Measuring the peak area
(after background subtraction)
Quntitative analysis
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RDTFrNII iiiPi += cos)1(
For a homogeneous sample, the Auger peak intensity is given by:
Ii: Intensity of the detected current, due to the ABC Auger transition of the i element,
IP: Incident beam current,
Ni: Concentration of the element i in the surafce,
i: Ionization cross-section on the A-level of the element i by the electrons from the incident beam,
i: Probability of the Auger ABC transition of the element i,
r: ionization cross-section on the A-level of the element i by the electrons scattered in previous
processes,
: mean free path for inelastic collisions,
: incidence angle of the primary beam,
F: Correction factor, dependent on the entrance solid angle in the analyzer,
T: Transfer function of the analyzer,
D: Detection efficiency,
R: Roughness factor of the surface.
Remarks
1. Deriving Ni from the previous equation is rather difficult, due to large number of implied parameters,
2. In applications, empirical methods are used, which leave from: (a) utilization of standard
specimens; (b) utilization of sensitivity factors.
Factors affecting the peak intensity
Quantitative analysis using standard specimens
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Scanning Auger Microscopy (SAM)
AES Auger Electron Spectroscopy
SAM Scanning Auger Microscopy: Same instrument can provide SEM
imaging, Auger spectra and chemical Auger mapping.
Specimen
Focussing &
scanning system of
the incident e-beam
Applications
• 1keV incident electron beam →
penetration depth of about 15 Å.
• Verification of surface
contamination freshly prepared in
UHV.
• Investigation of the thin film growth
process + elemental analysis.
• Depth profiling of concentration of
chemical elements.
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SAM image:
red =Al; blue = F; magenta = Al + F
Red = Al; green = O red =Al; blue = F; green = O
SEM surface image
Al+F+O
SAM
SEM and Auger images of an aluminium oxide surface, in absence and presence of
fluorine contramination.
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Energy-dispersive X-ray spectroscopy (EDS / EDX)
hv
Bremsstrahlung
Characteristic X-ray
Goldstein representation of EDS lines
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Ka
Kb
L-series
Fe
Cr
Kb
Ka
Ni
KbKa
– Characteristic x-rays
• elemental identification
• quantitative analysis
Continuum x-rays
• background radiation
• must be subtracted for quantitative analysis
X-ray spectrum from stainless steel
Characteristic emission + bremsstrahlung = Complete spectrum
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Qualitative Analysis
M-series
L-series
K-series
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6.4
Fe(26)
Ka7.0
Fe(26)
Kb
4.5
4.9
26
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Quantitative analysis
• Net intensity = complete intensity for the peak ÷ background intensity
• Net intensity is not completely proportional to the amount of atoms, but corrections should be made for
– Z: atomic number(Z) influence on the number of excitations
– A: Absorption of x-ray emission
– F: Fluorescence – generation of characteristic x-ray emission from higher energy x-ray
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Absorption
X-ray
detector
d
e
1
-
• Absorption coefficient
depends on the angle
between detector and
the normal to the
surface
• A long travel = large
absorption
• The normal of the
surface should point
towards the detector
Fluorescense
The electron in the inner
shell can be loosened if the
x-ray has a higher energy
than the escape energy of
the electron.
During decay characteristic
x-ray is emitted and the
intensity of x-ray with the
high energy is diminished
and the intensity of x-ray
with the low energy
increases.
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Quantitative analysis
hvP/B-ZAF – correction
Requires good background determination
Insensitive towards sample roughness –
because the background emission and the
characteristic x-ray emission come from
the same area in the sample and the
background goes into the calculations.
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Inhomogeneous samples – no possibility of correction!
ZAF-correction requires that the interaction volume is homogeneous
No use just to sample from a larger volume
hv
hv
Al Si
hv
hv
Al Si
+÷
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Quantitative analysis - Summary
Uncertainty on the quantitative analysis
• Determination of bremsstrahlung
• Overlapping peaks
• Absorbtion of the characteristic x-ray emission
• Fluorescence – excitation of atoms with lower atomic number
Limitations
• Quantitative analysis on elements with low atomic number (Z<10) is
difficult
• Lower detection limit ~0,1-1%
• Resolution ~1µm
Possibilities
• Elemental mapping
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• Using backscattered electrons for
mapping gives much higher
atomic number contrast
• Using the signal from the EDS-
detector enables to make
mappings of a single element
Elemental mapping
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EDS Applications
• Used to determine the elemental composition of a sample.
• Can perform both qualitative (What is it?) and quantitative (How much?) analysis.
• Depending on the window low atomic number elements may not be visible.
• Super ultra thin windows detect down to berilium.
• Older detectors may only detect fluorine and higher.
• Window less detectors are available.
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Secondary Ion spectroscopy: SIMS
material
Ions in Ions out
Is very sensitive
for some elements
on the ppm level
Modes: static and dynamic, secondary electron
Probe: Ions (Ar+, Ga+, Cs+, C60+, etc.), keV
Signal: Secondary Ions (from sample)
Information: Elemental and Molecular Composition
Sample: Any that can withstand ultra-high vacuum
Principle: Bombardment ions liberate secondary particles from the surface, secondary ions can be detected for mass
Depth: 10 Å (more in dynamic mode)
Spatial Resolution: less than 1 mm2
Sensitivity: “very high”
Relative Cost: Expensive
Other: Semi-quantitative to quantitative
Can resolve isotopes
Imaging modes
ToF detectors lead to exact mass detection
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This is a (by design) destructive technique…
Bombardment of a sample surface with a primary ion beam (Ip) followed by mass
spectrometry of the emitted secondary ions (Is) constitutes secondary ion mass
spectrometry. SIMS is a surface analysis technique used to characterize the surface
and sub-surface region of materials and based on m/e ratio measurement of ejected
particles under ion bombardment.
Primary ion beam:
Cs+, O2+, Ar+ and Ga+
at energies ~ a few keV.
Neutral & charged
(+/-) species
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Advantages of SIMS
• Very sensitive-can reach parts per billion range
• Ability to do depth profiling
• Ability to identify all elements
Disadvantages of SIMS
• Only ionized particles are measured
• Sputtering not necessarily even
• Intrinsically destructive
• Dynamic SIMS, 1nA/cm2, 1mm/hr
• Static SIMS, 1mA/cm2, 1A/hr
• Expensive $$$$
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Dynamic SIMS vs Static SIMS
Static mode involves the
bombardment of a sample
with an energetic (1-10
keV) beam of particles.
In static SIMS, the use of
low dose of incident
particles is critical to
maintain the chemical
integrity of the sample
surface during analysis
a focused beam of ions that
are sufficiently energetic to
cause ejection (sputtering) of
atom and small clusters of
atoms from the bombardment
region is used
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Dynamic SIMS – Depth Profiling
Factors affecting
depth resolution
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Coal Powder
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• Identification of foreign materials
– Particulates
– Fibers
– Residues
• Identification of bulk material compounds
• Identification of constituents in multilayered
materials
• Quantitation of silicone, esters, etc., as
contamination on various materials
Fig. Comparison of Sample to FTIR Spectral Library
FT-IR Spectroscopy, Attenuated Total Reflectance (ATR)
FTIR passes IR radiation
through a sample, and
measures the wavelengths at
which energy is absorbed.
Because molecules can
vibrate by stretching, bending
and twisting and absorb
varying amounts of energy at
each frequency, FTIR
provides structural and
chemical information.
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FTIR of (a) raw MWCNT, (b) oxidized MWCNT, (c)
chitosan and (d) the chitosan-MWCNT
nanocomposite
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SPR
• A surface-plasmon-resonance is excited at a metal-dielectric interface by a monochromatic, p-polarized light beam, such as He-Ne laser beam
• The surface plasmon is sensitive to changes in the environment near the interface and therefore has potential as a sensing probe.
• Sensitive detection method that monitors variations in thickness and refractive index in ultra-thin films
A plasmon can be thought of as a ray
of light bound onto a surface -
propagating among the surface and
presenting itself as an
electromagnetic field.
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Gold film
Incident light Reflected light
Glass slide
Bound antibodies
% R
efl
ec
tivit
y
Reflection angle
Prism
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% R
efl
ec
tivit
y
Reflection angle
Bound antibodies
Flow cell system
Gold film
Incident light
Reflected light
Change in angle of reflection
Free antigen
Glass slide
Antigen-Antibody
complex
Prism
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SIGNAL DETECTION
• The light source for SPR is a high efficiency near-infrared light emitting diode which has a fixed range of incident angles. The SPR response is monitored by a fixed array of light sensitive diodes covering the whole wedge of reflected light. The angle at which minimum reflection occurs is detected and converted to the resonance units. The SPR angle depends on several factors, most notably the refractive index into which the evanescent wave propagates on the non-illuminated side of the surface. In addition the other parameters are the wavelength of the incident light and the properties of the metal film.
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Key questions in nanoanalysis
• Identification (What?)
• Localisation (Where?)
• Quantification (How much?)
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