RockHydro Preliminary Design Review

Northwest Nazarene UniversityAdvisor: Dr. Lawrence

Chad LarsonBen Gordon

Seth LeijaDavid VinsonZach ThomasDrew Johnson

Section 1: Mission Overview◦ Purpose◦ Goals◦ Theory◦ Success◦ Benefits◦ Expected Results◦ Concept of Operations

Section 2: Design Overview◦ Design Process◦ Design Requirements◦ System Overview◦ Design View◦ Superhydrophobic◦ Flexible Chips◦ Radiation Hardened Chips◦ Data / Sensors◦ Block Diagram◦ Prototyping Plan◦ RockSat-C 2012 User’s Guide Compliance◦ Shared Can Logistics

Table of Contents

Section 3: Management◦ Team Organization◦ Budget◦ Work Breakdown Schedule◦ Timeline◦ Risk Factors

Section 4: Conclusions

Table of Contents

Study the feasibility of using superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.

Test Radiation Hardened chips and new flexible chips with American Semiconductors

Mission Overview: Purpose

Do research on superhydrophic material that would allow it to be used in future space missions.

Gather data on Radiation hardened chips and to gain experience working with the microchip industry.

Mission Overview: Goals

Mission Overview: Theory When water is in contact

with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.

For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the superhydrophobic material survived the flight.

Get usable data from the radiation hardened chips

Mission Overview: Success

The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight.

This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s Reduced Gravity program. NASA would benefit from the data gathered if they decide to use this material on future missions.

Provide data to American Semiconductors about their radiation hardened chips.

Mission Overview: Benefits

Mission Overview: Expected Results It is hypothesized that the material will

survive the high acceleration and vibrations and still be functional in post-flight testing.

It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.

Expected Results

Concept of Operations

Rocket Launch/G-switch triggered

Time =1.3 minHeight: 75kmStart of main

chip dataTime=2.8 min

Apogee of FlightBest data on chips

gathered

Time= 4.5 minHeight: 75kmMain chip data

complete

Time=5.5 minChute is deployed

Time= 15 minLands in ocean

Design Superhydrophobic Encasement Design American Semiconductor Board/

Final Design of Plate. Build encasement/Build American

Semiconductor board. Implement into Plate

◦ Test board◦ Run full flight test

Design Process

Physical Envelope Cylindrical: Diameter: 9.3 inches Height: 4.75 inches Mass Canister + Payload = 20±0.2 lbf Center of Gravity Lies within a 1x1x1 inch

envelope of the RockSat payload canister‘s geometric centroid.

Design Requirements

A Superhydrophobic “donut” will be on one plate

Along with that is the Flexible chips attached to small cylinders.

The electrical systems will be on another plate above the original plate.

System Overview

Design View

Superhydrophobic “donut”

Flexible Chips

American Semiconductor Board

Geiger Counter

Superhydrophobic

“Donut”

A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis.

This will be on the lower plate and will be placed around the center support.

Flexible Chips

Flexible Chip Cylinders

New flexible chips from American Semiconductors will be placed on different axis to find effects of space travel on them.

American Semiconductors will work with students to design a board which will test their radiation hardened chips

Radiation Hardened Chips

American Semiconductor Board

& Geiger Counter

Time Radiation – Geiger Counter American Semiconductor data will be stored

on a flash memory.

Data/Sensors

Radiation Hardened

Chip

FleX

Clock/Signal Power

Memory

Block DiagramGeiger

Counter

Between now and the CDR, the superhydrophobic enclosure will be in production. The American Semiconductor plate will be fully designed and the actual AVR board will be in production.

Prototyping Plan

Predicted mass - 10lb Using Rocksat Workshop Plexiglas plate

◦ Diameter – 9”◦ Height – 3” to 4.5”

A g-switch will be used for activation

Using deionized double contained water

User’s Guide Compliance

We will share a canister with the RockOn Workshop.

We will stay in contact with Colorado via e-mail and keep then updated with our design.

We will be using standoffs.

Shared Can Logistics

Team Organization

Electrical –American Semiconductors

David VinsonSeth Leija

Drew Johnson

Mechanical - Superhydrophobic

Ben GordonChad LarsonZach Thomas

Budget

Item Amount Budgeted ($)

½ Can $7000.00 paid by American Semiconductors

Superhydrophobic Material Made by NNU for less then $50.00

Travel Funded by Idaho Space Grant

Facilities Provided by NNU

Radiation Hardened Chips and Electronics

Provided by American Semiconductors

Work Breakdown Schedule

Electrical/American

Semiconductors

Design

Fabricate AVR

Build

Mechanical/Superhydrophobic

Complete Design

Begin Fabrication of

Enclosure

Paint material on interior of “donut”

Timeline

Complete design on SH subsystem

Nov 14

Preliminary Design with American

Semiconductors

Begin Fabricatio

nNov 30

Finalized Design

Jan 30

Complete Fabrication

Complete Fabricatio

n

Electrical Subsystem

Mechanical Subsystem

Begin Testing

Begin Testing

Risk Factors Risk 1: SH enclosure

breaks Risk 2: G-switch fails

to start data collection Risk 3:Malfunction on

electrical board.

Consequence

Risk 1 Risk 2

Risk 3

Possibility

The main focus before the CDR will be completing the design of the American Semiconductor board and begin the construction of the board.

Begin fabrication of superhydrophobic enclosure.

Future Work before CDR

Questions?