Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. ©...

Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner.© 2012 John Wiley & Sons, Ltd.

Chapter 9

Electronic Systems Reliability

© 2012 John Wiley & Sons, Ltd.


Figure 9.1 Parameter drift.


Figure 9.2 Temperature vs. reliability for electronic components.


Figure 9.3 Examples of electronic components. (a) Leadless chip capacitor (b) Quad flat pack IC package (QFP) (courtesy DfR Solutions) (c) Ball grid array (BGA) IC package.

(a) (b) (c)


Figure 9.4 Five stacked die 4GB flash memory (pyramid stacking with wire bond interconnects). Reproduced by permission of DfR Solutions.


Figure 9.5 Micro-hybrid (Courtesy National Semiconductor Corporation).


Figure 9.6 Typical failure density functions of electronic components when no component burn-in has been carried out.


Figure 9.7 Logic device protection. Diode D1 prevents the input voltage from rising above the power supply voltage. Capacitor C1 absorbs high frequency power supply transients. Reproduced by permission of ReliabilityAnalysis Center.


Figure 9.8 Transistor protection. Resistor R1 limits the base current IB and capacitor C1 absorbs power supply high frequency transients. Reproduced by permission of Reliability Analysis Center.


Figure 9.9 Temperature–power derating for transistors and diodes (typical).


Figure 9.10 Digital circuit noise decoupling.


Figure 9.11 Sneak analysis basic patterns (hardware).


Figure 9.12 Parameter distributions after selection.


Figure 9.13 Transpose circuit (from Spence and Soin (1988)).


Figure 9.14 Monte Carlo analysis of filter circuit (from Spence and Soin (1988)).

Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. ©...

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