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2 36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

Program Highlights 5 technical courses offered by industry

leaders on 3D advanced packaging,

package reliability and mechanics,

advanced failure analysis techniques,

embedded technologies, power electronics

and high temperature power module design.

9 keynotes covering latest technology and

industry trend in electronics packaging

A panelist forum titled “IoT: Roles of

Packaging and Industry Trends”, will

touch on packaging cost and its margin in

product; 18” wafer investment versus

Panel/FOWLP; SiP versus SoC; and low cost

innovation.

Technical paper presentation tracks featuring

>90 technical papers & posters from around

the industry and academia

More than 15 exhibitors from the renowned microelectronics industries and supply chain



4

11 NOVEMBER 2014, TUESDAY

0800-0830 Registration at Secretariat (Level 2)

0830-1200

Course 1 Meeting Room 2

Introduction to

Mechanics based Quality and Reliability

Assessment Methodology

by Dr. Sane Sandeep & Shubhada

Sahasrabudhe


Failure Analysis

on Modern Logic and

Mixed-Signal IC’s: Tools and

Methods by Christian

Burmer


Power Electronics and Embedding

Technologies

by Rolf Aschenbrenner

1200-1330 Lunch

1330-1700

Cont.’ Course 4 Meeting Room 3

Advanced

Stacked Die Packaging

Technology: More than 2D

by Dr John Yuanlin Xie


High-

Temperature Packaging with

Emphasis on Power Electronic

Module by Prof. Simon S.

Ang

1800-2200 VIP Dinner

36th International Electronics Manufacturing Technology Conference


12 NOVEMBER 2014, WEDNESDAY

0730-1730 Registration at Secretariat (Level 2)

0815-0830 Welcome Speech

Grand Ballroom by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair

0830-0910

Conference Opening Address “Panel Level Packaging Technologies as Enabler for

Innovative Mobile Devices” by Mr. Rolf Aschenbrenner,

Fraunhofer Institute for Reliability and Microintegration

0910-0950

Keynote Address I “Packaging and Interconnection Trend”

by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics

0950-1045 Coffee Break / Exhibition / Poster Session I

1045-1125

Keynote Address II “Automotive Power Packaging – Trends and Challenges”

by Dr. Andreas Knoblauch, Director, Package Development Automotive Power,

Infineon Technologies AG

1125-1205

Keynote Address III “Packaging Technology Challenges for Mobile

Computing Electronics” by Mr. Sow Yeek Kooi

Director, Technology Enabling and Start-up, Intel Malaysia

1205-1330 Lunch



6

12 NOVEMBER 2014, WEDNESDAY

1330–1510

Session A1 Ballroom 1

Advanced Packaging Co-Chairs:

Session B1 Ballroom 2

Characterization & Test I Co-Chairs:

Session C1 Ballroom 3

Materials

Co-Chairs:

Session D1 Ballroom 4

Process

Co-Chairs:

1510–1545 Coffee Break / Exhibition

1545–1725


Advanced Materials Co-Chairs:


Design

Co-Chairs:


Pb-free

Technology Co-Chairs:


Wirebond

Co-Chairs:

1830–2200 Dinner & Cultural Show

1830–1930

PANELIST FORUM IoT: Role of packaging and industry trends Panelists: Mr. Rolf Aschenbrenner, Dr. John Xie, Prof.

Mr. Xavier Baraton, Dr. Byeong Cheon Koh Moderator: Dr. Chee Choong Kooi

1930–1945 BANQUET DINNER ADDRESS

by Dr. Siow Kim Shyong Chairman, IEEE-CPMT Malaysia Chapter



7

13 NOVEMBER 2014, THURSDAY

0815-0855

Keynote Address IV “Innovation in Low Cost Packaging”

by Dr John Yuanlin Xie, Director, Packaging Technology R&D,

Altera Corporation

0855–0935

Keynote Address V “Challenges and Solutions in Modeling of Ultra-Fine

Pitch Microelectronics Packages” by Prof. Andrew A O Tay,

Department of Mechanical Engineering, National University of Singapore

0935–1000 Coffee Break / Exhibition

1020–1200


Process II

Co-Chairs:


Characterizati

on & Test II Co-Chairs:


Wirebond II

Co-Chairs:


Reliability

Co-Chairs:

1200–1300 Lunch



8

13 NOVEMBER 2014, THURSDAY

1300 – 1420 Session A4 Ballroom 1

Copper Wire

Co-Chairs:


Interconnect

Co-Chairs:


Materials II

Co-Chairs:


Modeling Co-Chairs:

1420 – 1500 Coffee Break / Exhibition / Poster Session II

1500 – 1540 Keynote Address VI “Review of New MEMS Devices and their

Manufacturing Technologies” by Dr. Koh Byeong Cheon ,

Senior Executive Vice President (Retired), Samsung Electro-Mechanics

1540 – 1620 Keynote Address VII “Test Point Selection Method for Mixed Signal

Testing” by Prof. Simon S. Ang,

High Density Electronics Center, University of Arkansas

1620 – 1700 Conference Closing Address “It’s a Small World After All: Recent Advances on Nano-materials and Technologies for Advanced Electronic, Photonics and MEMS Applications”

by Prof. Chin Ping Wong, Dean of the Faculty of Engineering,

The Chinese University of Hong Kong

1700 – 1730 Award Ceremony



HOTEL LAYOUT



SEE YOU IN JOHOR BAHRU!

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Further enquiry, please contact: • Fadzilatul Husna Adnan

([email protected] ), Secretariat • Dr. Tze Yang Hin ([email protected]), Program Chair



mailto:[email protected]

mailto:[email protected]

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