PowerPoint Presentation · Title: PowerPoint Presentation Author: Heather Created Date: 7/28/2011...
Transcript of PowerPoint Presentation · Title: PowerPoint Presentation Author: Heather Created Date: 7/28/2011...
Electrodeposition of SOFC
Interconnect Coatings
1H. McCrabb, 1T.D. Hall, 1J. Kell, 1S. Snyder, 2H. Zhang, 2X. Liu, 1E.J.Taylor
1Faraday Technology, Inc. 315 Huls Dr., Clayton, OH 453152West Virginia University, Dept. of Mechanical Aerospace Eng. ESB, Morgantown, WV
26506
12th Annual SECA Workshop
July 26 – 28, 2011
PSI Employees
by Education
PSI Locations
Faraday Technology, Inc.
• Faraday Technology specializes
in electrochemical engineering
• www.faradaytechnology.com
• Faraday is a wholly-owned
subsidiary of Physical Sciences,
Inc. (Boston, MA)
• www.psicorp.com
• Collectively, the company
staffs ~185 employees - ~100
with PhDs
• Annual revenue of ~ $50M
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 2
• Faraday’s R&D efforts
augment client company R&D
needs
• Open innovation leverages
government R&D dollars to
solve current industrial issues.
• Faraday’s strong IP portfolio
reinforces our open innovation
position and provides a
competitive advantage for
strategic partners.
26 Issued Electrochemical Patents
25 Pending Electrochemical Patents
Investment
Dollars
Discovery
ResearchKnowledge
Innovation Market
Dollars
Investment
Dollars
Discovery
ResearchKnowledge
Innovation Market
Dollars
Faraday Embraces Open Innovation
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 3
Platform Technology:Pulse/Pulse
Reverse Processing
Core Competency:Design and Engineer of Novel Electrochemical
Hardware
Total Manufacturing
Solution
• Electronics
• Edge and Surface Finishing
• Engineered Coatings
• Battery and Fuel Cell Power
• Environmental Systems
• Corrosion and Monitoring
Services
• Enables uniform processing
• Applicable for additive or
subtractive electrochemical
processes
• Uniform processing is
achieved over entire substrate,
improving end product
reliability
Either may be applied independently to
improve current industrial practices or may be
combined for a total manufacturing solution
Faraday Technology, Inc.
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 4
Objective of Program
slide 5
• Develop, optimize & validate an inexpensive
manufacturing process for coating metallic SOFC
interconnects with Co and Mn
– Demonstrate the process’s flexibility to 4”x4” and 10” x 10”
single and dual-sided patterned interconnect substrates
– Control coatings nanostructure and composition to prevent
T441 exposure to O2 and Cr diffusion to coating surface
– Mitigate Cr diffusion by identifying diffusion mechanism via
in-situ high temperature XRD and ex-situ XPS depth
profiling
– Develop a comprehensive economic assessment
– Work closely with our the SOFC industry to enhance the
commercialization plan for the program.
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Program Summary
slide 6
• FARADAYIC Process allows for non-line-of-sight deposition of a wide
range of compositions and surface structures using a single plating bath
• Coatings prepared using the FARADAYIC Process have uniform
surface composition and thickness on 2” x 2” flat panels
• Coatings exhibit adequate adhesion
• Initial ASR and crystallinity analysis showed that the as-deposited
thickness/composition had little effect on performance after a 500 hr
heat cycle
• 3µm thickness is capable of minimizing Cr diffusion for 500 hr testing
• Capability to coat dual-sided 1” buttons, 4” x 4”, and up to 11” x 14”
panels
• Based on batch manufacturing, the DOE’s high volume target of
1,600,000 plates per annum at a cost of ~$1.23 per 25 x 25 cm
interconnect
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Coating Process
slide 7
• Surface pretreatment to
remove oxide and enhance
coating adhesion
• Electrodeposition to coat
interconnects with Mn-Co
alloy
– Pulse and pulse reverse
electric fields to control
deposit properties
• Elevated thermal treatment
to convert alloy to spinel
Acetone&
ScrubGrit Blast
Rinse&
Scrub
PickleDip RinsePlate
Acetone&
ScrubGrit Blast
Rinse&
Scrub
PickleDip RinsePlate
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
FARADAYIC Processing
slide 8
“Tuned” to remove
adverse effects of H2
H2 = 2H+ + 2e-
“Tuned” to:
1. allow replenishment of
reacting species on electrode
surface
2. & allow transport of
undesirable byproducts from
electrode surface
“Tuned” to:
1. enhance mass transfer
2. control current
distribution
tcAp
pli
ed i
( + )Anodic
Cathodic( - )
Forward
modulation
Time off
ta
ic
Reverse
modulation
ia
toff
Eliminates H2 embrittlement
Maintain uniform
concentration &
hydrodynamic conditions
Controls deposit
composition & properties
DC: only iavg can be chosen
FARADAYIC: ia, ta, ic, tc, toff
can be varied independently to
achieve a desired rate
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
As-deposited
800oC 2hr
800oC 1200hr
14%Mn
~50%Mn
Initial Coating Development
ASR prediction (40,000h, 0.0460 Ohm cm2)
J. Wu, et al., Electrochimica Acta 54 (2008) 793–800
0 200 400 600 800 1000 12000.00
0.01
0.02
0.03
0.04
0.05
++
(1200, 0.0244)
(0, 0.0189)
AS
R (
Oh
m.c
m2)
Time (Hour)
ASR
ASR measurement
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 9
Initial Coating Development
slide 1012th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Good adhesion with
substrate
0 1 2 3 4 50
50
100
150
200
250
5
4
3
2
1
Inte
nsity
(Arb
. u
nit)
Distance ( m)
1 O 2 Cr
3 Mn 4 Fe
5 Co
No Cr penetrate
through the coatings
Significant Mn diffusion
from substrate
Cross section after ASR
0 200 400 600 8000
50
100
150
200
250
3002
Po
we
r d
en
sity (
mW
cm
-2)
Time (h)
1 cell with uncoated 430Desi
2 cell with MnCo coated 430F
Contact
problem
2nd TC1st TC
V/I curve
1
With electrodeposited MnCo coating, cell performance degradation reduced
Initial Coating Development
slide 1112th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Interconnect on button cell test
Objective of Phase I
• Demonstrate the technical and economic feasibility of
MnCo electrodeposited on SOFC interconnect
materials by answering the following questions:
1. What range of coating percent compositions can the
electrodeposition process deposit?
2. Can the electrodeposition process deposit Mn-Co alloy
coatings with a thickness range of 3 – 10 um?
3. How well does the coating perform at varying alloy
compositions and coating thickness?
4. Is the electrodeposition process economically viable?
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 12
Laboratory Scale Electrodeposition
Equipment
slide 13
Flow cell for plating onto 2”x2” planar T441 substrates
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Coating UniformityThe electrodeposited coating exhibits a virtually uniform coating composition
and thickness across the 2”x2” surface
Top
Bot
Flo
w D
irec
tio
n
As Plated
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 14
Coating Porosity and Adhesion
*Rockwell test with 1/16” steel ball used to quantify adhesion after
spinel growth after 72 hr. at 800°C
60kgf 100kgf 150kgf
*Sun, X., et. al. JPS, 176 (2008) 167
Feroxyl Porosity Test Results (AMS 2460 3.4.4.2)
SS Without Coating Mn-Co Coating As Deposited
Mn-Co Coating After 72 hour
Thermal Treatment at 800 C
Without Grit Blast With Grit Blast
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 15
Cr Ion Diffusion and Coating Porosity
slide 1612th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
• Cross-sections of samples that
underwent a soak treatment at
800 C for 500 hrs
– Coating thickness was as
deposited
– Indicates that a 3 micron layer
is adequate to produce Cr
complexing and minimize Cr
diffusion due to minimal
porosity
SubstrateCoating surface
Coating Crystal Structure
slide 1712th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
10 20 30 40 50 60 70
334
2 theta (degrees)
Inte
ns
ity
(a
.u.)
MnCo2O
4
Mn1.5
Co1.5
O4
Mn1.5
CrO4
332
333
40%Co 3µm
40%Co 7µm
40%Co 10µm
Crystal Structure after 500 hrs at 800°CIn
ten
sit
y (
a.u
.)
2 theta (degrees)
Effect of Thickness and Composition on
Performance
slide 1812th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
The ASR is 75 mΩ cm2 regardless of compositions and thickness
after 500 hrs at 800 C
500 600 700 800
0
500
1000
1500
Temperature ( )
AS
R (
m c
m2)
336
337
ASR Behavior after 500hrs
85%Co 7µm
85%Co 10µm
mΩ cm
2 100 hr 200 hr 500 hr
3 μm 40% Co 35 57 49
7 μm 40% Co 62 7 32
10 μm 40% Co 22 - 36
3 μm 85% Co 31 75 20
7 μm 85% Co 59 40 54
10 μm 85% Co 37 23 22
3 μm 57% Co - 34 26
7 μm 57% Co - - 12
10 μm 57% Co - - 12
ASR at 800 C
Phase II Program Milestones
slide 1912th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Milestones
Fiscal
YearTitle
Planned
Completion
Percent
Complete
20111. Design/modification of 10” x 10”
electrodeposition cellMay 2011 100%
20112. Long-term high temperature, thermal
evaluation
September
201133%
20113. Process development for 4”x4” planar
interconnects
September
201115%
20124. Process development for 4”x4” pattern
interconnectsJune 2012 0%
20125. Long-term on-cell performance
evaluationAugust 2012 0%
20126. Qualification/demonstration of IC in
single cell test rig
September
20120%
Extended Thermal Treatment Time Study
• Six samples were prepared using
varying deposition parameters
and placed into a tube furnace at
850 C.
– 2 samples with higher Mn content
and 4 with high Co content
– Target alloy thickness of 5 um
• An air flow of at least 500 sccm
flows through the furnace tube (to
simulate air in SOFC systems)
• Samples examined after 750,
1500, and 2000 hr
ASR Test order:C(t=0); D(t=750 hrs);
E(t=1500 hrs); F(t=2000 hrs); and
A(t=2000 hrs) (for Rockwell Test)
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 20
As Deposited
Co/Mn = 4
2000 hrsCo/Mn = 1
1
1 2 3
2 3Co/Mn = 4
Co/Mn = 0.5
Co/Mn = 18
Co/Mn = 16
Extended Thermal Treatment Time Study
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 21
4
4 5 6
5 6As DepositedCo/Mn = 18
2000 hrsCo/Mn = 10
Co/Mn = 44
Co/Mn = 18
Co/Mn = 16
Co/Mn = 15
Extended Thermal Treatment Time Study
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 22
Cross Section Results - 1001
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
Rel
ativ
e at
Distance (microns)
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
Rel
ativ
e at
Distance (microns)
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
Rel
ativ
e at
Distance (microns)
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
Rel
ativ
e at
Distance (microns)
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
50
100
150
200
0 2 4 6 8 10 12
Distance (microns)
Co
un
ts
O K CrK MnK FeK CoK
1st layer
2nd layer3rd layer
4th
layer
5th layer Substrate
0
50
100
150
200
0 2 4 6 8 10 12
Distance (microns)
Co
un
ts
O K CrK MnK FeK CoK
1st layer
2nd layer3rd layer
4th
layer
5th layer Substrate
0
50
100
150
200
0 2 4 6 8 10 12
Distance (microns)
Co
un
ts
O K CrK MnK FeK CoK
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
Rel
ativ
e at
Distance (microns)
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Distance (microns)
Rela
tiv
e a
t%
Chromia layerCo-Mn layer
Nb-T
i la
yer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
Rel
ativ
e at
Distance (microns)
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
C K O K AlK CrK MnK FeK CoK NbL TiK
Chromia layerCo-Mn layer
Nb
-Ti
layer Substrate
~3:4 Co:Mn coating
~7 μm ~5.5 μm ~1.5 μm
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 23
0 hours 2000 hours @ 850 C
Pilot Scale Electrodeposition Equipment
slide 2412th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Based upon Faraday’s electrochemical cell design that facilitates uniform flow across the surface
of a flat substrate (US patent #7,553,401)
Initial Pilot Scale Experiments
slide 2512th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
FARADAYIC Electrodeposition parameters varied for experiments conducted in the newly
modified FARADAYIC Electrodeposition Cell
Trial No
Electrode Spacing
(inches)
Electrolyte Flow
(PSI) Vibration Oscillation
2001 3 16 - -
2002 1.5 16 - -
2003 4.5 16 - -
2004 4.5 10 50 50
2005 4.5 16 50 50
2006 3 16 50 50
2008 3 5 50 50
2009 3 10 50 50
$0.52
$0.02
$0.61
$0.03
$0.00
$0.00
$0.65
$0.04$0.00
Plating Line Water Labor Energy Cobalt Managnese Boric Acid Ammonia Sulfate
$0.52
$0.02$1.09
$0.11$0.01
$0.02
$1.23
$0.00
$0.04
Plating Line Water Labor Energy Cobalt Managnese Boric Acid Ammonia SulfatePhase I
Phase II
2%
0%
29%
1%60%
6%1%
1%
68%
Plating Line
Water
Labor
Energy
Cobalt
Managnese
Boric Acid
Ammonia Sulfate
(42%)
(1%)
(51%)
(3%)
(0%)
(0%)
(3%)
(0%)
2%
0%
29%
1%60%
6%1%
1%
68%
Plating Line
Water
Labor
Energy
Cobalt
Managnese
Boric Acid
Ammonia Sulfate
(29%)
(1%)
(60%)
(6%)
(1%)
(1%)
(2%)
(0%)
2%
0%
29%
1%60%
6%1%
1%
68%
Plating Line
Water
Labor
Energy
Cobalt
Managnese
Boric Acid
Ammonia Sulfate
2%
0%
29%
1%60%
6%1%
1%
68%
Plating Line
Water
Labor
Energy
Cobalt
Managnese
Boric Acid
Ammonia Sulfate
2%
0%
29%
1%60%
6%1%
1%
68%
Plating Line
Water
Labor
Energy
Cobalt
Managnese
Boric Acid
Ammonia Sulfate
2%
0%
29%
1%60%
6%1%
1%
68%
Plating Line
Water
Labor
Energy
Cobalt
Managnese
Boric Acid
Ammonia Sulfate
Electrodeposition Cost Analysis
12th Annual SECA Workshop Pittsburgh, PA, July 27, 2011 slide 26
High volume manufacturing of 1,600,000 plates per annum at a cost of ~$1.23 per 25 x 25 cm interconnect
• Determine plating parameters effect on chromium
and oxygen diffusion
• Continue scale-up development for large area
planar T441 substrates
• Begin scale-up development for large area pattern
interconnects
– Demonstrate coating uniformity and
composition
• Testing in single cell and short stack SOFC
systems
slide 2712th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
Future Direction
Acknowledgments
slide 2812th Annual SECA Workshop Pittsburgh, PA, July 27, 2011
• Briggs White and the entire SECA program management team
• This material is based upon work supported by the Department of Energy under Award Nos. DE-SC0001023 and DE-FE0006165. Any opinions, findings, conclusions and recommendations expressed in this material are those of the authors and do not necessarily reflect the views of the DOE.
• Contact Information:Heather McCrabb
Ph: 937-836-7749
Email: [email protected]