Power Supply in Package (PSiP) Power Supply on Chip ... · • There are no PwrSoCproducts to...
Transcript of Power Supply in Package (PSiP) Power Supply on Chip ... · • There are no PwrSoCproducts to...
Controller
(with monitor &
Protection
Circuitry)
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Q2 FBEnable
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Driver
VccTG
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CT
APEC 2010
Power Supply in Package (PSiP)
Power Supply on Chip (PwrSoC)
Update 2010
By Arnold Alderman, Anagenesis, Inc.
And
Cian O’Mathuna, Tyndall National Institute
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APEC 20102
Outline
1. Terminology & Landscape1. Terminology & Landscape
2. 2009 Introductions2. 2009 Introductions
3. Key Trends3. Key Trends
5. The Market5. The Market
4. Enabling Technologies4. Enabling Technologies
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APEC 20103
Package Integration Leading to PSiP
Power
Transistor(s)
KeyLDO = Low Drop Out Linear RegulatorControl = Control, Monitor & Protection FunctionsMCM= Multi-Chip Module
Driver +
MOSFET
MCM
Power IC
PSiP
Package
Integration
LDO Control ICMOSFET
DriverInductor Capacitor
Source: PSMA PSIP2PwrSoC Phase 2 Study
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APEC 2010
Switched-mode Converter
Power Supply in Package (PSiP)
L CoSc
Sf
Cin
Load
Processor,
DSP
Source(battery,mains adaptor)
Converter
Control/Drive
ApplicationsAutomotive systems Power for Portable ProductsTelecomServersRoutersDistributed Supply RegulationIndustrial SuppliesWall Transformer RegulationSet Top Boxes
Source: Tyndall National Institute
The present PSiP products include the inductor.
Point-of-Load Supply
4
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APEC 2010
In a System
1.5
Source: Linear Technology Corporation
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APEC 20106
PSiP - Power Supply in Package
Number of Components
Source: PSMA PSIP2PwrSoC Phase 2 Study
2
35
25
33
13
7
A PSiP or PwrSoC:Less than 1”X1”X1”Module to chip scale packageContain all silicon componentsContains at least one power passive
PwrSoCPower passives are integrated on semi substrate
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APEC 2010
Power ASIC + Inductor on Lead Frame
6 x 4 x 0.85mm
12 x 10 x 1.85mm
Source: PSMA PSIP2PwrSoC Phase 2 Study7
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APEC 2010
1/32 Brick Products
8
The Brick Progression:1/4 Brick = 2.3” X 1.5” X 0.5”1/8th Brick = 2.3” X 0.9” X 0.5”1/16th Brick = 1.3” X 0.9” X 0.5”1/32nd Brick = 0.67” X 0.87” X 0.265”
Source: Vicor Corporation
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APEC 20109
PSiP & PwrSoC Landscape
• There are no PwrSoC products to report yet but continuing development of technologies that could make it happen.
• So all products shown are PSiP – 43 reported here.
PwrSoC PSiP POL
IoutCurrent Range(Amperes)
0.3 7 12 90 150
Embedded Power IC & DiscreteEmbedded (Down) Discretes on
Motherboard
(80% market share)
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APEC 201010
Product Categories
• 5 V nominal input voltage dc-dc non-isolated point of load power supply
• 12 V nominal input voltage dc-dc non-isolated point of load power supply
• (New) Above 12 V nominal input voltage dc-dc non-isolated point of load power supply
• (New) Isolated dc-dc
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APEC 201011
New 2009/2010 offerings• PSiP
– 43 products in this report covering 2003 to 2011 (projected)
• Linear Technology – 12 (barrage of 4 in August)
• Murata Power Solutions – 9 (isolated dc-dc).
• Enpirion – 5
• Intersil – 3
• National 1 in 2009, 2 in 2010,
• ST Microelectronics – 1
• Other players: Bel, Delta, Micrel
• Drop-outs have not re-entered the market.
uModule is a Linear Technology trademark
Source: Murata Power Solutions
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APEC 2010
Chip-on-Inductor
12
Source: National Semiconductor
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APEC 2010
Why is this compelling?
• Ease of design; Simple layout – reference design not necessary
• Lower component count
• Lower EMI, conductive noise
• Higher power density – PCB area is a premium
• Higher efficiency – shorter interconnection, lower parasitics
• Better thermal transfer
• Eliminates the pain point (L selection and mounting)
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APEC 201014
Vin & Vout Trend for 12 V Product
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44
2003
2004
2005
2006
2007
2008
2008
2009
2009
2009
2009
2009
2010
2010
2010
2010
Vin (Volts)
Year Introduced
PSiP Input Voltage Range
0 2 4 6 8 10 12 14
2003
2004
2005
2006
2007
2008
2008
2009
2009
2009
2009
2009
2010
2010
2010
2010
Vin (Volts)
Year Introduced
PSiP Output Voltage Range
Input voltage increasing; Input range increasing above 4:1Output voltage remaining 0.6 to 6 volts
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APEC 201015
Vin & Vout Trend for Above 12 V Product
0 5 10 15 20 25 30 35 40 45 50 55 60
2009
2009
2009
2009
2009
2009
2009
2010
Vin (Volts)
Year Introduced
PSiP Input Voltage Range
New product category first appeared in 2009
0 2 4 6 8 10 12 14 16 18 20 22 24
2009
2009
2009
2009
2009
2009
2009
2010
Vin (Volts)
Year Introduced
PSiP Input Voltage Range
Application: Automotive, IBS, Wall Worts, Telecom, Avionics
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APEC 201016
Frequency Trend
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
Swit
hci
ng
Fre
qu
en
cy (
kH
z)
Year Introduced
Suppliers did not push frequency higher this past year. Most new products are at below 1 MHz.
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APEC 201017
Output Current Trend
0
5
10
15
20
25
2002 2004 2006 2008 2010 2012
Ou
tpu
t C
urr
en
t (A
mp
ere
s)
Year
Output Current Capability Trend
Output current capped at 10 – 12 A but is expected to go to 20 AMost PSiP is serving the lower current portion of the market.
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APEC 201018
Current Density Trend
0.0
500.0
1000.0
1500.0
2000.0
2500.0
3000.0
2003 2004 2005 2006 2007 2008 2009 2010
Cu
rre
nt
De
nsi
ty (
A/i
n3)
Year
Current Density vs. Year
Extreme density still increasing.Many new products exhibiting higher density.All 2010 intros so far are low density
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APEC 201019
Functionality Expansion
2009 saw major functional expansion
Power Train Expansion
Dual Converters (opportunity for Power PMU
suppliers)
Dual + LDO (low noise)
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APEC 2010
PSiP & PwrSoC Market SizeWhy all the effort?
- more than $1 billion market- PwrSoC revenue will overtake PSiP within this decade!
20
$-
$100
$200
$300
$400
$500
$600
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20
Ma
rke
t S
ize
in $
Mil
lio
ns
PSiP PwrSoC
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APEC 201021
Inductor Integration
• Inductors
– Inductor integration technology continues to develop on several fronts
• Enpirion MEMS Technology
• The Tyndall Technology
• SOC technology at Intel (Paper today)
• Power Gold - gold bonding on silicon
Source: Tyndall National Institute Source: Intel Corporation
Source: Enpirion, Inc.
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APEC 201022
Capacitor Integration
• Capacitors
– Smaller/denser capacitors for PSiP:
• NOVACAP, a Dover Company introduces a new line of high-capacitance multilayer ceramic capacitors (MLCCs) that combine higher volumetric capacitance per given board area with lower equivalent series resistance (ESR) than alternative solutions.
– Integration continues to be further off (DRAM derivatives)
– Enablers:
• Quantum jump in switching frequency.
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APEC 201023
Future Trends
• More isolated dc-dc converters.
• Off-line isolated high voltage ac-dc converters.
• Maybe integrated inductor and the PwrSoC.
• Follow the Power IC, PMU and Power PMU developments.
• Higher power train functionality
In the coming year or two we will see