From Technologies to Market

July 2018

Power SiC 2018:

Materials, Devices and Applications

From Technologies to Market

Sample

2

Biography and contact

ABOUT THE AUTHORS

Dr. Hong LIN

Dr. Hong Lin has worked at Yole Développement as a Technology and Market Analyst since 2013, specializing in compound semiconductors and providing technical and economic analysis. Before joining Yole Développement, she worked as an R&D Engineer at Newstep Technologies, overseeing the development of cold cathodes made by plasma-enhanced chemical vapor deposition for nanotechnology-based visible and UV lamp applications. She holds a PhD in physics and chemistry of materials.

Email: lin@yole.fr

Dr. Ana VILLAMOR

Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She isinvolved in many custom studies and reports focused on emerging power electronics technologies, includingdevice technology and reliability analysis. Previously Ana was involved in a high-added value collaboration relatedto of SJ Power MOSFETs, within the CNM research center for the leading power electronic company ONSemiconductor. During this partnership, and after two years as Silicon Development Engineer, she acquiredrelevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and coauthorof several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master inMicro and Nano electronics,both from UAB (SP).

Email: villamor@yole.fr

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TABLE OF CONTENTS

• Executive Summary 9

• SiC Power Device market revenue

• SiC Power Device bare die market revenue

• SiC Power Device bare die market share

• SiC Power Device overview

• SiC diode market in 2017

• Projection of the SiC diode market by 2023

• SiC discrete transistor

• Why use SiC in the main inverter?

• Does SiC cross the chasm? (OBC market)

• Does SiC cross the chasm? (Main inverter

market)

• Full SiC module

• 2017 market share estimate for SiC power

device manufacturers

• Supplier development status

• How fast can new wafer capacity be ready?

• SiC substrate cost

• Production capacity vs demand

•

• What could happen for the SiC power industry in

5 to 10 years?

• Roadmap for SiC power industry drivers

• News 37

• Report Comparison 42

• What’s new in the 2018 report?

• Comparison with Yole’s previous forecasts

• What we got right and what we missed

• Why use SiC for Power Electronics

Applications? 50

• Power device technology life cycle

• GaN vs SiC vs Si

• Why use SiC power devices?

• Power vs frequency in electronics

• Power density enhancement from 1980-2020

• WBG market segmentation as a function of

voltage range

• SiC Device Market 57

• SiC Device Market Revenue

• Electrified Vehicle Market 66

• EV/HEV market evolution

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TABLE OF CONTENTS

• Different types of electrified vehicles –

definition

• Power converters in EV/HEV - Si based

solutions

• Silicon power semiconductor market in

EV/HEV: 2017 VS 2023

• SiC devices add value to electrified

vehicle applications

• SiC devices add value to electrified

vehicle applications

• SiC advantages vs EV applications.

• Why use SiC in the main inverter? (cost

aspect)

• Trends towards higher battery voltage

• Why go to 800V battery pack voltage for

electric vehicles?

• SiC potential market in EV/HEV

• Opinions about SiC penetration in

EV/HEV (as of 2018)

• Device manufacturer visions

•

• Opinions about SiC penetration in EV/HEV

(As of 2018)

• Reasons for OEMs

• Electrified vehicle charging solutions

• SiC in on-board chargers

• Does SiC cross the chasm? (OBC market)

• Does SiC cross the chasm? (Main inverter

market)

• WBG implementation in EV/HEV

• Infineon’s roadmap for EV/HEV SiC

products

• SiC component evaluation by Toyota

• Automotive-grade SiC power devices

• Before mass adoption, what must SiC do?

• SiC device market revenue in electrified

vehicle applications

• SiC device bare die market revenue in

electrified vehicle applications

• EV/HEV market – Conclusions

• Electrified Charging Infrastructure 105

• Electrified vehicle charging solutions

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS

• Charging infrastructure development

• Geographical split of PHEV & BEV

• Chinese EV/HEV market development

versus government target

• Charging infrastructure development

• Worldwide newly installed DC charging

infrastructures (units)

• Increasing battery pack energy capacity

per electric vehicle

• Towards 800V battery pack for electric

vehicles

• Power charging voltage range

• 350 kW ultra-high power charging

points

• SIC device market value in xEV charging

infrastructure, in $M

• SIC device bare die market value in xEV

charging infrastructure applications

• Photovoltaic Inverters 122

• PV inverters

• SiC player positioning

• Added value from SiC in residential

applications

• SiC in photovoltaic string inverters

• SiC in central photovoltaic inverters

• SiC in microinverters

• SiC implementation as a function of PV

classification

• PV market provisions

• SiC device market revenue in

photovoltaic applications

• SIC device chip market revenue in

photovoltaic applications

• SiC for solar power – Conclusions

• PFC and Power Supply 140

• Power supply - industry trends

• Power supply market segmentation

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS• Power supply unit standard

• Replacing Si MOSFET with SiC

• Developments in PFC topology

• Replacing Si MOSFET with SiC

• SiC penetration in PFC and power

supply

• SiC device market revenue in PFC for

power supply applications

• SiC device bare die Market revenue in

PFC for power supply applications

• Power supply – Conclusions

• Uninterruptible Power Supplies 156

• UPS market - definition and architecture

• SiC use in the UPS sector

• SiC penetration in the UPS sector

• Can SiC help save money for UPS

applications?

• WBG penetration in the UPS sector

• SiC device market value in UPS

applications

• SiC device bare die market value in UPS

applications

• Motor Drive Market 166

• Motor drive application

• Opportunities for SiC in motor drives

• Challenges for SIC integration in motor

drives

• SiC implementation in motor drives

• SiC device market value in motor drive

applications

• SiC device bare market value in motor

drive applications

• SiC for motor drive – Conclusions

• Power Converters for Wind Turbines 177

• Wind turbine market

• Architecture

• DFIGs vs. full converters

• Power devices used in wind applications

and SiC targets

• Silicon power devices currently used in

wind applications

• SiC in medium voltage drives for wind

power conversion

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TABLE OF CONTENTS

• SiC device market revenue in wind

power applications

• SiC device bare die market value in wind

power applications

• Are SiC devices ready for wind power?

• Rail Traction Market 187

• Segmentation

• Power devices in different train types

• SiC implementation in rail traction

• Hybrid SiC inverters for rail traction

• On-track testing of SiC hybrid inverters

• Full SiC inverters for rail traction

• SiC for auxiliary power in trains

• Focus on CRRC

• ROLL2RAIL – Shift2RAIL

• Is SiC ready? (Cost aspect)

• SiC device market value in rail traction

applications

• SiC device bare die market value in rail

traction applications

• SiC for rail – Conclusions

•

• Other SiC Applications 207

• Battery Chargers

• SiC for induction heating generators

• Possible applications of SiC in

aeronautics

• SiC for military applications

• SiC for space applications

• SiC JFET for protection applications

• Yole’s understanding of the status of SiC

in other applications

• SiC Device Market: Voltage Analysis 218

• SiC device market revenue

• SiC power device bare die market

revenue

• SiC diode bare die market share split by

voltage

• SiC transistor bare die market share split

by voltage

• SiC bare die market share split by

voltage

• SiC power device bare die market share

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS• SiC power device overview

• SiC diode market in 2017

• Projection of the SiC diode market by 2023

• SiC discrete transistor

• Hybrid and full SiC module

• SiC Power Device Technology 234

• SiC power devices 236

• SiC MOSFET vs. Si device benchmark

• SiC MOSFET: Trench vs planar

• 200V SiC MOSFET technology evolution

• SiC diode vs MOSFET technology

process

• Critical step processes

• Packaging 245

• Discrete device packaging

• Discrete device packaging-Case study

• Commercially-available Intelligent Power

Module examples

• Full SiC module packaging

• Development of junction temperature

inside SiC power modules

• Innovative packaging for SiC in R&D

• Full SiC module

• SiC device packaging-conclusions

• Integration 268

• Integration of silicon vs SiC

• Integration challenges

• Gate driver

• Capacitors for SiC devices

• Capacitors for high temperature

• Capacitors for WBG semiconductors

• SiC power stacks

• Innovative integration for SiC in R&D

• SiC device integration-conclusions

• SiC Device Reliability Status 279

• SiC reliability analysis

• Reliability main concerns

• Is reliability an issue for SiC?

• SiC reliability analysis

• SiC power reliability

• SiC reliability

• SiC Power Device Commercial Status 289

• SiC power device timeline

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS• SiC MOSFET technology developments

• SiC power device overview

• Discrete SiC MOSFETs

• Known discrete SiC MOSFETs

• Focus on high-voltage SiC Devices

• SiC device roadmap

• SiC power device commercial status –

conclusions

• SiC Power Device Industry Landscape 299

• Involvement origins of SiC power device

manufacturers as of 2018

• Development of pure SiC power device

manufacturers

• SiC power industry business models as of

2018

• From prototype to mass production

• 2017 market share estimate for SiC power

device manufacturers

• 2017 revenue estimate for SiC power device

manufacturers

• SiC power industry – conclusions

• Focus on Cree/Wolfspeed

• Focus on China

• A special focus on China

• China’s surge in SiCWafer production

capacity

• Will Chinese SiC wafer players reshape

the market?

• Focus on China – conclusions

• SiCWafer and Epiwafer Market 314

• SiC wafer process

• SiC growth technologies

• Difficulty of SiC growth

• Technology readiness for SiC production

• SiC: From polytype to devices

• SiC wafer supplier status

• Map of SiC players, including R&D

players

• Development in SiC substrate size

• 6” SiC wafer supply

• Supplier development status

• SiC materials producer status

• SiC wafer development axes

• SiC wafer capital investmentPower SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS• How much investment is needed for 1 million

6’’ SiC wafers?

• How fast can new wafer capacity be ready?

• SiC substrate cost

• SiC-based MOSFET wafer cost structure

• Wafer cost impact

• Production capacity vs demand

• SiC n-type substrates - average price

estimation

• SiC n-type substrate market - volume

projection, in units

• SiC n-type substrate market size projection

• SiC n-type substrate market value projection

• Market share estimate for n-type SiC

substrate players

• 2017 revenue estimate for SiC wafer

manufacturers

• SiC epi-wafer manufacturing

• SiC epi-house and epi-services

• SiC epiwafers

• Integration of SiC epi

• SiC epiwafer market

•

• SiC wafer and epiwafer market- conclusions

• IP 350

• SiC Schottky barrier diode (SBD)

• SiC MOSFET

• SiC power module/system

• SiC wafer

• Intellectual property - conclusions

• SiC Power Industry Ecosystem 358

• SiC wafering

• Power SiC industry Ecosystem

• SiC backside thinning

• SiC device processing

• Power SiC industry ecosystem – conclusions

• Open Discussion and Perspectives 383

• Primary drivers for using SiC in different

applications

• Lifecycle of the SiC transistor and diode

market

• SiC power industry - main challenges as of

2018

• SiC industry - Geographic analysis as of 2018

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS• Power device price: Si vs SiC

• SiC MOSFET vs Si IGBT

• Market Penetration rate of 600V/650V SiC

transistors

• Si vs SiC vs GaN: 600V

• Si vs SiC vs GaN: High voltage

• Transistor market 2017 vs 2023

• SiC vs silicon power semiconductor market

Share

• SiC transistor vs IGBT and MOSFET market

share

• SiC transistor vs IGBT market share

• SiC market share split by discrete vs module

• Outlook over ten years

• Key players and power electronics landscape

• What could happen to the SiC power

industry in 5 to 10 years?

• Roadmap for SiC power industry drivers

• General Conclusions 406

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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WHAT IS IN THIS REPORT?

• Why SiC-based materials are interesting options for

power electronics applications.

• Yole’s vision for SiC penetration in different

applications:

• xEVs

• Charging infrastructure

• PV

• Power supplies

• UPSs

• Motor drives

• Wind power

• Rail applications

• State-of-the-art SiC-based devices, modules, and power

stacks and their commercial statuses.

• SiC power device market projections through to 2023,

including:

• Bare die market split between transistors and diodes.

• Device market split by application.

• Device market split into discrete components and

modules.

• Analysis of SiC power device voltages.

• Description of the SiC substrate and epiwafer market

and market size projections through to 2023

• A description of the industrial SiC power landscape,

from materials to systems.

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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COMPANIES CITED IN THIS REPORT

ABB, Alstom, Ascatron, Aymont, Bombardier, Basic Semiconductor, Brückwell Technology, Caly Technology, Cree, CRRC, Danfoss, Delphi, DENSO, Dow Corning, Episil, Epiworld, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power

Technology, Hestia Power, Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop Grumman, NXP, ON Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM, Sanrex, Schneider Electric, Semikron, Shindengen, SICC,

Siemens, SMA, STMicroelectronics, Toshiba, Toyota, United Silicon Carbide, WeEn, X-Fab, Yaskawa, and more

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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LIST OF ABBREVIATIONS USED IN THIS REPORT AMB Active Metal Brazed

A, Amp Ampere

ASP Average Selling Price

BEV Battery Electric Vehicle

BJT Bipolar Junction Transistor

BOM Bill Of Materials

BPD Basal Plane Dislocation

BTS Base Transceiver Station

CAGR Compound Annual Growth Rate

CCM Continuous Conduction Mode

CTE Coefficient of Thermal Expansion

CVD Chemical Vapor Deposition

DC Direct Current

DCB Direct Copper-Bonded

DD Dislocation Density

DFIG Double-Fed Induction Generator

DMOS Diffused Metal Oxide Semiconductor

EREV Extended Range Electric Vehicle

EMC ElectroMagnetic Compatibility

EMI ElectroMagnetic Interference

xEVElectric Vehicle/Hybrid Electric

Vehicle

GaN Gallium Nitride

FCV Fuel Cell Vehicle

FET Field Effect Transistor

GIT Gate Injection Transistor

GTO Gate Turn-Off

HEMT High Electron Mobility Transistor

HEV Hybrid Electric Vehicle

HVAC Heating, Ventilation and Air Conditioning

HVDC High-Voltage Direct Current

JBS Juction Barrier Schottky

JFET Junction Field Effect Transistor

IC Integrated Circuit

IGBT Isolated Gate Bipolar Transistor

IGCT Integrated Gate-Commutated Thyristor

IPM Intelligent Power Module

IH Induction Heating

MESFET Metal-Semiconductor FET

MISFET Metal-Insulator FET

MOSFET Metal-Oxide-Semiconductor FET

MOCVDMetal-Organic Chemical Vapor

Deposition

NEV Neighbourhood Electric Vehicle

Ron/Rdson On-state Resistance

LLC

A power converter that is a variant of a

series resonant converter, using two

inductors (Lmagnetizing and Lresonant)

and a capacitor (C).

LV-HV Low Voltage to High Voltage

OBC On-Board Charger

OEM Original Equipment Manufacturer

PEPDCPrimary Electrical Power Distribution Center

PCB Printed Circuit Board

PCS Power Conversion System

PCU Power Control Unit

PFC Power Factor Correction

PHEV Plug-in Hybrid Electric Vehicle

POL Point-Of-Load

PSU Power Supply Unit

PV PhotoVoltaic

PWM Pulse Width Modulation

RF Radio Frequency

SBD Schottky Barrier Diode

SD Surface Defect

Si Silicon

SI Semi-insulating

SiC Silicon Carbide

SJMOSFET Super Junction MOSFET

SMD Surface Mount Device

SMPS Switching Mode Power Supply

SSV Start-Stop Vehicle

T° Temperature

TAM Total Available Market

T&DElectricity Transport and

Distribution

UPS Uninterruptible Power Supply

VSC Voltage Source Converter

WBG Wide Band Gap

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YOLE METHODOLOGY: TOP-DOWN AND BOTTOM-UP APPROACHES

To achieve market estimations, Yole uses two approaches: top down and bottom up.

Top-down

Bottom-up

From systems to device market

From substrate to device market

System inverter device Wafer

Wafer

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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Wafer Epiwafer Device Module InverterEnd

applications

REPORT OBJECTIVES

• Provide a clear understanding of the SiC power industry, covering markets from wafer to discrete/module (Units & M$).

• Analysis the market drivers/bottlenecks of SiC power industry drivers

by analysis the SiC adoption by different end applications and supply chain.

• Understanding the technology status of SiC power device technology

• Describe the industry playground

Report focus

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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EXECUTIVE SUMMARY 2018

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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SIC POWER DEVICE MARKET REVENUE

Split by application

The total SiC-based power device market is expected to grow steadily, reaching almost $1.4B in 2023.

Including discrete diodes, discrete transistors, diode bare die in hybrid modules and full SiC modules.

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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SIC POWER DEVICE OVERVIEW

* Danfoss: customer power module Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

20

DOES SIC CROSS THE CHASM? (MAIN INVERTER MARKET)

As of 2018 understanding

As shown earlier, main inverter presents the biggest opportunity for SiC.The adoption or not of SiC will be critical for the SiC power device market.

We indeed heard about different projects, but we don’t have any concrete names behind these projects.

100%

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SIC POWER RELIABILITY

What will be changed? (1/2)

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ROADMAP FOR SIC POWER INDUSTRY DRIVERS

Yole’s interpretation as of 2018

2000 2010 2020 2030Schematic illustration

Unipolar: power

conversion

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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NOTEWORTHY NEWS - 4/4

• Aug 2017, Nippon Steel & Sumitomo Metal Corporation (NSSMC) and Nippon Steel & Sumikin Materials Co., Ltd. decided to terminate SiC research and business development in 2018. NSSMC group decided to transfer relevant assets and technologies to Showa Denko K.K. (“Showa Denko”).

• Aug 2017, Pallidus launched M-SiC silicon carbide source material and technology platform.

• Sep 2017, Ascatron announced the availability of SiC components using its in-house technology. SBD and PiN diodes are available and MOSFETs are under development and will be available in 2018.

• Oct 2017, Infineon released the sixth and latest generation of SiC diodes.

• Oct 2017, Littelfuse launched its first series of SiC MOSFETs as the latest addition to its growing power semiconductor line.

• Dec 2017, ROHM tested SiC power module in FORMULA E race cars.

• Jan 2018, CRRC Times Electric announced the success of the trial production of 6 inch SiC chip production line.

• Jan 2018, Littelfuse completed the acquisition of IXYS.

• Jan 2018, Disco developed DAL7440 KABRA laser saw for 8-inch SiC wafers.

• Jan 2018, SDK to expand SiC epi capacity to 7000 wafers per month by September in 2018.

• Jan 2018, CRRC completed 6’’ SiC production line.

• Feb 2018, Cree signed $100M long-term deal to supply 150mm SiC wafers to Infineon.

• Feb 2018, SILTECTRA validated twinned SiC wafer produced using COLD SPLIT laser-based wafer thinning technique.

• March 2018, Bombardier tested SiC-equipped Mitrac TC1500 traction converter.

• May 2018, Rohm announced plans for a new production building at the Apollo plant in Chikugo, Japan. The expanded production capacity is intended to meet the growing demand for SiC power devices.The construction is scheduled to begin in February 2019 and be completed by the end of 2020.

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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AUTOMOTIVE-GRADE SIC POWER DEVIC

Example (Reverse engineering): Tesla - ST

ST has developped1-1 SiCMOSFET module for Tesla model 3.

SiC MOSFET one in one

module:

• 2 dies of 650V, 100A

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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PV MARKET

Geographic distribution

• China is by far the biggest market of PV in 2017, presenting more than 50% of market share.

• On I June 2018, China released a heavyweight solar PV policy (823) to rationalize capacity growth.

• The policy, which comes as a shock to the industry, suspends approving new subsidised utility-scale PV power stations in 2018.

• It also caps the scale of distributed projects at 10 GW.

• In addition, all utility-scale projects are mandated to set power prices through competitive auctions.

China is the biggest PV market in 2017.

But the latestpolicyindicated a clear trend to reducesubvention for the PV market.

Source: SolarPower Europe

The announcement of

the new policy in China

has a strong impact on

the PV market, the

stock price of top PV

inverter price has

plunged.

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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Full SiC modules

FULL SIC MODULE PACKAGING SOLUTIONS - SOME EXAMPLES

There is a wide range of module packaging on the marketfor full SiCmodules.

Fuji: 1200V, 35A/50A/75A

1700V, 25A, 35A, 50A.

1200V, 120A, 13mΩ

copper baseplate and

aluminum nitride insulator.

1200V, 325A, 3.6mΩ:

AlSiC baseplate and Si3N4 AMB insulator, enhancing ruggedness in

thermal cycling.

• 600V, 75A package

from Mitsubishi,

compatible with

conventional

products.

• Incorporates SiC

MOSFETs with

current sensors and

built-in drive circuit

and protection

functions.

GeneSiC:1200V, 100A

Panasonic and SanRex:

1200V/150A.

Infineon:

Easy1B with six-pack

topology.

Mass production in 2017.

Rohm:

Up to 120A, with 50%

volume reduction than if

IGBT were used

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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INTEGRATION SIVS SIC

Increased efficiency and smaller size by replacing Silicon with SiC MOSFET

3-phase SiC-based boost converter

prototype without copper bus bars and

common mode chokes

This can be parallelized to

get a 9-phase SiC converter,

resulting in 126 kW peak

power

485 mm

226 mm

73 mm

Source: Aachen University

Case study

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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SIC POWER DEVICETIMELINE

SiC JFET 2016

First SiC

MOSFET

2017

• First hybrid solution in production since 2006 by Infineon.

• Once SiC MOSFETs were in production, several players started

to release full SiC modules.

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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CREE’S TRANSFORMATION PATH (1/3)

LED

Lighting

Power & RF

2015 2016 2017 2018

Materials

Plan for

LED

Lighting

Power & RF + Materials +

Infineon RF Power

Focus

New Focus

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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SIC DIODE

Time evolution of patent publications

• SiC SCHOTTKY BARRIERDIODE (SBD)

* A patent family is a set of patents filed in multiple countries to protect a single invention by a common inventor. A first application is made in onecountry – thepriority country–and is then extended to other countries.

Note: The patent search was performed in March 2018,

thus the data corresponding to the year 2018 are not

complete. At the time of the patent search, 12 patent

families had been published in 2018.

High number of JP 1st publication in

2013 like Fuji Electric (14 patent families)

High number of JP 1st

publication in 2003 and 2006

First wave first

commeral

introduction of

SiC diode

Second wave

SiC device market

took off

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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SiC POWER INDUSTRY - MAIN CHALLENGES (AS OF 2018)

From materials to system integration

Material

• High cost.

• Limited wafer size.

• Short supply at 6’’

Device

• Less maturity compared to Si

• Lower manufacturing yield.

• Higher cost.

• Long-term reliability.

• Short circuit capability

• What is the right packaging?

System

• How to integrate the active component e.g. for driving, EMI, topology choices.

• What are the available choices for passive components and dielectric materials?

• What are the right price?

Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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SIC MOSFET VS SI IGBT

Which is the R&D status as of 2018?

Nowadays, companiesstill invest in R&D for IGBT.

SiC MOSFET

development

timeline

IGBT

development

timeline

Gen 5 IGBTDecreased

switching losses

Vth inestabilities

SBD

integrated

Enhanced short

circuit

characteristics

Improved screening

in production for

dynamic tests

Still investments

in IGBT

technology

Switching

transients

*Non-exhaustive list

PackagingImprovingPower

cycling

All SiC players

(device +

module makers)

Who? What?

Who? What?

As back-up solution for

SiC MOSFETs

SiC transistors will not be

used in all IGBT

applications as of 2018

IGBT market still grow.

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RELATED REPORTS

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• Patent analysis

• Design and characterization of

innovative optical systems

• Financial services (due diligence,

M&A with our partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

4©2018 | www.yole.fr | About Yole Développement

6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

5©2018 | www.yole.fr | About Yole Développement

OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

6©2018 | www.yole.fr | About Yole Développement

ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

7©2018 | www.yole.fr | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developpers

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

8©2018 | www.yole.fr | About Yole Développement

SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

9©2018 | www.yole.fr | About Yole Développement

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundled Offer and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Memory

10©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (1/4)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 – Update

− Silicon Photonics 2018 – Update

− Consumer Biometrics: Hardware & Software 2018 – Update

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Acoustic MEMS and Audio Solutions 2017

− MEMS & Sensors for Automotive Market & Technology Trends 2017

− High End Inertial Sensors 2017

− Magnetic Sensor 2017

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product

Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− MEMS Pressure Sensor 2018 – Market & Technology Report

− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report

− Gas & Particles 2018 – Market & Technology Report

− Gas & Particles Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

− MEMS Packaging 2017 – Market & Technology Report

− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report

RF DEVICES AND TECHNOLOGIES

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wireless technologies (Radar, V2X) for Automotive 2018

− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting

− Automotive Radar Comparison 2018

o PATENT ANALYSES – by KnowMade

− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market

& Technology Report – Update

− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report

− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report – Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market & Technology Report – Update

− RF GaN Comparison 2018* – Structure, Process & Cost Report

− RF GaN 2018 – Patent Landscape Analysis

SOFTWAREo MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Consumer Biometrics: Sensors & Software 2018 – Update

− Processing Hardware and Software for AI 2018 - Vol. 1 & 2

− From Image Processing to Deep Learning, Introduction to Hardware and Software

Update : 2017 version still available / *To be confirmed

11©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (2/4)

IMAGING & OPTOELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the Compact Camera Module and Wafer Level Optics

− Industry 2018 – Update

− 3D Imaging and Sensing 2018 – Update

− Sensors for Robotic Vehicles 2018

− Machine Vision for Industry and Automation 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− Uncooled Infrared Imagers 2017

o PATENT ANALYSES – by KnowMade

− iPhone X Dot Projector – Patent-to-Product Mapping

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -Update

− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report

− CMOS Image Sensors Monitor 2018* – Quaterly Update**

− Camera Module 2017 – Market & Technology Report

− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology

Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

ADVANCED PACKAGING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Advanced Packaging Industry 2018 – Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends

− 3D TSV and Monolithic Business Update 2018 – Update

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive Packaging 2018

− Hardware and Software for AI 2018 - Vol. 1 & 2

− Integrated Passive Devices (IPD) 2018

− Thin-Film Integrated Passive Devices 2018

− Memory Packaging Market and Technology Report 2018 – Update*

o PATENT ANALYSES – by KnowMade

− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

o LINKED REPORTS– by Yole Développement and System Plus Consulting

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− Fan-Out Packaging 2018 – Market & Technology Report – Update*

− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report

MANUFACTURING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wafer Starts for More Than Moore Applications 2018

− Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018

− Polymeric Materials for wafer-level Advanced Packaging 2018

− Laser Technologies for Semiconductor Manufacturing 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Equipment and Materials for 3D TSV Applications 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− Equipment for More than Moore: Technology & Market Trends for

Lithography & Bonding/Debonding 2018 – Market & Technology Report

− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report

Update : 2017 version still available / *To be confirmed

12©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (3/4)MEMORY

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market Monitor 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing Monitor 2018 (NAND & DRAM)

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018

o PATENT ANALYSES – by KnowMade

− 3D Non-Volatile Memories – Patent Landscape

COMPOUND SEMICONDUCTORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018

− Bulk GaN Substrate Market 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Power SiC 2018: Materials, Devices, and Applications – Market & Technology

Report – Update

− SiC Transistor Comparison 2018 – Structure, Process & Cost Report

− Power SiC 2018 – Patent Landscape Analysis

− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report – Update

− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023

– Market & Technology Report – Update

− RF GaN – Patent Landscape Analysis

POWER ELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for Electric Vehicles 2018 – Update

− Integrated Passive Devices (IPD) 2018

− Wireless Charging Market Expectations and Technology Trends 2018

− Thermal Management Technology and Market Perspectives in Power

− Electronics and LEDs 2017

− Gate Driver 2017

− Power MOSFET 2017

− IGBT 2017

− Market Opportunities for Thermal Management Components in Smartphones 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting

and KnowMade

− Power Modules Packaging 2018 – Market & Technology Report – Update

− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report

− Power ICs Market Monitor 2018 – Quaterly Update**

− Power ICs Market Comparison 2018* – Structure, Process & Cost Report

BATTERY AND ENERGY MANAGEMENTo MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update

o PATENT ANALYSES – by KnowMade

− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017

o LINKED REPORTS – by Yole Développement and KnowMade

− Solid State Electrolyte Battery 2018 – Market & Technology Report

− Solid-State Batteries 2018 – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

13©2018 | www.yole.fr | About Yole Développement

OUR 2018 REPORTS COLLECTION (4/4)

SOLID STATE LIGHTING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update

− Automotive Lighting 2018: Technology, Industry and Market Trends – Update

− UV LEDs 2018: Technology, Industry and Market Trends – Update

− LiFi: Technology, Industry and Market Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− CSP LED Lighting Modules

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Horticultural Lighting 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology Report

− VCSELs Comparison 2018 – Structure, Process & Cost Report

DISPLAYS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update

− Displays and Optical Vision Systems for VR/AR/MR 2018

− MicroLED Displays 2018 – Market & Technology Report – Update

o PATENT ANALYSES – by KnowMade

− MicroLED Display – Patent Landscape Analysis

MEDTECH

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical

− Applications 2018 – Update

− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Ultrasound technologies for Medical, Industrial and Consumer 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy: from Isolation to Downstream Applications 2018

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation

Laboratory Markets 2018*

− Artificial Organ Technology and Market 2017

− Connected Medical Devices Market and Business Models 2017

− Status of the Microfluidics Industry 2017

− Organs-On-Chips 2017

− Solid-State Medical Imaging 2017

− Medical Robotics Market & Technology Analysis 2017

o PATENT ANALYSES – by KnowMade

− Microfluidic IC Cooling – Patent Landscape

− Circulating Tumor Cell Isolation – Patent Landscape

− OCT Medical Imaging – Patent Landscape

− Pumps for Microfluidic Devices – Patent Landscape 2017

− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017

− FLUIDIGM – Patent Portfolio Analysis 2017

− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Organs-On-Chips 2017 – Market & Technology Report

− Organ-on-a-Chip – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed

14©2018 | www.yole.fr | About Yole Développement

OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

15©2018 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ON L I N E ON S I T E I N PE R S ON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person.Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 11,200+

monthly unique visitors, the

10,500+ weekly readers of

@Micronew se-newsletter

Several key events planned for

2018 on different topics to

attract 120 attendees on average

Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Project Manager

16©2018 | www.yole.fr | About Yole Développement

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: laferriere@yole.fr – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: troy.blanchette@yole.fr – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (Korea, Singapore, India & ROA)

Email: onozawa@yole.fr - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: ohtake@yole.fr - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan)

Email: oshiba@yole.fr - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development

Email: wang@yole.fr - +886 979 336 809

• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: levenez@yole.fr - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email eloy@yole.fr - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnershipwith Woodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: eloy@yole.fr - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development

Email: ivan.donaldson@yole.fr - +1 208 850 3914

o GENERAL

• Public Relations: leroy@yole.fr - +33 4 72 83 01 89

• Email: info@yole.fr - +33 4 72 83 01 80

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