Platform for European CMOS Imagers - IMEC · • Action 4.2.2: Upgrade the LTA Laser Head to...

Platform for European

CMOS Imagers

seventh framework

programme

EuroCIS – Project Summary

Project card

• Acronym: EuroCIS

• Work program topic: SPA-2011.2.2-02

▫ Space critical technologies

• Grant agreement no: 284487

• Start date: 1 Nov 2011

• Duration: 36 months

Funding scheme: Collaborative project

▫ Total budget: 2,844,010

▫ Funded budget: 1,993,216

• Partners: ▫ Imec

▫ Selex Galileo

▫ TNO

▫ Excico

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Goal and approach

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EC FP7 Space call I

• ‘Activity 9.2: Strengthening the foundations of Space science and technology’

• Area 9.2.2: Research to support space transportation and key technologies

• Sub-topic: ‘SPA-2011.2.2-02 Space critical technologies’

• Aim = ‘non-dependence’, i.e. ‘the possibility for Europe to have free, unrestricted access to any required space technology’

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Vision:

• formation and validation of a supply chain for a state-of-the-art large CMOS imagers (focal plane arrays) for use in space, whithin Europe

• bring existing know-how and technologies from the different partners together

• no development of new technology beyond the state-of-the-art

• enable ‘product platform’ to serve space needs in the future

• without having to access sources outside Europe (as is today the case for e.g. the CMOS imager Si processing)

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Workplan summary:

• 1) gather typical imager specs for space

• 2) bring the different design and technology blocks to maturity (‘platform’)

• 3) validate using a state-of-the CMOS imager & qualify/characterize

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Technical approach:

• Monolithic frontside as well as backside illuminated imagers (optionally TDI – TBD)

• Suitable for detection of light from the (near)UV up to the near infrared - expansion of this wavelength range of interest is possible towards the lower wavelengths (UV, X-ray) but will not be the focus of this project, lowest wavelength region ~ 200-250nm (TBC in WP1)

• Backside illumination will enable the best sensitivity, while special non-CMOS features implemented in imec will enable e.g. low noise, low dark current and excellent cross-talk behavior

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Summary Roles partners

• specification definition: Selex Galileo (+ all)

• imager design: imec

• imager processing: imec

• laser annealing (for backside passivation): Excico

• optical layer post-processing: TNO

• imager characterization: Selex Galileo

• dissemination and exploitation (imec + all)

• management: imec (+all)

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Partners & people

• imec (Belgium):

• Piet De Moor, [email protected] (coordination)

• Kiki Minoglou, [email protected] (tech proposal part B)

• Christine Van Houtven, [email protected] (admin proposal part A)

• Selex Galileo (Italy):

• Giampaolo Preti, [email protected] (coordination)

• Stefano Pieraccini, [email protected] (technical responsible)

• TNO (The Netherlands):

• Bram Hardenbol, [email protected] (proposal manager)

• Excico (France, SME) • Karim Huet, [email protected] (coordinator)

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mailto:[email protected]








Selex Galileo: role

• define specifications/requirements for space imagers for future missions

• set-up test plan for space imager characterization

• characterize imager (Electro-optical performance validation)

• validate imager with tests able to reach TRL 6 qualification, including:

Vibration, shock, burn-in, T cycling: Selex Galileo

Access to radiation facilities: imec support

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Selex Galileo: background: TEST

• Space testing facilities

• 2,000 sq. m. clean rooms (from 100 to 100,000 class)

• Space simulators, thermal and thermal shock chambers

• Attitude simulators

• Earth, Sun and Stars simulators

• VIS and IR FPA set-up

• Corona test facility

• EMC/EMI test facilities

• Shakers

• Cleanliness laboratory

• Solar arrays lay-down

• Optical, mechanical and electronics workshops

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Imec role: imager design

• Design based on (selected) space specs:

• Pixel design:

Pixel options:

4T pixel = pinned photodiode

high Voltage = thick gate oxide

Trench isolation for better MTF/cross-talk

Special start material: graded epi, high resistivity Si (n/p-type)

Snapshot vs. rolling shutter

Pixel design & performance optimization using 2D TCAD simulation

• Mixed analog-digital design of peripheral electronics:

Correlated double sampling (CDS)

(Column) analog-to-digital conversion

Output buffers

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Imec role: imager processing

• ‘Platform’ actions:

• Yield monitoring & improvement

• Standardize special imager processes (e.g. backside illumination module)

• Set-up full process design kit (PDK) and analog models (SPICE)

• Prepare for multi-project wafer service (MPW)

• imager processing:

• Fabrication of imagers:

Frontside illuminated

Backside illuminated

• Packaging of imagers

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Imec background: design

• Pixel design:

• Device modeling & simulation

• Analog signal processing:

• Correlated double sampling (CDS)

• Analog-to-digital conversion:

• On-chip, optionally per column

• Digital system design:

• On-chip command/control/SPI

• Radiation tolerant design:

• Know-how on analog design

• Digital rad-hard library DARE

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Dark current of radiation tolerant nMOS pixels

0

500

1000

1500

0.01 0.1 1 10 100 1000

Total Ionising Dose [kGy(Si)]

dark c

urren

t [

mV

/s]

continuous reset

pulsed reset

standard pixel

dose rate: 350 Gy(Si)/h


Imec background: processing

• 200 mm wafer size

• Flexible 0.13 um CIS+ platform:

• non-CMOS features

• backside illumination option

• Fab organisation:

• Runs 24 hours 7/7 days

• Computer controlled (FAB300)

• Operator based

• Contamination control

• Quality control: SPC

• Volume: 25000 lotturns/yr

• Cycle time monitoring

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EXcico role:

• laser annealing of backside illuminated imagers (after backside thinning)

• Setting up platform

Full Device explosure approach: qualification for Die size of interest

LTA upgrade (20 Joules)

FDE upgrade (larger optics for max die sensor)

• Optimize process for (N)UV detection

Simulations : process integration for optimization of Si/LTA wavelenght coupling

Demonstrations on LTA platform

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Excico background:

• Knowledgeable Simulation team on Laser processing of Semiconductor interactions : Thermal, Electromagnetical.

• Solid experience in BSI-CIS process integration for low-end and mid range market (mobile phone cameras and Digital Still Cameras)

• LTA platform: already present in 5 of the Top 10 WW IDM/foundries

• LTA platform is SEMI std compliant

• Any size of wafer compatibility from 4 to 12’’

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TNO: role: Optical coatings

• Design and applying optical thin films,

• optimize transmission, spectral response and light absorption

• Anti Reflex coating, optical Band Pass filters and Black Coating

• in the wavelength region from (near) UV (200 nm) to near IR (2000 nm) (or beyond)

• Qualify production of optical thin films on (dummy) 200 mm wafers

• Post-process of validated coatings on imagers wafer

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TNO: background

• TNO is the Dutch Organization for Applied Scientific Research, focusing on strengthening the innovative power of companies, public and governmental organizations (www.tno.nl).

• One of the activities of TNO is design and manufacturing of optical components and thin film coatings for tailored applications, like space instrumentation, e.g. spectrometers. The Optical Department has over 40 years experience in the development of innovative optical components and manufacturing techniques by merging scientific approach and highly skilled workmanship.

• Most of our customers are in Europe and are involved in space instrumentation, astronomy and scientific research at universities.

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http://www.tno.nl/


Work packages (WP responsible)

• WP1: specifications definition (Selex Galileo) M0-M3

• WP2: CIS design (imec) M4-M14

• WP3: CIS fabricatio (imec) M4-M31

• WP4: laser annealing (Excico) M4-M23

• WP5: optical post-process (TNO) M4-M28

• WP6: CIS characterization (Selex Galileo) M11-M36

• WP7: Dissemination and exploitation (imec) M1-M36

• WP8: Management and coordination (imec) M1-M36

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WP 1: Specifications definition

• Task 1.1: Define specifications/requirements for space imagers • Action 1.1.1 – Collect main optical requirements for space imagers

for EO missions running or planned in the near future

• Action 1.1.2 – Define the target imagers

• Action 1.1.3 – Define the (goal) specifications for FPAs

• Action 1.1.4 – Evaluate technical feasibility and agree the development plan

• Task 1.2: Set-up test plan for imager qualification • Action 1.2.1 – Define and agree the test activity

• Action 1.2.2 – Prepare the Test Plan

• Action 1.2.3 – Define the test jigs for FPA tests

• WP1 Deliverables ▫ D1.1 Detector requirements specifications (M3)

▫ D1.2 Detector test plan (M3)

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WP 2: CIS design

• Task 2.1: Design kit finalisation

• Action 2.1.1: refine transistor models

• Action 2.1.2: detailed process design kit

• Deliverable 2.1: Design kit description (M7)

• Task 2.2: imager design

• Action 2.2.1: pixel design

• Action 2.2.2: analog & digital electronics design

• Action 2.2.3: mask layout

• Deliverable 2.2: Imager design report (M14)

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WP 3: CIS fabrication

• Task 3.1: CIS process platrformization:

• Action 3.1.1: Yield assessment

• Action 3.1.2: Optimal process parameter extraction

Deliverable 3.1: Imager process description (M14)

Task 3.2: imager processing

• Action 3.2.1: Substrate processing

• Action 3.2.2: CMOS imager process

• Action 3.2.3: Backside processing

• Action 3.2.3-1: Match Optical coatings with substrate (TNO)

• Deliverable 3.2: Imager packaging description (M31)

• Task 3.3: imager packaging

• Action 3.3.1: Dicing and packaging

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WP 4: laser annealing

• Task 4.1: Process integration

• Action 4.1.1: Gathering information on backside junction requirements

• Action 4.1.2: Modeling LTA process

• Action 4.1.3: Processing test samples

Deliverable 4.1: Process integration (M14)

Task 4.2: Large area beam laser annealing tool upgrade • Action 4.2.1: Upgrade the FDE optical setup of the LTA system to adapt field size to device size.

• Action 4.2.2: Upgrade the LTA Laser Head to increase the output Energy

• Action 4.2.3:Improve the high voltage generation system

• Action 4.2.4: Improve the gas circulation loop

Deliverable 4.2: Large area beam laser annealing tool upgrade(M14)

• Task 4.3: Qualify and validate upgrated LTA on real device processing • Action 4.3.1: fine tuning on real devices

• Action 4.3.2: final qualification and validation of the LTA process on imagers

Deliverable 4.3: Qualify and validate upgrated LTA(M23)

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WP 5: optical post-process I

• Task 5.1: Initial definition of coatings for images • Action 5.1.1: Gathering and analyzing the optical specifications of the image sensors.

• Action 5.1.2; Modeling (TfCalc, Mcloud) optical thin films (AR, Band Pass, Black coating) based on preliminary specifications.

• Action 5.1.4: Small scale testing of optical thin films and verifying feasibility of specifications and production costs involved.

• Action 5.1.5: Establish (initial) specifications and process description for AR, Band Pass and Blackcoatings to be applied on the imagers.

Deliverable WP 5.1: Specifications for AR, Band Pass and Black coatings to be applied on the imagers. (Report, including background, theoretical and practical experiences and conclusions, specifications.) (M14)

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WP 5: optical post-process II

• Task 5.2: Specification of coatings and the coating processes. • Action 5.2.1: Validation whether or not specifications from 5.1.5 are still valid (after some months

development on the imagers); possible adjustment of specifications.

• Action 5.2.2: Manufacturing of optical thin films on 200 mm wafers, as required from the imec design

• Action 5.2.3: Applying optical thin films on test samples as required by Selex Galileo for Qualification tests.

• Action 5.2.4: Final establishing of specifications and process description for the AR, Band Pass and Black coatings to be applied on the imagers.

• Deliverable WP 5.2 : Proven concept of AR, Band Pass and Black coatings/ Final

manufacturing description for AR, Band Pass and Black coatings (M28)

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WP 6: CIS characterization

Task 6.1: Prepare the test jigs for FPA tests

Deliverable 6.1: Test procedures (M14)

• Task 6.2: Imager qualification

• Action 6.2.1: Electro-optical characterization

• Action 6.2.2: Imager tests to demonstrate the possibility for space qualification (TRL6) with qualification levels to be defined; tests will include:

▫ Functional characterization

▫ Burn-in

▫ Vibration and shock

▫ Thermal cycling

▫ Radiation (imec will support the access to radiation facilities)

Deliverable 6.2: Electro-optical performance test report (M36)

Deliverable 6.3: Environmental test reports (M36)

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WP 7: Dissemination and exploitation

Task 7.1: Evaluation of patentability

• Task 7.2: Create a project Web-page

• Task 7.3: Brainstorming with ESA’s technology staff ▫ Action 7.3.1: Preliminary meeting: specifications for CMOS imagers

▫ Action 7.3.2: Presentation at the end of the activity to show the technology achievements

• Task 7.4: Participation to a Space Conference in Europe at the end of the project

• Task 7.5: Organize training sessions

• Task 7.6: Evaluation of different markets

• WP7 Deliverables ▫ D7.1: Web page available (M6)

▫ D7.2: Midterm exploitation evaluation (M18)

▫ D7.3: Final dissemination and exploitation report (M36)

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WP 8: Overall management

• Task 8.1: steering committee constitution, consortium agreement signature

• Task 8.2: Day to day management, financial and administrative management

• Task 8.3: Reporting and evaluations

• Task 8.4: Protection of intellectual property

• WP8 Deliverables ▫ D8.1: First year report (M12)

▫ D8.2: Final activity and management report (M36)

▫ D8.3: Final public report (M36)

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PERT diagram

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Gantt

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milestones

• Milestone MS1 (M3)

• Space imager specifications ready:

• Definition of the imager


• Imager platform ready:

• Design blocks and technology blocks & characterization strategy qualified


• Imager demonstrator ready


• Imager characterized and qualified

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Deliverables: WP1-4

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Deliverable no.

Deliverable name Nature Dissemination level

Delivery date (month)

D1.1 Detector requirements specification

R(eport)

RE

To+3

D1.2 Detector Test Plan R(eport) RE To+3

D2.1 Design kit description R(eport) RE To+7

D2.2 Imager design report R(eport) RE To+14

D3.1 Imager process description R(eport) RE To+14

D3.2 Imager packaging description R(eport) RE To+31

D4.1 Process integration R(eport) RE To+14

D4.2 Large area beam laser annealing tool upgrade

R(eport) RE To+14

D4.3 Qualify and validate upgrated LTA on real device processign

R(eport) RE To+23


Deliverables: WP5-WP7

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Deliverable no.



D5.1 Specifications of optical coatings

R(eport)

RE To+14

D5.2 Proven concept, final manufacturing description

R(eport) RE To+28

D6.1 Test procedures O(ther) RE To+14

D6.2 Electro-optical performance test report

O(ther) RE To+36

D6.3 Environmental test report R(eport)

RE To+36

D7.1 Web page available O(ther) PU(blic) To+6

D7.2 Midterm exploitation evaluation

R(eport)

PU(blic) To+18

D7.3 Final dissemination and exploitation report

R(eport)

PU(blic) To+36


Deliverables: WP8

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Deliverable no.



D0.1 First year report R(eport)

CO(nfidential) To+12

D0.2 Final activity and management report

R(eport) CO(nfidential) To+36

D0.3 Final public report R(eport) PU(blic) To+36


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MEETINGS

Type of meeting

Combined with

Planned venue comments time

KOM SCM 1 imec To+1

TPM 1 To+6

TPM 2 SCM 2 imec First Year Review To+12

TPM 3 To+18

TPM 4 SCM 3 To+24

TPM 5 To+30

TPM 6 SCM 4 imec Final Review To+36

TPM: Technical progress meetings SCM: Steering Committee meeting

“EuroCIS project (project no. 284487) is partially

supported/co-funded by the European Community/ European

Union/EU under the Space theme of the 7th Framework

Programme for R&D (FP7).”

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seventh framework

programme

Platform for European CMOS Imagers - IMEC · • Action 4.2.2: Upgrade the LTA Laser Head to...

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