PIR CONTROLLER IC FOR LOAD SWITCH E31.8 ... VDD S Positive supply voltage, shunt regulator 6 REL O...

Elmos Semiconductor AG Data Sheet QM-No.: 25DS0120E.00

PIR CONTROLLER IC FOR LOAD SWITCH E931.98

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This document contains information on a pre-production product. Elmos Semiconductor AG reserves the right to change specifications and information herein without notice.

PRELIMINARY INFORMATION - NOV 15, 2013

Features

Applications

Typical Application Circuit

ÿ Digital signal processing ÿ On chip supply shunt regulator ÿ Low power consumption ÿ Differential PIR sensor input ÿ Excellent power supply rejection ÿ Insensitive to RF interference ÿ Inputs for sensitivity, on time and daylight sensor ÿ Outputs for relay and LED ÿ Instantaneous settling after power up ÿ Adaptive Zero Crossing Switching

ÿ Mains powered motion sensor lights that require relay switching on zero crossing, common requirement for low cost relays and capacitive loads.

General Description

The E931.98 integrated circuit combines all required functions for a single chip Passive Infra-Red (PIR) mo-tion sensor. Motion detection is signaled through the push-pull REL output. A digital input OEN enables REL output.The load is switched during mains voltage zero crossing. The algorithm adapts to the relay type and mains fre-quency. A LED output indicates whenever the PIR Signal is above the selected threshold. The E931.98 interfaces directly with up to two conven-tional PIR sensors via a high impedance differential in-put. The PIR signal is converted to a 15 bit digital value on chip.The parameters for sensitivity and timing are set by connecting the corresponding inputs to DC voltages. The voltage levels on the inputs are converted to digi-tal values with 7 bit resolution. All signal processing is performed digitally.

Ordering Information

Product ID Op. Temp. Range Package

E931.98 -25°C to +85°C SOIC14N/TSSOP14

R7

4

10

6

ENVREG

OEN

REL

VDD 5

PIRIN 1

ZCL 12

ZCN 11

E931.98PIR1

VDD 13

SENS 9

ONTIME 8 7 LED

2 NPIRIN

3 VSS

14 VSS

Q1

RE1AD2

R8

C5

C3

C6

C4

VSS

VSS

VSSVSS

VSS

R9

R3

R5

RV1

R4

CDS1

RV3

R6

RV2

C2Z1

R11

R12

LIVE

LOAD

NEUTRAL

D1

R2

C1

R1

R10 V1

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Functional Diagram

Pin Configuration

Top View

Note: Not to scale

REL

E931.98

LED

OEN

VDD

GND

ENVREG

PIRIN

NPIRIN

ZCL

ZCN

PIRADC

DigitalFilter

LoadSenseCircuit

Comparator&

AlarmEventLogicOSC

BAND GAPREF

PINADC

Test ControlLogicON TIME

SENS

Pin 1

1 2 3 4

14 13 12 11

VSS

VD

D

ZCL

ZCN

PIRI

N

NPI

RIN

VSS

ENV

REG

10

OEN

9

SEN

S

8

ON

TIM

E

5

VD

D

6

REL

7

LED

E931.98

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Pin Description

Pin Name Type 1) Description

1 PIRIN I PIR sensor input

2 NPIRIN I Negative PIR sensor input

3 VSS S Negative supply voltage

4 ENVREGRegulator enable, connect to V

DD to enable regulator, connect to V

SS to disable

regulator for low current battery based applications, where VDD

will be less than 3.6V.

5 VDD S Positive supply voltage, shunt regulator

6 REL O RELAY output (push-pull)

7 LED O LED output (push-pull)

8 ONTIME I On time selection input

9 SENS I Sensitivity selection input

10 OEN O > VIH

: REL output is enabled | This input is used for factory test and the < V

IL : REL output is disabled | voltage needs to remains between V

DD and V

SS

11 ZCN I Current sense input for Neutral

12 ZCL I Current sense input for Load

13 VDD S Positive supply voltage, shunt regulator

14 VSS S Negative supply voltage

1) I = Input, O = Output, I/O = Input/Output, S= Supply

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1 Absolute Maximum Ratings

Stresses beyond these absolute maximum ratings listed below may cause permanent damage to the device. These are stress rat-

ings only; operation of the device at these or any other conditions beyond those listed in the operational sections of this document

is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. All voltages

with respect to ground. Currents flowing into terminals are positive, those drawn out of a terminal are negative.

Description Condition Symbol Min Max Unit

Supply Voltage VDD

-0.3 3.6 V

Current into any pin One pin at a time -100 100 mA

Storage Temperature Tst

-45 125 °C

(VVDD

= +2.7V to +3.6V, TAMB

= -25°C to +85°C, unless otherwise noted. Typical values are at VVDD

= +3V and TOP

= +25°C. Positive currents flow into the device pins.)

Description Condition Symbol Min Typ Max Unit

Temperature

Operating temperature range -25 85 °C

Regulator

Shunt regulator current IR

5 mA

Supply current, ENREG=VDDVDD < Regulator voltage, Outputs un-loaded

IDD

50 µA

Supply current, ENREG=VSS Regulator not active, VDD=3.3V I

DD18 µA

Regulator voltage IR = 0.5mA V

DD2.7 3 3.3 V

Input OEN

Input low voltage VIL

0.8 V

Input high voltage VIH

0.9 V

Input Current VSS

<VIN

<VDD

II

-1 1 µA

Input ENVREG

Input low voltage VIL

0.2 VDD

Input high voltage VIH

0.8 VDD

Input Current VSS

<VIN

<VDD

II

-1 1 µA

Outputs REL, LED

Output current high VOL

>(VDD

-1V) IOH

-10 mA

Output current low VOL

<1V IOL

10 mA

Inputs SENS, ONTIME

Input voltage range Adjustment between 0V and ¼ VDD 0 V

DD

Input leakage current -1 1 µA

ZCH / ZCN Inputs

Input low current IIL

3 5 7 µA

Input high current IIH

3 5 7 µA

Input Voltage Input current +/-10µA II

0.3 0.5 0.7 VDD

2 Electrical Characteristics

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(VVDD

= +2.7V to +3.6V, TAMB

= -25°C to +85°C, unless otherwise noted. Typical values are at VVDD

= +3V and TOP

= +25°C. Positive currents flow into the device pins.)

Description Condition Symbol Min Typ Max Unit

PIRIN / NPIRIN Inputs

PIRIN /NPIRIN input resistance to V

SS

-60mV < VIN < 60mV 20 GΩ

PIRIN /NPIRIN input resistance differential -60mV < VIN < 60mV 40 GΩ

PIRIN input voltage range -60 60 mV

Oscillator and Filter

LPF cutoff frequency 7 Hz

HPF cutoff frequency 0.44 Hz

On chip oscillator frequency FCLK

64 kHz

System Clock C_G FCLK

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3.1 PIR Sensor Input

3 Functional Description

A differential input stage provides for the connection of up to two PIR sensors. The analog to digital converter generates a digital signal from the voltage level meas-ured between the PIRIN and NPIRIN pins.A band gap reference ensures a temperature and sup-ply voltage independent gain.

A differential input stage provides for the connection of up to two PIR sensors. The analog to digital converter generates a digital signal from the voltage level meas-ured between the PIRIN and NPIRIN pins.A band gap reference ensures a temperature and sup-ply voltage independent gain.

The signal from the band pass filter is rectified. When the signal level exceeds the selected sensitivity thresh-old, the REL output is activated. The LED output is active (high), whenever the signal level is above the sensitivity threshold.The voltage applied to the ONTIME input determines how long the REL output stays active. The REL output remains active from the first alarm condition to the last alarm condition plus the time selected with the ON-TIME input.

The E931.98 ensures, that the load is only switched on during mains voltage zero crossing. This function pre-vents early relay failure due to excessive contact wear when switching capacitive loads such as compact fluo-rescent lights.

The integrated shunt voltage regulator can be activated by the user through the ENVREG input. The E931.98 can be operated directly from batteries or regulated supply voltages ranging from 2.7V to 3.6V. In this case, the volt-age regulator needs to be switched off and the user can benefit from the very low current consumption.In applications with higher voltages, the user would ac-tivate the on chip shunt regulator, which generates a stable supply voltage of 3V for the E931.98 and the PIR detector. The VDD pin requires a bypass capacitor to VSS. The reference for the shunt regulator is taken from the integrated band gap reference.

3.2 Voltage Regulator

The IC contains an on chip low power oscillator. The fre-quency is set to 64kHz. The timing signals and cutoff frequencies of the digital filters are derived from this frequency

3.3 Oscillator

3.4 Band-Pass Filter

3.5 Alarm Event Processor

3.6 Relay Switching

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3.7 Power Up

The on chip power on reset keeps the circuit in a reset condition until the supply voltage is high enough for a stable operation. The REL output is activated indepen-dently of the OEN input signal for the duration, which is selected with the voltage on the ONTIME input. Ac-tivation of the RELAY output takes place 500ms after it detects uninterrupted mains signal (zero crossings) on the ZCN input.

A voltage applied to the ONTIME input set the time the REL output is active with a single trigger event. Any voltage above VDD/4 will select the maximum on time.

The integrated circuit monitors mains voltage/fre-quency presence through the ZCN input. Whenever the mains zero crossings disappear for duration of more than 0.5s, the circuit assumes, that the voltage has been disconnected. If the voltage is re-connected, the load is switched on in the same way like after a power up. This feature does not require the discharge of the power supply in order to force a power on reset.

3.8 Mains Voltage Presence Detection

4 On Time

Pin voltage PIN ADC count ON Time in seconds ON Time in minutes

VDD

*1/128 or less 0 8 0.1

VDD

*3/128 1 16 0.3

VDD

*5/128 2 24 0.4

VDD

*7/128 3 32 0.5

VDD

*9/128 4 48 0.8

VDD

*11/128 5 64 1.1

VDD

*13/128 6 96 1.6

VDD

*15/128 7 128 2.1

VDD

*17/128 8 192 3.2

VDD

*19/128 9 256 4.3

VDD

*21/128 10 384 6.4

VDD

*23/128 11 512 8.5

VDD

*25/128 12 768 12.8

VDD

*27/128 13 1024 17.1

VDD

*29/128 14 1536 25.6

VDD

*31/128 or above 15 2048 34.1

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A voltage applied to the SENS input sets the threshold used to detect a PIR signal between the PIRIN and NPIRIN inputs. VSS selects the minimum threshold voltage. Any voltage above VDD/4 will select the maximum threshold, which is the least sensitive setting for PIR signal detection.

5 Sensitivity

ON Time

1

10

100

1000

10000

0.01 0.02 0.04 0.05 0.07 0.09 0.10 0.12 0.13 0.15 0.16 0.18 0.20 0.21 0.23 0.24

Ontime Voltage, normalized to VDD

Sec

on

ds

Figure 1. PIR voltage trigger threshold vs. SENS pin voltages normalized to VDD

Figure 2. REL Output On Time in seconds vs. ONTIME pin voltages normalized to VDD.

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6 Application Information

Designator Typ. Value Description NoteU1 E931.98 PIR Controller IC TSSOP14 or SOIC14U2 LHI968 Dual Element PIR Sensor TO-5R1 1M Discharge resistorR2 100R Transient protection resistor Wire wound

R3 56k Current limiting resistor R3 < (VRel

-VVDD

)/(IIDD

+ IREL

/βQ1

+ IR4

+IR5

+IR6

)

R7 22k REL drive current setting resistor R7 = IREL

/βQ1

R4 10k Current limiting resistor In case VCDS

=0 and RV1 is also turned to 0

R5 680k Voltage divider VVDD

/4 = (RV3) / (RV3+R5)

R6 680k Voltage divider VVDD

/4 = (RV2) / (RV2+R6)

R8 2.2M Pull down resistorR9 100k Pull down resistor

R10 220k Pull down resistor Load voltage clamp resistor,R10 must be able to drop full load when REL is active

R11 10M Load voltage sensing resistorR12 10M Neutral voltage sensing resistorD1 1N4148 Fly back protection diodeD2 DB104S Diode bridgeZ1 ZD47 47V Zener Diode Choose according to RE1 voltageCdS1 Light dependent resistorRV1 2.2M OEN Voltage Adjust (Dark level)RV2 220k Sensitivity adjustment Select in conjunction with R6RV3 220k On Time adjustment Select in conjunction with R5

V1 S10275VAC Transorb, for high voltage spike pro-tection

C1 150n/230VAC Voltage dropper capacitorC2 10µF/64V Supply voltage storage Voltage rating dependant on RE1 voltageC3 1µF/6V Decoupling capacitor Ceramic, close to supply pins of deviceC4 10µF/6V Sensor supply storage Regulator compensation capacitorC5 470nF PIR signal bypass capacitorRE1 47V N.O. REL High coil voltage, less drive currentS1 3 position Mains switch

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7 Package Information

7.1 SOIC14N

The E931.98 is available in a Pb free, RoHs compliant SOIC14N plastic package according to JEDEC MS-012-F, variant AB. The package is classified to Moisture Sensitivity Level 3 (MSL 3) according to JEDEC J-STD-020 with a soldering peak temperature of (260+5)°C.

Date: 05.02.2013PACKAGE OUTLINE SPECIFICATION

Author: ASto 14 Lead Small Outline Package (150mil)

(SO14n) QM-No.: 08SP0665.06

Package Outline and Dimensions are according JEDEC MS-012-F, variant AB

Description Symbol mm inchmin typ max min typ max

Package height A -- -- 1.75 -- -- 0.067Stand off A1 0.10 -- 0.25 0.004 -- 0.010Package body thickness A2 1.25 -- -- 0.049 -- --Width of terminal leads, inclusive lead finish b 0.31 -- 0.51 0.012 -- 0.020Thickness of terminal leads, inclusive lead finish c 0.10 -- 0.25 0.004 -- 0.010Package length D 8.65 BSC 0.341 BSCPackage width E 6.00 BSC 0.236 BSCPackage body width E1 3.90 BSC 0.154 BSCLead pitch e 1.27 BSC 0.050 BSCLength of terminal for soldering to substrate L 0.4 -- 1.27 0.016 -- 0.050body chamfer (45°) h 0.25 -- 0.50 0.010 -- 0.020Angle of lead mounting area phi [°] 0 -- 8 0 -- 8mold release angle phi1 [°] 5 -- 15 5 -- 15Number of terminal positions N 14 14

Note: the mm values are valid, the inch values contains rounding errorsNote 1: for assembler specific pin1 identification please see QM-document 08SP0363.xx (Pin 1 Specification)

Page 1 of 1

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7.2 TSSOP14Date: 07.02.2013 PACKAGE OUTLINE SPECIFICATION

Author: ASto14 Lead Thin Shrink Small Outline Package

(TSSOP14) QM-No.: 08SP0695.03

Package Outline and Dimensions are according JEDEC MO-153 F, variant AB-1.

Description Symbol mm inchmin typ max min typ max

Package height A -- -- 1.20 -- -- 0.047Stand off A1 0.05 -- 0.15 0.002 -- 0.006Package body thickness A2 0.80 1.00 1.05 0.031 0.039 0.041Width of terminal leads, inclusive lead finish b 0.19 -- 0.30 0.007 -- 0.012Thickness of terminal leads, inclusive lead finish c 0.09 -- 0.20 0.004 -- 0.008Package length D 4.90 5.00 5.10 0.193 0.197 0.201Package width E 6.40 BSC 0.252 BSCPackage body width E1 4.30 4.40 4.50 0.169 0.173 0.177Lead pitch e 0.65 BSC 0.026 BSCLength of terminal for soldering to substrate L 0.45 0.60 0.75 0.018 0.024 0.030Angle of lead mounting area phi [°] 0 -- 8 0 -- 8mold release angle phi1 [°] 12 REF 12 REFNumber of terminal positions N 14 14

Note: the mm values are valid, the inch values contains rounding errorsNote 1: for assembler specific pin1 identification please see QM-document 08SP0363.xx (Pin 1 Specification)

Page 1 of 1

The E931.98 is available in a Pb free, RoHs compliant TSSOP14 plastic package according to JEDEC MO-153-F, variant AB-1. The package is classified to Moisture Sensitivity Level 3 (MSL 3) according to JEDEC J-STD-020 with a solder-ing peak temperature of (260+5)°C.

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8 Marking

8.1 Top Side

ÿ Elmos Logo ÿ 93198 ÿ XXXSL ÿ YWWR@

Signature Explanation93198 Elmos project numberA Elmos project revision codeXXX Production lot numberS Assembler codeL Production line codeYWW Year and week of assemblyR Mask revision code@ Elmos internal code

WARNING – Life Support Applications PolicyElmos Semiconductor AG is continually working to improve the quality and reliability of its products. Neverthe-less, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vul-nerability to physical stress. It is the responsibility of the buyer, when utilizing Elmos Semiconductor AG products, to observe standards of safety, and to avoid situations in which malfunction or failure of an Elmos Semiconductor AG Product could cause loss of human life, body injury or damage to property. In the development of your design, please ensure that Elmos Semiconductor AG products are used within specifi ed operating ranges as set forth in the most recent product specifi cations.

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Application DisclaimerCircuit diagrams may contain components not manufactured by Elmos Semiconductor AG, which are included as means of illustrating typical applications. Consequently, complete information suffi cient for construction purpos-es is not necessarily given. The information in the application examples has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies. Furthermore, such information does not convey to the purchaser of the semiconductor devices described any license under the patent rights of Elmos Semiconductor AG or others.

Contact Information

HeadquartersElmos Semiconductor AGHeinrich-Hertz-Str. 1 • D-44227 Dortmund (Germany) : +492317549100 : [email protected] : www.elmos.com

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© Elmos Semiconductor AG, 2013. Reproduction, in part or whole, without the prior written consent of Elmos Semiconductor AG, is prohibited.

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PIR CONTROLLER IC FOR LOAD SWITCH E31.8 ... VDD S Positive supply voltage, shunt regulator 6 REL O...

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