PIC16(L)F151X/152X Memory Programming · 2011. 9. 19. · PIC16(L)F151X/152X DS41442B-page 2...

PIC16(L)F151X/152X Memory Programming Specification

PIC16(L)F151X/152X

This document includes the programming specifications for the following devices:

1.0 OVERVIEWThe PIC16(L)F151X/152X devices can beprogrammed using either the high-voltage In-CircuitSerial Programming™ (ICSP™) method or the low-voltage ICSP™ method.

1.1 Hardware Requirements

1.1.1 HIGH-VOLTAGE ICSP PROGRAMMING

In High-Voltage ICSP™ mode, these devices requiretwo programmable power supplies; one for VDD andone for the MCLR/VPP pin.

1.1.2 LOW-VOLTAGE ICSP PROGRAMMING

In Low-Voltage ICSP™ mode, these devices can beprogrammed using a single VDD source in theoperating range. The MCLR/VPP pin does not have tobe brought to a different voltage, but can instead be leftat the normal operating voltage.

1.1.2.1 Single-Supply ICSP ProgrammingThe LVP bit in Configuration Word 2 enables single-supply (low-voltage) ICSP programming. The LVP bitdefaults to a ‘1’ (enabled) from the factory. The LVP bitmay only be programmed to ‘0’ by entering the High-Voltage ICSP mode, where the MCLR/VPP pin is raisedto VIHH. Once the LVP bit is programmed to a ‘0’, onlythe High-Voltage ICSP mode is available and only theHigh-Voltage ICSP mode can be used to program thedevice.

• PIC16F1512 • PIC16LF1512• PIC16F1513 • PIC16LF1513• PIC16F1516 • PIC16LF1516• PIC16F1517 • PIC16LF1517• PIC16F1518 • PIC16LF1518• PIC16F1519 • PIC16LF1519• PIC16F1526 • PIC16LF1526• PIC16F1527 • PIC16LF1527

Note 1: The High-Voltage ICSP mode is alwaysavailable, regardless of the state of theLVP bit, by applying VIHH to the MCLR/VPP pin.

2: While in Low-Voltage ICSP mode, MCLRis always enabled, regardless of theMCLRE bit, and the port pin can nolonger be used as a general purposeinput.

2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 1

PIC16(L)F151X/152X

1.2 Pin UtilizationFive pins are needed for ICSP™ programming. Thepins are listed in Table 1-1 and Table 1-2.

TABLE 1-1: PIN DESCRIPTIONS DURING PROGRAMMING – PIC16(L)F1526 AND PIC16(L)F1527

Pin NameDuring Programming

Function Pin Type Pin Description

RB6 ICSPCLK I Clock Input – Schmitt Trigger InputRB7 ICSPDAT I/O Data Input/Output – Schmitt Trigger Input

RG5/MCLR/VPP Program/Verify mode P(1) Program Mode Select/Programming Power SupplyVDD VDD P Power SupplyVSS VSS P GroundLegend: I = Input, O = Output, P = PowerNote 1: The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage needs to be

applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any significant current.

TABLE 1-2: PIN DESCRIPTIONS DURING PROGRAMMING – PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516, PIC16(L)F1517, PIC16(L)F1518 and PIC16(L)F1519

Pin NameDuring Programming

Function Pin Type Pin Description

RB6 ICSPCLK I Clock Input – Schmitt Trigger InputRB7 ICSPDAT I/O Data Input/Output – Schmitt Trigger Input

RE3/MCLR/VPP Program/Verify mode P(1) Program Mode Select/Programming Power SupplyVDD VDD P Power SupplyVSS VSS P GroundLegend: I = Input, O = Output, P = PowerNote 1: The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage needs to be

applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any significant current.

DS41442B-page 2 Advance Information 2010-2011 Microchip Technology Inc.

PIC16(L)F151X/152X

2.0 DEVICE PINOUTSThe pin diagrams for the PIC16(L)F151X/152X familyare shown in Figure 2-1 through Figure 2-7. The pinsthat are required for programming are listed in Table 1-1and shown in bold lettering in the pin diagrams.

FIGURE 2-1: 28-PIN SPDIP, SOIC, SSOP DIAGRAM FOR PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516 AND PIC16(L)F1518

SPDIP, SOIC, SSOP

PI

C16

(L)F

1512

PIC

16(L

)F15

13PI

C16

(L)F

1516

PIC

16(L

)F15

18

1

2

3

4

5

6

789

10

VPP/MCLR/RE3RA0

RA1RA2

RA3RA4

RA5

RB6/ICSPCLK

RB5

RB4RB3

RB2RB1RB0VDD

VSS11

12

13

14 15

16

171819

20

28

27

26

252423

2221VSS

RA7

RA6RC0RC1RC2

RC3

RC5

RC4

RC7RC6

RB7/ICSPDAT


PIC16(L)F151X/152X

FIGURE 2-2: 28-PIN UQFN DIAGRAM FOR PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516

AND PIC16(L)F1518

23

6

1

18192021

1571617

RC

0

54

RB

7/IC

SPD

ATR

B6/

ICSP

CLK

RB

5R

B4

RB3RB2RB1RB0VDDVSSRC7

RC

6R

C5

RC

4

RE3

/MC

LR/V

PP

RA

0R

A1

RA2RA3RA4RA5VSSRA7RA6

RC

1R

C2

RC

3

9 10 138 141211

27 26 2328 222425

UQFN

PIC16(L)F1512PIC16(L)F1513PIC16(L)F1516PIC16(L)F1518


PIC16(L)F151X/152X

FIGURE 2-3: 40-PIN PDIP DIAGRAM FOR PIC16(L)F1517 AND PIC16(L)F1519

FIGURE 2-4: 40-PIN UQFN DIAGRAM FOR PIC16(L)F1517 AND PIC16(L)F1519

PDIP

PIC

16(L

)F15

17PI

C16

(L)F

1519

2

3

4

5

6

7

8

9

10

VPP/MCLR/RE3

RA0

RA1

RA2

RA3

RA4

RA5

RE0

RE1

RE2

RB6/ICSPCLK/ICDCLK

RB5

RB4RB3

RB2

RB1

RB0

VDD

VSS

RD2

11

12

13

14

15

16

1718

19

20

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

2423

22

21

VDDVSS

RA7

RA6

RC0

RC1

RC2

RC3

RD0

RD1

RC5

RC4RD3

RD4

RC7

RC6

RD7

RD6

RD5

RB7/ICSPDAT/ICDDAT1

10

23456

1

17 18 19 2011 12 13 14

34

87

40 39 38 37 36 3515 16

2627282930

2122232425

32 31

9

33R

A1

RA

0VP

P/M

CLR

/RE3

RB

3

ICD

DAT

/ICSP

DAT

/RB

7IC

DC

LK/IC

SPC

LK/R

B6

RB

5R

B4

RC

6R

C5

RC

4R

D3

RD

2R

D1

RD

0R

C3

RC

2R

C1

RC0

RA7VSSVDDRE2RE1RE0RA5

RC7RD4RD5RD6RD7VSSVDDRB0RB1RB2

UQFN

RA

3R

A2

PIC16(L)F1517PIC16(L)F1519

RA6

RA4


PIC16(L)F151X/152X

FIGURE 2-5: 44-PIN TQFP DIAGRAM FOR PIC16(L)F1517 AND PIC16(L)F1519

1011

23

6

1

18 19 20 21 2212 13 14 15

38

87

44 43 42 41 40 3916 17

2930313233

232425262728

36 3435

9

37

RA

3R

A2

RA

1R

A0

V PP/

MC

LR/R

E3NC

ICD

DAT

/ICSP

DAT

/RB

7IC

DC

LK/IC

SPC

LK/R

B6

RB

5R

B4

NC

NC

NCRC0

VSSVDDRB0RB1RB2RB3

54

TQFP

RA6RA7VSSVDDRE2RE1RE0RA5RA4

RC7RD4RD5RD6RD7

RC

6R

C5

RC

4R

D3

RD

2R

D1

RD

0R

C3

RC

2R

C1

PIC16(L)F1517PIC16(L)F1519


PIC16(L)F151X/152X

FIGURE 2-6: 64-PIN QFN DIAGRAM FOR PIC16(L)F1526 AND PIC16(L)F1527

FIGURE 2-7: 64-PIN TQFP DIAGRAM FOR PIC16(L)F1526 AND PIC16(L)F1527

1234567891011121314

383736353433

50 49

17 18 19 20 21 22 23 24 25 26

RE

2R

E3

RE

4R

E5

RE

6R

E7

RD

0V D

DVS

SR

D1

RD

2R

D3

RD

4R

D5

RD

6R

D7

RE1RE0RG0RG1RG2RG3

VPP/MCLR/RG5RG4VSSVDDRF7RF6RF5RF4RF3RF2

RB0RB1RB2RB3RB4RB5RB6/ICSPCLK/ICDCLKVSSRA6RA7VDDRB7/ICSPDAT/ICDDAT

RC4RC3RC2

RF0

RF1

AVD

D

AVS

SR

A3

RA

2R

A1

RA

0VS

SVD

D

RA

4R

A5

RC

1R

C0

RC

7R

C6

RC5

1516

31

4039

27 28 29 30 32

4847464544434241

54 53 52 5158 57 56 5560 5964 63 62 61

QFN

PIC16(L)F1526PIC16(L)F1527

1234567891011121314

383736353433

50 49

17 18 19 20 21 22 23 24 25 26

RE

2R

E3

RE

4R

E5

RE

6R

E7

RD

0V D

DVS

SR

D1

RD

2R

D3

RD

4R

D5

RD

6R

D7

RE1RE0RG0RG1RG2RG3

VPP/MCLR/RG5RG4VSSVDDRF7RF6RF5RF4RF3RF2

RB0RB1RB2RB3RB4RB5RB6/ICSPCLK/ICDCLKVSSRA6RA7VDDRB7/ICSPDAT/ICDDAT

RC4RC3RC2

VR

F0R

F1

AVD

D

AVS

SR

A3

RA

2R

A1

RA

0V S

SVD

D

RA

4R

A5

RC

1R

C0

RC

7R

C6

RC5

1516

31

4039

27 28 29 30 32

4847464544434241

54 53 52 5158 57 56 5560 5964 63 62 61

TQFP

PIC16(L)F1526PIC16(L)F1527


PIC16(L)F151X/152X

3.0 MEMORY MAPThe memory for the PIC16(L)F151X/152Xdevices is broken into two sections: program memoryand configuration memory. Only the size of theprogram memory changes between devices, theconfiguration memory remains the same.

FIGURE 3-1: PIC16(L)F1512 PROGRAM MEMORY MAPPING

7FFFh8000h

8200h

FFFFh

2 KW

Implemented

Maps to

Program Memory

Configuration Memory8000-81FFh

User ID Location

User ID Location

User ID Location

User ID Location

Reserved

Reserved

Device ID

Configuration Word 1


Calibration Word 1

Calibration Word 2

Reserved

8000h

8001h

8002h

8003h

8004h

8005h

8006h

8007h

8009h

8008h

800Ah

Implemented

0000h

Maps to0-07FFh

07FFh

800Bh-81FFh


PIC16(L)F151X/152X

FIGURE 3-2: PIC16(L)F1513 PROGRAM MEMORY MAPPING

7FFFh8000h

8200h

FFFFh

4 KW

Implemented

Maps to

Program Memory


User ID Location

User ID Location

User ID Location

User ID Location

Reserved

Reserved

Device ID



Calibration Word 1

Calibration Word 2

Reserved

8000h

8001h

8002h

8003h

8004h

8005h

8006h

8007h

8009h

8008h

800Ah

Implemented

0000h

Maps to0-0FFFh

0FFFh

800Bh-81FFh


PIC16(L)F151X/152X

FIGURE 3-3: PIC16(L)F1526, PIC16(L)F1516 AND PIC16(L)F1517 PROGRAM MEMORY MAPPING

7FFFh8000h

8200h

FFFFh

8 KW

Implemented

Maps to

Program Memory


User ID Location

User ID Location

User ID Location

User ID Location

Reserved

Reserved

Device ID



Calibration Word 1

Calibration Word 2

Reserved

8000h

8001h

8002h

8003h

8004h

8005h

8006h

8007h

8009h

8008h

800Ah

Implemented

0000h

Maps to0-1FFFh

1FFFh

800Bh-81FFh


PIC16(L)F151X/152X

FIGURE 3-4: PIC16(L)F1527, PIC16(L)F1518 AND PIC16(L)F1519 PROGRAM MEMORY

MAPPING

7FFFh8000h

8200h

FFFFh

Implemented

16KW

Implemented

3FFFh

Maps to0-3FFFh

Maps to

Program Memory


User ID Location

User ID Location

User ID Location

User ID Location

Reserved

Reserved

Device ID



Calibration Word 1

Calibration Word 2

Reserved

8000h

8001h

8002h

8003h

8004h

8005h

8006h

8007h

8009h

8008h

800Ah

0000h

800Bh-81FFh


PIC16(L)F151X/152X

3.1 User ID LocationA user may store identification information (user ID) infour designated locations. The user ID locations aremapped to 8000h-8003h. Each location is 14 bits inlength. Code protection has no effect on these memorylocations. Each location may be read with codeprotection enabled or disabled.

3.2 Device IDThe device ID word is located at 8006h. This location isread-only and cannot be erased or modified.

Note: MPLAB® IDE only displays the 7 LeastSignificant bits (LSb) of each user IDlocation, the upper bits are not read. It isrecommended that only the 7 LSbs beused if MPLAB IDE is the primary toolused to read these addresses.

REGISTER 3-1: DEVICE ID: DEVICE ID REGISTER(1)

R R R R R R

DEVbit 13 bit 8

R R R R R R R R

DEV REVbit 7 bit 0

Legend: P = Programmable bit U = Unimplemented bit, read as ‘0’R = Readable bit W = Writable bit ‘0’ = Bit is cleared-n = Value at POR ‘1’ = Bit is set x = Bit is unknown

bit 13-5 DEV: Device ID bitsThese bits are used to identify the part number.

bit 4-0 REV: Revision ID bitsThese bits are used to identify the revision.

Note 1: This location cannot be written.


PIC16(L)F151X/152X

TABLE 3-1: DEVICE ID VALUES

3.3 Configuration WordsThere are two Configuration Words, Configuration Word1 (8007h) and Configuration Word 2 (8008h). Theindividual bits within these Configuration Words areused to enable or disable device functions such as theBrown-out Reset, code protection and Power-up Timer.

3.4 Calibration WordsThe internal calibration values are factory calibratedand stored in Calibration Words 1 and 2 (8009h,800Ah).

The Calibration Words do not participate in eraseoperations. The device can be erased without affectingthe Calibration Words.

DEVICEDEVICE ID VALUES

DEV REV

PIC16F1527 0001 0101 101 x xxxxPIC16F1526 0001 0101 100 x xxxxPIC16LF1527 0001 0101 111 x xxxxPIC16LF1526 0001 0101 110 x xxxxPIC16F1519 0001 0110 111 x xxxxPIC16F1518 0001 0110 110 x xxxxPIC16F1517 0001 0110 101 x xxxxPIC16F1516 0001 0110 100 x xxxxPIC16F1513 0001 0110 010 x xxxxPIC16F1512 0001 0111 000 x xxxxPIC16LF1519 0001 0111 111 x xxxxPIC16LF1518 0001 0111 110 x xxxxPIC16LF1517 0001 0111 101 x xxxxPIC16LF1516 0001 0111 100 x xxxxPIC16LF1513 0001 0111 010 x xxxxPIC16LF1512 0001 0111 001 x xxxx


PIC16(L)F151X/152X

REGISTER 3-2: CONFIGURATION WORD 1

R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1FCMEN IESO CLKOUTEN BOREN —

bit 13 bit 8

R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1

CP MCLRE PWRTE WDTE FOSC

bit 7 bit 0

Legend:R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’

‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase

bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit1 = Fail-Safe Clock Monitor is enabled0 = Fail-Safe Clock Monitor is disabled

bit 12 IESO: Internal External Switchover bit1 = Internal/External Switchover mode is enabled0 = Internal/External Switchover mode is disabled

bit 11 CLKOUTEN: Clock Out Enable bit1 = CLKOUT function is disabled. I/O or oscillator function on CLKOUT pin.0 = CLKOUT function is enabled on CLKOUT pin

bit 10-9 BOREN: Brown-out Reset Enable bits(1)11 = BOR enabled10 = BOR enabled during operation and disabled in Sleep01 = BOR controlled by SBOREN bit of the PCON register00 = BOR disabled

bit 8 Unimplemented: Read as ‘1’bit 7 CP: Code Protection bit(2)

1 = Program memory code protection is disabled0 = Program memory code protection is enabled

bit 6 MCLRE: MCLR/VPP Pin Function Select bitIf LVP bit = 1:

This bit is ignored.If LVP bit = 0:

1 = MCLR/VPP pin function is MCLR; Weak pull-up enabled.0 = MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA register.

bit 5 PWRTE: Power-up Timer Enable bit(1)1 = PWRT disabled0 = PWRT enabled

bit 4-3 WDTE: Watchdog Timer Enable bit11 = WDT enabled10 = WDT enabled while running and disabled in Sleep01 = WDT controlled by the SWDTEN bit in the WDTCON register00 = WDT disabled

bit 2-0 FOSC: Oscillator Selection bits111 = ECH: External Clock, High-Power mode: on CLKIN pin110 = ECM: External Clock, Medium-Power mode: on CLKIN pin101 = ECL: External Clock, Low-Power mode: on CLKIN pin100 = INTOSC oscillator: I/O function on OSC1 pin011 = EXTRC oscillator: RC function on OSC1 pin010 = HS oscillator: High-speed crystal/resonator on OSC2 pin and OSC1 pin001 = XT oscillator: Crystal/resonator on OSC2 pin and OSC1 pin000 = LP oscillator: Low-power crystal on OSC2 pin and OSC1 pin

Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.2: The entire program memory will be erased when the code protection is turned off.


PIC16(L)F151X/152X

REGISTER 3-3: CONFIGURATION WORD 2

R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1LVP DEBUG LPBOR BORV STVREN —

bit 13 bit 8

U-1 U-1 U-1 R/P-1 U-1 U-1 R/P-1 R/P-1— — — VCAPEN(2) — — WRT

bit 7 bit 0

Legend:R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’

‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase

bit 13 LVP: Low-Voltage Programming Enable bit(1)1 = Low-voltage programming enabled0 = HV on MCLR/VPP must be used for programming

bit 12 DEBUG: In-Circuit Debugger Mode bit1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger

bit 11 LPBOR: Low-Power BOR1 = Low-Power BOR is disabled0 = Low-Power BOR is enabled

bit 10 BORV: Brown-out Reset Voltage Selection bit1 = Brown-out Reset voltage (VBOR), low trip point selected0 = Brown-out Reset voltage (VBOR), high trip point selected

bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit1 = Stack Overflow or Underflow will cause a Reset0 = Stack Overflow or Underflow will not cause a Reset

bit 8-5 Unimplemented: Read as ‘1’bit 4 VCAPEN: Voltage Regulator Capacitor Enable bits(1)

0 = VCAP functionality is enabled on VCAP pin1 = All VCAP pin functions are disabled

bit 3-2 Unimplemented: Read as ‘1’bit 1-0 WRT: Flash Memory Self-Write Protection bits

2 kW Flash memory (PIC16(L)F1512):11 = Write protection off10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON control01 = 000h to FFFh write-protected, 400h to 7FFh may be modified by PMCON control00 = 000h to 7FFh write-protected, no addresses may be modified by PMCON control

4 kW Flash memory (PIC16(L)F1513):11 = Write protection off10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by PMCON control01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by PMCON control00 = 000h to FFFh write-protected, no addresses may be modified by PMCON control

8 kW Flash memory (PIC16F/LF1516/1517/1526):11 = Write protection off10 = 000h to 1FFh write-protected, 200h to 1FFFh may be modified by PMCON control01 = 000h to FFFh write-protected, 1000h to 1FFFh may be modified by PMCON control00 = 000h to 1FFFh write-protected, no addresses may be modified by PMCON control

16 kW Flash memory (PIC16F/LF1518/1519/1527):11 = Write protection off10 = 000h to 1FFh write-protected, 200h to 3FFFh may be modified by PMCON control01 = 000h to 1FFFh write-protected, 2000h to 3FFFh may be modified by PMCON control00 = 000h to 3FFFh write-protected, no addresses may be modified by PMCON control

Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.2: Applies to PIC16F151X/152X devices only. On PIC16LF151X/152X, the VCAPEN bit is unimplemented.


PIC16(L)F151X/152X

4.0 PROGRAM/VERIFY MODEIn Program/Verify mode, the program memory and theconfiguration memory can be accessed andprogrammed in serial fashion. ICSPDAT andICSPCLK are used for the data and the clock,respectively. All commands and data words aretransmitted LSb first. Data changes on the rising edgeof the ICSPCLK and latched on the falling edge. InProgram/Verify mode both the ICSPDAT andICSPCLK are Schmitt Trigger inputs. The sequencethat enters the device into Program/Verify modeplaces all other logic into the Reset state. Uponentering Program/Verify mode, all I/Os areautomatically configured as high-impedance inputsand the address is cleared.

4.1 High-Voltage Program/Verify Mode Entry and Exit

There are two different methods of entering Program/Verify mode via high-voltage:

• VPP – First entry mode• VDD – First entry mode

4.1.1 VPP – FIRST ENTRY MODETo enter Program/Verify mode via the VPP-first methodthe following sequence must be followed:

1. Hold ICSPCLK and ICSPDAT low. All other pinsshould be unpowered.

2. Raise the voltage on MCLR from 0V to VIHH.3. Raise the voltage on VDD FROM 0V to the

desired operating voltage.

The VPP-first entry prevents the device from executingcode prior to entering Program/Verify mode. Forexample, when Configuration Word 1 has MCLRdisabled (MCLRE = 0), the power-up time is disabled(PWRTE = 0), the internal oscillator is selected(FOSC = 100), and ICSPCLK and ICSPDAT pins aredriven by the user application, the device will executecode. Since this may prevent entry, VPP-first entrymode is strongly recommended. See the timingdiagram in Figure 8-2.

4.1.2 VDD – FIRST ENTRY MODETo enter Program/Verify mode via the VDD-first methodthe following sequence must be followed:

1. Hold ICSPCLK and ICSPDAT low.2. Raise the voltage on VDD from 0V to the desired

operating voltage.3. Raise the voltage on MCLR from VDD or below

to VIHH.

The VDD-first method is useful when programming thedevice when VDD is already applied, for it is notnecessary to disconnect VDD to enter Program/Verifymode. See the timing diagram in Figure 8-1.

4.1.3 PROGRAM/VERIFY MODE EXITTo exit Program/Verify mode take MCLR to VDD orlower (VIL). See Figures 8-3 and 8-4.

4.2 Low-Voltage Programming (LVP) Mode

The Low-Voltage Programming mode allows thePIC16(L)F151X/152X devices to be programmed usingVDD only, without high voltage. When the LVP bit ofConfiguration Word 2 register is set to ‘1’, the low-voltage ICSP programming entry is enabled. To disablethe Low-Voltage ICSP mode, the LVP bit must beprogrammed to ‘0’. This can only be done while in theHigh-Voltage Entry mode.

Entry into the Low-Voltage ICSP Program/Verify modesrequires the following steps:

1. MCLR is brought to VIL.2. A 32-bit key sequence is presented on

ICSPDAT, while clocking ICSPCLK.

The key sequence is a specific 32-bit pattern, '01001101 0100 0011 0100 1000 0101 0000' (moreeasily remembered as MCHP in ASCII). The device willenter Program/Verify mode only if the sequence isvalid. The Least Significant bit of the Least Significantnibble must be shifted in first.

Once the key sequence is complete, MCLR must beheld at VIL for as long as Program/Verify mode is to bemaintained.

For low-voltage programming timing, see Figure 8-8and Figure 8-9.

Exiting Program/Verify mode is done by no longerdriving MCLR to VIL. See Figure 8-8 and Figure 8-9.

Note: To enter LVP mode, the LSB of the LeastSignificant nibble must be shifted in first.This differs from entering the keysequence on other parts.


PIC16(L)F151X/152X

4.3 Program/Verify Commands The PIC16(L)F151X/152X implements 10programming commands; each six bits in length. Thecommands are summarized in Table 4-1.

Commands that have data associated with them arespecified to have a minimum delay of TDLY between thecommand and the data. After this delay 16 clocks arerequired to either clock in or clock out the 14-bit dataword. The first clock is for the Start bit and the last clockis for the Stop bit.

4.3.1 LOAD CONFIGURATIONThe Load Configuration command is used to accessthe configuration memory (User ID Locations,Configuration Words, Calibration Words). The LoadConfiguration command sets the address to 8000h andloads the data latches with one word of data (seeFigure 4-1).

After issuing the Load Configuration command, use theIncrement Address command until the proper addressto be programmed is reached. The address is then pro-grammed by issuing either the Begin Internally TimedProgramming or Begin Externally Timed Programmingcommand.

The only way to get back to the program memory(address 0) is to exit Program/Verify mode or issue theReset Address command after the configuration memoryhas been accessed by the Load Configuration command.

FIGURE 4-1: LOAD CONFIGURATION

TABLE 4-1: COMMAND MAPPING

CommandMapping Data/Note

Binary (MSb … LSb) Hex

Load Configuration x 0 0 0 0 0 00h 0, data (14), 0Load Data For Program Memory x 0 0 0 1 0 02h 0, data (14), 0Read Data From Program Memory x 0 0 1 0 0 04h 0, data (14), 0 Increment Address x 0 0 1 1 0 06h —Reset Address x 1 0 1 1 0 16h —Begin Internally Timed Programming x 0 1 0 0 0 08h —Begin Externally Timed Programming x 1 1 0 0 0 18h —End Externally Timed Programming x 0 1 0 1 0 0Ah —Bulk Erase Program Memory x 0 1 0 0 1 09h Internally Timed Row Erase Program Memory x 1 0 0 0 1 11h Internally Timed

Note: Externally timed writes are not supportedfor Configuration and Calibration bits. Anyexternally timed write to the Configurationor Calibration Word will have no effect onthe targeted word.

X0 0 LSb MSb 0

1 2 3 4 5 6 1 2 15 16

ICSPCLK

ICSPDAT0 0 0 0

TDLY


PIC16(L)F151X/152X

4.3.2 LOAD DATA FOR PROGRAM

MEMORYThe Load Data for Program Memory command is usedto load one 14-bit word into the data latches. The wordprograms into program memory after the BeginInternally Timed Programming or Begin ExternallyTimed Programming command is issued (seeFigure 4-2).

FIGURE 4-2: LOAD DATA FOR PROGRAM MEMORY

4.3.3 READ DATA FROM PROGRAM MEMORY

The Read Data from Program Memory command willtransmit data bits out of the program memory mapcurrently accessed, starting with the second rising edgeof the clock input. The ICSPDAT pin will go into Outputmode on the first falling clock edge, and it will revert toInput mode (high-impedance) after the 16th falling edgeof the clock. If the program memory is code-protected(CP), the data will be read as zeros (see Figure 4-3).

FIGURE 4-3: READ DATA FROM PROGRAM MEMORY

ICSPCLK

ICSPDAT

1 2 3 4 5 6 1 2 15 16

X0 0 LSb MSb 00 1 0 0

TDLY

1 2 3 4 5 6 1 2 15 16

LSb MSb

TDLY

ICSPCLK

ICSPDAT

Input InputOutput

x

(from Programmer)

X00 0 1 0

ICSPDAT(from device)


PIC16(L)F151X/152X

4.3.4 INCREMENT ADDRESSThe address is incremented when this command isreceived. It is not possible to decrement the address.To reset this counter, the user must use the ResetAddress command or exit Program/Verify mode and re-enter it. If the address is incremented from address7FFFh, it will wrap-around to location 0000h. If theaddress is incremented from FFFFh, it will wrap-aroundto location 8000h.

FIGURE 4-4: INCREMENT ADDRESS

4.3.5 RESET ADDRESSThe Reset Address command will reset the address to0000h, regardless of the current value. The address isused in program memory or the configuration memory.

FIGURE 4-5: RESET ADDRESS

X0

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT0 1 1

3

X X X

TDLY

Next Command

0

Address + 1Address

X0

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT0 1 1

3

X X X

TDLY

Next Command

1

0000hNAddress


PIC16(L)F151X/152X

4.3.6 BEGIN INTERNALLY TIMED

PROGRAMMINGA Load Configuration or Load Data for ProgramMemory command must be given before every BeginProgramming command. Programming of theaddressed memory will begin after this command isreceived. An internal timing mechanism executes thewrite. The user must allow for the program cycle time,TPINT, for the programming to complete.

The End Externally Timed Programming command isnot needed when the Begin Internally TimedProgramming is used to start the programming.

The program memory address that is beingprogrammed is not erased prior to being programmed.

FIGURE 4-6: BEGIN INTERNALLY TIMED PROGRAMMING

4.3.7 BEGIN EXTERNALLY TIMED PROGRAMMING

A Load Configuration or Load Data for ProgramMemory command must be given before every BeginProgramming command. Programming of theaddressed memory will begin after this command isreceived. To complete the programming the EndExternally Timed Programming command must be sentin the specified time window defined by TPEXT (seeFigure 4-7).

Externally timed writes are not supported forConfiguration and Calibration bits. Any externally timedwrite to the Configuration or Calibration Word will haveno effect on the targeted word.

FIGURE 4-7: BEGIN EXTERNALLY TIMED PROGRAMMING

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT

3TPINT

X10 0 0 X X X0

Next Command

X1 0

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT0 0 0 1 1 0

End Externally Timed Programming Command

TPEXT3


PIC16(L)F151X/152X

4.3.8 END EXTERNALLY TIMED

PROGRAMMINGThis command is required after a Begin ExternallyTimed Programming command is given. Thiscommand must be sent within the time windowspecified by TPEXT after the Begin Externally TimedProgramming command is sent.

After sending the End Externally Timed Programmingcommand, an additional delay (TDIS) is required beforesending the next command. This delay is longer thanthe delay ordinarily required between other commands(see Figure 4-8).

FIGURE 4-8: END EXTERNALLY TIMED PROGRAMMING

4.3.9 BULK ERASE PROGRAM MEMORYThe Bulk Erase Program Memory command performstwo different functions dependent on the current stateof the address.

A Bulk Erase Program Memory command should notbe issued when the address is greater than 8008h.

After receiving the Bulk Erase Program Memorycommand the erase will not complete until the timeinterval, TERAB, has expired.

FIGURE 4-9: BULK ERASE PROGRAM MEMORY

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT

3TDIS

X10 1 0 X X X1

Next Command

Address 0000h-7FFFh:Program Memory is erasedConfiguration Words are erased

Address 8000h-8008h:Program Memory is erasedConfiguration Words are erasedUser ID Locations are erased

Note: The code protection Configuration bit(CP) has no effect on the Bulk EraseProgram Memory command.

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT

3TERAB

X11 0 0 X X X0

Next Command


PIC16(L)F151X/152X

4.3.10 ROW ERASE PROGRAM MEMORYThe Row Erase Program Memory command will erasean individual row. Refer to Table 4-2 for row sizes ofspecific devices and the PC bits used to address them.If the program memory is code-protected the RowErase Program Memory command will be ignored.When the address is 8000h-8008h the Row EraseProgram Memory command will only erase the user IDlocations regardless of the setting of the CPConfiguration bit.

After receiving the Row Erase Program Memorycommand the erase will not complete until the timeinterval, TERAR, has expired.

FIGURE 4-10: ROW ERASE PROGRAM MEMORY

TABLE 4-2: PROGRAMMING ROW SIZE AND LATCHESDevices PC Row Size Number of Latches

PIC16(L)F151X/152X 32 32

1 2 3 4 5 6 1 2

ICSPCLK

ICSPDAT

3TERAR

X01 0 0 X X X1

Next Command


PIC16(L)F151X/152X

5.0 PROGRAMMING ALGORITHMSThe devices use internal latches to temporarily storethe 14-bit words used for programming. Refer toTable 4-2 for specific latch information. The datalatches allow the user to write the program words witha single Begin Externally Timed Programming or BeginInternally Timed Programming command. The LoadProgram Data or the Load Configuration command isused to load a single data latch. The data latch will holdthe data until the Begin Externally Timed Programmingor Begin Internally Timed Programming command isgiven.

The data latches are aligned with the LSbs of theaddress. The PC’s address at the time the BeginExternally Timed Programming or Begin InternallyTimed Programming command is given will determinewhich location(s) in memory are written. Writes cannotcross the physical boundary. For example, with thePIC16F1527, attempting to write from address 0002h-0009h will result in data being written to 0008h-000Fh.

If more than the maximum number of data latches arewritten without a Begin Externally Timed Programmingor Begin Internally Timed Programming command, thedata in the data latches will be overwritten. Thefollowing figures show the recommended flowcharts forprogramming.


PIC16(L)F151X/152X

FIGURE 5-1: DEVICE PROGRAM/VERIFY FLOWCHART

Done

Start

Bulk Erase Device

Write User IDs

Enter Programming Mode

Write Program Memory(1)

Verify User IDs

Write Configuration Words(2)

Verify Configuration Words

Exit Programming Mode

Verify Program Memory

Note 1: See Figure 5-2.2: See Figure 5-5.


PIC16(L)F151X/152X

FIGURE 5-2: PROGRAM MEMORY FLOWCHART

Start

Read Data

Program Memory

Data Correct?

ReportProgramming

Failure

All LocationsDone?

No

NoIncrementAddress

Command

from

Bulk Erase

Program

Yes

Memory(1, 2)

Done

Yes

Note 1: This step is optional if device has already been erased or has not been previously programmed.2: If the device is code-protected or must be completely erased, then Bulk Erase device per Figure 5-6.3: See Figure 5-3 or Figure 5-4.

Program Cycle(3)


PIC16(L)F151X/152X

FIGURE 5-3: ONE-WORD PROGRAM CYCLE

BeginProgramming

Wait TDIS

Load Datafor

Program Memory

Command(Internally timed)

BeginProgramming

Wait TPEXT

Command(Externally timed)(1)

EndProgramming

Wait TPINT

Program Cycle

Command

Note 1: Externally timed writes are not supported for Configuration and Calibration bits.


PIC16(L)F151X/152X

FIGURE 5-4: MULTIPLE-WORD PROGRAM CYCLE

BeginProgramming

Wait TPINT

Load Datafor

Program Memory

Command(Internally timed)

Wait TPEXT

EndProgramming

Wait TDIS

Load Datafor

Program Memory

IncrementAddress

Command

Load Datafor

Program Memory

BeginProgramming

Command(Externally timed)

Latch 1

Latch 2

Latch n

IncrementAddress

Command

Program Cycle

Command


PIC16(L)F151X/152X

FIGURE 5-5: CONFIGURATION MEMORY PROGRAM FLOWCHART

Start

LoadConfiguration

Program Cycle(2)

Read Data

Memory Command

Data Correct?Report

ProgrammingFailure

Address =8004h?

Data Correct?Report

ProgrammingFailure

Yes

No

Yes

Yes

No

IncrementAddress

Command

No IncrementAddress

Command

Done

One-word

One-wordProgram Cycle(2)

(Config. Word 1)

IncrementAddress

Command

IncrementAddress

Command

(User ID)

From Program

Read Data

Memory CommandFrom Program

ProgramBulk Erase

Memory(1)

Data Correct?Report

ProgrammingFailure

Yes

No

One-wordProgram Cycle(2)

(Config. Word 2)

IncrementAddress

Command

Read Data

Memory CommandFrom Program

Note 1: This step is optional if device is erased or not previously programmed.2: See Figure 5-3.


PIC16(L)F151X/152X

FIGURE 5-6: ERASE FLOWCHART

Start

Load Configuration

Done

Bulk EraseProgram Memory

Note: This sequence does not erase the Calibration Words.


PIC16(L)F151X/152X

6.0 CODE PROTECTIONCode protection is controlled using the CP bit inConfiguration Word 1. When code protection isenabled, all program memory locations (0000h-7FFFh)read as all ‘0’. Further programming is disabled for theprogram memory (0000h-7FFFh).

The user ID locations and Configuration Words can beprogrammed and read out regardless of the codeprotection settings.

6.1 Program MemoryCode protection is enabled by programming the CP bitin Configuration Word 1 register to ‘0’.The only way to disable code protection is to use theBulk Erase Program Memory command.

7.0 HEX FILE USAGEIn the hex file there are two bytes per program wordstored in the Intel® INHX32 hex format. Data is storedLSB first, MSB second. Because there are two bytesper word, the addresses in the hex file are 2x theaddress in program memory. (Example: ConfigurationWord 1 is stored at 8007h on the PIC16(L)F151X/152X. In the hex file this will be referenced as 1000Eh-1000Fh).

7.1 Configuration WordTo allow portability of code, it is strongly recommendedthat the programmer is able to read the ConfigurationWords and user ID locations from the hex file. If theConfiguration Words information was not present in thehex file, a simple warning message may be issued.Similarly, while saving a hex file, Configuration Wordsand user ID information should be included.

7.2 Device ID and RevisionIf a device ID is present in the hex file at 1000Ch-1000Dh (8006h on the part), the programmer shouldverify the device ID (excluding the revision) against thevalue read from the part. On a mismatch condition theprogrammer should generate a warning message.


PIC16(L)F151X/152X

7.3 Checksum ComputationThe checksum is calculated by two different methodsdependent on the setting of the CP Configuration bit.

7.3.1 PROGRAM CODE PROTECTION DISABLED

With the program code protection disabled, thechecksum is computed by reading the contents of thePIC16(L)F151X/152X program memory locations andadding up the program memory data starting at address0000h, up to the maximum user addressable location.Any Carry bit exceeding 16 bits are ignored.Additionally, the relevant bits of the Configuration Wordsare added to the checksum. All unimplementedConfiguration bits are masked to ‘0’.

TABLE 7-1: CONFIGURATION WORD MASK VALUES

Device Config. Word 1 MaskConfig. Word 2

Mask

PIC16F1512 3EFFh 3E13hPIC16F1513 3EFFh 3E13hPIC16F1516 3EFFh 3E13hPIC16F1517 3EFFh 3E13hPIC16F1518 3EFFh 3E13hPIC16F1519 3EFFh 3E13hPIC16LF1512 3EFFh 3E03hPIC16LF1513 3EFFh 3E03hPIC16LF1516 3EFFh 3E03hPIC16LF1517 3EFFh 3E03hPIC16LF1518 3EFFh 3E03hPIC16LF1519 3EFFh 3E03hPIC16F1526 3EFFh 3E13hPIC16F1527 3EFFh 3E13hPIC16LF1526 3EFFh 3E03hPIC16LF1527 3EFFh 3E03h


PIC16(L)F151X/152X

EXAMPLE 7-1: CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION DISABLED

PIC16F1527, BLANK DEVICE

EXAMPLE 7-2: CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION DISABLED PIC16LF1527, 00AAh AT FIRST AND LAST ADDRESS

PIC16F1527 Sum of Memory addresses 0000h-3FFFh(1) C000hConfiguration Word 1(2) 3FFFhConfiguration Word 1 mask(3) 3EFFhConfiguration Word 2(2) 3FFFhConfiguration Word 2 mask(3) 3E13hChecksum = C000h + (3FFFh and 3EFFh) + (3FFFh and 3E13h)

= C000h + 3EFFh + 3E13h= 3D12h

Note 1: Sum of memory addresses = (Total number of program memory address locations) x (3FFFh) = C000h, truncated to 16 bits.

2: Configuration Word 1 and 2 = all bits are ‘1’; thus, code-protect is disabled.3: Configuration Word 1 and 2 Mask = all bits are set to ‘1’, except for unimplemented bits that are ‘0’.

PIC16LF1527 Sum of Memory addresses 0000h-3FFFh(1) 4156hConfiguration Word 1(2) 3FFFhConfiguration Word 1 mask(3) 3EFFhConfiguration Word 2(2) 3FFFh

Configuration Word 2 mask(4) 3E03h

Checksum = 4156h + (3FFFh and 3EFFh) + (3FFFh and 3E03h)= 4156h + 3EFFh + 3E03h= BE58h

Note 1: Total number of Program memory address locations: 3FFFh + 1 = 4000h. Then, 4000h - 2 = 3FFEh. Thus, [(3FFEh x 3FFFh) + (2 x 00AAh)] = 4156h, truncated to 16 bits.

2: Configuration Word 1 and 2 = all bits are ‘1’; thus, code-protect is disabled.3: Configuration Word 1 Mask = all Configuration Word bits are set to ‘1’, except for unimplemented bits

that are ‘0’.4: On the PIC16LF1527 device, the VCAPEN bit is not implemented in Configuration Word 2; Thus, all

unimplemented bits are ‘0’.


PIC16(L)F151X/152X

7.3.2 PROGRAM CODE PROTECTION

ENABLEDWith the program code protection enabled, thechecksum is computed in the following manner: TheLeast Significant nibble of each user ID is used tocreate a 16-bit value. The masked value of user IDlocation 8000h is the Most Significant nibble. This sumof user IDs is summed with the Configuration Words (allunimplemented Configuration bits are masked to ‘0’).

EXAMPLE 7-3: CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION ENABLED PIC16F1527, BLANK DEVICE

PIC16F1527 Configuration Word 1(2) 3F7FhConfiguration Word 1 mask(3) 3EFFhConfiguration Word 2(2) 3FFFh

Configuration Word 2 mask(3) 3E13h

User ID (8000h)(1) 0006hUser ID (8001h)(1) 0007hUser ID (8002h)(1) 0001hUser ID (8003h)(1) 0002hSum of User IDs(4) = (0006h and 000Fh)

PIC16(L)F151X/152X

EXAMPLE 7-4: CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION ENABLED

PIC16LF1527, 00AAh AT FIRST AND LAST ADDRESSPIC16LF1527 Configuration Word 1(2) 3F7Fh

Configuration Word 1 mask(3) 3EFFhConfiguration Word 2(2) 3FFFhConfiguration Word 2 mask(3), (5) 3E03hUser ID (8000h)(1) 000EhUser ID (8001h)(1) 0008hUser ID (8002h)(1) 0005hUser ID (8003h)(1) 0008hSum of User IDs(4) = (000Eh and 000Fh)

PIC16(L)F151X/152X

8.0 ELECTRICAL SPECIFICATIONSRefer to device specific data sheet for absolutemaximum ratings.

TABLE 8-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY MODE

AC/DC CHARACTERISTICS Standard Operating ConditionsProduction tested at 25°CSym. Characteristics Min. Typ. Max. Units Conditions/Comments

Supply Voltages and Currents

VDD Supply Voltage(VDDMIN, VDDMAX)

PIC16F151XPIC16F152X 2.3 — 5.5 V

PIC16LF151XPIC16LF152X 1.8 — 3.6 V

VPEW Read/Write and Row Erase operations VDDMIN — VDDMAX VVPBE Bulk Erase operations 2.7 — VDDMAX VIDDI Current on VDD, Idle — — 1.0 mAIDDP Current on VDD, Programming — — 3.0 mA

IPPVPPCurrent on MCLR/VPP — — 600 A

VIHH High voltage on MCLR/VPP for Program/Verify mode entry 8.0 — 9.0 V

TVHHR MCLR rise time (VIL to VIHH) for Program/Verify mode entry — — 1.0 s

I/O pins

VIH (ICSPCLK, ICSPDAT, MCLR/VPP) input high level 0.8 VDD — — V

VIL (ICSPCLK, ICSPDAT, MCLR/VPP) input low level — — 0.2 VDD V

VOHICSPDAT output high level VDD-0.7

VDD-0.7VDD-0.7

— — VIOH = 3.5 mA, VDD = 5VIOH = 3 mA, VDD = 3.3VIOH = 2 mA, VDD = 1.8V

VOLICSPDAT output low level

— —VSS+0.6VSS+0.6VSS+0.6

VIOH = 8 mA, VDD = 5VIOH = 6 mA, VDD = 3.3VIOH = 3 mA, VDD = 1.8V

Programming Mode Entry and Exit

TENTS Programing mode entry setup time: ICSPCLK, ICSPDAT setup time before VDD or MCLR 100 — — ns

TENTH Programing mode entry hold time: ICSPCLK, ICSPDAT hold time after VDD or MCLR 250 — — s

Serial Program/VerifyTCKL Clock Low Pulse Width 100 — — nsTCKH Clock High Pulse Width 100 — — nsTDS Data in setup time before clock 100 — — nsTDH Data in hold time after clock 100 — — ns

TCO Clock to data out valid (during a Read Data command) 0 — 80 ns

TLZD Clock to data low-impedance (during a Read Data command) 0 — 80 ns

THZD Clock to data high-impedance (during a Read Data command) 0 — 80 ns

TDLYData input not driven to next clock input (delay required between command/data or command/command)

1.0 — — s

TERAB Bulk Erase cycle time — — 5 msTERAR Row Erase cycle time — — 2.5 ms

Note 1: Externally timed writes are not supported for Configuration and Calibration bits.


PIC16(L)F151X/152X

8.1 AC Timing Diagrams

FIGURE 8-1: PROGRAMMING MODE ENTRY – VDD FIRST

FIGURE 8-2: PROGRAMMING MODE ENTRY – VPP FIRST

FIGURE 8-3: PROGRAMMING MODE EXIT – VPP LAST

FIGURE 8-4: PROGRAMMING MODE EXIT – VDD LAST

TPINT Internally timed programming operation time ————

2.55

msms

Program memory Configuration Words

TPEXT Externally timed programming pulse 1.0 — 2.1 ms Note 1

TDIS Time delay from program to compare (HV discharge time) 300 — — s

TEXIT Time delay when exiting Program/Verify mode 1 — — sNote 1: Externally timed writes are not supported for Configuration and Calibration bits.

TABLE 8-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY

AC/DC CHARACTERISTICS Standard Operating ConditionsProduction tested at 25°CSym. Characteristics Min. Typ. Max. Units Conditions/Comments

VPP

TENTH

VDD

TENTS

ICSPDAT

ICSPCLK

VIHH

VIL

TENTH

ICSPDAT

ICSPCLK

VDD

TENTS

VPPVIHH

VIL

TEXIT

VPP

VDD

ICSPDAT

ICSPCLK

VIHH

VIL

TEXIT

VPP

VDD

ICSPDAT

ICSPCLK

VIHH

VIL


PIC16(L)F151X/152X

FIGURE 8-5: CLOCK AND DATA

TIMING

FIGURE 8-6: WRITE COMMAND-PAYLOAD TIMING

FIGURE 8-7: READ COMMAND-PAYLOAD TIMING

as

ICSPCLK

TCKH TCKL

TDHTDS

ICSPDAT

output

TCOICSPDAT

ICSPDAT

ICSPDAT

TLZD

THZD

input

as

from input

from output to input

to output

1 2 3 4 5 6 1 2 15 16

X 0 LSb MSb 0

TDLY

Command NextCommandPayload

ICSPCLK

ICSPDATX X X X X

1 2 3 4 5 6 1 2 15 16

X

TDLY

Command NextCommandPayload

ICSPCLK

ICSPDATX X X X X

(from Programmer)

LSb MSb 0ICSPDAT(from Device)

x


PIC16(L)F151X/152X

FIGURE 8-8: LVP ENTRY (POWERED)

FIGURE 8-9: LVP ENTRY (POWERING UP)

TCKLTCKH

33 clocks

0 1 2 ... 31

TDHTDS

TENTH

LSb of Pattern MSb of Pattern

VDD

MCLR

ICSPCLK

ICSPDAT

TENTS

TCKH TCKL

33 Clocks

Note 1: Sequence matching can start with no edge on MCLR first.

0 1 2 ... 31

TDHTDS

TENTH

LSb of Pattern MSb of Pattern

VDD

MCLR

ICSPCLK

ICSPDAT


PIC16(L)F151X/152X

APPENDIX A: REVISION HISTORY

Revision A (08/2010)Original release of this document.

Revision B (09/2011)Added PIC16(L)F1512/1513 devices; Added newFigures 3-1 and 3-2; Updated Registers 3-1, 3-2 and 3-3 to new format; Updated Register 3-3 to add 2 kW and4 kW Flash memory; Added Notes to Examples 7-1 to7-4; Updated Table 8-1; Other minor corrections.


PIC16(L)F151X/152X

NOTES:


Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

2010-2011 Microchip Technology Inc. Advance Info

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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All other trademarks mentioned herein are property of their respective companies.

© 2010-2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-61341-635-8

rmation DS41442B-page 41

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.


AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://www.microchip.com/supportWeb Address: www.microchip.comAtlantaDuluth, GA Tel: 678-957-9614 Fax: 678-957-1455BostonWestborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL Tel: 630-285-0071 Fax: 630-285-0075ClevelandIndependence, OH Tel: 216-447-0464 Fax: 216-447-0643DallasAddison, TX Tel: 972-818-7423 Fax: 972-818-2924DetroitFarmington Hills, MI Tel: 248-538-2250Fax: 248-538-2260IndianapolisNoblesville, IN Tel: 317-773-8323Fax: 317-773-5453Los AngelesMission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608Santa ClaraSanta Clara, CA Tel: 408-961-6444Fax: 408-961-6445TorontoMississauga, Ontario, CanadaTel: 905-673-0699 Fax: 905-673-6509

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EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91UK - WokinghamTel: 44-118-921-5869Fax: 44-118-921-5820

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08/02/11

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1.0 Overview1.1 Hardware Requirements1.1.1 High-Voltage ICSP Programming1.1.2 Low-Voltage ICSP Programming

1.2 Pin UtilizationTABLE 1-1: Pin Descriptions During Programming – PIC16(L)F1526 and PIC16(L)F1527TABLE 1-2: Pin Descriptions During Programming – PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516, PIC16(L)F1517, PIC16(L)F1518 and PIC16(L)F1519

2.0 Device PinoutsFIGURE 2-1: 28-Pin SPDIP, SOIC, SSOP Diagram for PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516 and PIC16(L)F1518FIGURE 2-2: 28-Pin UQFN Diagram for PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516 and PIC16(L)F1518FIGURE 2-3: 40-Pin PDIP Diagram for PIC16(L)F1517 and PIC16(L)F1519FIGURE 2-4: 40-Pin UQFN Diagram for PIC16(L)F1517 and PIC16(L)F1519FIGURE 2-5: 44-Pin TQFP Diagram for PIC16(L)F1517 and PIC16(L)F1519FIGURE 2-6: 64-Pin QFN Diagram for PIC16(L)F1526 and PIC16(L)F1527FIGURE 2-7: 64-Pin TQFP Diagram for PIC16(L)F1526 and PIC16(L)F1527

3.0 Memory MapFIGURE 3-1: PIC16(L)F1512 Program Memory MappingFIGURE 3-2: PIC16(L)F1513 Program Memory MappingFIGURE 3-3: PIC16(L)F1526, PIC16(L)F1516 and PIC16(L)F1517 Program Memory MappingFIGURE 3-4: PIC16(L)F1527, PIC16(L)F1518 and PIC16(L)F1519 Program Memory Mapping3.1 User ID Location3.2 Device IDRegister 3-1: DEVICE ID: Device ID Register(1)TABLE 3-1: Device ID Values

3.3 Configuration Words3.4 Calibration WordsRegister 3-2: Configuration Word 1Register 3-3: Configuration Word 2

4.0 Program/Verify Mode4.1 High-Voltage Program/Verify Mode Entry and Exit4.1.1 Vpp – First Entry Mode4.1.2 Vdd – First Entry Mode4.1.3 Program/Verify Mode Exit

4.2 Low-Voltage Programming (LVP) Mode4.3 Program/Verify CommandsTABLE 4-1: Command Mapping4.3.1 Load ConfigurationFIGURE 4-1: Load Configuration

4.3.2 Load Data For Program MemoryFIGURE 4-2: Load Data For Program memory

4.3.3 Read Data From Program MemoryFIGURE 4-3: Read Data From Program memory

4.3.4 Increment AddressFIGURE 4-4: Increment Address

4.3.5 Reset AddressFIGURE 4-5: Reset Address

4.3.6 Begin Internally Timed ProgrammingFIGURE 4-6: Begin Internally Timed Programming

4.3.7 Begin Externally Timed ProgrammingFIGURE 4-7: Begin Externally Timed Programming

4.3.8 End Externally Timed ProgrammingFIGURE 4-8: End Externally Timed Programming

4.3.9 Bulk Erase Program MemoryFIGURE 4-9: Bulk Erase Program memory

4.3.10 Row Erase Program MemoryTABLE 4-2: Programming Row Size and LaTchesFIGURE 4-10: Row Erase Program Memory

5.0 Programming AlgorithmsFIGURE 5-1: Device Program/Verify FlowchartFIGURE 5-2: Program Memory FlowchartFIGURE 5-3: One-Word Program CycleFIGURE 5-4: Multiple-Word Program CycleFIGURE 5-5: Configuration Memory Program FlowchartFIGURE 5-6: Erase Flowchart

6.0 Code Protection6.1 Program Memory

7.0 Hex File Usage7.1 Configuration Word7.2 Device ID and Revision7.3 Checksum ComputationTABLE 7-1: Configuration Word Mask Values7.3.1 Program Code Protection DisabledEXAMPLE 7-1: Checksum Computed with Program Code Protection Disabled PIC16F1527, Blank DeviceEXAMPLE 7-2: Checksum Computed with Program Code Protection Disabled PIC16LF1527, 00AAh at First and Last Address

7.3.2 Program Code Protection EnabledEXAMPLE 7-3: Checksum Computed with Program Code Protection Enabled PIC16F1527, Blank DeviceEXAMPLE 7-4: Checksum Computed with Program Code Protection Enabled PIC16LF1527, 00AAh at First and Last Address

8.0 Electrical SpecificationsTABLE 8-1: AC/DC Characteristics Timing Requirements for Program/Verify Mode8.1 AC Timing DiagramsFIGURE 8-1: Programming Mode Entry – Vdd FirstFIGURE 8-2: Programming Mode Entry – Vpp FirstFIGURE 8-3: Programming Mode Exit – Vpp LastFIGURE 8-4: Programming Mode Exit – Vdd lastFIGURE 8-5: Clock and data timingFIGURE 8-6: Write Command-payload timingFIGURE 8-7: Read Command-payload timingFIGURE 8-8: LVP Entry (Powered)FIGURE 8-9: LVP Entry (Powering UP)

Appendix A: Revision HistoryTrademarksWorldwide Sales and Service

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