Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting

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Physics of Compressed Baryonic Matter12th CBM Collaboration Meeting

R&D ON MICRO-CABLES R&D ON MICRO-CABLES

FOR BABY SENSOR FOR BABY SENSOR

RADIATION TEST RADIATION TEST

MODULEMODULE

October 13 - 18, 2008October 13 - 18, 2008JINR, Dubna, Russia

Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail: [email protected]

2e-mail: [email protected]

DEMONSTRATOR 0-b BABY SENSOR RADIATION TEST MODULE

Dubna, October, 2008

4. LEMO connectors – 4 pcs4. LEMO connectors – 4 pcs5. Flexible sensor cables – 4 pcs5. Flexible sensor cables – 4 pcs6. SMD resistors 1MΩ6. SMD resistors 1MΩ on flex mounts – 4 pcson flex mounts – 4 pcs7. Jumpers for bias line – 4 pcs7. Jumpers for bias line – 4 pcs

Test module consist of: Test module consist of: 1. Baby sensor CBM01B2 – 1 pcs1. Baby sensor CBM01B2 – 1 pcs2. Flexible-rigid board – 1 pcs2. Flexible-rigid board – 1 pcs3. ERNI connectors3. ERNI connectors on flex mounts – 8 pcson flex mounts – 8 pcs

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CONNECTING CIRCUITOF MODULE

Schematic viewof strip to connectors

connectionFront side Back side

e-mail: [email protected], October, 2008

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FLEXIBLE BOARD

MaterialMaterial: : foiled dielectric FDI-A-50

Sensor cableSensor cable bonding area :bonding area :Pitch= Pitch= 300 300 um;um;Width of pads Width of pads == 200 200 um.um.

ERNI-flex-mountERNI-flex-mount bonding area :onding area :Pitch= Pitch= 635 um;635 um;Width of pads =Width of pads = 500 500 um.um.

Polyimide layerThickness 20 um

Aluminum layerThickness 30 um


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SENSOR CABLES

Technologically zone

Testing zoneTesting zone

Work zone


Sensor bonding Sensor bonding area:area:Pitch= Pitch= 101,4 101,4 um;um;Width= Width= 34 um.34 um.

Board bonding Board bonding area:area:Pitch= Pitch= 300 300 um;um;Width= Width= 80 um.80 um.




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TESTING OF CABLES


The Sensor cable design provided 100% automatically test (shorts, traces breaks) before assembly with applying of a standard contact device for testing Contact device

on the basis of Socket IC51-4364

Sensor cablesin the frame ТАВ-70

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FLEX-MOUNTSFOR SMD & ERNI CONNECTORS

Board bonding Board bonding area:area:Pitch= Pitch= 300/635 300/635 um;um;Width= Width= 100 um.100 um.



Ni + Sn-Bi layerThickness 3+8 um



Dual row male connector: type BERNI 114805 model (68 pins)

Resistors (1MΩ)

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ASSEMBLING SCHEMEOF MODULE


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MODULE ASSEMBLING – PART 1ASSEMBLING OF SENSOR WITH CABLES

N - side P - side


1. Ultrasonic bonding of Flexible cables to Sensor (N-side):

(128 traces + 2 bias) x 2 = 260 bonds

2. Bonds protection (Glue EpoTec T7110)

3. Rotation of sensor

4. Ultrasonic bonding of Flexible cables to Sensor (P-side): (128 traces + 2 bias) x 2 = 260 bonds

5. Bonds protection (Glue EpoTec T7110)

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MODULE ASSEMBLING – PART 2ASSEMBLING OF FLEXIBLE-RIGID BOARD


1. Gluing of “Balconies” to Rigid board (Glue Araldite2011)

2. Gluing of Flexible board to Rigid board (Glue UP10-14-2)

3. Mounting of SMD on flex-mounts to Flexible-rigid board.

US-bonding: 6 x 4 = 24 bonds and bonds protection (Glue EpoTec T7110)

4. Mounting of ERNI on flex-mounts to Flexible-rigid board. Gluing, US-bonding: 64 x 8 = 512 bonds, soldering and bonds protection (Glue EpoTec T7110)

“Balconies”Trough windowfor sensor mounting

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MODULE ASSEMBLING – PART 3MOUNTING OF SENSOR ASSEMBLY TO BOARD


1. Soldering of LEMO connectors to Flexible-rigid board.

2. Mounting of Sensor assembly to Flexible-rigid board. Gluing (Glue Araldite2011), US-bonding: 130 x 4 = 520 bonds and bonds protection (Glue EpoTec T7110)

As a result of activity were manufactured:1 technological and2 working modules.

(Total of bonded connections at one module 1600)

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TECHNOLOGICAL FEATURES OF ASSEMBLY

Bonds quality

0

2

4

6

8

1 1,2 1,4 1,6 1,8 2 2,2 2,4 2,6

Power

Po

ol

str

en

gth

, g

ram

T=10

T=20

T=30

T=40

T=50

T=60

Bonds quality

0

2

4

6

8

10

1 1,2 1,4 1,6 1,8 2 2,2 2,4 2,6

Power

Po

ol

str

en

gth

, g

ram

T=10

T=10

T=30

T=40

T=50

T=60


Three types of wedges (Gaiser Tool )for single-point TAB bonding:- Cables to sensor – GT1183-01710B;- Cables to board – GT1183-02205B;- Flex-mounts to board – GT1183-04010B.

Bonding of Cable to Sensor (N-side)

Bonding of Cable to Sensor (P-side)

Bonding of Cable to Flexible-rigid board

Pool strength:- Cables to sensor (N-side): 6-7 gram ;- Cables to sensor (P-side): 7-8 gram ;- Cables to board: 10-11 gram.

Bonds quality

02468

101214

1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 6Power

Po

ol

stre

ng

th,

gra

m

T=10

T=20

T=30

T=40

T=50

T=60

T=70

T=80

T=90

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TEST MODULE FOR CBM01B2 BABY-SENSOR RADIATION TEST

Front side Back side


We hope, that the experience, acquired by us, at development of a design, improvement of assembling technique and manufacture of test module on the basis of flexible-rigid boards will be useful for collaboration in the future for next investigations of baby sensors for CBM and NICA.

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ACTIVITY ON THE DEMONSTRATOR Nr.1SELECTION OF VARIANT


Conceptional design of the mechanics of the CBM STSladder (for Demonstrator Nr.1) offered by S.Igolkin

Option 1:“Old”

Option 2:“Angle tiling”

Option 3:“Flat tiling”

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OPTION 3:ADVANTAGES AND LIMITATION


In our opinion, from the point of view of usage the flexible aluminium – polyimide cables and manufacturability of Modules & Ladders assemblies, most reasonable looks Option 3 “Flat Tiling”- with flat arrangement of sensors with overlapping, but without a bend of a cable.

Limitations for Option 3:

- The gap between sensors for the safe passing of a cables: The gap offered on the drawing 0,5 mm is reasonable.

- The gap between sensors and frame: The gap offered on the drawing also is reasonable (minimum gap 2mm at placing one cable; maximum gaps of 5,2 mm and 4,4 mm at placing seven cables).

-The gap between sensors for in Module : The gap offered on the drawing 0,5 mm. For determination of gap between sensors in Module (the connection of sensors by daisy-chain cables) it is necessary to select variant of strip arrangement in a sensor (for both sides).

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SENSOR TOPOLOGYPROPOSAL


From the point of view of further assembly of sensors in modules, the optimal variant would be changing of strip rotation: from 15 on Р-side and 0 on N-side to 7,5 on both sides .Thus width of bonding contact pads is necessary to reduce from 80um up to 60um, that will allow to arrange bonding contact pads in parallel to sides of a sensor. It considerably will simplify further assembly, and also will allow to utilize identical cables for N- and P-sides with straight lines. In case of arrangement of contact pads with angles 0 and 15 will be necessary to use one cable with straight lines and second - with

rotated lines 15(that not manufacturability at pitch of lines 50-60um .

Besides the adjustment of cables with a sensor on rotated pads is more difficult than on pads which are placed parallel to sensor side.

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Kind of connections of Daisy-chain cables to sensor (Demonstrator Nr.1)


Variant of commutation for sensors with 7.5 and 7.5 degrees strip rotation.

TAB-bonding

(Pitch 60um)

Sensorbonding area

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Kind of connections of Analog cables to FEB (Demonstrator Nr.1)


Analog cablebottom layer

Analog cabletop layer

Output:Pitch 50.7 um(two rowsat 101.4um)

Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 120 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads.

TAB-bonding

(Pitch 120um)

Wire-bonding

(Pitch 50.7um)

Input:Pitch 60 um(two rowsat 120um)

Pitch-adapter

Sensor

Double-deck analog cable

Front-End Board

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TYPES OF FLEXIBLE CABLESFOR DEMONSTRATOR NR.1


Width of trace 20 20 -- 3030 um um Pitch of trace 660 0 umum Quantity of traces 1024 1024 (+bias?)(+bias?)

Demonstrator Nr.1 will need development of following flexible cables:1. Daisy-chain cable: 2 types;2. Analog cable: min 16 types (or 32 types).

Daisy-chain cable

Material:foiled dielectric FDI-A-24 thickness: of Al layer 12 - 14 um of polyimide layer 10 um

Sensor bonding area

Hybrid bonding area (adapter?)

Analog cable

Width of trace 4 400 um um Pitch of trace 120 um 120 um

Quantity of traces 512 (+bias?)512 (+bias?)

Material: foiled dielectric FDI-A-20 thickness: of Al layer 10 um of polyimide layer 10 um

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PROBLEMS AND TASKS


1. Select and agree of sensor topology.2. Select and agree of ladder arrangement.3. Select and agree of connection to FEB.

4. Development and investigation of technological processes for Module & Ladder assembling. 5. Development of flexible cables design.

6. Status of assembling sites for Demonstrator Nr.1?7. Status of test equipment for testing of module components?

21e-mail: [email protected], October, 2008

Thank you

for your attention

Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting

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