Photonic packaging and integration technologies...
-
Upload
nguyentuyen -
Category
Documents
-
view
218 -
download
0
Transcript of Photonic packaging and integration technologies...
![Page 1: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/1.jpg)
2572-9
Winter College on Optics: Fundamentals of Photonics - Theory, Devices and Applications
Sonia M. García Blanco
10 - 21 February 2014
University of Twente The Netherlands
Photonic packaging and integration technologies I
![Page 2: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/2.jpg)
26/02/2014 Title: to modify choose 'View' then 'Heater and footer'
1
Photonic packaging and integration technologies IWinter School on Optics
ICTP, Trieste, February 2014Sonia M. García Blanco, University of Twente
![Page 3: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/3.jpg)
UNIVERSITY OF TWENTE: NETHERLANDS
26/02/2014 2
![Page 4: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/4.jpg)
… ENSCHEDE ….
26/02/2014 3
![Page 5: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/5.jpg)
CAMPUS OF THE UNIVERSITY OF TWENTE
26/02/2014 4
MESA+ Institutefor
Nanotechnology
![Page 6: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/6.jpg)
MESA+ INSTITUTE FOR NANOTECHNOLOGY
26/02/2014 5
![Page 7: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/7.jpg)
6
Packaged dies
[Lars Zimmerman, Helios, Silicon Photonics course][P. O’Brien, Tyndall National Institute, Cork, Ireland]
PHOTONIC PACKAGING AND INTEGRATION TECHNOLOGIES
Bare photonic dies
![Page 8: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/8.jpg)
7
- Protect devices from environment
- Provide the correct atmosphere for proper functioning (vacuum, nitrogen)
- Increase reliability
- Interaction of device with environment:Electrical signalsOptical signals: transparent window, optical waveguides, fibersFluidicsPressure, gases, etc
- Low cost- Small size
PACKAGING GOALS
![Page 9: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/9.jpg)
26/02/2014 8
LECTURE LEARNING GOALS
1. Get an overview of different available packaging and integrationtechnologies
2. Get a “feeling” for the challenges of packaging
3. Acquire a “design-for-packaging” attitude
1. Get an overview of different available packaging and integrationtechnologies
2. Get a “feeling” for the challenges of packaging
3. Acquire a “design-for-packaging” attitude
![Page 10: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/10.jpg)
9
1. Packaging of LEDs, detectors and image sensors
2. Packaging of photonic devices
3. Hybrid and heterogeneous integration technologies
OUTLINE
![Page 11: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/11.jpg)
10
- Die-level versus wafer level packaging
- Overview of bonding technologies
- Example: Wafer level packaging of microbolometerdetectors
PACKAGING OF LEDs, DETECTORS AND IMAGE SENSORS
![Page 12: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/12.jpg)
11
Level 0: wafer-level packaging
Level 1: die-level packaging
[Image: K. Gilleo]
TRENDS ON LED, DETECTOR AND IMAGE SENSOR PACKAGING
![Page 13: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/13.jpg)
12
CHIP LEVEL PACKAGING OF LEDs
Time + cost- Several assembly steps per LED die- Many LED dies/wafer
![Page 14: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/14.jpg)
26/02/2014 13
WAFER LEVEL PACKAGING OF LEDs
![Page 15: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/15.jpg)
26/02/2014 14
[Yole Development, Semicon West 2011]
WAFER LEVEL PACKAGING OF LEDs
![Page 16: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/16.jpg)
26/02/2014 15Thru silicon vias (TSV)
WAFER LEVEL PACKAGING OF LEDs
![Page 17: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/17.jpg)
26/02/2014 16
- Thru silicon vias (TSV)
[Silex]
TECHNOLOGIES FOR WAFER LEVEL PACKAGING
[PlanOptik]
- Packaging wafers
[HeptaGON]
- Wafer level optics
![Page 18: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/18.jpg)
17
- Die-level versus wafer level packaging
- Overview of bonding technologies
- Example: Wafer level packaging of microbolometerdetectors
PACKAGING OF LEDs, DETECTORS AND IMAGE SENSORS
![Page 19: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/19.jpg)
26/02/2014 18
BONDING TECHNIQUESTechnique Advantages Disadvantages
Bonding without interlayer Hermetic Flat surface required
Direct Strong bond High-TPlasma activated Low T Complex equipment
Anodic Strong bond High T, high voltage, ionic glass
Metallic interlayer Hermetic, non flat surface OK Specific metals requiredEutectic Strong bond Flat surface
Thermocompression More tolerant to flatness High pressure Solder Self-alignment Solder flow possible
Insulating layer Non flat surface ok VaryGlass frit hermetic High T, large bond areaAdhesive Versatile, low T Non hermetic
![Page 20: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/20.jpg)
26/02/2014 19
DIRECT BONDING
[D. Epstein, MIT]
REQUIREMENTS:
- Smooth surfaces (<1.5 nm rms)- Flat wafers (on cm-scale)- No particles (voids larger than particles!)- T>500C typically (depending on materials)
- Matching CTEs (otherwise stress-induced cracks)- Suitable surface chemistry (hybrophilicity vs hydrophobicity)
![Page 21: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/21.jpg)
26/02/2014 20
DIRECT BONDING
[Sami Franssila, Aalto, Finland]
1. 2.
![Page 22: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/22.jpg)
26/02/2014 21
PLASMA ACTIVATED DIRECT BONDING
[Howlader et. Al., J. Micro/Nanolith. MEMS MOEMS. 9(4), 041107, 2010]
Anneal Temperature <200 C
![Page 23: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/23.jpg)
26/02/2014 22
ANODIC BONDING
[Wikipedia]
- Ion containing glasses: eg., Borofloat 33 or Pyrex 7740
- T >350 C- V >400 V- P not so relevant
Anodic bonding
![Page 24: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/24.jpg)
26/02/2014 23
EUTECTIC BONDING
[Wikipedia]
Materials Composition TemperatureAu-Sn 80/20 wt% 280 CAu-Si 97.15/2.85 wt% 370 CAu-Ge 28/72 wt% 361 CAl-Si 87.5/12.5 wt% 580 CCu-Sn 5/95 wt% 231 CAu-In 0.6/99.4 wt% 156 C
- Tolerant to surface quality and wafer bow- Low temperature process- Sensitive to surface oxides
![Page 25: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/25.jpg)
26/02/2014 24
METAL THERMOCOMPRESSION BONDINGPROCESS:- Metal between chip and substrate- T- Pressure
BONDING MECHANISM:- Breaking of surface oxides- Interface formation- Grain growth
[Suss Microtec]
![Page 26: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/26.jpg)
26/02/2014 25
GLASS FRIT BONDING
- T >400 C- Tolerant to particles- Tolerant to surface quality- Possible voids- Possible outgassing
[Sun et. al, J. Eletron. Mat, 2004 ]
Bonding profile
Characteristics:
![Page 27: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/27.jpg)
26
INO’s -package:
-packFootprint (mmxmm) 10.5 x 9.7
Volume 60 LWeight (g) 0.53
160x120 pixel FPA 130 mK:
EXAMPLE OF WAFER-LEVEL PACKAGING
![Page 28: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/28.jpg)
27
1 mm
Sn63Pb37
InAg solder
0.55 mm
AR coated Si floatzone
Ceramic spacer
80 m
Vacuum port solder
Getter material
Solderable layer
Bolometric detector
arraySi die
1. Window wafer
2. Ceramic spacer wafer
3. -bolometerwafer
Each level microfabricated at the wafer level[S. García-Blanco et. al., « Hybrid wafer-level vacuum
hermetic micropackaging technology for MOEMS-MEMS », Proc. SPIE 720602, 2009]
CONCEPT OF LOW-T MICROPACKAGE
![Page 29: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/29.jpg)
28
3. Microbolometer wafer
1. IR window wafer 2. Ceramic spacer wafer
Batch microfabrication
technologies
Low cost devices
CONCEPT OF LOW-T MICROPACKAGE
![Page 30: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/30.jpg)
29
Bonding Pad IC Solder
Ceramic (Metal)
Ni Spacer
Pump-out Opening
Window
2. Wafer-to-wafer bonding
Cost reduction by: - Assembly of only known-good dies- Minimize costly IR-coated window material- Assembly done with low cost instrumentation
1. Die and window to carrier waferIC
Window
Ceramic or Metallic Tray
Vacuum port
CONCEPT OF LOW-T MICROPACKAGE
![Page 31: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/31.jpg)
30
1. Packaging of LEDs, detectors and image sensors
2. Packaging of photonic devices
3. Hybrid and heterogeneous integration technologies
OUTLINE
![Page 32: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/32.jpg)
31
1. Two examples of packaging of photonic modules
PACKAGING OF PHOTONIC DEVICES
- Laser diode in butterfly package- Transmitter optical subassembly (TOSA)
2. “Fiber-to-the-chip” assembly strategies
- Ferrule welding- Fiber array butt coupling (active vs passive alignment)- Grating couplers
![Page 33: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/33.jpg)
26/02/2014 32
PACKAGING OF PHOTONIC MODULESLaser diode module package:
- Butterfly package- Laser chip- Thermistor- Thermoelectric cooler
- Isolator- Focusing lens
- Optical fiber- Electrical leads
[Peter O’Brian, Tyndall]
![Page 34: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/34.jpg)
26/02/2014 33
EXAMPLES OF PACKAGES
[Kyocera]
![Page 35: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/35.jpg)
26/02/2014 34
EXAMPLE 1: LASER DIODE MODULE
Sensitivity to alignment errors:
z
y
Welded fiber ferrule
![Page 36: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/36.jpg)
26/02/2014 35
EXAMPLE 2: ASSEMBLY OF A TRANSMITTER OPTICAL SUBASSEMBLY (TOSA) PACKAGE1. Components and lens attachment (adhesive) on silicon submount
![Page 37: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/37.jpg)
26/02/2014 36
TOSA PACKAGETOSA package from TEC Microsystems
![Page 38: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/38.jpg)
26/02/2014 37
LENS PLACEMENT
Adhesive in V-groove
![Page 39: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/39.jpg)
26/02/2014 38
EXAMPLE 2: ASSEMBLY OF A TRANSMITTER OPTICAL SUBASSEMBLY (TOSA) PACKAGE1. Components and lens attachment (adhesive) on silicon submount
2. TEC assembly into package (fluxless, lead-free solder)
3. Silicon submount onto TEC (fluxless, lead-free solder)
![Page 40: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/40.jpg)
39
1. Two examples of packaging of photonic modules
PACKAGING OF PHOTONIC DEVICES
- Laser diode in butterfly package- Transmitter optical subassembly (TOSA)
2. Fiber-to-the-chip assembly strategies
- Ferrule welding- Fiber array butt coupling (active vs passive alignment)- Grating couplers
![Page 41: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/41.jpg)
26/02/2014 40Attention: Post-weld shift!
FIBER WELDING
Nd:YAG laser welding station.Newport
![Page 42: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/42.jpg)
26/02/2014 41
FIBER WELDING
![Page 43: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/43.jpg)
26/02/2014 42
FIBER PIGTAILING: FIBER GROOVE ARRAYS1X12 V-groove array OZ Optics:
![Page 44: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/44.jpg)
26/02/2014 43
FIBER PIGTAILING: FIBER GROOVE ARRAYS
[O/E Land Inc]
![Page 45: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/45.jpg)
26/02/2014 44
ACTIVE ALIGNMENT
- Move fibre array vs chip in 6-axes to maximize coupling of light- Glue in place with typically UV curable epoxyCONSIDERATIONS:
PROCEDURE:
- Time consuming, costly procedure
- Pitch mismatch between fibre array and photonic chip Loss of real-state- Mode mismatch between fibre and waveguides Low coupling efficiency
![Page 46: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/46.jpg)
26/02/2014 45
PASSIVE ALIGNMENT: SILICON MICROBENCH TECHNOLOY
- V-grooves to chips
[Group IV photonics, 2011]
- Etched V-grooves lithographically aligned to photonic device- Extra notch for glue relief- Alignment errors limit the overall performance
![Page 47: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/47.jpg)
26/02/2014 46
ACTIVE ALIGNMENT
- Move fibre array vs chip in 6-axes to maximize coupling of light- Glue in place with typically UV curable epoxyCONSIDERATIONS:
PROCEDURE:
- Time consuming, costly procedure
- Pitch mismatch between fibre array and photonic chip loss of real-state- Mode mismatch between fibre and waveguides Low coupling efficiency
![Page 48: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/48.jpg)
26/02/2014 47
MODE SIZE CONVERTERS
Si layer thickness 220nmSilicon layer width 450nm to 75nm
Refractive index of polymer 1.58Total size of the polymer
layer2um by 2um
Thickness of silica substrate 2.5umTaper length Varied between
10um and 300umWavelength 1.5um
[FiMMProp]
![Page 49: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/49.jpg)
26/02/2014 48
MODE SIZE CONVERTERS
[FiMMProp]
![Page 50: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/50.jpg)
26/02/2014 49
ACTIVE ALIGNMENT
- Move fibre array vs chip in 6-axes to maximize coupling of light- Glue in place with typically UV curable epoxyCONSIDERATIONS:
PROCEDURE:
- Time consuming, costly procedure
- Pitch mismatch between fibre array and photonic chip loss of real-state- Mode mismatch between fibre and waveguides Low coupling efficiency
![Page 51: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/51.jpg)
26/02/2014 50
INTRODUCTION OF DIFFERENT INTERPOSERS
[Teem photonics]
Two examples of ion-exchange waveguides in glass interposer:
[Fraunhofer IZM, glassPack]
Match to fibre pitch
Match to photonic waveguides
![Page 52: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/52.jpg)
26/02/2014 51
[K. Watanabe et. al., CLEO Europe 2009]
INTRODUCTION OF DIFFERENT INTERPOSERS
Interposer in TripleX (Si3N4/SiO2 based waveguide technology from LioniX):
[C. Stamatiadis et. al., Optical Network Design and Modelling (ONDM), 2011]
![Page 53: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/53.jpg)
26/02/2014 52
InP with TripleX interposer:
[M. Smit, Packaging requirements, Paradigm project]
INTRODUCTION OF DIFFERENT INTERPOSERS
![Page 54: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/54.jpg)
26/02/2014 53
[P. O’Brien, ECOC 2012]
GRATING COUPLING
gPack (IZM, Epixfab): Angled fibre (Tyndall, Epixfab):
![Page 55: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/55.jpg)
26/02/2014 54
gPACK (IZM, Epixfab)
![Page 56: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/56.jpg)
26/02/2014 55
ANGLED FIBER (Tyndall, EPIXFAB)
[P. O’Brien, ECOC 2012]
![Page 57: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/57.jpg)
26/02/2014 56
ANGLED FIBER (Tyndall, EPIXFAB)
[P. O’Brien, ECOC 2012]
However:
Still size and pitch problem! Use of interposer
[K. Watanabe et. al., CLEO Europe 2009]
![Page 58: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/58.jpg)
57
- Packaging of LEDs, detectors and image sensors
- Packaging of photonic devices
- Hybrid and heterogeneous integration technologies
OUTLINE
![Page 59: Photonic packaging and integration technologies Iindico.ictp.it/event/a13188/session/7/contribution/32/material/0/0.pdf · Photonic packaging and integration technologies I. ... TOSA](https://reader031.fdocuments.us/reader031/viewer/2022022002/5a87b87c7f8b9ac96a8df6d8/html5/thumbnails/59.jpg)
26/02/2014 58
LECTURE LEARNING GOALS
1. Get an overview of different available packaging and integrationtechnologies
2. Get a “feeling” for the challenges of packaging
3. Acquire a “design-for-packaging” attitude
1. Get an overview of different available packaging and integrationtechnologies
2. Get a “feeling” for the challenges of packaging
3. Acquire a “design-for-packaging” attitude