philips-lcd-tv-ftl13e-aa--ab.pdf
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Published by WO 0472 Service PaCE Printed in The Netherlands Subject to modification EN 3122 785 13453 © Copyright 2004 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Colour Television Chassis FTL13E AA & AB CL 16532149_000.eps 110703 Contents Page Contents Page 1. Technical Specifications, Connections, and Chassis Overview 2 2. Safety Instructions, Warnings, and Notes 5 3. Directions for Use 6 4. Mechanical Instructions 19 5. Service Modes, Error Codes, and Fault Finding 22 6. Wiring Diagram, Block Diagrams and Overviews Wiring Diagram 33 Block Diagram Supply and Supply Lines 34 Block Diagram Video 36 Testpoint Overview Small Signal Board 37 Block Diagram Audio and Control 38 I2C IC’s overview 39 7. Circuit Diagrams and PWB Layouts Diagram PWB Audio Panel and Supply, DC Protection (A1) 40 47-48 Filters (A2) 41 47-48 Audio Amplifier Left High (A3) 42 47-48 Audio Amplifier Left Low (A4) 43 47-48 Audio Amplifier Right High (A5) 44 47-48 Audio Amplifier Right Low (A6) 45 47-48 Supply & DC Protection (A7) 46 47-48 Small Signal Board (AA) (B1-B20) 49-75 76-87 Small Signal Board (AB) (B1-B20) 88-106 107-118 LED/Switch Panel (LD) 119 120 LED/Switch Panel (ITV) (LD) 121 122 Side I/O (O) 123 124 Side I/O (ITV) (O) 125 126 Top Control (P) 127 128 Aux Supply (SA) 129 130-133 Power Supply (SP1) 134 136-137 Doubler (SP2) 135 136-137 8. Alignments 139 9. Circuit Descriptions, Abbreviation List, and IC Data Sheets 145 10. Spare Parts List 170 11. Revision List 187
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philips-lcd-tv-ftl13e-aa--ab.pdf
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Published by WO 0472 Service PaCE Printed in The Netherlands Subject to modification EN 3122 785 13453
Copyright 2004 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.
Colour Television Chassis
FTL13EAA & AB
CL 16532149_000.eps110703
Contents Page Contents Page1. Technical Specifications, Connections, and Chassis
Overview 22. Safety Instructions, Warnings, and Notes 53. Directions for Use 64. Mechanical Instructions 195. Service Modes, Error Codes, and Fault Finding 226. Wiring Diagram, Block Diagrams and Overviews
Wiring Diagram 33Block Diagram Supply and Supply Lines 34Block Diagram Video 36Testpoint Overview Small Signal Board 37Block Diagram Audio and Control 38I2C ICs overview 39
7. Circuit Diagrams and PWB Layouts Diagram PWBAudio Panel and Supply, DC Protection (A1) 40 47-48Filters (A2) 41 47-48Audio Amplifier Left High (A3) 42 47-48Audio Amplifier Left Low (A4) 43 47-48Audio Amplifier Right High (A5) 44 47-48Audio Amplifier Right Low (A6) 45 47-48Supply & DC Protection (A7) 46 47-48Small Signal Board (AA) (B1-B20) 49-75 76-87Small Signal Board (AB) (B1-B20) 88-106 107-118LED/Switch Panel (LD) 119 120LED/Switch Panel (ITV) (LD) 121 122Side I/O (O) 123 124Side I/O (ITV) (O) 125 126Top Control (P) 127 128Aux Supply (SA) 129 130-133Power Supply (SP1) 134 136-137Doubler (SP2) 135 136-137
8. Alignments 1399. Circuit Descriptions, Abbreviation List, and IC Data
Sheets 14510. Spare Parts List 17011. Revision List 187
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Technical Specifications, Connections, and Chassis OverviewEN 2 FTL13E AA & AB1.
1. Technical Specifications, Connections, and Chassis OverviewIndex of this chapter:1.1 Technical Specifications1.2 Connections1.3 Chassis Overview
Note: Figures below can deviate slightly from the actual situation, due to the different set executions.
1.1 Technical Specifications
1.1.1 Vision
Display type : TFT LCD, 15:9Screen size : 30-inch (76 cm)Resolution (HxV) : WXGA 1280(*3)x768Contrast ratio : 350:1Light output : 450 cd/m^2LCD response time : 16 msViewing angle : 176 deg. (H)
: 176 deg. (V)Tuning system : PLLColour systems : PAL B/G, D/K, I
: SECAM B/G, D/K, L/LAV (playback only) : NTSC 4.43/3.58Channel selections : 100 presets
: UVSHAerial input : 75 ohm, IEC-typeDimensions (WxHxD) in mm : 891x489x110
1.1.2 Sound
Sound systems : FM-mono, AM-mono: 2CS B/G, D/K: NICAM B/G, D/K, I, L/
L'Maximum power : 2 x 10 W_rms (int.)
1.1.3 Miscellaneous
Mains voltage : 95 - 264 V_acMains frequency : 50 / 60 HzAmbient temperature : +5 to +45 CMaximum humidity : 90 % R.H.Power consumption :- Normal operation : 160 W- Standby : < 2 W
1.2 Connections
Figure 1-1 Side I/O and rear connections
1.2.1 Side I/O (Left Bottom Side)
Hosiden: SVHS (Input)1 - Y Ground 2 - C Ground 3 - Y 1 V_pp / 75 ohm 4 - C 0.3 V_pp / 75 ohm
Cinch (Input)- CVBS 1 V_pp / 75 ohm - Audio - L 0.5 V_rms / 10 kohm - Audio - R 0.5 V_rms / 10 kohm
Headphone (Output) (only for consumer TV sets)- Headphone 32 - 600 ohm / 10 mW
STB (only for ITV)- RJ-11 Only for ICONN
1.2.2 Audio receiver (if present)
Audio - In (Cinch)C - Audio - Centre
Audio - Out (Cinch)R - Audio - R 0.5 V_rms / 1 kohm L - Audio - L 0.5 V_rms / 1 kohm
Audio - Out (Cinch)R - Audio - R 0.5 V_rms / 1 kohm L - Audio - L 0.5 V_rms / 1 kohm
P/CHMENU/OK
TOP CONTROLS
L
YPb
PrRLR
Volume ProgramRed
IR
ANT
ServiceEXT. 1/2/3/4 MainsAudio InAudio Out
Centre In No function
Light sensor
iTV only
PC Input (VGA)
LR
Audio S-VideoCVBS-Video
LRSTB
CL 36532053_066.eps291003
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Technical Specifications, Connections, and Chassis Overview EN 3FTL13E AA & AB 1.
1.2.3 VGA
VGA (Input)
Figure 1-2 VGA Connector
1 - Red 0.7 V_pp / 75 ohm 2 - Green 0.7 V_pp / 75 ohm 3 - Blue 0.7 V_pp / 75 ohm 4 - Ground 5 - Ground 6 - Ground 7 - Ground 8 - Ground 9 - 5V_DC_OUT +5 V_dc 10 - Ground 11 - Ground 12 - DDC_SDA 13 - H-sync 0 - 5 V 14 - V-sync 0 - 5 V 15 - DDC_SCL
Cinch (Input)- Audio - L 0.5 V_rms / 10 kohm - Audio - R 0.5 V_rms / 10 kohm - Y 0.7 V_pp / 75 ohm - Pb 0.7 V_pp / 75 ohm - Pr 0.7 V_pp / 75 ohm
1.2.4 SCARTs
Figure 1-3 SCART connector
External 1: RGB/YUV and CVBS - In/Out1 - Audio - R 0.5 V_rms / 1 kohm 2 - Audio - R 0.5 V_rms / 10 kohm 3 - Audio - L 0.5 V_rms / 1 kohm 4 - Audio Ground 5 - Audio Ground 6 - Audio - L 0.5 V_rms / 10 kohm 7 - Blue / U 0.7 V_pp / 75 ohm 8 - CVBS-status 0 - 1.3 V: INT
4.5 - 7 V: EXT 16:99.5 - 12 V: EXT 4:3
9 - Video Ground 10 - N.C. 11 - Green / Y 0.7 V_pp / 75 ohm 12 - N.C. 13 - Video Ground 14 - Video Ground 15 - Red / V 0.7 V_pp / 75 ohm 16 - Status / FBL 0 - 0.4 V: INT
1 - 3 V: EXT / 75 ohm 17 - Video Ground 18 - Video Ground 19 - CVBS-out 1 V_pp / 75 ohm 20 - CVBS-in 1 V_pp / 75 ohm 21 - Shielding Ground
External 2: CVBS and SVHS - In/Out (for Recorder)1 - Audio - R 0.5 V_rms / 1 kohm 2 - Audio - R 0.5 V_rms / 10 kohm 3 - Audio - L 0.5 V_rms / 1 kohm 4 - Audio Ground 5 - Audio Ground 6 - Audio - L 0.5 V_rms / 10 kohm 7 - C-out 0.7 V_pp / 75 ohm 8 - CVBS-status 0 - 1.3 V: INT
4.5 - 7 V: EXT 16:99.5 - 12 V: EXT 4:3
9 - Video Ground 10 - Easylink (P50) 11 - Green 0.7 V_pp / 75 ohm 12 - N.C. 13 - Video Ground 14 - Video Ground 15 - C-in 0.7 V_pp / 75 ohm 16 - Status / FBL 0 - 0.4 V: INT
1 - 3 V: EXT / 75 ohm 17 - Video Ground 18 - Video Ground 19 - CVBS-out 1 V_pp / 75 ohm 20 - CVBS-in 1 V_pp / 75 ohm 21 - Shielding Ground
External 3: CVBS - In1 - Ground 2 - Audio - R 0.5 V_rms / 10 kohm 3 - Ground 4 - Audio Ground 5 - Ground 6 - Audio - L 0.5 V_rms / 10 kohm 7 - N.C. 8 - CVBS-status 0 - 1.3 V: INT
4.5 - 7 V: EXT 16:99.5 - 12 V: EXT 4:3
9 - Video Ground 10 - N.C. 11 - N.C. 12 - N.C. 13 - Video Ground 14 - Video Ground 15 - N.C. 16 - N.C. 17 - Video Ground 18 - Video Ground 19 - N.C. 20 - CVBS-in 1 V_pp / 75 ohm 21 - Shielding Ground
1
610
11
5
15
1 21
202CL96532137_056.eps
171199
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Technical Specifications, Connections, and Chassis OverviewEN 4 FTL13E AA & AB1.
External 4: CVBS - In1 - Ground 2 - Audio - R 0.5 V_rms / 10 kohm 3 - Ground 4 - Audio Ground 5 - Ground 6 - Audio - L 0.5 V_rms / 10 kohm 7 - N.C. 8 - CVBS-status 0 - 1.3 V: INT
4.5 - 7 V: EXT 16:99.5 - 12 V: EXT 4:3
9 - Video Ground 10 - N.C. 11 - N.C.
12 - N.C. 13 - Video Ground 14 - Video Ground 15 - N.C. 16 - N.C. 17 - Video Ground 18 - Video Ground 19 - N.C. 20 - CVBS-in 1 V_pp / 75 ohm 21 - Shielding Ground
Aerial - In- IEC-type Coax, 75 ohm
1.3 Chassis Overview
Figure 1-4 PWB location
CL 36532053_054.eps090703
TOP CONTROL PANEL P
POWER SUPPLY SP
SMALL SIGNAL PANEL B
AUX SUPPLY PSA
LED / MAINS SWITCH PANELLD
A AUDIO AMPLIFIER
SIDE I/O PANELO
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Safety Instructions, Warnings, and Notes EN 5FTL13E AA & AB 2.
2. Safety Instructions, Warnings, and Notes Index of this chapter:2.1 Safety Instructions2.2 Warnings2.3 Notes
2.1 Safety Instructions
Safety regulations require that during a repair: Connect the set to the Mains (AC Power) via an isolation
transformer (> 800 VA). Replace safety components, indicated by the symbol ,
only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points: Route the wire trees correctly and fix them with the
mounted cable clamps. Check the insulation of the Mains (AC Power) lead for
external damage. Check the strain relief of the Mains (AC Power) cord for
proper function. Check the electrical DC resistance between the Mains (AC
Power) plug and the secondary side (only for sets which have a Mains (AC Power) isolated power supply): 1. Unplug the Mains (AC Power) cord and connect a wire
between the two pins of the Mains (AC Power) plug. 2. Set the Mains (AC Power) switch to the "on" position
(keep the Mains (AC Power) cord unplugged!). 3. Measure the resistance value between the pins of the
Mains (AC Power) plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm.
4. Switch "off" the set, and remove the wire between the two pins of the Mains (AC Power) plug.
Check the cabinet for defects, to avoid touching of any inner parts by the customer.
2.2 Warnings
All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential. Available ESD protection equipment: Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822 310 10671.
Wristband tester 4822 344 13999. Be careful during measurements in the high voltage
section. Never replace modules or other components while the unit
is switched "on". When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a circuit becoming unstable.
2.3 Notes
2.3.1 General
Measure the voltages and waveforms with regard to the chassis (= tuner) ground (), or hot ground (), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the
Service Default Mode (see chapter 5) with a colour bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or 61.25 MHz for NTSC (channel 3).
Where necessary, measure the waveforms and voltages with () and without () aerial signal. Measure the voltages in the power supply section both in normal operation () and in stand-by (). These values are indicated by means of the appropriate symbols.
The semiconductors indicated in the circuit diagram and in the parts lists, are interchangeable per position with the semiconductors in the unit, irrespective of the type indication on these semiconductors.
Manufactured under license from Dolby Laboratories. Dolby, Pro Logic and the double-D symbol, are trademarks of Dolby Laboratories.
2.3.2 Schematic Notes
All resistor values are in ohms and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm).
Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).
All capacitor values are given in micro-farads (= x10-6), nano-farads (n= x10-9), or pico-farads (p= x10-12).
Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).
An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.
The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.
2.3.3 Rework on BGA (Ball Grid Array) ICs
GeneralAlthough (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.
Device RemovalAs is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an (LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB.To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.
Area PreparationWhen the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA. Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent. After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.
-
Directions for UseEN 6 FTL13E AA & AB3.
Device ReplacementThe last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGA should be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers.To reflow the solder, apply a temperature profile according to the IC data sheet. So as not to damage neighbouring components, it may be necessary to reduce some temperatures and times.
More InformationFor more information on how to handle BGA devices, visit this URL: www.atyourservice.ce.philips.com (needs subscription, not available for all regions). After login, select Magazine, then go to Workshop Information. Here you will find Information on how to deal with BGA-ICs.
2.3.4 Lead Free Solder
Philips CE is going to produce lead-free sets (PBF) from 1.1.2005 onwards.
Figure 2-1 Lead-free logo
This sign normally has a diameter of 6 mm, but if there is less space on a board also 3 mm is possible.
Regardless of this logo (is not always present), one must treat all sets from this date onwards according to the following rules.
Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free soldering tin Philips SAC305 with order
code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.
Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able To reach at least a solder-tip temperature of 400C. To stabilise the adjusted temperature at the solder-tip. To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around 360C - 380C is reached and stabilised at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400C, otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch off unused equipment or reduce heat.
Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If not to avoid, clean carefully the solder-joint from old tin and re-solder with new tin.
Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies.
Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against moisture. This packaging may only be opened short before it is used (soldered). Otherwise the body of the IC gets "wet" inside and during the heating time the structure of the IC will be destroyed due to high (steam-)pressure inside the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90C) for drying (think of ESD-protection!).Do not re-use BGAs at all!
For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the end of the service period. For the repair of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method: Always use the highest temperature to solder, when using
SAC305 (see also instructions below). De-solder thoroughly (clean solder joints to avoid mix of
two alloys).Caution: For BGA-ICs, you must use the correct temperature-profile, which is coupled to the 12NC. For an overview of these profiles, visit the website www.atyourservice.ce.philips.com (needs subscription, but is not available for all regions)You will find this and more technical information within the "Magazine", chapter "Workshop information".For additional questions please contact your local repair help desk.
2.3.5 Practical Service Precautions
It makes sense to avoid exposure to electrical shock. While some sources are expected to have a possible dangerous impact, others of quite high potential are of limited current and are sometimes held in less regard.
Always respect voltages. While some may not be dangerous in themselves, they can cause unexpected reactions that are best avoided. Before reaching into a powered TV set, it is best to test the high voltage insulation. It is easy to do, and is a good service precaution.
3. Directions for UseYou can download this information from the following websites:http://www.philips.com/supporthttp://www.p4c.philips.com
P b
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Directions for Use EN 7FTL13E AA & AB 3.
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