PHASTFlex D5 1 Project Presentation For EU v5 · Research Institute. • Leading group on design,...
Transcript of PHASTFlex D5 1 Project Presentation For EU v5 · Research Institute. • Leading group on design,...
PHASTFlex Project Presentation
Photonic Hybrid ASsembly Through FLEXible waveguides
Project:
Project No: 619267
Call Identifier: FP7-ICT-2013-11
Start Date: 1/1/14
Duration: 36 months
Website: www.phastflex.eu
Contacts:
Xaveer Leijtens:
Tel: +31 40 247 5112
David Robbins:
Tel: +44 1327 857795
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PHASTFlex in a
nutshell
PHASTFLEX proposes the development of a fully automated, high precision,
cost-effective assembly technology for next generation hybrid photonic
packages.
Challenge :
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Challenge :
Current assembly and packaging approaches to Photonic Integrated Circuits (PICs)
lead to custom-engineered solutions; packaging is at least an order of magnitude
more expensive than the photonic chips themselves, and this is a major bottle-
neck to market penetration.
The most demanding assembly task for multi-port PICs is the high-precision (±0.1μm)
alignment and fixing of the optical waveguides.
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PHASTFlex in a
nutshellSolution:
PHASTFlex proposes an innovative solution, in which InP PICs with active functions will be combined with passive TriPleXTM PICs bonded onto a suitable carrier; for example LTCC (ceramic).
In the PHASTFlex concept the waveguides in the TriPleX PIC are released during fabrication to make them movable. Actuators and fixing functions, integrated in the same PIC, place and fix the flexible waveguides in the optimal position (peak out-coupled power)
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out-coupled power)
The project aims to develop a complete assembly process and tooling to implement this concept, including pre-assembly using eutectic bonding and automated handling, with on-chip micro-fabricated fine-alignment and fixing functions.
Impact:
Proof of the concept by assembly of prototypes for challenging end-user applications
Cost reduction through high volume compatible, automated assembly methods
Goal:
Penetration of low cost photonic circuits into multiple, new application areas.
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Flexible Waveguide
Technology
• On-chip alignment of flexible optical waveguide structures:
• Alignment case:– Chip-to-Chip: InP-TriPleX
InP chip
Interposer chipTriPleX
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– Chip-to-Chip: InP-TriPleX
– Multi-port
– 100nm precision
• Main ideas:– Combine passive and active alignment
– Use micro-fabrication for flexible waveguides, alignment and fixing
Fibre Array Unit
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Assembly Concept
Passive alignment
Assembly of subcomponents
onto a silicon bench or ceramic
carrier followed by fine alignment
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FixationFinal Fixing
Active alignment
Carrier
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Concept - detail
Step 1: Passive coarse alignment and flip chip bonding of PICs
onto a LTCC carrier
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Concept - detail
Step 2: Active fine alignment using flexible waveguides,
actuators and integrated locking features
Target alignment accuracy ~0.1µm
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PHASTFlex in
numbers
• Nine project partners
– 7 industrial, of which 2 provide applications
– 2 universities
– Germany, Netherlands , UK , Spain
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– Germany, Netherlands , UK , Spain
• All recognised leading industrial and research entities
in the photonics components and systems industry
• Project duration: 36 months
• Total Cost: 3.884M€
• Total Effort: 303 person months
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Consortium Partners
and roles
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• TU Eindhoven, Netherlands
• TU Delft, Netherlands
• Oclaro Technology Ltd, UK
• LioniX BV, Netherlands
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• Willow Photonics Ltd, UK
• Ficontec Service GmbH, Germany
• TELNET REDES INTELIGENTES SA, Spain
• IMST GmbH, Germany
• Aifotec AG, Germany
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1: TU Eindhoven
Characterize
COBRACOBRACOBRACOBRA
About TU/e:• Photonic integration group part of the COBRA
Research Institute.
• Leading group on design, fabrication and research of InP photonic integrated circuits:
• Development of design libraries
• 800 m2 cleanroom facilities for InP PIC fabrication
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Design
Fabricate
Test structures for:
o Active alignment
o Flip-chip bonding
o RF Carrier
InP Application PIC
Project Tasks:
• Active alignment mapping of TriPleX flexible waveguides
• RF and DC characterization of InP PICs
• Full hybrid assembly characterization
Characterize
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2. TU Delft
About TU Delft:• Department Precision and Microsystems
Engineering (PME), Mechanical Engineering
• PME addresses fundamental questions and application challenges related to technologies, materials and methodologies
– For High-Tech Systems and Scientific Instrumentation
– Introducing the achievements of nano-science into Mechanical Engineering
Project Role:• Development of on-chip MEMS functions for fine
alignment of flexible waveguides
– Design and modelling, e.g. thermal-mechanical
– Realisation in TUD’s clean room facilities
– Mechanical characterisation
• Alignment experiments and performance characterisation
• Transfer of technology and design rules to exploiting
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Past and ongoing work
on Microfabrication and MEMS for photonic alignment
science into Mechanical Engineering • Transfer of technology and design rules to exploiting partners
MEMS for
single fibre
alignment
Passive
chip2chip
alignment
MEMS for
fibre
array
alignment
Chip2chip active
alignment using
flexible waveguides
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3. Oclaro Technology
Project Role:
Develop specification
definition for the assembly –
work package leader setting
assembly process flow
InP Photonic Integrated Circuit
About Oclaro:
Oclaro is one of the world's largest suppliers of optical
components, modules and subsystems for the global
optical communications market. A vertically-integrated
company with a strong technology focus, Oclaro employs
InP PIC technology as a cornerstone of its product strategy.
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InP Photonic Integrated Circuit
(PIC) fabrication on generic
foundry process
PIC technology development
for assembly compatibility
Challenging end user
application in 100G
transmitters and receivers
Monolithic transmitter
chip for tunable XFP
transceiver module
• 1000 chips/wafer
• Batch processed
• 3” InP wafers
• On-wafer tested
• Scalable manufacture
Multi-wavelength
transmitter and optical
switch matrix chips
fabricated for project
partners on InP generic
PIC platform
c/o TU Eindhoven,
University of Cambridge
InP PIC examples …
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4. LioniX
About LioniX: LioniX is a leading provider in co-
development
of products and manufacturing of
components based on cutting-edge
micro/nano-technology for its (OEM)
customers
Application fields
Project Tasks:Photonic functions – Design and Implimmentation in TripleX
Flexible waveguides – Technology devbelopment, T-bar joint
Actuator - Technology development and optimization
Fixing Tools – Implimnetaiton into design and technology
Assembly -0 Adapt Triplex felxiblke waveguides to ASSEMBLY
solution.s
Specific design and implementationTriPleX waveguide
cross-section
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Technology & tools� Low-loss TriPleX waveguide
technology (VIS – NIR)
� Fiber-matched and high-contrast
waveguide integration on single
chip
� Optical characterization tools
Expertise� TriPleX chip fabrication
� Optical waveguide and
functional design
� Fiber-to-chip assembly
� Waveguide characteri-zation
and preliminary circuit testing
Application fields
� (tele)-communication
� bio-medical imaging
� sensing applications
cross-section
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5. Willow Photonics
About Willow Photonics:
• One man consultancy
• Heavily involved in advancing InP-based generic platforms since 2007
• Currently working with partner TU/e to coordinate the PARADIGM FP7 project
Project Role:
• Collaborate in drawing together
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project
• Broad expertise in III-V semiconductor technology particularly InP based transmitters and receivers. Packaging etc
• Collaborate in drawing together
the overall designs and
specifications for the hybrid micro-
assembly
• Dissemination lead
• Support for technical co-ordination
and formal reporting
• Project administration –
coordinator support - member of
the project coordination and
management team.
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6. Ficontec
About ficonTEC:
• ficonTEC designs and produces semi-
and fully automated production and
testing equipment
• ficonTEC is the market leader in the field
of micro-optics such as laser diode
manufacture, optoelectronics, medical
technology, and telecommunications
Laser soldering
Epoxy bonding/UV Curing
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Project Role:
• ficonTEC is responsible for developing,
designing, manufacturing and testing of
the packaging equipment.
• Definition of the requirements for this
kind of new flexible and fast assembly
system
• Focus is on the flexibility of this
production equipment which must
match the flexible approach of the PIC
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technology, and telecommunications
Component placement
AL 500-AA
SEA RC H
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7. TELNET
Project Role:
End user - application in active antennas:
• TELNET is an end-user, setting up the specifications of the InP and TriPleX chips in order to achieve the multi-channel phase-shifter needed for smart beam antennas
• TELNET has also an important role in the
About TELNET:Manufacturer of
Fiber optic cables
BTS antennas
Transport and Broadband Access
equipment
TELNET works onFractal antennas for mobile
phone base stations:
Multiband / Multiservice: 790-960 MHz,
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• TELNET has also an important role in the final characterization and evaluation of the optical coupling between the chips developed for phased array antennas.
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Multiband / Multiservice: 790-960 MHz,
1710-2700MHz
Small dimensions
Low visual impact and camouflaging
Facilitate site sharing
Compact Trisector and Panel Antennas
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8. IMST GmbH
About IMST: Design, engineering and characterization of
• Wireless communications systems
• Radar Systems
• RF & Digital Hardware
• Microelectronics
• Antennas & Active Antenna Systems
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• Antennas & Active Antenna Systems
Application fields
• Short range communication (WiMOD, ZigBee, Bluetooth)
• Mobile communication (GSM, GPRS, UMTS, LTE)
• Satellite communication (GPS, Galileo, Iridium, Inmarsat)
• Radar technology
RF Carrier development (responsible)
• High frequency design �
• Thermal analysis �
• LTCC prototyping
• RF characterisation
Project Role:
Assembly, packaging and integration (support)
• Design of solder pads
• Alignment mark optimisation
• Height difference compensation of the chips
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9. Aifotec
Project Role:
• Perform the hybrid assembly of components
supplied by the consortium
• Work closely with Ficontec on the definition
and operation of the assembly equipment
• Develop the flip-chip assembly process
About Aifotec:
Deep knowledge in:
• Volume assembly
• Process development
• Design for manufacturablilty.
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• Develop the flip-chip assembly process
together with the other packaging partners
• Lead packaging assembly tasks
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Technology & tools:
• Wirebonding
• High precision gluing
• Spot size Laser soldering
• Large area oven based soldering
Oclaro/TUE
IMST
Carrier
TUD/LX
Aifotec / Ficontec