Phase evolution in Cu-Zn powder mixtures subjected to ...cj...Figure 4.20: Cu-48 wt% Zn powder (a)...
Transcript of Phase evolution in Cu-Zn powder mixtures subjected to ...cj...Figure 4.20: Cu-48 wt% Zn powder (a)...
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Phase Evolution in Cu-Zn Powder Mixtures Subjected to
Ultrasonic Powder Consolidation and Ball Milling
A Thesis Presented
By
Azin Houshmand
to
The Department of Mechanical and Industrial Engineering
in partial fulfillment of the requirements
for the degree of
Master of Science
in the field of
Mechanical Engineering
Northeastern University
Boston, Massachusetts
December, 2016
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ABSTRACT
Ultrasonic powder consolidation (UPC) is a novel, low-temperature, rapid powder
consolidation process, capable of producing full-density materials from powders in a few
seconds.
The objective of this work was to investigate the phase evolution in a Cu-Zn
powder mixture subjected to UPC in comparison with that in other high-strain rate
materials processing methods such as ball milling. Systematic UPC experiments were
performed with a Cu-48 wt% Zn powder mixture at nominal consolidation temperatures
of 25 °C to 300 °C, using 20 kHz, 9 m-amplitude ultrasonic vibration applied to the
powder compact for a duration of 1 to 4 s. Optical microscopy and X-ray diffraction
revealed the formation of γ-brass at the interface of Cu and Zn powder particles in the
samples consolidated at or above 200 °C. The γ-brass formation increased with
increasing consolidation temperature and vibration time and approached 70 vol% in a
sample consolidated at 300 °C for 4 s. No new phase formed in a reference sample made
at 300 °C but with no vibration, despite the close contact between Cu and Zn achieved in
the reference sample.
The γ-brass formation in the UPC samples is contrasted by the direct formation of
β-brass in ball-milled composite powders of the Cu-48 wt% Zn composition. The phase
selection in UPC is governed by the local state at the Cu-Zn interface. The high excess
vacancies generated at the Cu-Zn interface enhance the interdiffusion at the Cu-Zn
interface by many orders of magnitude, allowing the interfacial Cu and Zn concentrations
to exceed the normal solubility limits before a new phase can nucleate. This, in turn,
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increases the driving force for the nucleation of γ-brass at the Cu-Zn interface. The
driving for β-brass nucleation does not increase as much because of the large solubility of
Zn in Cu.
Adding a pre-UPC step, such as a heat treatment or ball milling for a very short
time (before any new phase formation is detectable), facilities β-brass nucleation which
then grows in subsequent UPC. This shows the feasibility of β-brass production from
elemental powders in a two-step UPC process.
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ACKNOWLEGEMENT
I would like to express my gratitude to my advisor Professor Ando, who has been
a tremendous mentor for me. I would like to thank him for providing me with the
opportunity to work on this project and his encouragement and guidance during this
project.
Special thanks are due to my colleagues, Dr. Somayeh Gheybi, Dr. Nazanin
Mokarram, Mina Yaghmazadeh, Yangfan Li, Tianyu Hu, Zheng Liu and Gianmarco
Vella in the Advanced Materials Processing Laboratory for their friendship,
encouragement and help along the way.
I would like to thank the Department of Mechanical and Industrial Engineering
for providing me with various forms of support for my research. Special thanks also go to
Jonathan Doughty and William Fowle for all their help during this project.
Last but not least, I would like to express my appreciation towards my family.
Words cannot express how grateful I am to my mother, Shadi, my father, Sadegh and my
brother Farzin for their unconditional love and support. Last but not least, I would like to
thank my love, Behrooz for always being there for me and his incredible help throughout
my education.
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TABLE OF CONTENTS
ABSTRACT ........................................................................................................................ ii
ACKNOWLEGEMENT .................................................................................................... iv
TABLE OF CONTENTS .....................................................................................................v
LIST OF FIGURES .......................................................................................................... vii
LIST OF TABLES ............................................................................................................. xi
1. INTRODUCTION .......................................................................................................1
2. BACKGROUND AND OBJECTIVES .......................................................................3
2.1 Powder Consolidation ................................................................................3
2.1.1. Conventional Powder Metallurgy Techniques ....................................3
2.1.2. Ultrasonic Powder Consolidation (UPC) ............................................6
2.2 Kinetics of Ultrasonic Powder Consolidation ............................................8
2.3 Mechanical Alloying ................................................................................17
2.4 Objectives .................................................................................................19
3. EXPERIMENTAL PROCEDURE ............................................................................20
3.1 Experimental Setup ..................................................................................20
3.1.1. Ultrasonic Powder Consolidation .....................................................20
3.1.2. Ball mill .............................................................................................26
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3.2 Materials ...................................................................................................28
3.3 Experimental Procedure ...........................................................................29
3.4 Metallographic Characterization and Microscopy ...................................33
3.5 Image Analysis .........................................................................................34
3.6 X-Ray Diffraction ....................................................................................35
4. RESULTS AND DISCUSSION ................................................................................36
4.1 Ball Milling of Copper and Zinc Powders ...............................................36
4.2 Ultrasonic Powder Consolidation of Copper and Zinc Powders .............39
4.2.1. Metallographic Characterization .......................................................39
4.2.2. Phase Identification ...........................................................................48
4.2.3. Gamma-brass Growth Kinetics in UPC ............................................50
4.2.4. Phase Evolution .................................................................................55
5. CONCLUSION ..........................................................................................................66
REFERENCES ..................................................................................................................68
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LIST OF FIGURES
Figure 2.1: Generation of vacancies by climb of jogs on screw dislocations [61]. ............ 9
Figure 2.2: Excess vacancy concentrations at various strain rates calculated with the
model presented in [18]. The solid diamonds are NMR data. ......................... 9
Figure 2.3: Voltage-time plot for Al wires subjected to ultrasonic vibration [25]. .......... 10
Figure 2.4: TEM image of Al wire subjected to ultrasonic vibration for 1 s [25]. ........... 11
Figure 2.5: Interface temperature and increase in interface temperature above nominal
joining temperature estimated for ultrasonic joining of Al and Cu [19]. ...... 13
Figure 2.6: Normalized melting point of aluminum vs vacancy mole fraction calculated
using a thermodynamic model [19]. .............................................................. 16
Figure 2.7: SEM image of the featureless region along the Al-Zn weld interface [23]. .. 16
Figure 3.1: Schematic view of the ultrasonic powder consolidation setup....................... 20
Figure 3.2: STAPLA Condor ultrasonic welding unit. ..................................................... 21
Figure 3.3: ST30 Digital controller. .................................................................................. 21
Figure 3.4: Amplitude enhancement of sonotrode. ........................................................... 22
Figure 3.5: Schematic diagrams showing the sonotrode tip [25]...................................... 22
Figure 3.6: Schematic view of the heater plate. ................................................................ 23
Figure 3.7: The heater plate control box. .......................................................................... 24
Figure 3.8: Wiring diagram of the heater and control box [25]. ....................................... 25
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Figure 3.9: Drawing of the die and the punch. ................................................................. 25
Figure 3.10: PQ-N04 planetary ball mill. ......................................................................... 26
Figure 3.11: Stainless steel vacuum grinding jar. ............................................................. 27
Figure 3.12: SEM pictures of as-received (a) Cu powder (b) Zn powder. ....................... 28
Figure 3.13: Cu-Zn phase diagram [82]. ........................................................................... 29
Figure 3.14: The acrylic box connected to an argon gas cylinder. ................................... 30
Figure 3.15: Temperature and pressure profile during the UPC process. ......................... 31
Figure 3.16: The sequence of creating a black and white image. ..................................... 34
Figure 3.17: PANalytical X'Pert PRO XRD instrument at MIT. ...................................... 35
Figure 4.1: Ball-milled copper and zinc powder mixture at room temperature and argon
atmosphere for (a) 1 hour, (b) 5 hours, (c) 10 hours. ................................... 37
Figure 4.2: X-ray diffraction pattern for mechanically alloyed Cu-48 wt% Zn powder
mixture, ball-milled for 10 hours. ................................................................ 38
Figure 4.3: Reference sample made at 300 ºC and under 100 MPa uniaxial pressure. .... 40
Figure 4.4: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under
100 MPa for 1 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e)
250 ºC (f) 300 ºC. ......................................................................................... 44
Figure 4.5: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under
100 MPa for 2 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e)
250 ºC (f) 300 ºC. ......................................................................................... 45
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Figure 4.6: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under
100 MPa for 3 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e)
250 ºC (f) 300 ºC. ......................................................................................... 46
Figure 4.7: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under
100 MPa for 4 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e)
250 ºC (f) 300 ºC. ......................................................................................... 47
Figure 4.8: X-ray diffraction pattern for the specimen consolidated at 100 ºC with 2 s
vibration and under 100 MPa uniaxial pressure. ......................................... 49
Figure 4.9: X-ray diffraction pattern for the specimen consolidated at 300 ºC with 2 s
vibration and under 100 MPa uniaxial pressure. ......................................... 49
Figure 4.10: Volume fraction of Gamma-brass as a function of nominal temperature for
samples made under 100 MPa pressure and 1, 2, 3 and 4 s ultrasonic
vibration. ...................................................................................................... 51
Figure 4.11: Volume fraction of Gamma-brass as a function of vibration time for samples
made under 100 MPa pressure and at 200 ºC, 250 ºC and 300 ºC. .............. 51
Figure 4.12: Cube root of Gamma-brass volume fraction as a function of vibration time
for samples made at 200 ºC, 250 ºC and 300 ºC. ......................................... 52
Figure 4.13: Cube root of Gamma-brass volume fraction as a function of square root of
vibration time for samples made at 200 ºC, 250 ºC and 300 ºC. ...................................... 52
Figure 4.14: Arrhenius plot for Gamma-brass growth...................................................... 54
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Figure 4.15: Optical micrographs of consolidated specimens at 300 ºC with 2 s of
ultrasonic vibration and powder mixture of (a) Cu-10 wt% Zn, (b) Cu-20
wt% Zn, (c) Cu-30 wt% Zn, (d) Cu-40 wt% Zn. ......................................... 56
Figure 4.16: Optical micrographs of consolidated specimens at 300 ºC with 2 s of
ultrasonic vibration after heat treatment process at 100 ºC for (a) 15 min, (b)
30 min, (c) 60 min, (d) 300 min. ................................................................. 57
Figure 4.17: X-ray diffraction pattern for the specimen consolidated at 300 ºC with 2 s
vibration and heat treated at 100 ºC for 300 min. ........................................ 58
Figure 4.18: Gibbs free energy curves for different Zn concentrations in Cu-Zn UPC
samples. ........................................................................................................ 60
Figure 4.19: Gibbs free energy curves for different Zn concentrations and corrected
Gibbs free energy curves for compounds with high excess vacancy
concentration. ............................................................................................... 62
Figure 4.20: Cu-48 wt% Zn powder (a) Heat treated at 100 ºC for 5 minutes (b) Ball-
milled for 5 minutes, then consolidated at 300 ºC with 2 s of ultrasonic
vibration, under 100 MPa uniaxial pressure. ............................................... 64
Figure 4.21: X-ray diffraction pattern for Cu-48 wt% Zn powder heat treated at 100 ºC
for 5 minutes. ............................................................................................... 64
Figure 4.22: X-ray diffraction pattern for Cu-48 wt% Zn ball-milled for 5 minutes. ...... 65
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LIST OF TABLES
Table 3-1: Processing conditions for consolidated Cu-48wt% Zn samples. .................... 32
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1. INTRODUCTION
Ultrasonic welding (USW) is a joining process that uses ultrasonic vibration to
join different materials at low temperatures [1, 2]. USW is applicable to metals, polymers
[3, 4] and ceramics [5] and is widely used in automotive, electronics and semiconductor
industries [6, 7]. Ultrasonic powder consolidation (UPC) is a modified USW in which
ultrasonic vibration and simultaneous uniaxial pressure is applied to consolidate metallic
powders [8-11].
It is known that ultrasonic vibration results in local, high strain rate plastic
deformation in metals [12-14]. Several studies have shown that the excess vacancy
concentration in metals increases drastically above the thermal equilibrium values as a
result of this high strain rate plastic deformation [15-18]. This high excess vacancy
concentration may affect material behavior in three ways, through the effects on diffusion
[8, 19-21], thermodynamic stability [8, 19] and mechanical flow stress [22].
Al-Zn and Al-Cu sheet joining with USW have verified the occurrence of excess
vacancy enhanced diffusion [8, 19]. Gunduz et al. [23] also showed the possibility of
melting point depression across the Al-Zn interface subjected to USW. Another important
phenomenon reported in several studies is the dynamic softening in materials subjected to
ultrasonic vibration [22, 24, 25].
Despite the above mentioned observations and hypotheses, there has been a lack
of fundamental understanding of the mechanisms involved in USW and UPC. The
motivation of this study was to provide a better understanding of thermodynamics and
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kinetics of phase transformation in copper and zinc powder mixture subjected to
ultrasonic vibration by comparing it with another well-understood high strain rate
deformation such as ball milling.
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2. BACKGROUND AND OBJECTIVES
2.1 Powder Consolidation
2.1.1. Conventional Powder Metallurgy Techniques
One of the metal forming processes which has been around for about a century is
powder metallurgy (P/M) [26]. However, it has only been in the past 35 years that this
process gained popularity in mass-producing high quality metal parts. As evidence of its
widespread use, 80% of the total metal powder production in the US in 2005 was for P/M
processes [27]. Major advantages of P/M process such as better control over the
microstructure, facilitating ceramic and metal matrix composite manufacturing,
producing near net shape parts at high material yield and its cost effectiveness have
contributed to this popularity [26].
Any P/M process usually involves four steps: 1) powder manufacturing, 2)
powder mixing, 3) compaction and 4) sintering. During compaction and consolidation,
the particles initially go through a transitional restacking stage where they are rearranged
due to the external forces. Above a certain threshold, the particles start to deform
plastically and fill the voids which further increases the density. Finally, when the
breaking stress of the particles is reached, fragmentation occurs which increases the
density but only slightly. These compaction and consolidation stages are not always
sequential and their significance depends on the ductility of the material [28]. Inherent in
this process is the inevitable porosity in the final part which affects its mechanical,
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thermal and electrical properties and limits its applications [29]. Obviously, full-density
consolidation is desired in most applications and can be achieved through the following
methods: 1) pressure-based consolidation 2) sintering-based consolidation 3) shockwave
consolidation
Pressure-based consolidation
Pressure-based consolidation methods are characterized by the simultaneous
application of high temperature and pressure. Several mechanisms are involved in the
densification such as plastic flow by movement of dislocations and creep [30]. One of the
popular pressure-based methods is hot isostatic pressing (HIP) in which the part is sealed
in a flexible container inside a vessel and high pressure and temperature are applied via a
gaseous medium [31].
As opposed to HIP which applies the pressure in all directions, methods like hot
pressing and hot forging apply uniaxial pressure [32]. However, hot pressing and hot
forging are different from each other in terms of initial powder density, strain rate and
lateral constraint. Also due to the friction with the die walls, these methods usually result
in non-uniform densification [33, 34].
Another method is hot extrusion which is suitable for manufacturing parts with
fixed cross-sectional profile. The ease of extrusion is mostly controlled by the
temperature which should not be too high to alter the microstructure [35].
Overall, all these methods are limited in application due to issues such as
microstructural changes in high temperatures, non-uniform densification, regional
anisotropy and surface contamination [36].
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Sintering-based consolidation
In these methods, high density is obtained through improved green compaction
followed by sintering. In order to improve the green compaction, methods such as axial
cold pressing (ACP), cold isostatic pressing (CIP), roll compaction (RC), powder forging
(PF) and cold powder extrusion (CPE) have been used [28, 37-40]. As improved green
compaction is not enough for achieving a high-density final product, sintering plays an
important role in removal of remaining pores [30, 41]. Removal of isolated pores during
sintering is not always practical due to the dependence on slow diffusional mass
transportation. Full densification can be achieved by liquid phase sintering (LPS) in the
presence of persistent or transient liquid [42, 43]. The downfall to this process is that the
presence of a liquid phase cause structural changes due to the rapid diffusion in the liquid
[26, 32, 42].
Shock wave consolidation
Shock wave consolidation is achieved by a shock wave passing through the
powder and causing the particles to weld rapidly. The shock wave can be generated either
by an accelerated mass striking the powder at high speed (cold dynamic compaction) or
by the detonation of an explosive charge around the powder (explosive compaction). The
high strain rate accompanied by the momentary heating as a result of the shock wave,
cause local melting of the particles leading to rapid, full-density consolidation [44]. The
drawback of this method is its limited applicability to simple geometries and small
volumes, high cost and low production rate [45].
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2.1.2. Ultrasonic Powder Consolidation (UPC)
Ultrasonic powder consolidation (UPC) is an ultrasonic welding (USW) technique
that is used for mainly metallic powder consolidation [8, 9, 25]. USW is a solid-state
joining process applicable to joining sheets, foils and wires, producing metallurgically
bonded joints. This method uses local high-frequency vibration and simultaneous normal
pressure in parts. Parts are placed on a base (anvil) and an ultrasonic probe (sonotrode)
compresses them under a desired normal force, while vibrating at a desired amplitude and
frequency in a direction parallel to the joint plane [46].
The fact that USW is applicable for metals, polymers and ceramics joining and
has the ability to weld dissimilar materials makes it widely practical in automotive and
semiconductor industries [5, 47-50]. USW is also a low cost and high energy efficient
method (85-90% of energy is delivered to the weld zone) and the welding time and
temperature is very low in this process, preventing damage and deformation to the joint.
More importantly, no atmosphere control is required as USW is not sensitive to surface
oxides [51].
USW was developed in Germany in the 1940’s and it was then used industrially
in the 1950’s. The first studies on this topic were done under a US Army contract during
1955-1956 where the design of the ultrasonic welder for the welding of aluminum alloys,
copper and steel joints along with the metallurgical characteristics of the joints were
discussed [46]. Later in 1960’s various studies focused on the fundamentals of bonding in
USW. Frederick [52] concluded that bonding occurs in ultrasonic metal welding as a
result of rapid plastic deformation which breaks up the oxide layer on the metals and
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creates fresh metal surfaces, and then the fresh surfaces are pushed together to atomic
distances leading to the creation of metallic bonding between two surfaces. Gencsoy et al.
also stated that the in copper titanium ultrasonic welding oxide layers were disrupted and
diffusion occurred across the fresh weld interface [53]. Hazlett et al. conducted series of
ultrasonic welding experiments to investigate the bonding mechanism and suggested that
metallurgical bonds could be a result of nascent metal contact across the interface,
mechanical mixing as well as grain boundary diffusion [54]. Although these studies have
discussed the bonding mechanisms in USW, the current understanding is only shallow
and more research has to been done to fully address the bonding mechanisms.
Ultrasonic powder consolidation (UPC), developed at the Advanced Materials
Processing Laboratory (AMPL) [9, 23, 25] is a new UWS technique in which ultrasonic
vibration can produce bulk and metallurgically bonded metal powder consolidates at
temperatures much below the metal’s melting point and in a few seconds, which is not
possible by conventional powder metallurgy techniques [8, 25]. In UPC, simultaneous
application of pressure and vibration at desired temperature promotes particle packing,
deformation and bonding. Short processing time, low operation temperature, low energy
consumption and adaptability to a continues process are some of the advantages of UPC
[8, 9, 22, 55].
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2.2 Kinetics of Ultrasonic Powder Consolidation
In USW and UPC, materials subjected to high-frequency ultrasonic vibration undergo
high strain rate plastic deformation. In the high strain-rate deformation of metals, the
concentration of vacancies stays high [16]. Vacancy mole fractions many orders of
magnitude above the thermal equilibrium value have been estimated in metals subjected
to high strain rate severe plastic deformation by electron microscopy [13, 16, 56, 57],
calorimetry [14], electrical resistivity measurements [14, 25], X-ray diffraction (XRD)
[14] and nuclear magnetic resonance (NMR) [18]. The deformation-induced excess
vacancies are generated by the non-conservative motion of jogs on screw dislocations
[15, 16, 56, 58] and/or possibly by other mechanisms [15, 56, 59, 60] . According to [61],
a trail of vacancies follows the movement of a jogged screw dislocation as shown in
Figure 2.1 This is due to the non-conservative motion of jogs on screw dislocations in
low temperature deformation (˂ 0.4 Tm) [62].
There are three conditions necessary to create a vacancy in this manner. First, the above
mentioned critical stress must be applied within the material. Second, the energy of the
formation of a vacancy must be less than the maximum energy that can be stored in a
bent dislocation. The last condition requires that the created vacancies have enough time
to diffuse away and in to the material to reduce the chance of void formation instead of
individual vacancies [61, 63]. Aluminum has been shown to satisfy these conditions in a
low temperature ultrasonic materials processing (UMP) [8, 64, 65].
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Figure 2.1: Generation of vacancies by climb of jogs on screw dislocations [61].
The vacancy concentration may reach a high value even at lower strain rates as well, if
temperature is sufficiently low. A NMR study by Murty, et al. [18] has shown that the
mole fraction of vacancies (𝑋𝑉) in pure aluminum deforming under tension at a strain rate
of 0.55 s-1
rises above the thermal equilibrium value below about 570 K and reaches a
high plateau value of about 0.1 below about 310 K as shown in Figure 2.2.
Figure 2.2: Excess vacancy concentrations at various strain rates calculated with the model
presented in [18]. The solid diamonds are NMR data.
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The temperature at which 𝑋𝑉 hits the plateau value increases with increasing strain rate.
At a strain rate of 105 s
-1, typical of ultrasonic joining [66, 67], the model presented in
[18] predicts 𝑋𝑉 = 0.1 below about 660 K.
Furthermore, in a another study by Colanto [25], aluminum wires subjected to
ultrasonic vibration, showed an increase in voltage which indicates an increase in
electrical resistivity during the application of ultrasonic vibration, which translates into a
high value of excess vacancies (𝑋𝑉 = 0.06), shown in Figure 2.3. TEM micrograph of
the same aluminum sample (Figure 2.4) reveals numerous vacancy clusters and Frank
loops which further verifies the presence of high excess vacancies in this sample.
Figure 2.3: Voltage-time plot for Al wires subjected to ultrasonic vibration [25].
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Figure 2.4: TEM image of Al wire subjected to ultrasonic vibration for 1 s at 773 K [25].
Such a high value of vacancy concentration translates into diffusivity values that are
several orders of magnitude over the normal values, giving rise to measurable diffusion
distances in ultrasonically joined materials [8, 19, 22], even during such short times.
Since the diffusion coefficient is proportional to vacancy concentration, an
increased diffusivity is expected [62]. This enhanced diffusion rate was demonstrated for
a foreign element during continuous plastic flow by Seitz where vacancies were created
by movement of dislocations [62]. In spite of the increased diffusivity, its magnitude has
been a topic of disagreement in low temperature, high strain rate plastic deformation
processes [20, 21, 68]. According to Ruoff and Ballufi, tracer diffusion studies provided
no reliable correlation between enhanced diffusivity and the increased average vacancy
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concentration. They also reported that enhanced apparent diffusivity is probably due to
crack short circuiting and interface roughness effects, dismissing the claims role of
enhanced lattice diffusion. Nevertheless, their theoretical calculations indicate a much
larger than equilibrium vacancy concentration at 𝑇 = 0.5 𝑇𝑚 and sufficiently high strain
rates (˃10-3
sec-1
) [68].
Despite the body of work strongly suggesting an excess vacancy concentration in
metals undergoing high strain rate plastic deformation and its role in enhanced
diffusivity, there existed little to no experimental data that clearly showed this.
Specifically, high strain rate can cause an increase in temperature, and the effects of this
rise on diffusivity needed to be separated from the effect of excess vacancies on
diffusivity [20].
Hu et al. [19] experimentally determined the interface temperature during the
ultrasonic joining of aluminum and copper, the data showed an increase in the interface
temperature above nominal joining temperature, Figure 2.5
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Figure 2.5: Interface temperature and increase in interface temperature above nominal
joining temperature estimated for ultrasonic joining of Al and Cu [19].
The high diffusivity caused by excess vacancies play an important role in the
metallurgical bond formation in kinetic joining processes. That can be summarized as
below:
Effects on diffusion and flow stress: Formation of metallurgical bond requires
that the mating metal surfaces be fresh with no oxides or contamination and in atomic-
scale proximity and that the atoms at the mating surfaces have sufficient mobility to
adjust their positions required for the crystal boundary being formed. The metallurgical
bond formation in kinetic powder consolidation must occur in the sequence: (1)
macroscopic shape change of powder particles for oxide film disruption and dense
packing, (2) elimination of nano-scale surface asperities and steps at the interface for
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atomic-scale mating surface conformity and (3) atom repositioning at the interface to
configure a crystal boundary. The overall rate of metallurgical bond formation is limited
by the slowest of the three steps, although these steps may overlap.
Steps 1 and 2 both require plastic deformation and hence would depend on the
local flow stress of the material. A recent study on UPC of copper powder by Liu [55]
has shown that both compact densification (i.e., deformation) and metallurgical bonding
(of deformed particles) depended on consolidation temperature and time and hence are
thermally activated processes. Moreover, UPC can produce full-density, metallurgically
bonded consolidates within a few seconds at moderate temperatures [8, 22, 69]. All these
findings suggest that the material subjected to ultrasonic deformation does not work
harden as much as in conventional deformation processing and may even dynamically
soften by some unknown mechanism. This phenomenon, referred to as ultrasonic
softening, was originally proposed by Langencker [24] and has been observed in other
studies [1, 16, 25, 64]. Langencker believed that ultrasound energy absorbed by
dislocations will raise temperature at the dislocations, lowering the local flow stress,
however, he never considered the effect of excess vacancies on the rate of dislocation
climb. He suggested that dislocations may obtain thermal jogs but they may not move or
intersect. This assumption however, contradicts his observation of increased dislocation
density in his tensile test specimens [24]. Awatani et al. [16] on the other hand, did
address possible excess vacancy generation in their study of ultrasonic fatigue tests on
aluminum.
It is known that excess vacancies exert an osmotic climb force on the edge
component of dislocations. This osmotic climb force acts as an effective pressure, which
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exceeds 1100 MPa at excess vacancy concentrations around 100 times higher than the
equilibrium concentration. This significantly increases the dislocation climb velocity. An
analysis based on vacancy diffusion-controlled dislocation climb under no applied stress
yields an equation for the climb velocity 𝑣𝑐 in a crystal containing excess vacancies,
𝑣𝑐 ≈ 𝐷𝑉𝑋𝑉/𝑏 , where b is the Burgers vector, 𝐷𝑉 is the vacancy diffusivity, and 𝑋𝑉 is the
excess vacancy mole fraction [70]. It has been known that 𝑋𝑉 in high strain-rate
deformation may reach 10-4
~ 10-1
[18, 25, 56], dislocations can climb at velocities
significantly higher than normal climb velocity, encouraging rapid untangling and
annihilation of dislocations [22].
Effects on phase stability: A high vacancy concentration may also affect the
thermodynamic stability of the solid relative to that of the liquid, possibly causing
melting below the equilibrium melting point. For aluminum, melting point may be
depressed by as much as 400 K at a vacancy concentration of 0.1 [19], Figure 2.6. Such
strain-induced melting point depression would play an important role in the bond
formation in kinetic joining processes, particularly if the interface temperature exceeds
the depressed melting temperature. Gunduz et al. [23] in an ultrasonic welding
experiment of aluminum and zinc, observed featureless areas along the weld zone,
indicating incidence of local melting, Figure 2.7. The joining temperature was 513 K and
no temperature increase was monitored by the thermocouple during the experiment. This
suggests the melting point depression as a result of high excess vacancies.
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Figure 2.6: Normalized melting point of aluminum vs vacancy mole fraction calculated
using a thermodynamic model [19].
Figure 2.7: SEM image of the featureless region along the Al-Zn weld interface [23].
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2.3 Mechanical Alloying
Mechanical alloying (MA) is a solid-state powder processing technique that
occurs by repeated fracturing and rewelding of the particles of a powder mixture in a ball
mill [71]. This technique was originally developed in 1970’s for oxide-dispersion
strengthened (ODS) super alloys production and since then has been widely used for
synthesizing wide ranges of equilibrium and non-equilibrium alloy phases from elemental
or pre-alloyed powders [72].This process is carried out in different types of ball mills
such as vibratory mills, attrition mills, planetary mills or conventional ball mills.
During ball milling the powder particles are constantly fractured, flattened, and
cold welded. A mixture of powders and grinding media with variable ball to powder
ratios is used. The impact force due to collision of two balls in the mill deforms the
trapped powder particles, leading to work hardening and fracture. As a result of particle
fracture, new surfaces are created, enabling the particles to weld together. In the early
stages of ball milling, the powder particles are relatively soft, thus, the tendency to
welding together and forming larger particles is high. The resulting composite particles at
this stage have a characteristic layered structure of various concentrations of the starting
compositions. As the process continues, the particles get work hardened and undergo
fracture and fragmentation [71, 73, 74].
Currently, MA methods are proven to be successful for producing novel materials
and structures, however, the limitations of this method are mainly the low efficiency and
a lack of adequate models to predict the final outcome of this process [75-77].
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The current models for MA by ball milling have not addressed all aspects of the
process properties and structure relationships in MA, however, different models did their
parts in addressing some of these aspects. The model presented in [78] only addresses the
individual particle impacts as hertzian collision and evaluated the hardening and strains in
particles as a function of their collision speed. It was assumed that some of the impact-
welded particles were broken as a result of residual stresses while some remained welded.
So to estimate the average particle size after ball milling, criteria for stress, fracture
initiation and propagation were used. Aikin et al. expressed the reaction kinetics in terms
of the probabilities of welding and fracture between particles [79, 80]. This model was
then fitted to experimental results. The model in [81] used an energy criterion to further
explain the phase transformations during ball milling. Also using the same model, Magini
et al. [73] were able to predict the final phases after ball milling. Despite the above
mentioned models, the fundamental principles and thermodynamics of microstructure
evolution and phase transformation during ball milling are not yet fully understood.
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2.4 Objectives
This study was aimed at understanding the phase evolution in Cu and Zn
elemental powder mixture subjected to UPC in comparison with other high-strain rate
materials processing methods such as ball milling. Systematic UPC and ball milling
experiments were carried out with a Cu-48 wt% Zn powder mixture. Optical microscopy,
image analysis and XRD were done on specimens to investigate the microstructure and
phase evolution with particular interest in the unusual effects of excess vacancies on the
thermodynamics and kinetics of phase transformation in UPC and ball milling.
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3. EXPERIMENTAL PROCEDURE
3.1 Experimental Setup
3.1.1. Ultrasonic Powder Consolidation
The apparatus used in this study is a CONDOR ultrasonic welding unit shown in
Figure 3.1 and Figure 3.2 manufactured by STAPLA Ultrasonic Corporation,
Wilmington, MA. This welder operates at a maximum power of 3.5 kW and a fixed
frequency of 20 kHz. The unit consists of a controller, a converter, an ultrasonic
sonotrode and a booster. The high frequency signals are transmitted to the converter
through the controller unit shown in Figure 3.3 and the booster unit amplifies and
transmits the resulting vibrations to the ultrasonic sonotrode as shown in Figure 3.4 . The
amplitude of the vibration can be varied between 4-9 µm.
Figure 3.1: Schematic view of the ultrasonic powder consolidation setup.
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Figure 3.2: STAPLA Condor ultrasonic welding unit.
Figure 3.3: ST30 Digital controller.
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Figure 3.4: Amplitude enhancement of sonotrode.
The sonotrode is made of high speed tool steel and has a 3680 µm x 3680 µm
square tip with a 14 x 14 grid of square knurls spaced 100 µm apart. Each knurl is a 150
µm x 150 µm square as shown in Figure 3.5.
Figure 3.5: Schematic diagrams showing the sonotrode tip [25].
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A heater plate was designed to allow experiments at elevated temperature. Two
high temperature cartridge heaters from McMaster (6.28 mm in diameter, 51 mm in
length and 250 W in power) are inserted in a stainless steel plate along with a K-type
thermocouple probe from OMEGA as shown in Figure 3.6. The cartridge heaters have a
stainless steel armored lead covering and a maximum operating temperature of 760 ºC
(1033 K).
Figure 3.6: Schematic view of the heater plate.
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This setup is connected to a computer through a control box shown in Figure 3.7
and a National Instruments PCI-6035e DAQ board. A computer program, coded in
LabView 8.6, acquires the temperature data from the thermocouple and controls the
temperature of the cartridge heaters to ensure that the set temperature is reached. This
program records the temperature data at a rate of 1000 data points per second.
Additionally, an external K-type thermocouple is used to further monitor the specimen
temperature during each experiment. Figure 3.8 shows the detailed wiring diagram of the
heater and control box.
Figure 3.7: The heater plate control box.
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Figure 3.8: Wiring diagram of the heater and control box [25].
In order to consolidate the specimen, UPC experiments employ a die-punch setup
made of A2 tool steel hardened to minimize high temperature deformation. The die and
punch are 2 mm and 3.5 mm thick, respectively, and have a matching diameter of 4.1
mm.
Figure 3.9: Drawing of the die and the punch.
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3.1.2. Ball mill
The ball mill used in this study is a PQ-N04 planetary ball mill from Across
International with a maximum speed of 600 rpm. This ball mill has four grinding stations
placed on a Sun Wheel as shown in Figure 3.10.
Figure 3.10: PQ-N04 planetary ball mill.
In this study a 100 ml stainless steel vacuum grinding jar was used as shown in
Figure 3.11. The pre-mixed powders and stainless steel grinding balls with 10 mm
diameter purchased from McMaster were placed inside the grinding jar and the jar was
then evacuated and backfilled with argon gas to ensure an inert atmosphere. A ball to
powder mass ratio of 10 to 1 was selected for the ball milling experiments.
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Figure 3.11: Stainless steel vacuum grinding jar.
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3.2 Materials
The materials used in this study were copper and zinc powders with 5 µm and 75
µm mean diameter, respectively. The copper powder was obtained from Fukuda Metal
Foil and Powder Co. LTD. and the zinc powder was purchased from Alfa Aesar. SEM
micrographs of the as-received powders are shown in Figure 3.12.
Figure 3.12: SEM pictures of as-received (a) Cu powder (b) Zn powder.
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3.3 Experimental Procedure
A mixture of Cu-48 wt% Zn was prepared and dry mixed in a rotary plastic
container for 3 hours to ensure a homogenous distribution. Systematic UPC experiments
with powder mixture of Cu-48 wt% Zn composition were conducted to investigate the
effects of ultrasonic vibration on the microstructural evolution of specimens.
As seen in the Cu-Zn phase diagram is in Figure 3.13, the Cu-48 wt% Zn powder
mixture composition was chosen such that the consolidated material lies in the -brass
region.
Figure 3.13: Cu-Zn phase diagram [82].
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In order to consolidate a sample, the die was first placed on the heater plate. Then,
approximately 0.1 g of powder mixture was placed in the die and finally the punch was
positioned on top of the die. The whole setup was then placed under an acrylic (Plexiglas)
box with tubing connected to an argon gas cylinder to avoid oxidation during the
experiment by providing a flowing argon bath as shown in Figure 3.14.
Figure 3.14: The acrylic box connected to an argon gas cylinder.
The powder mixture was then heated to the consolidation temperature. Once the
system was reached the desired temperature the die-punch setup was subjected to normal
pressure applied through the sonotrode to the punch. Then the whole setup was kept at
the consolidation temperature for a few minutes under the applied pressure, to make sure
the temperature distribution was uniform in the die-punch setup. Soon after the holding
time was over, in-plane ultrasonic vibration was applied through the sonotrode and punch
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for a few seconds (1-4 s). Once the process was over and the consolidated sample was
cooled down enough, the sample was removed from the die. Figure 3.15 shows the
heating-cooling profile as well as the pressure profile for each sample, during the UPC
process.
Figure 3.15: Temperature and pressure profile during the UPC process.
The pre-mixed powder mixture was subjected to ultrasonic vibration in the argon
atmosphere for 1, 2, 3 and 4 s at the nominal consolidation temperature ranging from
room temperature to 300 ºC (573 K) and under 100 MPa uniaxial pressure. For all the
experiments, the amplitude of ultrasonic vibration was kept at 9 µm. A reference sample
was also made at 300 ºC (573 K) under identical pressure and temperature conditions but
without ultrasonic vibration to compare and investigate the effect of ultrasonic vibration
on phase transformation.
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The processing conditions used for sample consolidation are summarized in Table 3-1.
Table 3-1: Processing conditions for consolidated Cu-48wt% Zn samples.
# Temperature (ºC) Vibration Time (s) Pressure (MPa)
1 RT 1 100
2 100 1 100
3 150 1 100
4 200 1 100
5 250 1 100
6 300 1 100
7 RT 2 100
8 100 2 100
9 150 2 100
10 200 2 100
11 250 2 100
12 300 2 100
13 RT 3 100
14 100 3 100
15 150 3 100
16 200 3 100
17 250 3 100
18 300 3 100
19 RT 4 100
20 100 4 100
21 150 4 100
22 200 4 100
23 250 4 100
24 300 4 100
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3.4 Metallographic Characterization and Microscopy
The consolidated specimen was mounted in an acrylic resin and cured for 1 hour
at room temperature. Metallographic specimen preparation was performed on the samples
to allow sample observation under an optical microscope. For this process a Buehler
ECOMET 5 two speed grinding/polishing table was used. First, the sample was ground
in several steps on SiC abrasive papers with continuously reducing abrasiveness. The grit
sizes used were 240, 400, 600, 1000, 1500 and 2000. This process is continued until all
previously visible scratches were removed and the finest possible surface condition was
achieved. Between the grinding steps, the specimen was rinsed with tap water to reduce
the risk of contamination. After grinding, the specimen was polished on a rotating wheel
using a final polish-blue color-medium nap cloth purchased from Mark V laboratory. A
solution consisting of 1.0 µm alumina (aluminum oxide) powder suspended in distilled
water was used as an abrasive material which aids the scratch removal from the surface
of the sample. To obtain the best surface quality, the sample was then successively
polished with 0.3 µm and 0.05 µm alumina suspensions. Finally the prepared sample was
metallurgically characterized under an Olympus VANOX-T optical microscope with the
highest magnification of 1000x.
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3.5 Image Analysis
Image analysis was performed on the resulting micrographs to determine the areal
fractions of phases formed during the UPC process.
First, using the Photoshop software, the image was transformed to a binary image
such that it contained only two colors. The new phase formed in the UPC process was
kept in its original light blue color while copper and zinc particles are transformed to a
darker color. This image was then converted to a black and white image using the ImageJ
software. The area fraction of the new phase can be easily calculated as the number of
white pixels divided by the total pixel count in the image as shown in Figure 3.16.
Figure 3.16: The sequence of creating a black and white image.
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3.6 X-Ray Diffraction
X-ray diffraction (XRD) was carried out to investigate the phase changes in ball-
milled and UPC-consolidated Cu-Zn samples. XRD patterns were obtained for various
ball-milled and UPC samples using a PANalytical X'Pert PRO diffractometer with Cu kα
(λ=0.15418 nm) incident radiation at a scanning rate of 5º/min located at the Center for
Materials Science and Engineering (CMSE) at the Massachusetts Institute of Technology
(MIT), shown in Figure 3.17.
Figure 3.17: PANalytical X'Pert PRO XRD instrument at MIT.
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4. RESULTS AND DISCUSSION
4.1 Ball Milling of Copper and Zinc Powders
Systematic ball milling experiments were performed on Cu-48 wt% Zn pre-mixed
powder mixture with ball milling durations of 1, 5 and 10 hours. Figure 4.1 shows optical
micrographs of the cross sections of composite powder particles from the three batches.
The three samples all show an outer region in yellowish color and a core regions
consisting of thin reddish and light blue alternating layers and some dark holes between
the layers. The thickness of the yellowish outer region is seen to increase with increasing
ball-milling time. A close look at the core regions of the samples reveals that some parts
of the core region has also turned yellow, which is most clearly seen in the sample ball
milled for 10 h.
Figure 4.2 shows the XRD pattern of the sample ball milled for 10 h. Three
phases are identified; the fcc Cu-rich solid solution (-brass), the hcp Zn-rich solid
solution and bcc -brass. From the colors of the phases seen in Figure 4.1, it is deduced
that the yellowish phase that formed in the outer region of the samples, and also in the
core region as evident in the sample ball milled for 10 h, is bcc -brass, and the reddish
and light blue layers in the core region of the samples are, respectively, the fcc -brass
phase and the hcp Zn-rich solid solution. This suggests that during the ball milling of Cu
and Zn powder mixture, thin alternate layers of Cu and Zn were first produced by
repeated deformation and welding, which then promoted interdiffusion and hence
formation of the intermediate phase -brass between the welded Cu and Zn layers. As
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seen in Figure 4.1, this process is complete in the outer regions of the samples whereas in
the core regions where much of the elements still remained unreacted as -brass and the
Zn-rich solid solution. It is also seen that the outer -brass layer thickened with
increasing ball-milling time, while the amount of -brass increased in the core region as
well. The fact that the outer layers of the samples are all yellow in one color suggests that
the outer layer must consist of a single phase that has the Cu-48 wt% Zn composition,
which cross-verifies that the yellow phase is -brass.
Figure 4.1: Ball-milled copper and zinc powder mixture at room temperature and argon
atmosphere for (a) 1 hour, (b) 5 hours, (c) 10 hours.
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Figure 4.2: X-ray diffraction pattern for mechanically alloyed Cu-48 wt% Zn powder
mixture, ball-milled for 10 hours.
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4.2 Ultrasonic Powder Consolidation of Copper and
Zinc Powders
Systematic UPC experiments were conducted under the conditions shown in
Table 3-1 to investigate the phase evolution in a Cu-48 wt% Zn powder mixture during
UPC.
4.2.1. Metallographic Characterization
In addition to the UPC specimens prepared under the conditions in Table 3-1, a
reference sample was first made at 300 ºC and under 100 MPa uniaxial pressure but with
no ultrasonic vibration. Figure 4.3 shows a micrograph of the reference sample where
reddish Cu particles are seen to form a network and Zn fills the cells in the network. The
individual particles of Cu in the Cu network are discernible and largely in their original
spheroidal shape, indicating a low degree of compact densification in the Cu network.
We note also some holes in the Cu network. They were created during sample
preparation which indicates a lack of bonding among the Cu particles. Thus, the
conditions applied, i.e., 300 ºC, 100 MPa and no ultrasonic vibration, did not produce
good metallurgical consolidation of the Cu particles in the Cu network. The densification
of the Zn particles in the cells, however, is more complete. Individual Zn particles are
hardly discernible, and no voids or gaps are visible in the Zn-filled cells, up to the
interface with the Cu network.
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Despite the intimate contact between Cu and Zn at their interface, no new phase
formed in the reference specimen which was produced at 300 °C, but without ultrasonic
vibration. Thus there was not enough interdiffusion to allow for diffusional
transformations in the reference sample under the condition applied.
Figure 4.3: Reference sample made at 300 ºC and under 100 MPa uniaxial pressure.
Figure 4.4 - Figure 4.7 show micrographs of samples consolidated at nominal
temperatures of 25, 100, 150, 200, 250 and 300 ºC with 1, 2, 3 and 4 s of ultrasonic
vibration. Overall, the samples all exhibit a network of Cu regions and Zn-filled cells as
in the reference sample, but with increasing degrees of particle densification at higher
consolidation temperature and time. Moreover, a new phase formed between Cu and Zn
which became evident above about 150 °C regardless of ultrasonic vibration time.
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In the samples consolidated at room temperature, micrographs (a) of Figure 4.4 -
Figure 4.7, individual Cu particles are discernible, many of which were lost from the
polished surface of the samples during sample preparation. Thus, little densification or
bonding of Cu particles was achieved at room temperature, regardless of the ultrasonic
vibration time applied. A higher degree of densification, and most probably bonding, of
Zn particles is achieved even at room temperature. However, there is no indication of
phase transformation in the samples consolidated at room temperature.
The samples consolidated at 100 °C, micrographs (b) of Figure 4.4 - Figure 4.7,
exhibit higher degrees of densification in the Cu region, as well as full densification in
the Zn region. The individual Cu particles in these samples are still largely discernible
and some Cu particles have even come off the polished surface during sample
preparation. The Cu region became more intact as the ultrasonic vibration time was
increased, with virtually full densification achieved at 4 s. This suggests that densification
depended on both the vibration time temperature. No evidence of phase transformation is
noted in these specimens consolidated at 100 °C.
Even higher degrees of consolidation are observed in the Cu regions of the
samples consolidated at 150 °C, micrographs (c) of Figure 4.4 - Figure 4.7, where good
metallurgical consolidation of Cu and Zn particles also seems to be achieved at 2 s and
longer times. At 1 s, however, some Cu particles are still discernible. While the
achievement of full densification does not necessarily guarantee good metallurgical
bonding in the consolidated sample, the absence of particle detachment during sample
preparation implies good bonding in the Cu regions of the samples consolidated for 2 s
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and longer. Thus, both the densification and bonding in the Cu region (network) are time-
dependent processes. Still no new phase is found in these samples consolidated at 150 °C.
The samples consolidated at 200 °C, micrographs (d) of Figure 4.4 - Figure 4.7,
exhibit well-consolidated Cu and Zn regions, except at the shortest consolidation time of
1 s applied, at which the Cu particles are still somewhat discernible. Thus, the thermal
activation at 200 °C was sufficient for rapid metallurgical consolidation of Cu particles to
complete within 1+ s. Furthermore, a new phase has just appeared at the interface
between the Cu and Zn regions. The new phase, appearing in gray in the micrographs,
just formed in the sample consolidated for 1 s, Figure 4.4(d), and increased significantly
with increasing ultrasonic vibration time, Figure 4.5(d), Figure 4.6(d) and Figure 4.7(d).
More extensive formation of the new phase occurred in the samples consolidated
at 250 °C, micrographs (e) of Figure 4.4 - Figure 4.7. The gray new phase has just
covered most of the Cu-Zn interface as early as 1 s. At 2 s, the new phase has formed a
well-developed continuous layer between the Cu and Zn regions, which further thickened
into the Cu and Zn regions over the next 2 s. At 4 s, the new phase has grown to consume
most of the Zn and much of the Cu. A close look at the gray new phase regions in these
samples reveals dark features that appear to coincide with the prior inter-particle
boundaries in the Cu regions.
The samples consolidated at 300 °C, micrographs (f) of Figure 4.4 - Figure 4.7,
exhibit a well-developed layer of the gray phase even at the shortest consolidation time of
1 s. At 4 s, the gray new phase has consumed almost all of the remaining Zn. The dark
features noted in the samples consolidated at 250 °C are more clearly seen in the samples
consolidated for 1 - 3 s. The matching between the dark features and the prior boundaries
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of Cu particles is very evident in the samples consolidated for 2 s and 3 s, Figure 4.5(f)
and Figure 4.6(f). Careful observation of the gray new phase regions reveals that most of
these dark features are terminated at a certain distance from the interface with the
remaining Cu. This implies that the gray new phase regions that contain the dark features
were created by the diffusion of Zn into the Cu and that the gray regions that extend
beyond the position at which the dark features are terminated were created by the
diffusion of Cu into the Zn. The dark features in the gray new phase regions are largely
erased in the sample consolidated at 300 °C for 4 s, Figure 4.7(f).
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Figure 4.4: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under 100
MPa for 1 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e) 250 ºC (f) 300 ºC.
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Figure 4.5: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under 100
MPa for 2 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e) 250 ºC (f) 300 ºC.
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Figure 4.6: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under 100
MPa for 3 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e) 250 ºC (f) 300 ºC.
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Figure 4.7: Optical micrographs of Cu-48 wt% Zn powder mixture consolidated under 100
MPa for 4 s at (a) room temperature (b) 100 ºC (c) 150 ºC (d) 200 ºC (e) 250 ºC (f) 300 ºC.
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4.2.2. Phase Identification
The new phase that formed above 150 °C was identified by XRD as -brass, an
equilibrium phase of the Cu-Zn phase system that has the nominal composition of
Cu5Zn8, Figure 3.13. Figure 4.8 and Figure 4.9 show the XRD patterns of the sample
consolidated at 100 °C for 2 s and the sample consolidated at 300 °C for 2 s, respectively.
The XRD pattern of the sample consolidated at 100 °C, Figure 4.8, shows only the fcc Cu
(-brass) and hcp Zn reflections. Thus, no new phase formed in this sample consolidated
at 100 °C, as expected from the micrograph in Figure 4.5(b). The XRD pattern of the
sample consolidated at 300 °C, Figure 4.9, however, shows additional peaks that are
indexed as reflections. Thus, the new phase in Figure 4.5(f) must be -brass. Since the
new phase that formed in all other UPC samples consolidated at/above 200 °C also was
in the same gray color, it is deduced that -brass was the only new phase that formed in
all of the UPC samples consolidated at/above 200 °C, despite the Cu-48wt%Zn
composition of the powder mixture at which -brass is the phase expected in the eventual
equilibrium state.
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Figure 4.8: X-ray diffraction pattern for the specimen consolidated at 100 ºC with 2 s
vibration and under 100 MPa uniaxial pressure.
Figure 4.9: X-ray diffraction pattern for the specimen consolidated at 300 ºC with 2 s
vibration and under 100 MPa uniaxial pressure.
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4.2.3. Gamma-brass Growth Kinetics in UPC
As seen from the micrographs in Figure 4.4 - Figure 4.7, the-brass formation
was observed only in the samples consolidated at 200 °C and above. The volume fraction
of the -brass in the UPC samples was determined by the image analysis described in
Section 3.4. Figure 4.10 shows the volume fraction of -brass against the nominal
consolidation temperature for the vibration times of 1 - 4 s. Figure 4.11 re-plots Figure
4.10 to show the increase in -brass volume fraction with time at 200, 250 and 300 °C.
Clearly, the volume fraction of -brass increased with increasing temperature and time.
To investigate the rate-limiting step of the -brass growth, the cube root of the
volume fraction was plotted against the vibration time. The resultant growth curves
shown in Figure 4.12 imply a parabolic growth, which is indicative of diffusion-
controlled growth. In fact, when the cube root of the volume fraction is re-plotted
against the square root of vibration time, the resultant plots are nearly linear, Figure 4.13.
Thus, the growth of -brass in the UPC samples seems to be diffusion-controlled.
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Figure 4.10: Volume fraction of Gamma-brass as a function of nominal temperature for
samples made under 100 MPa pressure and 1, 2, 3 and 4 s ultrasonic vibration.
Figure 4.11: Volume fraction of Gamma-brass as a function of vibration time for samples
made under 100 MPa pressure and at 200 ºC, 250 ºC and 300 ºC.
0 50 100 150 200 250 3000
10
20
30
40
50
60
70
Nominal Consolidation Temperature ( C)
Vo
lum
e F
racti
on
of
the
co
mp
ou
nd
(%
)
1 s
2 s
3 s
4 s
0 1 2 3 40
10
20
30
40
50
60
70
Vibration Time (s)
Vo
lum
e F
racti
on
of
the
Co
mp
ou
nd
(%
)
200 C
250 C
300 C
y=-0.4286x2+6.7143x-0.0571
y=-0.5714x2+14.286x+0.0571
y=-0.2143x2+17.157x+0.9714
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Figure 4.12: Cube root of Gamma-brass volume fraction as a function of vibration time for
samples made under 100 MPa pressure and at 200 ºC, 250 ºC and 300 ºC.
Figure 4.13: Cube root of Gamma-brass volume fraction as a function of square root of
vibration time for samples made under 100 MPa pressure and at 200 ºC, 250 ºC and 300 ºC.
0 1 2 3 40
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (s)
Cu
be
Ro
ot
of
Co
mp
ou
nd
Vo
lum
e F
racti
on
200 C
250 C
300 C
1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 21.5
2
2.5
3
3.5
4
4.5
Square Root of Time (s-2
)
Cu
be
Ro
ot
of
Co
mp
ou
nd
Vo
lum
e F
racti
on
200 C
250 C
300 C
y=1.3396x+1.3603
y=0.8911x+0.9658
y=1.2337x+1.1964
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The kinetic equation for the diffusion-controlled growth of a phase in a material
has the general form:
𝑥 = 𝛼√𝐷𝑡 (1)
Where x is the growth distance, D is the diffusivity of the element whose diffusion is
limiting the growth kinetics, t is the growth time and α is a factor that depends on the far-
field and interfacial concentrations of the element in concern.
Since the -brass region in the Cu-Zn phase diagram is narrow and nearly vertical,
Figure 3.13, the value of α for the growth of -brass is not strongly dependent on
temperature. We may assume that the cube root of the volume fraction crudely
represents the growth distance x in our case. We may also assume that the vibration time
is the growth time. Then, the slope of the cube root of the volume fraction plot vs. t1/2
in
Figure 4.13 may be regarded as 𝛼√𝐷, the rate constant in Eq. (1). Therefore, plotting the
logarithm of the slope against the inverse of the temperature in Kevin may yield a straight
line. In the absence of knowledge of the exact temperature in the material being
consolidated, we use the nominal consolidation temperature as the actual temperature in
the material during UPC, although this is not strictly correct [19].
Figure 4.14 shows the Arrhenius plot obtained in the manner described above
which gives an activation energy of 18,660 J/Mol. This value of activation energy is in a
range comparable to the activation energy of Zn in a dilute Cu-Zn solution which is
reported to be 191 kJ/Mol [83] and that of the diffusion in Cu in a dilute Zn-Cu solution
which is about 125 kJ/Mol [83].
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The above analysis based on Eq. (1) requires a constant interfacial concentration.
This, however, is not guaranteed in UPC where the interfacial concentrations may not be
limited at the equilibrium solubilities. Moreover, the excess vacancies are not thermally
generated, and as such the activation energy of substitutional diffusion is not necessarily
the same as the sum of the activation energies of vacancy jump and formation. Further
work is needed to more correctly address the kinetics of -brass growth in the UPC of
Cu-Zn powder mixture.
Figure 4.14: Arrhenius plot for Gamma-brass growth.
1.7 1.8 1.9 2 2.1
x 10-3
-0.1
0
0.1
0.2
0.3
Time-1
(s-1
)
ln(s
lop
e)
y=-1122.2x+2.2879
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4.2.4. Phase Evolution
The formation of -brass from Cu and Zn powders in the UPC samples is
contrasted by the direct formation of -brass from Cu and Zn in the ball milled composite
powders shown in Figure 4.1. Since the Cu5Zn8 composition of -brass differs from the
Cu-48wt%Zn composition of the powder mixture, the UPC samples have not reached the
final equilibrium state expected at the Cu-48wt%Zn composition.
In order to investigate the effect of powder mixture composition on the phase
formation in the UPC of Cu-Zn powder mixture, additional UPC experiments were
carried out with powder mixtures of 10 wt% Zn, 20 wt% Zn, 30 wt% Zn and 40 wt% Zn
compositions. The samples in these experiments were all consolidated at 300 ºC for 2 s of
ultrasonic vibration under 100 MPa uniaxial pressure. Figure 4.15 shows optical
micrographs of these samples in which formation of gray colored -brass between the Cu
and Zn regions is evident, even in the sample with only 10 wt% Zn. Increasing the zinc
concentration only produced higher volume fractions of -brass. Thus -brass was the
phase that nucleated and grew in the UPC of Cu-Zn powder mixture, regardless of the Zn
content in the powder mixture. No -brass formation is noted in these specimens.
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Figure 4.15: Optical micrographs of consolidated specimens at 300 ºC with 2 s of ultrasonic
vibration, under 100 MPa uniaxial pressure and powder mixture of (a) Cu-10 wt% Zn, (b)
Cu-20 wt% Zn, (c) Cu-30 wt% Zn, (d) Cu-40 wt% Zn.
The above results suggest that the phase selection in UPC Cu-Zn is not affected by
the global chemical state of the material. Rather, it is an event governed by the local state
at the Cu- Zn interface in the powder mixture. -brass, however, is not a stable phase in
samples with overall chemical compositions less than about 50 wt% Zn, Figure 3.13. The
stable phases should be -brass in the samples with 10, 20 and 30 wt%Zn, -brass and -
brass in the samples with 40 wt%Zn, and -brass in the samples with 48 wt%Zn. This
was confirmed by heat treatment experiments of samples with 48 wt%Zn consolidated at
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300 °C for 2 s under 100 MPa pressure. Figure 4.16 shows micrographs of the samples
after heat treatment at 100 °C for 15, 30, 60 and 300 minutes where -brass formed
between the remaining Cu and the -brass and increased with increasing heat treating
time. At 300 minutes, the -brass has grown to occupy the entire volume of the sample,
which in turn verified the overall Cu-48 wt%Zn composition of the sample. XRD also
confirmed the complete transformation to b brass in this sample, Figure 4.17.
Figure 4.16: Optical micrographs of consolidated specimens at 300 ºC with 2 s of ultrasonic
vibration, under 100 MPa uniaxial pressure after heat treatment process at 100 ºC for (a) 15
min, (b) 30 min, (c) 60 min, (d) 300 min.
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As shown in Figure 4.16, after heat treating the sample at 100 ºC for 15 min, the
-brass starts to grow at the interface of copper rich phase and -brass. As the heat
treatment time increases, the amount of -brass becomes more significant and finally
after 300 min of heat treatment the whole sample transforms to -brass. The XRD result
shown in Figure 4.17 confirms this observation.
Figure 4.17: X-ray diffraction pattern for the specimen consolidated at 300 ºC with 2 s
vibration and under 100 MPa uniaxial pressure and heat treated at 100 ºC for 300 min.
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The selection of -brass, instead of -brass, as the phase to nucleate at the Cu-Zn
interface seems unique to the UPC process as it was the -brass that formed in ball milled
Cu-Zn powder mixtures, Figure 4.1. Since there was no -brass in the UPC-consolidated
Cu-Zn samples, -brass nucleation must have been exclusively more active than -brass
nucleation.
This may be explained with the Gibbs free energy curves, or G curves, in Figure
4.18 schematically drawn for the temperature of the sample during UPC. Although the
equilibrium Cu-Zn phase diagram, Figure 3.13, has another intermediate phase, , that is
stable below 598 °C, G curves are shown only for-brass, -brass, -brass phases and
the hcp Zn-rich solution since no phase was observed in the samples. The G curve of -
brass, 𝐺𝛼, is wide reflecting the large solubility of Zn in -brass, whereas the G curves
for -brass and -brass, 𝐺𝛽 and 𝐺𝛾, are narrow to match with their narrow composition
ranges. The G curve of the hcp Zn-rich solution, 𝐺(𝑍𝑛) must also be narrow as expected
from the limited equilibrium solubility of Cu in Zn.
When a Cu-Zn powder mixture is subjected to UPC, interdiffusion causes a rapid
increase of the concentration of Cu in the Zn and the Zn concentration in the Cu at the
Cu-Zn interface. Since the substitutional diffusivity is proportional to vacancy
concentration, the diffusivity is increased over the normal value by a factor of 𝑋𝑉𝑒𝑥/𝑋𝑉
𝑒𝑞
where 𝑋𝑉𝑒𝑥 is the excess vacancy concentration and 𝑋𝑉
𝑒𝑞 is the equilibrium (thermal)
vacancy concentration [19, 23]. Recent NMR studies has shown that 𝑋𝑉𝑒𝑥 can be as high
as 0.1 in pure aluminum being subjected to tensile testing [18]. Such a high 𝑋𝑉𝑒𝑥 value
translates into a diffusivity several orders of magnitude above the normal value [19].
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60
Under such conditions, significant interdiffusion may occur at the interface before any
intermediate phase can nucleate. This would allow the interfacial Cu concentration in the
Zn to exceed the usual equilibrium solubility before the phase can nucleate. The arrow
on the 𝐺(𝑍𝑛) curve indicates the increase in Cu concentration at the interface. The
interfacial Cu concentration may even exceed the metastable solubility limit defined by
the common tangent on the 𝐺(𝑍𝑛) and 𝐺𝛾 curves, (Point P on the 𝐺(𝑍𝑛) curve), so that -
brass gains a large driving force for its nucleation in the Zn at the interface.
The Zn concentration in the Cu at the interface may also increase as indicated by
the arrow on the 𝐺𝛼 curve in Figure 4.18 This, however, would not increase the driving
force for the nucleation of -brass or -brass on the Cu at the interface as much because
of the wide 𝐺𝛼 curve which mandates its tangent lines to go below the 𝐺𝛽 or 𝐺𝛾 curve,
Figure 4.18.
Figure 4.18: Gibbs free energy curves for different Zn concentrations in Cu-Zn UPC
samples.
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61
The excess vacancies in the hcp Zn-Cu solution impose another important effect
on the phase evolution as they would also increase the Gibbs free energy of the phase in
which they are created. For a crystal consisting of 𝑛0 atoms, the free energy is increased
by an amount given by:
∆𝐺 = 𝑛𝑣𝐺𝑣 − 𝑇∆𝑆𝑉 (2)
Where 𝑛𝑣 is the number of thermal and excess vacancies, 𝐺𝑣 is the free energy of a
vacancy and ∆𝑆𝑉 is the configurational entropy change for the inclusion of vacancies. For
random mixing of vacancies in the crystal, ∆𝑆𝑉 is given by:
∆𝑆𝑉 = 𝑘[(𝑛0 + 𝑛𝑣) ln(𝑛0 + 𝑛𝑣) − ln 𝑛𝑣 − 𝑛0ln 𝑛0] (3)
For one mole of such ‘atom – vacancy solutions’ i.e., 𝑛0 + 𝑛𝑣 = 𝑁𝑎,
∆𝐺(𝑍𝑛)(𝑋𝑉) ≅𝑅𝑇
1−𝑋𝑉[(1 − 𝑋𝑉) ln(1 − 𝑋𝑉) + 𝑋𝑉 ln 𝑋𝑉] +
𝑋𝑉
1−𝑋𝑉𝐺𝑉 (4)
Where 𝐺𝑉 is the free energy for the formation of one mole of vacancies.
Thus, the excess vacancies would lift the 𝐺(𝑍𝑛) curve by ∆𝐺(𝑍𝑛)(𝑋𝑉), as shown
with the broken curve in Figure 4.18. This would have an effect of increasing the driving
force for nucleation by ∆𝐺(𝑍𝑛)(𝑋𝑉).
The excess vacancies may potentially have yet another effect. Figure 4.19 shows
𝐺𝛼, 𝐺(𝑍𝑛), and 𝐺𝐿, the G curve of the liquid Cu-Zn phase. As the 𝐺(𝑍𝑛) curve is lifted by
∆𝐺(𝑍𝑛)(𝑋𝑉), the mid part of 𝐺𝐿 may get under the common tangent between the 𝐺𝛼 and
𝐺(𝑍𝑛) curves. This constitutes a thermodynamic condition for ‘eutectic melting’ between
the -brass and the (Zn) solution. However, whether such thermodynamic conditions for
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62
strain-induced melting can actually occur in the Cu-Zn system in the presence of excess
vacancies is not known at present.
Figure 4.19: Gibbs free energy curves for different Zn concentrations and corrected Gibbs
free energy curves for compounds with high excess vacancy concentration.
The direct formation of -brass from Cu and Zn during ball-milling, Figure 4.1,
implies that the interdiffusion in the ball-milled Cu-Zn powder mixture was not as much
enhanced as in UPC. Although the instantaneous strain rate in ball-milling may be high,
the deformation is intermittent, i.e., it happens in a composite powder particle only when
the particle is impacted by the balls, and excess vacancies may be lost to sinks, i.e.,
dislocations, during the intervals between impacts. The lower process temperature (which
is nominally room temperature for ball-milling) may also keep the diffusion more limited
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63
than in UPC. With limited diffusion, the Cu concentration in the Zn at the Cu-Zn
interface would not be increased as much as in UPC, and the driving force for -brass
nucleation hence stays low. Under such conditions, the -brass phase, which has a large
overall driving force for formation at the Cu-48wt%Zn composition, is the phase that
forms. -brass may also form in intermediate stages where high Zn regions remains,
although ultimately the -brass must all transform to -brass.
To further investigate the reason behind the selection of the phase to form in Cn-
Zn powder mixture, two new experiments were performed. In the first experiment, a Cu-
48 wt% Zn powder mixture, encapsulated in a pre-evacuated and Ar gas-backfilled quartz
tube, was placed in a furnace at 100 ºC for 5 minutes. Once the powder was cooled to
room temperature, it was taken out of the quartz tube and consolidated by UPC at 300 ºC
for 2 s of ultrasonic vibration under 100 MPa uniaxial pressure. In the second experiment,
a Cu-48 wt% Zn powder mixture was first ball-milled in Ar atmosphere for 5 minutes
and consolidated by UPC under the same conditions as those of the first experiment. In
either experiment, the Cu concentration in the Zn at the interface is not expected to
increase to the extent that -brass nucleation is favored.
Figure 4.20(a) and Figure 4.20(b) shows the cross sections of the consolidated
samples from the first and second experiments, respectively. Both samples exhibit
significant amount of -brass formation despite the very short duration of the pre-heat
treatment or ball milling. Although no -brass formation was detected using XRD in the
heat treated or ball-milled powder mixture, Figure 4.21 and Figure 4.22, -brass must
have nucleated during the short pre-heat treatment and ball milling and subsequently
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64
grew further during UPC, while -brass also formed as a result of the enhance diffusion
in UPC. These new experiments demonstrate the feasibility of producing -brass by UPC
in a two-step procedure with a pre heat treatment or ball milling.
Figure 4.20: Cu-48 wt% Zn powder (a) Heat treated at 100 ºC for 5 minutes (b) Ball-milled
for 5 minutes, then consolidated at 300 ºC with 2 s of ultrasonic vibration, under 100 MPa
uniaxial pressure.
Figure 4.21: X-ray diffraction pattern for Cu-48 wt% Zn powder heat treated at 100 ºC for
5 minutes.
30 40 50 60 70 80 900
0.5
1
1.5
2
2.5
3x 10
4
2 (degree)
Inte
nsit
y
Cu
Zn
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65
Figure 4.22: X-ray diffraction pattern for Cu-48 wt% Zn powder ball-milled for 5 minutes.
30 40 50 60 70 80 90 1000
0.5
1
1.5
2
2.5
3x 10
4
2 (degree)
Inte
nsit
y
Cu
Zn
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66
5. CONCLUSION
The objective of this work was to study the phase evolution in Cu and Zn powder
mixtures subjected to UPC in comparison with that in Cu and Zn powder mixtures
subjected to ball milling. The following results have been obtained during this study:
1. Systematic UPC experiments with a Cu-48wt% Zn powder mixture at different
nominal processing temperatures have shown that the densification and bonding
between powder particles increase with increasing temperature and vibration time.
2. Consolidated samples made at and above 200 ºC exhibited a reaction zone,
composed of an intermediate phase identified as γ-brass (Cu5Zn8). The growth of
the γ-brass increased with increasing temperature and vibration time.
3. The γ-brass region exhibited dark linear features that coincide with the prior
particle boundaries of the Cu powder particles and are terminated at some
distance from the interface with the remaining Cu in the sample. This implies that
the regions of the γ-brass that contained the dark features were created by the
diffusion of Zn into the Cu and that the gray regions that extend beyond the dark
features were created by the diffusion of Cu into the Zn.
4. The dark features in the intermediate phase regions were largely eliminated in the
sample consolidated at 300 °C and with 4 s of vibration.
5. UPC of Cu-Zn powder mixtures with Zn contents from 10 to 40 wt% all produced
γ-brass, suggesting that the phase selection in UPC Cu-Zn is not affected by the
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67
global chemical state of the material. Rather, it is an event governed by the local
state at the Cu- Zn interface in the powder mixture.
6. When a Cu-Zn powder mixture is subjected to UPC, interdiffusion, enhanced by
the high excess vacancy concentration, causes a rapid increase in the Cu
concentration in the Zn and the Zn concentration in the Cu at the Cu-Zn interface.
Since the substitutional diffusivity is proportional to the vacancy concentration,
the diffusivity is increased over the normal value by as much as several orders of
magnitude. This permits the interfacial Cu concentration in the Zn to exceed the
usual equilibrium solubility of Zn in the hcp Zn-Cu solid solution above which
the ε phase can form, or even the metastable solubility above which the γ-brass
phase can form, yielding a large driving force for the nucleation of γ-brass in the
Zn at the interface.
7. Zn diffusion into the Cu would also be significant, but was not sufficient to cause
fcc β-brass (CuZn) to nucleate because of the much larger solubility of Zn in Cu.
8. Ball milling of Cu-48wt% Zn powder mixture for 10 h caused β-brass, the
equilibrium phase at the composition, to nucleate directly between Cu and Zn, but
with much slower growth than the γ-brass growth in UPC.
9. Ball milling or heat treatment may be used as a pre-treatment to cause β-brass to
nucleate in the Cu and Zn powder mixture, so that the β-brass can grow in the pre-
treated powder mixture when subjected to UPC.
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